CN106804069A - A kind of coil panel and preparation method thereof, electromagnetic heating apparatus - Google Patents
A kind of coil panel and preparation method thereof, electromagnetic heating apparatus Download PDFInfo
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- CN106804069A CN106804069A CN201510828701.9A CN201510828701A CN106804069A CN 106804069 A CN106804069 A CN 106804069A CN 201510828701 A CN201510828701 A CN 201510828701A CN 106804069 A CN106804069 A CN 106804069A
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Abstract
The present invention relates to electromagnetic heating technique field, more particularly to a kind of coil panel and preparation method thereof, electromagnetic heating apparatus.The coil panel includes carrier, and the carrier is provided with according to the predetermined wire casing extended around thread path, and the surface attachment of the wire casing has the layer of precious metal formed by activation process, and conductive layer is attached with the layer of precious metal.And, the preparation method of the coil panel completes plating process after carrying out coarse treatment, activation process and conductive processing to carrier so that coil panel is easier to make, and realizes the effect of convenient making；And its safety coefficient is high, different coil panels can be made according to different demands, there is simple structure and energy-saving consumption-reducing.
Description
Technical field
The present invention relates to electromagnetic heating technique field, more particularly to a kind of coil panel and its making side
Method, electromagnetic heating apparatus.
Background technology
With the development of modern science and technology, the demand of the energy is more and more high, energy saving also by
Countries in the world and linked groups are paid attention to, and China has also formulated a series of energy-saving accordingly
Policy, the energy-saving of living electric apparatus is an aspect highly paid close attention to, and various heating
Coil panel is the necessity of each family life, and its mode of heating is generally Electromagnetic Heating or combustion
Material flame heating, if the efficiency of utilization of heater coil disc can be improved, reduces the waste of the energy,
The electric energy and the energy of its consumption can be just reduced, so start with from heater coil disc, it is energy-saving,
Its economic benefit for producing, the energy of saving will be considerable.
At present, IH (English entitled Indirect Heating, Chinese entitled indirectly heat) is used
The coil of the small household appliances that mode is heated is made by the way of coiling enamel-covered wire.This coiling
Complex manufacturing technology, coil used by electromagnetic oven, electric pressure cooking saucepan and electric cooker needed according to tool
The different coil of body use occasion coiling, waste of materials.The heater coil disc of coiling enamel-covered wire exists
Easily there is the problem of wire jumper, scratch, short-term and deficient manufacturing procedure during use, it is safely
Number is low, and the form of coil is single.
The content of the invention
(1) technical problem to be solved
The technical problem to be solved in the present invention is complicated existing small household appliances wire winding, is being used
Easily occur that wire jumper, scratch, short-term, deficient manufacturing procedure, safety coefficient be low and coil form in journey
Single problem.
(2) technical scheme
In order to solve the above-mentioned technical problem, the present invention provides a kind of coil panel, and it includes carrier,
The carrier is provided with according to the predetermined wire casing extended around thread path, the surface attachment of the wire casing
There is the layer of precious metal formed by activation process, conductive layer is attached with the layer of precious metal.
Wherein, the conductive layer at least includes the first conductive layer, and first conductive layer is by changing
The mode for learning plating is attached on the layer of precious metal.
Wherein, the conductive layer also includes the second conductive layer, and second conductive layer is by plating
Mode be attached on first conductive layer.
Wherein, also it is attached with antioxidation coating on the conductive layer.
Wherein, the wire casing is that the carrier is carried out around thread path according to predetermined by laser
Engraving is formed.
Wherein, the wire casing is formed simultaneously in the carrier forming process, or the wire casing
Carved by cutter and to be formed after carrier shaping, from direction from the bottom land of the wire casing to notch,
The side wall of the wire casing both sides is expanded outwardly respectively.
Wherein, the cross section of the wire casing is in inverted trapezoidal shape, upside-down triangle shape or semicircle arcuation.
Wherein, the carrier has two relative mounting surfaces of through-thickness, the wire casing bag
Include according to first predetermined the first wire casing being disposed therein around thread path on a mounting surface, and
According to second predetermined the second wire casing being arranged on around thread path on another mounting surface.
Wherein, the material of the carrier is the metal that plastics, ceramics or outside are coated with insulating barrier.
The present invention also provides a kind of electromagnetic heating apparatus, and it includes described coil panel, the line
Circle disk is used for Electromagnetic Heating.
The present invention again a kind of preparation method of coil panel is provided, its comprise the following steps for：
S1, carrier shaping；
S2, wire casing shaping, form according to the predetermined wire casing extended around thread path on the carrier；
S3, activation process, the carrier is immersed in activating solution, and the activating solution includes expensive
Metallic compound, the precious metal ion in the precious metal chemical complex is reduced to fine particle of noble metal
And adsorb on the inner surface of the wire casing, to form layer of precious metal；
S4, on the layer of precious metal adhere to conductive layer.
Wherein, the step of wire casing in step S2 is molded is around thread path with laser according to predetermined
Laser carving treatment is carried out to carrier, to form inner surface as the wire casing of mat surface.Wherein, the step
Wire casing shaping in rapid S2 includes：The carrier is carried out around thread path according to predetermined with cutter
Engraving treatment；Or in the step S2 wire casing shaping with the step S1 in carrier into
Type is same step, and the step S1 carriers shaping includes：By carrier material put into mould in,
The inner surface of the mould is provided with according to the predetermined bulge loop extended around thread path, with carrier into
Stamped out according to the predetermined wire casing extended around thread path on the surface of carrier while type.
Wherein, the conductive layer in step S4 by metallization process formed the first conductive layer and
Second conductive layer, it comprises the following steps：
S42, the carrier are immersed in chemical plating fluid, and the conductive metal ion in chemical plating fluid exists
There is redox reaction under the catalytic action of layer of precious metal, generation conductive metal particle is attached to
On the wire casing, the first conductive layer is formed；
S43, by the carrier immersion electroplate liquid by chemical plating, in the electroplate liquid
Conductive metal ion there is redox reaction in the presence of electric current, generation conducting metal is micro-
Grain is attached to and second conductive layer is formed on first conductive layer.
Wherein, step S4 also includes after attachment conductive layer on the layer of precious metal：By electricity
Plating mode adheres to antioxidation coating on the electrically conductive.
(3) beneficial effect
Above-mentioned technical proposal of the invention has the following advantages that：
The present invention provides a kind of coil panel and preparation method thereof, electromagnetic heating apparatus, by attachment
The mode of conductive metal layer carrier coiling directly on a surface, compared to prior art its
Have the following technical effect that：
First, wire winding is simple, it is not necessary to the stopper slot of clamping coil is set on carrier, is determined
The structure of position muscle etc so that the structure of carrier is more simple.
2nd, coil form is versatile and flexible, can be variously-shaped come coiling according to the demand of user
Coil, the characteristics of with Flexible Production.
3rd, production efficiency is high, the more conventional coiling COPPER WIRES PRODUCTION line of the manufacture efficiency of the coil panel
The mode for enclosing disk is much higher, beneficial to volume production.
4th, reduce carrier material requirements, the coil panel first by way of activation process
The surface attachment layer of precious metal of carrier, then adheres to conductive layer on layer of precious metal so as to carrying
The material requirements of body is substantially reduced.
5th, easy to use and safety coefficient is high, the coil panel is compared to traditional coiling enamel-covered wire
Mode, its deficient manufacturing procedure that can realize avoiding the occurrence of wire jumper, scratch, short-term in use
Problem, it has the advantages that safety coefficient is high and energy-saving consumption-reducing.
Brief description of the drawings
Fig. 1 is the top view of the coil panel of the embodiment of the present invention one；
Fig. 2 is the stereogram of the coil panel of the embodiment of the present invention one；
Fig. 3 is the structural representation of the coil panel of the two-sided wire casing shape of the embodiment of the present invention two；
Fig. 4 is the A-A sectional views of Fig. 3；
Fig. 5 is the structural representation of the coil panel of the one side wire casing shape of the embodiment of the present invention two；
Fig. 6 is the B-B sectional views of Fig. 5；
Fig. 7 is the position relationship of the antioxidation coating of the embodiment of the present invention two, conductive layer and layer of precious metal
Schematic diagram.
In figure：1：Carrier；2：Conductive layer；3：Wire casing；4：Block；5：Antioxidation coating；
6：Layer of precious metal.
Specific embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below will knot
Close the embodiment of the present invention in accompanying drawing, the technical scheme in the embodiment of the present invention is carried out it is clear,
It is fully described by, it is clear that described embodiment is a part of embodiment of the invention, without
It is whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art are not having
There is the every other embodiment obtained on the premise of making creative work, belong to the present invention
The scope of protection.
Embodiment one
With reference to shown in Fig. 1, Fig. 2 and Fig. 7, the present embodiment provides a kind of coil panel, the coil panel
Including carrier 1, carrier 1 is provided with according to the predetermined wire casing 3 extended around thread path, so-called predetermined
It is the winding mode for pre-setting around thread path, its form can flexibly be set according to actual needs,
Do not limit to herein, for example：It is predetermined to use vortex shape, also referred to as A Ji meter around thread path
Moral helical form.The surface attachment of wire casing 3 has the layer of precious metal 6 formed by activation process, your gold
Conductive layer 2 is attached with category layer 6.
It can be seen that, the coil panel that the present embodiment is provided is by way of adhering to conductive metal layer in carrier 1
Coiling directly on a surface, the spacing of clamping coil need not be not only set on the carrier 1
The structure of groove, positioning bar etc so that the structure of carrier 1 is more simple；But also can be with root
Carry out the variously-shaped coil of coiling according to the demand of user, the characteristics of with Flexible Production.Additionally,
The mode of the more conventional coiling COPPER WIRES PRODUCTION coil panel of the manufacture efficiency of this coil panel is much higher.
Importantly, the present embodiment first by way of activation process in the surface attachment of wire casing 3
Layer of precious metal 6, then adheres to conductive layer 2 so as to the material of carrier 1 on layer of precious metal 6
It is required that substantially reducing, such as common plasticses, ceramics can be used, or even be covered with insulating barrier
Metal.
Embodiment two
The present embodiment two and the identical technology contents not repeated description of embodiment one, embodiment one are public
The content opened falls within the disclosure of the present embodiment two, and the present embodiment two is in embodiment one
On the basis of do further refinement gained.
First, the material of carrier 1 can be plastics in the present embodiment.Such as PC plastics, i.e. carrier
1 is obtained by PC injection moldings.The shaping of PC plastics has that shrinkage factor is low, intensity is high,
The characteristics of fatigue durability, dimensionally stable, few creep, and in temperature wider and humidity model
There is the electrical insulating property of stabilization in enclosing.Additionally, the coil panel being made of PC plastics is than traditional
Coil panel is more frivolous.Certainly, carrier 1 can also be exhausted using other according to demand in the present embodiment
The good plastics of edge, such as polyphenylene oxide or engineering plastics.In addition to plastics, in the present embodiment
The material of carrier 1 is also coated with the metal of insulating barrier widenable to ceramics or selection, it is ensured that its
Electrical insulating property with stabilization.
Secondly, the present embodiment carries out activation process so as to realize making by the inner surface to wire casing 3
Attachment layer of precious metal 6.Wherein, noble metal refer mainly to gold, silver and platinum group metal (ruthenium, rhodium,
Palladium, osmium, iridium, platinum) etc. 8 kinds of metallic elements.
The concrete mode of the activation process is：The carrier 1 of coil panel is immersed in activating solution, it is living
Changing liquid includes precious metal chemical complex, concentrated acid, reducing agent and complexing agent.Precious metal chemical complex can be with
It is palladium bichloride or silver chlorate, concentrated acid can be concentrated hydrochloric acid or the concentrated sulfuric acid, and reducing agent can be
Stannous chloride, complexing agent can be received for citric acid, Cymag, sodium tartrate or sodium pyrophosphate.
Wherein, concentrated acid is used to dissolve precious metal chemical complex；Reducing agent is used to reduce precious metal chemical complex
The inner surface of wire casing 3 is attached into layer of precious metal 6；Complexing agent is by precious metal chemical complex and reduction
Agent is maintained at suspended state so that precious metal chemical complex and reducing agent do not occur in solution state
, only just there is redox reaction when being contacted with the inner surface of wire casing 3 in redox reaction.
It is corresponding, a kind of method of concrete configuration activating solution that the present embodiment is also provided：By PdCl2
Solution is dissolved in the mixed solution of dense HCL and distilled water, then to adding SnCl in the mixed liquor2,
Form the first mixed liquor；Take citric acid receive, NaCN, sodium tartrate or sodium pyrophosphate are dissolved in distillation
In water, the second mixed liquor is formed；First mixed liquor is mixed with the stirring of the second mixed liquor, is formed
Activating solution.
In the present embodiment, wire casing 3 is carried out around thread path according to predetermined by laser to carrier 1
Engraving treatment is formed, so can online Slot shaping while form coarse in the inner surface of wire casing
Face so that layer of precious metal 6 can uniform and firmly be attached to the inner surface of wire casing 3.
It is worth noting that, the process for carrying out laser engraving treatment to wire casing 3 in the present embodiment is (i.e.
It is roughened the process for the treatment of) while being also the process of the shaping of wire casing 3.Carried out to wire casing 3
Before roughening treatment, this wire casing 3 is on the carrier 1 virtual presence, on the carrier 1
The wire casing 3 of physical presence can not be seen.It is this to be formed on the surface of carrier 1 by laser engraving
The rectangular shape in the cross section of wire casing 3, the width of wire casing 3 is much larger than its depth.In general,
The depth of this wire casing 3 is generally several microns, and its width range is 0.2mm~10mm,
Spacing range between adjacent wire casing 3 is 0.2mm~10mm.
Finally, the structure of the conductive layer 2 in the present embodiment can also further optimize.For example：
Conductive layer 2 at least includes the first conductive layer, and the first conductive layer is attached to by way of chemical plating
On layer of precious metal 6.Certainly, conductive layer 2 also includes the second conductive layer, and the second conductive layer passes through
The mode of plating is attached on the first conductive layer.
Wherein, the mode of chemical plating is：Carrier 1 is immersed in chemical plating fluid, in wire casing 3
Under the layer of precious metal 6 of upper attachment is catalyzed, by there is oxygen in the conductive metal ion in chemical plating fluid
Change the inner surface that reduction reaction is attached to wire casing 3, form the first conductive layer.This chemical plating
Mode is easier to be firmly attached the first conductive layer on very thin layer of precious metal 6, and
So that the follow-up mode more easily by plating adheres to the second conductive layer on the first conductive layer, but
The thickness of the first conductive layer that chemical plating can adhere to is very thin, can only adapt to coil panel small-power and add
The situation of heat., it is necessary to pass through the side of plating when coil panel needs to realize high-power heating
Formula adheres to the second conductive layer on the first conductive layer, because being led by the second of plating mode attachment
Electric layer thickness is than larger, and attachment speed is fast.The mode of plated second conductive layer is will be described
In by the carrier immersion electroplate liquid of chemical plating, the conductive metal ion in electroplate liquid is in electricity
There is redox reaction in the presence of stream, generation conductive metal particle is attached to the first conductive layer,
Form the second conductive layer.
The material that conductive layer 2 is used in the present embodiment is copper, because copper has good electric conductivity.
Certain conductive layer 2 can also be using other electric good conductor materials such as silver or aluminium.
As shown in fig. 7, when conductive layer 2 is led using the oxidation proof propertiess such as copper or silver are poor
During electric material, in addition it is also necessary in the outer attachment antioxidation coating 5 of conductive layer 2, i.e., in the second conductive layer peripheral hardware
Antioxidation coating 5 is equipped with, to prevent the electric conductivity of the oxidation influence conductive layer 2 of conductive layer 2.When
When conductive layer 2 is using the oxidation proof propertiess such as aluminium relatively good material, it is also possible to be not provided with anti-oxidation
Layer 5.The material of antioxidation coating 5 is nickel, or one kind in nickel, silver, aluminium and gold or
It is arbitrarily several to be mixed to form.
Specifically, the thickness of the first conductive layer is 5um-10um, the thickness of the second conductive layer
It is 40um-70um, the thickness of antioxidation coating 5 is 5um-10um.Certainly can also be according to reality
Border situation requirement is done accordingly to the thickness of the first conductive layer, the second conductive layer and antioxidation coating 5
Adjustment.
With reference to shown in Fig. 3 to Fig. 6, carrier 1 has through-thickness relative in the present embodiment
First mounting surface and the second mounting surface, wire casing 3 include the First Line being arranged on the first mounting surface
Groove 3, and it is arranged at the second wire casing 3 on the second mounting surface.Coil panel could be arranged to one side
The shape of wire casing 3 or the shape of two-sided wire casing 3, the i.e. one or two sides of carrier 1 can be set wire casing 3,
Conductive layer 2 is respectively provided with wire casing 3.Using this scheme, because the both sides of coil panel are provided with
The coil of the coiling of conductive layer 2, therefore can be in the case of the constancy of volume of coil panel carrier 1, will
The heating power of coil panel is improved will by about one time.
Embodiment three
Similarly, the present embodiment three is no longer gone to live in the household of one's in-laws on getting married with embodiment one, the identical technology contents of embodiment two
State, the difference of the present embodiment three and embodiment two is the molding mode of wire casing 3, can specifically be led to
Contrast the present embodiment is crossed to be understood with above-described embodiment two, it is as follows：
The wire casing 3 of above-described embodiment two is (i.e. laser carving being roughened to carrier 1
Quarter process) while formed；And the wire casing 3 in the present embodiment is then in the same of the shaping of carrier 1
When formed or carrier 1 shaping after by cutter engraving process (such as CNC processing) formation,
Wire casing 3 is roughened again afterwards.Specifically, when the material of carrier is plastics,
Can be in the inner surface setting of mould according to the predetermined bulge loop extended around thread path, thus can be with
Formed according to the predetermined line extended around thread path on the surface of carrier while carrier injection moulding
Groove.The depth of wire casing 3 is generally several microns in above-described embodiment two；And in the present embodiment
The depth of wire casing 3 typically has several millimeters.So that the cross section of wire casing 3 is rectangular as an example, in wire casing 3
In the case of identical A/F, the attachment surface of conductive layer 2 in above-described embodiment two is only
The bottom wall of wire casing 3；And the attachment surface of the present embodiment conductive layer 2 is in addition to the bottom wall of wire casing 3
Also add two side walls of wire casing 3.I.e. the cross-sectional width of conductive layer 2 is big in the present embodiment
The width of conductive layer 2 in above-described embodiment two, in the case of the thickness identical of conductive layer 2,
In the present embodiment the cross-sectional area of conductive layer 2 more than in above-described embodiment two conductive layer 2 it is transversal
Area.It can be seen from resistance formula R=ρ .L/S, in the case where resistivity number of turns is constant,
Increase cross-sectional area can reduce resistance.According to horse-power formula P=U2/R, in the feelings that voltage is constant
Under condition, resistance is reduced, the heating power of coil panel can be improved.
The wire casing 3 formed using both modes, the inner surface smoother of wire casing 3, if right
Activation process is directly carried out to wire casing 3, layer of precious metal 6 is relatively difficult to be uniformly adhered to wire casing 3
Inner surface.One preferred scheme of the present embodiment is that wire casing 3 is carried out before activation process
Roughening treatment, mat surface is formed with the inner surface of wire casing so that layer of precious metal 6 can be uniform
And the firm inner surface for being attached to wire casing 3.The roughening that the present embodiment is provided is processed as using and swashs
Light carries out engraving treatment according to the bearing of trend of wire casing to wire casing.Certainly can also be thick using chemistry
Rough facture.The roughening that wire casing can be just completed for the ease of only passing through laser engraving is processed,
The shape of cross section of wire casing 3 is the expansion shape gradually broadened to notch from its bottom land in the present embodiment,
I.e. from direction from the bottom land of wire casing to notch, the side wall of wire casing both sides expands outwardly respectively, the shape
The wire casing 3 of shape ensure that laser while being engraved into the bottom wall and two side walls of wire casing 3.
Preferably, the cross section of wire casing 3 is preferably inverted trapezoidal, del or semicircular arc.
When laser carries out laser engraving roughening treatment to the wire casing 3 of these shapes, laser can shine simultaneously
The bottom wall and two side walls of wire casing 3 are mapped to, i.e., being irradiated by a laser can just complete wire casing 3
Roughening treatment.And be the wire casing 3 of rectangle for cross section, laser is carried out once to wire casing 3
Expose to it is many can only be while process a side wall and a bottom wall of wire casing 3, it is difficult to locate simultaneously
The bottom wall and two side walls of wire casing 3 are managed, i.e., for cross section for the wire casing 3 of rectangle is at least needed
To irradiate the roughening treatment that could complete wire casing 3 by laser twice.
With reference to shown in Fig. 4, Fig. 6, the cross section of the present embodiment wire casing 3 in isosceles trapezoid shape,
The side wall of wire casing 3 and the angular range of bottom wall normal direction are 15 °~75 °.The thickness h of carrier 1
It is 2-8mm, the width range L1 of the bottom wall of wire casing 3 is 0.5mm~1.5mm, the depth of wire casing 3
Degree scope is 2mm~8mm.There is isolation bar, the horizontal stroke of isolation bar between two neighboring wire casing 3
Section is in isosceles trapezoid, and the width range L2 at the top of isolation bar is 0.2mm~1.0mm.It is above-mentioned
The setting of parameter, can both cause that the coil in wire casing had good electric conductivity, and line is caused again
There is good insulating properties between circle adjacent turn.
It can be seen that, in the present embodiment, carrier 1 is formed first with plastic grain injection moulding, while
Wire casing 3, i.e. wire casing 3 and the integrated injection molding of carrier 1 are formed during carrier 1 is molded.
The surface of wire casing 3 is the mat surface for adsorbing layer of precious metal 6, is labored to the surface of wire casing 3
Roughening treatment is done before change treatment to carrier 1.When roughening is processed as the treatment of laser laser carving,
Wire casing 3 is formed during laser laser carving treatment is carried out to carrier 1.Specifically, by making
With laser machine on obtained carrier 1 laser engraving wire casing 3 obtaining for adsorbing noble metal
The mat surface of layer 6.Can be according to different demands, the number of turns of radium-shine different wire casing 3, then
Activation process is carried out to carrier 1, layer of precious metal 6 is formed in the inner surface of wire casing 3, utilized
Mat surface forms strong absorption affinity, is allowed to contact more firm with layer of precious metal 6.
Example IV
The present embodiment four is gone back on the basis of above-described embodiment one, embodiment two and embodiment three
There is provided a kind of method for making above-mentioned coil panel, following steps are specifically included：
S1, carrier 1 are molded；Specifically, when the material of carrier 1 is plastics, by what is melted
Plastics injection mould forms carrier；When the material of carrier 1 is for ceramics, porcelain mud is first passed through into mould
Tool is squeezed into blank, then sinters blank into carrier again；When the material of carrier 1 is exhausted to coat
During the metal of edge material, first by metal material punch forming, then on metal by spraying or
The mode of person's injection forms insulating barrier.
S2, wire casing shaping, form according to the predetermined wire casing extended around thread path on the carrier；
Further, the wire casing in step S2 be shaped to laser according to it is predetermined around thread path to carrier
Laser carving treatment is carried out, to form inner surface as the wire casing of mat surface.It is molded in formation wire casing 3
While roughening treatment has been done to wire casing
In addition, the wire casing 3 can also carrier 1 shaping after, with cutter according to it is predetermined around
Thread path carries out engraving treatment and is formed to carrier 1, such as carry out CNC processing, CNC to carrier 1
Machining locus are predetermined around thread path.Or wire casing 3 can also be while carrier 1 be molded
Formed.The forming process of carrier 1 includes：By carrier material put into mould in, the interior table of mould
Face is provided with according to the predetermined bulge loop extended around thread path, with while carrier is molded in carrier
Surface stamp out according to the predetermined wire casing extended around thread path.Formed using both modes
Wire casing, with respect to the wire casing that laser laser carving is formed, can be in the constant feelings of support surface area
Under condition, increase the area that wire casing adheres to conductive layer, so as to reduce the resistance of coil.
S3, activation process, the carrier 1 is immersed in activating solution, and activating solution includes noble metal
Compound, the precious metal ion in precious metal chemical complex is reduced to fine particle of noble metal and adsorbs
On the inner surface of the wire casing 3, to form layer of precious metal 6；
The activating solution also includes concentrated acid, reducing agent and complexing agent.It is corresponding, it is living in step S3
Change liquid collocation method be：S31, noble metal compound solution is dissolved in concentrated acid solution, then to
Reducing agent is wherein added, the first mixed liquor is formed；S32, the addition complexing in the first mixed liquor
Agent.Wherein, precious metal chemical complex is palladium bichloride or silver chlorate, and concentrated acid is concentrated hydrochloric acid or dense sulphur
Acid, reducing agent is stannous chloride, and complexing agent is received for citric acid, Cymag, sodium tartrate or Jiao
Sodium phosphate.
Step S3 can be specifically expanded on further by following preferred embodiment：By 0.3gPdCl2
Solution is dissolved in the mixed solution of the dense HCL and 10ml distilled water of 10ml, then is added thereto to
12gSnCl2, form the first mixed liquor；Take again 250g citric acids receive, NaCN, sodium tartrate
Or sodium pyrophosphate is dissolved in 1.5L distilled water, the second mixed liquor is formed；By the first mixed liquor and
The stirring mixing of two mixed liquors.First mixed liquor and the second mixed liquor are stirred continuously mixing, are obtained final product
This time activation colloid is arrived.Wherein sodium citrate Main Function is to play a part of stabilizer, network
Close Sn2+, prevent Sn2+It is oxidized to Sn4+。
S4, the attachment conductive layer 2 on layer of precious metal 6.
Following steps (referring to following table) are specifically included in step S4：
S41, the carrier 1 for cleaning activated treatment；Specifically can be by water under high pressure in 20-30 DEG C of bar
Part is cleaned, and is preferably 25 DEG C, and certainly, the temperature range is not limited to.
S42, carrier 1 are immersed in chemical plating fluid, and the conductive metal ion in chemical plating fluid is expensive
There is redox reaction under the catalytic action of metal level, generation conductive metal particle attachment is online
On groove 3, so as to form the first conductive layer；Further, the implementation temperature in step S42 can
When electing 40 DEG C -60 DEG C as, preferably 52 DEG C, certainly, the temperature range is not limited to.And,
The time control of chemical plating at 60-90 minutes, with realize fully reaction.
S43, by the carrier immersion electroplate liquid by chemical plating, in the electroplate liquid
Conductive metal ion there is redox reaction in the presence of electric current, generation conducting metal is micro-
Grain is attached to first conductive layer and forms the second conductive layer, it is preferred that the reality in step S43
Apply temperature and be chosen as 20-60 DEG C, certainly, the temperature range is equally also not limited to this, and,
According to the difference of plated material, different reaction time, when electro-coppering, time control are controlled
At 60-90 minutes；When electronickelling, time control was at 10-20 minutes.
S44, the carrier 1 that will plate the second conductive layer are dried, specifically, passing through drying cupboard
It is selected in when temperature is 100 DEG C and carrier 1 is dried.
Additionally, after the completion of step S43, when temperature is 55 DEG C -60 DEG C, in the second conductive layer
On form antioxidation coating 5 by way of plating, then the carrier 1 after antioxidation coating 5 will have been plated
It is dried.
Conductive layer metallization process table
As the above analysis, the method for the present embodiment offer making coil panel can reduce carrier 1
Material requirements.Compared to the existing selectivity depositing process technology LDS (English based on laser
Entitled Laser Direct Structuring, Chinese entitled laser direct structuring technique) for, its
Advantage is apparent.In the surface attachment noble metal of carrier 1 first by way of activation process
Layer 6, then adheres to conductive layer 2 so that the material requirements to carrier 1 is big on layer of precious metal 6
It is big to reduce, common plasticses and ceramics, the metal of insulating layer coating of applicable multiple types and color
Material, cost is lower.
Embodiment five
The present embodiment also provides a kind of electromagnetic heating apparatus, wherein, including embodiment one is to implementation
Coil panel in example three.I.e. the coil panel includes：The coil panel includes carrier 1, is set on carrier 1
Have according to the predetermined wire casing 3 extended around thread path, the inner surface of wire casing 3 is attached with through at overactivation
The layer of precious metal 6 for being formed is managed, conductive layer 2 is attached with layer of precious metal 6.Coil panel carrier 1
Material and molding mode, the molding mode of wire casing 3, the composition and conductive layer 2 of conductive layer 2 are attached
The mode etc. in the inwall of wire casing 3 is referred to the description of above coil panel, no longer goes to live in the household of one's in-laws on getting married herein
State.Additionally, coil panel progress can also be improved, for example：At the two ends of conductive layer 2 of coil panel
Block 4 is additionally provided with, block 4 can be as terminals, and its material can be copper, or
Other conductive materials.
The electromagnetic heating apparatus include electromagnetic heating apparatus be electromagnetic oven, decoct strike-machine, soy bean milk making machine,
Electric kettle, coffee machine, electrical boiler, electric cooker or electric pressure cooking saucepan.For electromagnetic oven,
Coil panel and power amplifier board that embodiment one, embodiment two or embodiment three are provided, motherboard,
Lamp plate (manipulation display board), temperature controller, temperature-sensitive support, blower fan, power line, furnace panel (porcelain
Plate, black brilliant plate), plastic cement upper and lower covers etc. assemble and can be formed by a complete electromagnetic oven.
What deserves to be explained is, the product according to concrete application is different, the shape of coil panel carrier 1
Have different changes.Such as electromagnetic oven and electric kettle, coil panel carrier 1
Shape is generally discoid.For electric cooker and electric pressure cooking saucepan, the shape of coil panel carrier 1
Shape is then for hollow hemispherical, it may also be said in bowl-shape.And if it is desired that obtain coil panel carrier 1
Directly to the interior pot side wall heating of electric cooker and electric pressure cooking saucepan, coil panel carrier 1 can be with
It is cylindrical shape, i.e., hollow is cylindric.Disk i.e. in coil panel is not to the shape structure of coil panel
Into any restriction in addition., with embodiment one to example IV, here is omitted for other.
In sum, the present invention provides a kind of coil panel and preparation method thereof, electromagnetic heating apparatus,
In the coiling directly on a surface of carrier by way of adhering to conductive metal layer, compared to existing
It has the following technical effect that technology：
First, wire winding is simple, it is not necessary to the stopper slot of clamping coil is set on carrier, is determined
The structure of position muscle etc so that the structure of carrier is more simple.
2nd, coil form is versatile and flexible, can be variously-shaped come coiling according to the demand of user
Coil, the characteristics of with Flexible Production.
3rd, production efficiency is high, the more conventional coiling COPPER WIRES PRODUCTION line of the manufacture efficiency of the coil panel
The mode for enclosing disk is much higher, beneficial to volume production.
4th, reduce carrier material requirements, the coil panel first by way of activation process
The surface attachment layer of precious metal of carrier, then adheres to conductive layer on layer of precious metal so as to carrying
The material requirements of body is substantially reduced.
5th, easy to use and safety coefficient is high, the coil panel is compared to traditional coiling enamel-covered wire
Mode, its deficient manufacturing procedure that can realize avoiding the occurrence of wire jumper, scratch, short-term in use
Problem, it has the advantages that safety coefficient is high and energy-saving consumption-reducing.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, and
It is non-that it is limited；Although being described in detail to the present invention with reference to the foregoing embodiments, ability
The those of ordinary skill in domain should be understood：It still can be to the skill described in foregoing embodiments
Art scheme is modified, or carries out equivalent to which part technical characteristic；And these are repaiied
Change or replace, the essence of appropriate technical solution is departed from various embodiments of the present invention technical side
The spirit and scope of case.
Claims (17)
1. a kind of coil panel, it is characterised in that：Including carrier, the carrier is provided with according to pre-
The fixed wire casing extended around thread path, the surface attachment of the wire casing has what is formed by activation process
Layer of precious metal, conductive layer is attached with the layer of precious metal.
2. coil panel according to claim 1, it is characterised in that：The conductive layer is at least
Including the first conductive layer, first conductive layer is attached to your gold by way of chemical plating
On category layer.
3. coil panel according to claim 2, it is characterised in that：The conductive layer is also wrapped
The second conductive layer is included, it is conductive that second conductive layer is attached to described first by way of plating
On layer.
4. coil panel according to claim 1, it is characterised in that：On the conductive layer also
It is attached with antioxidation coating.
5. the coil panel according to claim 1-4 any one, it is characterised in that：It is described
Wire casing is to carry out engraving formation to the carrier around thread path according to predetermined by laser.
6. the coil panel according to claim 1-4 any one, it is characterised in that：It is described
Wire casing is formed simultaneously in the carrier forming process or the wire casing passes through after carrier shaping
Cutter is carved to be formed, from direction from the bottom land of the wire casing to notch, the side of the wire casing both sides
Wall is expanded outwardly respectively.
7. coil panel according to claim 6, it is characterised in that：The interior table of the wire casing
Face is mat surface, and the mat surface is roughened to be formed by the inner surface to wire casing.
8. coil panel according to claim 6, it is characterised in that：The wire casing it is transversal
Face is in inverted trapezoidal shape, upside-down triangle shape or semicircle arcuation.
9. the coil panel according to claim 1-4,7-8 any one, it is characterised in that：
The carrier has two relative mounting surfaces of through-thickness, and the wire casing is included according to first
Predetermined the first wire casing being disposed therein around thread path on a mounting surface, and it is pre- according to second
Fixed the second wire casing being arranged on around thread path on another mounting surface.
10. coil panel according to claim 9, it is characterised in that：The material of the carrier
Matter is the metal that plastics, ceramics or outside are coated with insulating barrier.
A kind of 11. electromagnetic heating apparatus, it is characterised in that：It is any including such as claim 1-10
Coil panel described in one, the coil panel is used for Electromagnetic Heating.
A kind of 12. preparation methods of coil panel, it is characterised in that comprise the following steps for：
S1, carrier shaping；
S2, wire casing shaping, form according to the predetermined wire casing extended around thread path on the carrier；
S3, activation process, the carrier is immersed in activating solution, and the activating solution includes expensive
Metallic compound, the precious metal ion in precious metal chemical complex is reduced to fine particle of noble metal and inhales
It is attached on the inner surface of the wire casing, to form layer of precious metal；
S4, on the layer of precious metal adhere to conductive layer.
The preparation method of 13. coil panels according to claim 12, it is characterised in that：Step
The step of wire casing in rapid S2 is molded is that the carrier is entered around thread path according to predetermined with laser
Row laser carving treatment, to form inner surface as the wire casing of mat surface.
The preparation method of 14. coil panels according to claim 12, it is characterised in that：Institute
Stating the shaping of the wire casing in step S2 includes：With cutter according to it is predetermined around thread path to the shaping
Carrier carry out engraving treatment；
Or the wire casing shaping in the step S2 is shaped to together with the carrier in the step S1
One step, the step S1 carriers shaping includes：By carrier material put into mould in, the mould
The inner surface of tool is provided with according to the predetermined bulge loop extended around thread path, same with what is be molded in carrier
When stamped out according to the predetermined wire casing extended around thread path on the surface of carrier.
The preparation method of 15. coil panels according to claim 14, it is characterised in that：
Also including roughening treatment between the activation process in wire casing shaping and step S3 in step S2：
The roughening is processed as to carrying out laser laser carving according to the predetermined wire casing extended around thread path
Treatment.
The preparation method of 16. coil panels according to claim 12, it is characterised in that：Step
Adhering to conductive layer on the layer of precious metal in rapid S4 includes：
S42, the carrier are immersed in chemical plating fluid, and the conductive metal ion in chemical plating fluid exists
There is redox reaction under the catalytic action of layer of precious metal, generation conductive metal particle is attached to
On the wire casing, the first conductive layer is formed；
S43, by the carrier immersion electroplate liquid by chemical plating, in the electroplate liquid
Conductive metal ion there is redox reaction in the presence of electric current, generation conducting metal is micro-
Grain is attached to first conductive layer, forms the second conductive layer.
The preparation method of 17. coil panels according to claim 12, it is characterised in that：Step
Rapid S4 also includes after attachment conductive layer on the layer of precious metal：In the conductive layer by electricity
Plating mode adheres to antioxidation coating.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510828701.9A CN106804069B (en) | 2015-11-25 | 2015-11-25 | Coil disc, manufacturing method thereof and electromagnetic heating equipment |
| PCT/CN2015/096054 WO2017088197A1 (en) | 2015-11-25 | 2015-11-30 | Coil disc and manufacturing method therefor, and electromagnetic heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510828701.9A CN106804069B (en) | 2015-11-25 | 2015-11-25 | Coil disc, manufacturing method thereof and electromagnetic heating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106804069A true CN106804069A (en) | 2017-06-06 |
| CN106804069B CN106804069B (en) | 2023-04-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510828701.9A Active CN106804069B (en) | 2015-11-25 | 2015-11-25 | Coil disc, manufacturing method thereof and electromagnetic heating equipment |
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| Country | Link |
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| CN (1) | CN106804069B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106900098A (en) * | 2015-12-21 | 2017-06-27 | 佛山市顺德区美的电热电器制造有限公司 | A kind of coil panel and preparation method thereof, electromagnetic heating apparatus |
| CN109309977A (en) * | 2017-07-28 | 2019-02-05 | 佛山市顺德区美的电热电器制造有限公司 | Coil panel and its manufacturing method, electromagnetic cooking appliance for electromagnetic cooking appliance |
| CN109309978A (en) * | 2017-07-28 | 2019-02-05 | 佛山市顺德区美的电热电器制造有限公司 | Coil panel and its manufacturing method, the electromagnetic cooking appliance with the coil panel |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102906306A (en) * | 2010-03-19 | 2013-01-30 | 恩索恩公司 | Method for direct metallization of non-conductive substrates |
| TW201332405A (en) * | 2012-01-19 | 2013-08-01 | Kuang Hong Prec Co Ltd | Circuit substrate structure and method of manufacturing the same |
| CN104465067A (en) * | 2014-11-18 | 2015-03-25 | 东莞劲胜精密组件股份有限公司 | Wireless charging coil manufacturing method and wireless charging structure |
| CN205249519U (en) * | 2015-11-25 | 2016-05-18 | 佛山市顺德区美的电热电器制造有限公司 | Coil panel and electromagnetic heating equipment |
-
2015
- 2015-11-25 CN CN201510828701.9A patent/CN106804069B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102906306A (en) * | 2010-03-19 | 2013-01-30 | 恩索恩公司 | Method for direct metallization of non-conductive substrates |
| TW201332405A (en) * | 2012-01-19 | 2013-08-01 | Kuang Hong Prec Co Ltd | Circuit substrate structure and method of manufacturing the same |
| CN104465067A (en) * | 2014-11-18 | 2015-03-25 | 东莞劲胜精密组件股份有限公司 | Wireless charging coil manufacturing method and wireless charging structure |
| CN205249519U (en) * | 2015-11-25 | 2016-05-18 | 佛山市顺德区美的电热电器制造有限公司 | Coil panel and electromagnetic heating equipment |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106900098A (en) * | 2015-12-21 | 2017-06-27 | 佛山市顺德区美的电热电器制造有限公司 | A kind of coil panel and preparation method thereof, electromagnetic heating apparatus |
| CN109309977A (en) * | 2017-07-28 | 2019-02-05 | 佛山市顺德区美的电热电器制造有限公司 | Coil panel and its manufacturing method, electromagnetic cooking appliance for electromagnetic cooking appliance |
| CN109309978A (en) * | 2017-07-28 | 2019-02-05 | 佛山市顺德区美的电热电器制造有限公司 | Coil panel and its manufacturing method, the electromagnetic cooking appliance with the coil panel |
| CN109309977B (en) * | 2017-07-28 | 2021-10-26 | 佛山市顺德区美的电热电器制造有限公司 | Coil panel for electromagnetic cooking appliance, manufacturing method of coil panel and electromagnetic cooking appliance |
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| Publication number | Publication date |
|---|---|
| CN106804069B (en) | 2023-04-18 |
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