CN205249519U - Coil panel and electromagnetic heating equipment - Google Patents
Coil panel and electromagnetic heating equipment Download PDFInfo
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- CN205249519U CN205249519U CN201520950936.0U CN201520950936U CN205249519U CN 205249519 U CN205249519 U CN 205249519U CN 201520950936 U CN201520950936 U CN 201520950936U CN 205249519 U CN205249519 U CN 205249519U
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Abstract
The utility model relates to an electromagnetic heating technology field especially relates to a coil panel and electromagnetic heating equipment. This coil panel includes the carrier, be equipped with the wire casing that extends according to the predetermined route that winds on the carrier, the surface adhesion of wire casing has the noble metal layer through the activating treatment forms, it has the conducting layer to adhere to on the noble metal layer. And, the manufacturing method of this coil panel through handle roughly the carrier, activating treatment and the electrically conductive back of handling accomplish the process of plating of executing for the coil panel is makeed more easily, has realized the effect that makes things convenient for the preparation, and its factor of safety is high, can make different coil panels according to different demands, has simple structure and the energy -conserving advantage that subtracts bad news.
Description
Technical field
The utility model relates to electromagnetic heating technique field, relates in particular to a kind of coil panel and electromagnetismFiring equipment.
Background technology
Along with the development of modern science and technology, the demand of the energy is more and more high, save the energy also byCountries in the world and linked groups pay attention to, and China has also formulated a series of energy-saving and cost-reducing accordinglyPolicy, the energy-saving and cost-reducing of living electric apparatus is an aspect meriting attention very much, and various heatingCoil panel is the necessity of each family life, and its mode of heating is generally Electromagnetic Heating or combustionThe heating of material flame, if can improve the efficiency of utilization of heater coil disc, reduces the waste of the energy,Just can reduce electric energy and the energy of its consumption, thus start with from heater coil disc, energy-saving and cost-reducing,The economic benefit of its generation, the energy of saving is by considerable.
At present, use IH (English IndirectHeating by name, Chinese indirect by name)The coil of the small household appliances that mode heats is all to adopt the mode of coiling enamel-covered wire to make. This coilingComplex manufacturing technology, electromagnetic oven, electric pressure cooking saucepan and electric cooker coil used need to be according to toolThe coil that body use occasion coiling is different, waste material. The heater coil disc of coiling enamel-covered wire existsThe problem that easily occurs wire jumper, scratch, short-term and deficient manufacturing procedure in use procedure, it is safelyNumber is low, and the form of coil is single.
Utility model content
(1) technical problem that will solve
The technical problems to be solved in the utility model is existing small household appliances wire winding complexity, makesWith easily occurring the low and coil of wire jumper, scratch, short-term, deficient manufacturing procedure, safety coefficient in processThe problem that form is single.
(2) technical scheme
In order to solve the problems of the technologies described above, the utility model provides a kind of coil panel, it comprise carryBody, described carrier is provided with the wire casing extending according to predetermined coiling path, the surface of described wire casingBe attached with the layer of precious metal forming through activation processing, on described layer of precious metal, be attached with conductive layer.
Wherein, described conductive layer at least comprises the first conductive layer, and described the first conductive layer is by changingThe mode of learning plating is attached on described layer of precious metal.
Wherein, described conductive layer also comprises the second conductive layer, and described the second conductive layer is by electroplatingMode be attached on described the first conductive layer.
Wherein, on described conductive layer, be also attached with antioxidation coating.
Wherein, described wire casing is described carrier to be carried out according to predetermined coiling path by laserEngraving forms. Wherein, described wire casing forms in described carrier forming process simultaneously, or instituteState wire casing and carve formation by cutter after carrier moulding, from the bottom land of described wire casing to notchDirection, the sidewall of described wire casing both sides expands outwardly respectively. Wherein, the longitudinal section of described wire casingBe inverted trapezoidal shape, upside-down triangle shape or semicircle arcuation.
Wherein, described carrier has two installed surfaces that through-thickness is relative, described wire casing bagDraw together according to the first predetermined coiling path and be arranged on the first wire casing on one of them installed surface, andBe arranged on the second wire casing on another installed surface according to the second predetermined coiling path.
Wherein, the material of described carrier is plastics, pottery or the metal that is coated with insulating barrier.
The utility model also provides a kind of electromagnetic heating apparatus, and it comprises described coil panel, instituteState coil panel for Electromagnetic Heating.
(3) beneficial effect
Technique scheme tool of the present utility model has the following advantages:
The utility model provides a kind of coil panel and electromagnetic heating apparatus, by adhering to conducting metalThe mode of layer is direct coiling on the surface of carrier, and than prior art, it has as followsTechnique effect:
One, wire winding is simple, and the stopper slot, fixed of clamping coil need to be set on carrierThe structure of position muscle and so on, makes the structure of carrier more simple.
Two, coil form is versatile and flexible, can carry out coiling various shapes according to user's demandCoil, has the feature of Flexible Production.
Three, production efficiency is high, the manufacture efficiency of this coil panel coiling COPPER WIRES PRODUCTION line more in the pastThe mode of circle dish is high a lot, is beneficial to volume production.
Four, reduce the material requirements of carrier, first this coil panel exists by the mode of activation processingThe surface attachment layer of precious metal of carrier then adheres to conductive layer on layer of precious metal, makes carryingThe material requirements of body reduces greatly.
Five, easy to use and safety coefficient is high, this coil panel is than traditional coiling enamel-covered wireMode, it in use can realize the deficient manufacturing procedure of avoiding occurring wire jumper, scratch, short-termProblem, it has advantages of the high and energy-saving consumption-reducing of safety coefficient.
Brief description of the drawings
Fig. 1 is the top view of the utility model embodiment mono-coil panel;
Fig. 2 is the stereogram of the utility model embodiment mono-coil panel;
Fig. 3 is the structural representation of the coil panel of the two-sided wire casing shape of the utility model embodiment bis-;
Fig. 4 is the A-A cutaway view of Fig. 3;
Fig. 5 is the structural representation of the coil panel of the utility model embodiment bis-one side wire casing shapes;
Fig. 6 is the B-B cutaway view of Fig. 5;
Fig. 7 is the position of the utility model embodiment bis-antioxidation coatings, conductive layer and layer of precious metalBe related to schematic diagram.
In figure: 1: carrier; 2: conductive layer; 3: wire casing; 4: block; 5: antioxidation coating;6: layer of precious metal.
Detailed description of the invention
For making object, technical scheme and the advantage of the utility model embodiment clearer, belowIn connection with the accompanying drawing in the utility model embodiment, to the technical side in the utility model embodimentCase is clearly and completely described, and obviously, described embodiment is of the present utility model onePart embodiment, instead of whole embodiment. Based on the embodiment in the utility model, thisIt is every other that field those of ordinary skill obtains under the prerequisite of not making creative workEmbodiment, belongs to the scope that the utility model is protected.
Embodiment mono-
Shown in Fig. 1, Fig. 2 and Fig. 7, the present embodiment provides a kind of coil panel, this coil panelComprise carrier 1, carrier 1 is provided with the wire casing 3 extending according to predetermined coiling path, so-called predeterminedCoiling path is the winding mode setting in advance, and its form can arrange according to actual needs flexibly,Do not limit at this, for example: predetermined coiling path can adopt vortex shape, is also referred to as A Ji meterMoral helical form. The surface attachment of wire casing 3 has the layer of precious metal 6 forming through activation processing, your goldBelong on layer 6 and be attached with conductive layer 2.
Visible, the mode of the coil panel that the present embodiment provides by adhering to conductive metal layer is at carrier 1Surface on direct coiling, the spacing of clamping coil not only need to be set on carrier 1The structure of groove, positioning bar and so on, makes the structure of carrier 1 more simple; But also can rootCarry out the coil of the various shapes of coiling according to user's demand, there is the feature of Flexible Production. In addition,The mode of the manufacture efficiency of this coil panel coiling COPPER WIRES PRODUCTION coil panel is more in the past high a lot.The more important thing is, first the present embodiment passes through the mode of activation processing in the surface attachment of wire casing 3Layer of precious metal 6 then adheres to conductive layer 2 on layer of precious metal 6, makes the material to carrier 1Require greatly to reduce, such as adopting common plastics, pottery, or even be coated with insulating barrierMetal.
Embodiment bis-
The technology contents that the present embodiment two is identical with embodiment mono-is not repeated in this description, embodiment mono-public affairsThe content of opening also belongs to the disclosed content of the present embodiment two, and the present embodiment two is at embodiment mono-On basis, do further refinement gained.
First, in the present embodiment, the material of carrier 1 can be plastics. Such as PC plastics, i.e. carrier1 obtains by PC injection molding. The moulding of PC plastics has that shrinkage factor is low, intensity is high,Fatigue durability, dimensionally stable, the few feature of creep, and at wider temperature and humidity modelIn enclosing, there is stable electrical insulating property. In addition the coil panel that, employing PC plastics are made is than traditionalCoil panel is more frivolous. Certainly, in the present embodiment, carrier 1 can also adopt other exhausted according to demandThe plastics that edge is good, as polyphenylene oxide or engineering plastics etc. Except plastics, in the present embodimentThe material of carrier 1 also, widenable to pottery or the outside metal that is coated with insulating barrier, ensures itThere is stable electrical insulating property.
Next, thus the present embodiment makes it by the surface of wire casing 3 being carried out to activation processing realizationAdhere to layer of precious metal 6. Wherein, noble metal mainly refer to gold, silver and platinum group metal (ruthenium, rhodium, palladium,Osmium, iridium, platinum) etc. 8 kinds of metallic elements.
The concrete mode of this activation processing is: the carrier of coil panel 1 is immersed in activating solution. LiveChange liquid and comprise precious metal chemical complex, concentrated acid, reducing agent and complexing agent. Precious metal chemical complex canFor palladium bichloride or silver chlorate, concentrated acid can be concentrated hydrochloric acid or the concentrated sulfuric acid, and reducing agent can beStannous chloride, complexing agent can be received for citric acid, Cymag, sodium tartrate or sodium pyrophosphate.Wherein, concentrated acid is used for dissolving precious metal chemical complex; Reducing agent is for reducing precious metal chemical complexBecome layer of precious metal 6 to be attached to the inner surface of wire casing 3; Complexing agent is by precious metal chemical complex and reductionAgent remains on suspended state, and precious metal chemical complex and reducing agent are not occurred in the time of solution state, only in the time contacting with wire casing 3 inner surfaces, just there is redox reaction in redox reaction.
Corresponding, the method for a kind of concrete configuration activating solution that the present embodiment also provides: by PdCl2Solution is dissolved in the mixed solution of dense HCL and distilled water, then adds SnCl in this mixed liquor2,Form the first mixed liquor; Get that citric acid is received, NaCN, sodium tartrate or sodium pyrophosphate are dissolved in distillationIn water, form the second mixed liquor; The first mixed liquor and the second mixed liquor are uniformly mixed, formActivating solution.
In the present embodiment, wire casing 3 carries out carrier 1 according to predetermined coiling path by laserEngraving is processed and is formed, and forms coarse when Slot shaping so online at the inner surface of wire casingFace, makes layer of precious metal 6 can evenly and firmly be attached to the inner surface of wire casing 3.
It should be noted that in the present embodiment wire casing 3 is carried out to laser engraving processing process (The process of roughening processing) be also the process of wire casing 3 moulding simultaneously. Wire casing 3 is being carried outBefore roughening is processed, this wire casing 3 is virtual presence on carrier 1, on carrier 1Can not see in esse wire casing 3. Thisly form on the surface of carrier 1 by laser engravingThe rectangular shape of wire casing 3 cross section, the width of wire casing 3 is much larger than its degree of depth. Generally speaking,The degree of depth of this wire casing 3 is generally several microns, and its width range is 0.2mm~10mm,Spacing range between adjacent wire casing 3 is 0.2mm~10mm.
Finally, the structure of the conductive layer 2 in the present embodiment also can further be optimized. For example:Conductive layer 2 at least comprises the first conductive layer, and the first conductive layer is attached to by the mode of chemical platingOn layer of precious metal 6. Certainly, conductive layer 2 also comprises the second conductive layer, and the second conductive layer passes throughThe mode of electroplating is attached on the first conductive layer.
Wherein, the mode of chemical plating is: carrier 1 is immersed in chemical plating fluid, at wire casing 3On under layer of precious metal 6 catalysis of adhering to, by there is oxygen in the conductive metal ion in chemical plating fluidChange reduction reaction and be attached on wire casing 3, form the first conductive layer. The mode of this chemical plating moreEasily on very thin layer of precious metal 6, adhere to securely the first conductive layer, and after makingThe continuous easier mode by plating is adhered to the second conductive layer on the first conductive layer, but chemical platingThe thickness of first conductive layer that can adhere to is very thin, can only adapt to the feelings of coil panel low-power heatingCondition. In the time that coil panel need to be realized high-power heating, need mode by electroplating theOn one conductive layer, adhere to the second conductive layer, because the second conduction bed thickness adhering to by plating modeSpend greatlyr, and it is fast to adhere to speed. The mode of electroplating the second conductive layer is by described processizationLearn in the carrier immersion plating liquid of plating processing, the conductive metal ion in electroplate liquid is at the work of electric currentBy lower generation redox reaction, generate conductive metal particle and be attached to the first conductive layer, formThe second conductive layer.
The material that in the present embodiment, conductive layer 2 adopts is copper, because copper has good electric conductivity.Certainly conductive layer 2 can also adopt other electric good conductor material such as silver or aluminium.
As shown in Figure 7, when conductive layer 2 adopts poor the leading of oxidation proof properties such as copper or silverWhen electric material, also need to outside conductive layer 2, adhere to antioxidation coating 5, at the second conductive layer peripheral hardwareBe equipped with antioxidation coating 5, to prevent the electric conductivity of oxidation affects conductive layer 2 of conductive layer 2. WhenWhen conductive layer 2 adopts the reasonable materials of oxidation proof properties such as aluminium, also can not arrange anti-oxidationLayer 5. The material of antioxidation coating 5 is nickel, can be also a kind of in nickel, silver, aluminium and gold orSeveral being mixed to form arbitrarily.
Particularly, the thickness of the first conductive layer is 5um-10um, the thickness of the second conductive layerFor 40um-70um, the thickness of antioxidation coating 5 is 5um-10um. Certainly can also be according to realityBorder situation requires the thickness of the first conductive layer, the second conductive layer and antioxidation coating 5 to do accordinglyAdjust.
In conjunction with shown in Fig. 3 to Fig. 6, in the present embodiment, to have through-thickness relative for carrier 1The first installed surface and the second installed surface, wire casing 3 comprises the First Line being arranged on the first installed surfaceGroove 3, and be arranged at the second wire casing 3 on the second installed surface. Coil panel can be set to one sideWire casing 3 shapes or two-sided wire casing 3 shapes, the one or two sides of carrier 1 all can be provided with wire casing 3,The interior conductive layer 2 that all arranges of wire casing 3. Adopt this scheme, because the both sides of coil panel are provided withThe coil of conductive layer 2 coilings, therefore can, the in the situation that of 1 constancy of volume of coil panel carrier, incite somebody to actionThe heating power of coil panel improves one times nearly.
Embodiment tri-
In like manner, the technology contents that the present embodiment three is identical with embodiment mono-, embodiment bis-is no longer superfluousState, the difference of the present embodiment three and embodiment bis-is specifically to lead to the molding mode of wire casing 3Cross contrast the present embodiment and above-described embodiment two is known, as follows:
The wire casing 3 of above-described embodiment two is (to be laser carving carrier 1 being carried out to roughening processingCarve process) time form; Wire casing 3 in the present embodiment is same in carrier 1 mouldingIn time, forms or carve processing (such as CNC processing) formation by cutter after carrier 1 moulding,Again wire casing 3 is carried out to roughening processing afterwards. Particularly, in the time that the material of carrier is plastics,The bulge loop that can extend according to predetermined coiling path in the inner surface setting of mould, so just canIn carrier injection mo(u)lding, form the line extending according to predetermined coiling path on the surface of carrierGroove. In above-described embodiment two, the degree of depth of wire casing 3 is generally several microns; And in the present embodimentWire casing 3 degree of depth generally have several millimeters. Cross section taking wire casing 3 is rectangular as example, at wire casing 3Have in the situation of identical A/F, conductive layer 2 attachment surfaces in above-described embodiment two are onlyThe diapire of wire casing 3; And the attachment surface of the present embodiment conductive layer 2 is except the diapire of wire casing 3Two sidewalls of wire casing 3 are also increased. The cross-sectional width that is conductive layer 2 in the present embodiment is largeThe width of conductive layer 2 in above-described embodiment two, in the case of the thickness of conductive layer 2 is identical,In the present embodiment, the cross-sectional area of conductive layer 2 is greater than the transversal of conductive layer 2 in above-described embodiment twoArea. Known according to resistance formula R=ρ .L/S, in the situation that resistivity number of turns is constant,Increase cross-sectional area and can reduce resistance. According to horse-power formula P=U2/R, in the constant feelings of voltageUnder condition, reduce resistance, can improve the heating power of coil panel.
The wire casing 3 that adopts these two kinds of modes to form, the inner surface smoother of wire casing 3, if rightDirectly wire casing 3 is carried out to activation processing, layer of precious metal 6 is relatively difficult to be attached to uniformly wire casing 3Inner surface. A preferred version of the present embodiment is before activation processing, wire casing 3 to be carried outRoughening processing, forms matsurface with the inner surface at wire casing, makes layer of precious metal 6 energy evenlyAnd be firmly attached to the inner surface of wire casing 3. The roughening that the present embodiment provides is treated to swashingLight is carved processing according to the bearing of trend of wire casing to wire casing. Certainly can also adopt chemistry thickRough facture. For the ease of only just can complete the roughening processing of wire casing by laser engraving,Concrete, in the present embodiment wire casing 3 be shaped as the direction to notch from the bottom land of wire casing,The sidewall of wire casing both sides expands outwardly respectively, and the wire casing design of this shape can ensure that laser simultaneouslyEngraving is to diapire and two sidewalls of wire casing 3.
Preferably, the cross section of wire casing 3 is preferably inverted trapezoidal, del or semicircular arc.Laser carries out laser engraving roughening while processing to the wire casing 3 of these shapes, laser can be simultaneously according toThe diapire and two sidewalls that are mapped to wire casing 3, just can complete wire casing 3 by an Ear Mucosa Treated by He Ne Laser IrradiationRoughening processing. And the wire casing 3 that is rectangle for cross section, laser carries out once wire casing 3Expose to a many sidewall and the diapires that can only simultaneously process wire casing 3, be difficult to locate simultaneouslyReason is to diapire and two sidewalls of wire casing 3, and the wire casing 3 that is rectangle for cross section at least needsWant the roughening processing that twice Ear Mucosa Treated by He Ne Laser Irradiation just can complete wire casing 3.
Shown in Fig. 4, Fig. 6, the cross section of the present embodiment wire casing 3 is the shape of falling isosceles trapezoid,The angular range of the sidewall of wire casing 3 and diapire normal direction is 15 °~75 °. The thickness h of carrier 1For 2-8mm, the width range L1 of wire casing 3 diapires is 0.5mm~1.5mm, wire casing 3 darkDegree scope is 2mm~8mm. Between adjacent two wire casings 3, there is isolation bar, the horizontal stroke of isolation barCross section is isosceles trapezoid, and the width range L2 at isolation bar top is 0.2mm~1.0mm. Above-mentionedThe setting of parameter, both can make the coil in wire casing have good electric conductivity, made again lineBetween circle adjacent turn, there is good insulating properties
Visible, in the present embodiment, first utilize plastic grain injection mo(u)lding to form carrier 1, simultaneouslyIn the process of carrier 1 moulding, form wire casing 3, i.e. wire casing 3 and carrier 1 integrated injection molding.The surface of wire casing 3 is the matsurface for adsorbing layer of precious metal 6, is being labored in wire casing 3 surfacesChange to process and before carrier 1 is done to roughening processing. When being treated to laser radium carving, processes roughening,Wire casing 3 forms in the process of carrier 1 being carried out to the processing of laser radium carving. Concrete, by makingWith laser machine on the carrier 1 making laser engraving wire casing 3 to obtain for adsorbing noble metalThe matsurface of layer 6. Can be according to different demands, the number of turns of radium-shine different wire casing 3, thenCarrier 1 is carried out to activation processing, form layer of precious metal 6 at the inner surface of wire casing 3, utilizeMatsurface forms strong absorption affinity, makes it to contact more firmly with layer of precious metal 6.
Embodiment tetra-
The present embodiment four is on the basis of above-described embodiment one, embodiment bis-and embodiment tri-, alsoProvide a kind of for making the method for above-mentioned coil panel, specifically comprised the steps:
S1, carrier 1 moulding; Concrete, in the time that the material of carrier 1 is plastics, by meltingPlastics inject mould and form carrier; In the time that the material of carrier 1 is pottery, first porcelain mud is passed through to mouldTool is squeezed into blank, and then sinters blank into carrier; When the material of carrier 1 is absolutely coatedWhen the metal of edge material, first by metal material punch forming, then on metal by spraying orThe mode of person's injection moulding forms insulating barrier.
S2, wire casing moulding form the wire casing extending according to predetermined coiling path on described carrier. ;Further, the wire casing in step S2 be shaped to laser according to predetermined coiling path to carrierCarry out radium carving and process, to form the wire casing 3 of inner surface as matsurface.
In addition, this wire casing 3 also can be after carrier 1 moulding, with cutter according to predetermined aroundThread path is carved to process to carrier 1 and is formed, such as carrier 1 is carried out to CNC processing, CNCMachining locus is the coiling path of being scheduled to. , or wire casing 3 can also be in carrier 1 mouldingForm. The forming process that is carrier 1 comprises: carrier material is dropped in mould, in mouldSurface is provided with the bulge loop extending according to predetermined coiling path, to carry in carrier mouldingStamp out according to the wire casing of predetermined coiling path extension in the surface of body. Adopt these two kinds of modes to formWire casing, with respect to the wire casing forming by laser radium carving, can be constant at carrier surface areaIn situation, increase the area that wire casing adheres to conductive layer, thereby reduce the resistance of coil.
S3, activation processing, immerse described carrier 1 in activating solution, and activating solution comprises noble metalCompound, the precious metal ion in precious metal chemical complex is reduced to fine particle of noble metal and is adsorbed onOn the inner surface of wire casing 3, to form layer of precious metal 6;
This activating solution also comprises concentrated acid, reducing agent and complexing agent. Corresponding, in this step S3, liveChanging the collocation method of liquid is: S31, noble metal compound solution is dissolved in concentrated acid solution, then toWherein add reducing agent, form the first mixed liquor; S32, in the first mixed liquor, add complexingAgent. Wherein, precious metal chemical complex is palladium bichloride or silver chlorate, and concentrated acid is concentrated hydrochloric acid or dense sulphurAcid, reducing agent is stannous chloride, complexing agent is that citric acid is received, Cymag, sodium tartrate or JiaoSodium phosphate.
This step S3 specifically can further set forth by following preferred embodiment: by 0.3gPdCl2Solution is dissolved in the mixed solution of the dense HCL of 10ml and 10ml distilled water, then adds wherein12gSnCl2, form the first mixed liquor; Get again that 250g citric acid is received, NaCN, sodium tartrateOr sodium pyrophosphate is dissolved in 1.5L distilled water, form the second mixed liquor; By the first mixed liquor andTwo mixed liquors are uniformly mixed. The first mixed liquor and the second mixed liquor are constantly uniformly mixed, obtain final productArrive activation colloid this time. Wherein natrium citricum Main Function is the effect of playing stabilizing agent, networkClose Sn2+, prevent Sn2+Be oxidized to Sn4+。
S4, on layer of precious metal 6, adhere to conductive layer 2. In addition also can carry out described conductive layer,Electroplate or chemical plating formation antioxidation coating.
This step S4 specifically comprises the steps (can with reference to following table):
S41, clean the carrier 1 of activated processing; Specifically can be by water under high pressure at 20-30 DEG C of barPart cleans, and can be preferably 25 DEG C, and certainly, this temperature range is not limited to.
S42, carrier 1 are immersed in chemical plating fluid, and the conductive metal ion in chemical plating fluid is expensiveUnder the catalytic action of metal level, there is redox reaction, generate conductive metal particle and adhere to onlineOn groove 3; Further, when the enforcement temperature in step S42 is chosen as 40 DEG C-60 DEG C, preferablyBe 52 DEG C, certainly, this temperature range is not limited to. And the time of chemical plating is controlled at 60-90Minute, to realize abundant reaction.
S43, by the described carrier immersion plating liquid through chemical plating processing, in described electroplate liquidConductive metal ion under the effect of electric current, there is redox reaction, generate conducting metal micro-Grain is attached to described the first conductive layer, and preferred, the enforcement temperature in step S43 is chosen as20-60 DEG C, certainly, this temperature range is equally also not limited to this, and, according to plated materialDifference, control the different reaction time, in the time of electro-coppering, the time is controlled at 60-90 minute;In the time of electronickelling, the time is controlled at 10-20 minute.
S44, the carrier 1 that has plated the second conductive layer is dried, concrete, pass through drying cupboardWhen being selected in temperature and being 100 DEG C, carrier 1 is dried.
In addition, after step S43 completes, in the time that temperature is 55 DEG C-60 DEG C, at the second conductive layerThe upper mode by plating forms antioxidation coating 5, then by the carrier 1 having plated after antioxidation coating 5Be dried.
Conductive layer metallization process table
As the above analysis, the present embodiment provides the method for making coil panel can reduce carrier 1Material requirements. Than the existing selectiveization depositing process technology LDS (English based on laserLaserDirectStructuring by name, Chinese laser direct structuring technique by name), itsAdvantage is apparent. First pass through the mode of activation processing at the surface attachment noble metal of carrier 1Layer 6 then adheres to conductive layer 2 on layer of precious metal 6, makes the material requirements of carrier 1 largeLarge reduction, the metal of the common plastics of applicable multiple types and color and pottery, insulating layer coatingMaterial, cost is lower.
Embodiment five
The present embodiment also provides a kind of electromagnetic heating apparatus, wherein, comprises that embodiment mono-is to enforcementCoil panel in example three. This coil panel comprises: this coil panel comprises carrier 1, on carrier 1, establishesHave the wire casing 3 extending according to predetermined coiling path, the inner surface of wire casing 3 adheres to be had through overactivation placeThe layer of precious metal 6 that reason forms, is attached with conductive layer 2 on layer of precious metal 6. Coil panel carrier 1Material and molding mode, the molding mode of wire casing 3, the composition of conductive layer 2 and conductive layer 2 are attachedAll can be with reference to the description of coil panel above in mode of wire casing 3 inwalls etc., no longer superfluous hereinState. In addition also can improve coil panel progress, for example: at conductive layer 2 two ends of coil panel,Also be provided with block 4, block 4 can be used as terminals, and its material can be copper, can be alsoOther conductive material.
This electromagnetic heating apparatus comprise electromagnetic heating apparatus be electromagnetic oven, decoct strike-machine, soy bean milk making machine,Electric kettle, coffee machine, electrical boiler, electric cooker or electric pressure cooking saucepan. For electromagnetic oven,The coil panel that embodiment mono-, embodiment bis-or embodiment tri-are provided and power amplifier board, motherboard,Lamp plate (manipulation display board), temperature controller, temperature-sensitive support, blower fan, power line, furnace panel (porcelainPlate, black brilliant plate), plastic cement upper and lower covers etc. assembles and just can form a complete electromagnetic oven.
What deserves to be explained is, according to the product difference of concrete application, the shape of coil panel carrier 1Have different variations. Such as for electromagnetic oven and electric kettle, coil panel carrier 1Shape is generally discoid. For electric cooker and electric pressure cooking saucepan, the shape of coil panel carrier 1Shape is hollow hemispherical, is also bowl-shape. And if make coil panel carrier 1The directly interior pot sidewall heating to electric cooker and electric pressure cooking saucepan, coil panel carrier 1 is all rightFor cylindric, hollow cylindric. It is the not shape structure to coil panel of dish in coil panelBecome any restriction in addition. Other,, with embodiment mono-to embodiment tetra-, repeat no more herein.
In sum, the utility model provides a kind of coil panel and electromagnetic heating apparatus, by attachedMode direct coiling on the surface of carrier of conductive metal layer, than prior artIt has following technique effect:
One, wire winding is simple, and the stopper slot, fixed of clamping coil need to be set on carrierThe structure of position muscle and so on, makes the structure of carrier more simple.
Two, coil form is versatile and flexible, can carry out coiling various shapes according to user's demandCoil, has the feature of Flexible Production.
Three, production efficiency is high, the manufacture efficiency of this coil panel coiling COPPER WIRES PRODUCTION line more in the pastThe mode of circle dish is high a lot, is beneficial to volume production.
Four, reduce the material requirements of carrier, first this coil panel exists by the mode of activation processingThe surface attachment layer of precious metal of carrier then adheres to conductive layer on layer of precious metal, makes carryingThe material requirements of body reduces greatly.
Five, easy to use and safety coefficient is high, this coil panel is than traditional coiling enamel-covered wireMode, it in use can realize the deficient manufacturing procedure of avoiding occurring wire jumper, scratch, short-termProblem, it has advantages of the high and energy-saving consumption-reducing of safety coefficient.
Finally it should be noted that: above embodiment is only in order to the technical solution of the utility model to be described,Be not intended to limit; Although the utility model is had been described in detail with reference to previous embodiment,Those of ordinary skill in the art is to be understood that: it still can be recorded aforementioned each embodimentTechnical scheme modify, or part technical characterictic is wherein equal to replacement; And thisA little amendments or replacement, do not make essence disengaging the utility model of appropriate technical solution respectively implementThe spirit and scope of example technical scheme.
Claims (11)
1. a coil panel, is characterized in that: comprise carrier, described carrier is provided with according in advanceSurely wind the line path extend wire casing, the surface attachment of described wire casing has layer of precious metal, described your goldBelong on layer and be attached with conductive layer.
2. coil panel according to claim 1, is characterized in that: described conductive layer at leastComprise the first conductive layer, described the first conductive layer is attached to described your gold by the mode of chemical platingBelong on layer.
3. coil panel according to claim 2, is characterized in that: described conductive layer also wrapsDraw together the second conductive layer, described the second conductive layer is attached to described the first conduction by the mode of electroplatingOn layer.
4. coil panel according to claim 1, is characterized in that: on described conductive layer, go backBe attached with antioxidation coating.
5. according to the coil panel described in claim 1-4 any one, it is characterized in that: described inWire casing is according to predetermined coiling path, described carrier to be carved to formation by laser.
6. according to the coil panel described in claim 1-4 any one, it is characterized in that: described inWire casing forms in described carrier forming process simultaneously, or described wire casing is logical after carrier mouldingCross cutter engraving and form, the direction from the bottom land of described wire casing to notch, described wire casing both sidesSidewall expands outwardly respectively.
7. coil panel according to claim 6, is characterized in that: the interior table of described wire casingFace is matsurface, and described matsurface is processed formation by the inner surface of wire casing being carried out to roughening.
8. coil panel according to claim 6, is characterized in that: described wire casing transversalFace is inverted trapezoidal shape, upside-down triangle shape or semicircle arcuation.
9. according to the coil panel described in claim 1-4,7-8 any one, it is characterized in that:Described carrier has two installed surfaces that through-thickness is relative, and described wire casing comprises according to firstPredetermined coiling path is arranged on the first wire casing on one of them installed surface, and pre-according to secondSurely the path that winds the line is arranged on the second wire casing on another installed surface.
10. coil panel according to claim 9, is characterized in that: the material of described carrierMatter is plastics, pottery or the outside metal that is coated with insulating barrier.
11. 1 kinds of electromagnetic heating apparatus, is characterized in that: comprise as any in claim 1-10Coil panel described in one, described coil panel is for Electromagnetic Heating.
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CN201520950936.0U CN205249519U (en) | 2015-11-25 | 2015-11-25 | Coil panel and electromagnetic heating equipment |
PCT/CN2015/096054 WO2017088197A1 (en) | 2015-11-25 | 2015-11-30 | Coil disc and manufacturing method therefor, and electromagnetic heating device |
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CN201520950936.0U CN205249519U (en) | 2015-11-25 | 2015-11-25 | Coil panel and electromagnetic heating equipment |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106804069A (en) * | 2015-11-25 | 2017-06-06 | 佛山市顺德区美的电热电器制造有限公司 | A kind of coil panel and preparation method thereof, electromagnetic heating apparatus |
CN107928379A (en) * | 2016-10-13 | 2018-04-20 | 广东美的生活电器制造有限公司 | Heating vessel |
CN109309978A (en) * | 2017-07-28 | 2019-02-05 | 佛山市顺德区美的电热电器制造有限公司 | Coil panel and its manufacturing method, the electromagnetic cooking appliance with the coil panel |
CN109659682A (en) * | 2018-12-13 | 2019-04-19 | 泉州萃思技术开发有限公司 | A kind of communication antenna production technology |
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2015
- 2015-11-25 CN CN201520950936.0U patent/CN205249519U/en active Active
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106804069A (en) * | 2015-11-25 | 2017-06-06 | 佛山市顺德区美的电热电器制造有限公司 | A kind of coil panel and preparation method thereof, electromagnetic heating apparatus |
CN106804069B (en) * | 2015-11-25 | 2023-04-18 | 佛山市顺德区美的电热电器制造有限公司 | Coil disc, manufacturing method thereof and electromagnetic heating equipment |
CN107928379A (en) * | 2016-10-13 | 2018-04-20 | 广东美的生活电器制造有限公司 | Heating vessel |
CN109309978A (en) * | 2017-07-28 | 2019-02-05 | 佛山市顺德区美的电热电器制造有限公司 | Coil panel and its manufacturing method, the electromagnetic cooking appliance with the coil panel |
CN109659682A (en) * | 2018-12-13 | 2019-04-19 | 泉州萃思技术开发有限公司 | A kind of communication antenna production technology |
CN109659682B (en) * | 2018-12-13 | 2020-11-20 | 江苏南通海之升电子商务有限公司 | Communication antenna production process |
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