CN103002673B - A kind of manufacture method of aluminium base and line layer conduction panel - Google Patents
A kind of manufacture method of aluminium base and line layer conduction panel Download PDFInfo
- Publication number
- CN103002673B CN103002673B CN201210561485.2A CN201210561485A CN103002673B CN 103002673 B CN103002673 B CN 103002673B CN 201210561485 A CN201210561485 A CN 201210561485A CN 103002673 B CN103002673 B CN 103002673B
- Authority
- CN
- China
- Prior art keywords
- aluminium base
- consent
- line layer
- silver
- bearing copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of manufacture method of aluminium base and line layer conduction panel; wherein; described manufacture method comprises: by substrate drilling blind hole, uses low resistance conductive silver-bearing copper slurry consent, and uses the high Plate grinder plate silver-bearing copper slurry that cuts to polish after consent; simultaneously; for ensureing that silver-bearing copper slurry makes not contaminated in rear flow process or stings erosion, plate being done a graphic plating, silver-bearing copper being starched and above covers the uniform copper facing of one deck; thus effectively protect silver-bearing copper slurry, and make aluminium base with line layer conducting.It optimizes Making programme, reduces production cost, avoids the aluminium base direct contact plating liquid medicine of via, cause corrosion; It can adopt conventional PCB equipment directly to produce, and improves production efficiency, meanwhile, also improves the reliability of product via, meets quality requirements.
Description
Technical field
The present invention relates to aluminum-substrate printed circuit plate manufacture technology field, particularly relate to a kind of by the manufacture method of the aluminium base and line layer conduction panel of aluminium base, line layer conducting.
Background technology
Along with the development of electron trade, the copper-clad plate of high heat radiating metal base obtains applying more and more widely, as the figure of metal substrate has all appearred in the fields such as integrated circuit, automobile, office automation, high-power electric appliance equipment, power-supply device, LED illumination.Compare FR-4 tradition hardboard, Metal Substrate has the thermal conductivity of nearly more than 10 times, high-breakdown-voltage, high body surface resistivity, high-dimensional stability and the excellent excellent properties such as high temperature resistant, meets trend and demand that high-frequency microelectronics develops.A kind of aluminium base that need make special process is also applied and gives birth to---the handtailor plate (i.e. aluminium base and line layer conduction panel) of aluminium base, line layer conducting.
At present, aluminium base and line layer conduction panel aluminium base via in the industry traditional manufacturing technique be galvanoplastic: after namely to aluminium substrate boring, by hardware factory's electro-coppering of specialty, then carry out heavy copper, plate electric treatment.Described galvanoplastic making is aluminium base exists following shortcoming with line layer conduction panel:
1, because aluminium is amphoteric oxide, can not direct contact plating liquid medicine, first need do special processing, flow process is more complicated;
2, general PCB factory cannot produce, and affects manufacturing schedule;
3, coating reliability is difficult to ensure, affects quality;
4, the production cycle is longer, and production cost is high.
In view of this, prior art haves much room for improvement and improves.
Summary of the invention
In view of the deficiencies in the prior art, the object of the invention is to provide a kind of manufacture method of aluminium base and line layer conduction panel.The flow process being intended to exist when adopting galvanoplastic to produce aluminium base and line layer conduction panel in solution prior art is complicated, production cost is high, product quality is difficult to the problems such as guarantee.
Technical scheme of the present invention is as follows:
A manufacture method for aluminium base and line layer conduction panel, wherein, said method comprising the steps of:
S1, get out blind hole at line layer and the aluminium base conduction position that needs;
S2, making consent aluminium flake half tone, aluminium flake aperture large 0.1mm more monolateral than consent aperture;
S3, use screen printer carry out consent, and ensureing that consent is full does not have bubble;
S4, consent are complete carries out baking sheet, and the parameter of baking sheet is: 150 DEG C of * 60min;
Use the high heavy-duty abrasive machine that cuts to polish to circuit surface after S5, baking sheet, consent silver-bearing copper is starched smooth;
S6, the circuit surface of having polished is carried out graphic plating once;
S7, subsequent treatment is carried out to the product after plating, generate aluminium base and line layer conduction panel.
The manufacture method of described aluminium base and line layer conduction panel, wherein, in described step S1, the degree of depth of blind hole is 0.3mm ~ 0.5mm.
The manufacture method of described aluminium base and line layer conduction panel, wherein, in described step S4, uses cabinet type baking box or continuous tunnel furnace to carry out baking sheet.
The manufacture method of described aluminium base and line layer conduction panel, wherein, in described step S6, during graphic plating, copper facing THICKNESS CONTROL is more than 15 μm.
Beneficial effect:
The manufacture method of the aluminium base and line layer conduction panel of the application, optimizes Making programme, reduces production cost, avoids the aluminium base direct contact plating liquid medicine of via, cause corrosion; It can adopt conventional PCB equipment directly to produce, and improves production efficiency, meanwhile, also improves the reliability of product via, meets quality requirements.
Accompanying drawing explanation
Fig. 1 is the flow chart of the manufacture method of aluminium base and line layer conduction panel of the present invention.
Embodiment
The invention provides a kind of manufacture method of aluminium base and line layer conduction panel, for making object of the present invention, technical scheme and effect clearly, clearly, the present invention is described in more detail below.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Refer to Fig. 1, it is the flow chart of the manufacture method of aluminium base and line layer conduction panel of the present invention.As shown in the figure, described aluminium base and manufacture method that is line layer conduction panel comprises the following steps:
S1, get out blind hole at line layer and the aluminium base conduction position that needs;
S2, making consent aluminium flake half tone, aluminium flake aperture large 0.1mm more monolateral than consent aperture;
S3, use screen printer carry out consent, and ensureing that consent is full does not have bubble;
S4, consent are complete carries out baking sheet, and the parameter of baking sheet is: 150 DEG C of * 60min;
Use the high heavy-duty abrasive machine that cuts to polish to circuit surface after S5, baking sheet, consent silver-bearing copper is starched smooth;
S6, the circuit surface of having polished is carried out graphic plating once;
S7, subsequent treatment is carried out to the product after plating, generate aluminium base and line layer conduction panel.
Be specifically described for above-mentioned steps respectively below:
Described step S1 gets out blind hole at line layer and the aluminium base conduction position that needs.In the present embodiment, it adopts drilling machine to get out blind hole at line layer and the aluminium base conduction position that needs, and rule of thumb, the degree of depth of blind hole is that 0.3mm ~ 0.5mm is for best.
Described step S2 is for making consent aluminium flake half tone, aluminium flake aperture large 0.1mm more monolateral than consent aperture.Then, use screen printer to carry out consent in step s3, ensureing that consent is full does not have bubble.To be that consent is complete carry out baking sheet to step S4, and the parameter of baking sheet is: 150 DEG C of * 60min.In the present embodiment, cabinet type baking box or continuous tunnel furnace is used to carry out baking sheet.Step S5 uses the high heavy-duty abrasive machine that cuts to polish to circuit surface after baking sheet, consent silver-bearing copper is starched smooth.Then, in step s 6 the circuit surface of having polished is carried out graphic plating once, in the present embodiment, copper facing THICKNESS CONTROL is more than 15 μm, and making silver-bearing copper starch surface has the uniform copper plate protection of one deck, in case the pollution of rear flow process.Then, subsequent treatment is carried out to the product after plating, generate aluminium base and line layer conduction panel.Its subsequent processes is same as the prior art, has just repeated no more here.
In short, key point of the present invention is:
1, by substrate drilling blind hole, low resistance conductive silver-bearing copper slurry consent is used;
2, the high Plate grinder plate silver-bearing copper slurry that cuts is used to polish after consent;
3, for ensureing that silver-bearing copper slurry makes not contaminated in rear flow process or stings erosion, plate being done a graphic plating, silver-bearing copper being starched and above covers the uniform copper facing of one deck, thus effectively protecting silver-bearing copper slurry, and make aluminium base with line layer conducting.
This kind of manufacture method substantially reduces the Making programme of via, improves production efficiency, reduces production cost, and this manufacture method also improves the reliability of electrodeposited coating simultaneously, ensure that quality., in manufacture method of the present invention, preferably purchase low-resistance conduction silver-bearing copper slurry and use high cutting lapping machine with should be noted that.
In sum; the manufacture method of aluminium base and line layer conduction panel of the present invention, wherein, described manufacture method comprises: by substrate drilling blind hole; use low resistance conductive silver-bearing copper slurry consent; and use the high Plate grinder plate silver-bearing copper slurry that cuts to polish after consent, meanwhile, for ensureing that silver-bearing copper slurry makes not contaminated in rear flow process or stings erosion; plate is done a graphic plating; silver-bearing copper is starched and upper covers the uniform copper facing of one deck, thus effectively protect silver-bearing copper slurry, and make aluminium base with line layer conducting.It optimizes Making programme, reduces production cost, avoids the aluminium base direct contact plating liquid medicine of via, cause corrosion; It can adopt conventional PCB equipment directly to produce, and improves production efficiency, meanwhile, also improves the reliability of product via, meets quality requirements.
Should be understood that, application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection range that all should belong to claims of the present invention.
Claims (1)
1. a manufacture method for aluminium base and line layer conduction panel, is characterized in that, said method comprising the steps of:
S1, get out blind hole at line layer and the aluminium base conduction position that needs;
S2, making consent aluminium flake half tone, aluminium flake aperture large 0.1mm more monolateral than consent aperture;
S3, use screen printer carry out consent, and ensureing that consent is full does not have bubble;
S4, consent are complete carries out baking sheet, and the parameter of baking sheet is: 150 DEG C of * 60min;
Use the high heavy-duty abrasive machine that cuts to polish to circuit surface after S5, baking sheet, consent silver-bearing copper is starched smooth;
S6, the circuit surface of having polished is carried out graphic plating once;
S7, subsequent treatment is carried out to the product after plating, generate aluminium base and line layer conduction panel;
In described step S1, the degree of depth of blind hole is 0.3mm ~ 0.5mm;
In described step S6, during graphic plating, copper facing THICKNESS CONTROL is more than 15 μm, and making silver-bearing copper starch surface has the uniform copper plate of one deck; And make aluminium base with line layer conducting;
In described step S4, cabinet type baking box or continuous tunnel furnace is used to carry out baking sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210561485.2A CN103002673B (en) | 2012-12-21 | 2012-12-21 | A kind of manufacture method of aluminium base and line layer conduction panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210561485.2A CN103002673B (en) | 2012-12-21 | 2012-12-21 | A kind of manufacture method of aluminium base and line layer conduction panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103002673A CN103002673A (en) | 2013-03-27 |
| CN103002673B true CN103002673B (en) | 2015-11-04 |
Family
ID=47930644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210561485.2A Active CN103002673B (en) | 2012-12-21 | 2012-12-21 | A kind of manufacture method of aluminium base and line layer conduction panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103002673B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106572609A (en) * | 2016-11-04 | 2017-04-19 | 深圳市深联电路有限公司 | Manufacture method for manufacturing high-thermal-conductivity and single-sided aluminum substrate |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103442527A (en) * | 2013-09-03 | 2013-12-11 | 中国电子科技集团公司第五十四研究所 | Method for controlling height of slurry in hole in raw LTCC chip |
| CN104968154A (en) * | 2015-05-06 | 2015-10-07 | 刘地发 | Automatic production line of LED aluminum substrate |
| CN106559963A (en) * | 2016-11-17 | 2017-04-05 | 深圳崇达多层线路板有限公司 | A kind of method for plugging in PCB |
| CN108513457A (en) * | 2018-04-08 | 2018-09-07 | 景旺电子科技(龙川)有限公司 | Technique is connected with aluminium base in a kind of line layer |
| CN108925029A (en) * | 2018-07-30 | 2018-11-30 | 景旺电子科技(龙川)有限公司 | A kind of method and aluminium base printed board and preparation method thereof improving aluminium base printed board heat dissipation effect |
| CN110519915B (en) * | 2019-08-12 | 2024-03-19 | 珠海杰赛科技有限公司 | Blind buried hole printed circuit board and manufacturing method thereof |
| CN112135441A (en) * | 2020-10-09 | 2020-12-25 | 景旺电子科技(龙川)有限公司 | Grounding metal-based circuit board and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201383902Y (en) * | 2009-02-27 | 2010-01-13 | 深圳市博敏兴电子有限公司 | Metal-base printed wiring board |
| CN102215641A (en) * | 2011-05-04 | 2011-10-12 | 深圳市博敏电子有限公司 | Manufacturing process of high-density printed board with holes in pads |
| CN102387660A (en) * | 2011-10-31 | 2012-03-21 | 景旺电子（深圳）有限公司 | Metal base PCB (Printed Circuit Board) and production method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008103548A (en) * | 2006-10-19 | 2008-05-01 | Sumitomo Electric Ind Ltd | Multilayer printed wiring board, and its manufacturing method |
-
2012
- 2012-12-21 CN CN201210561485.2A patent/CN103002673B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201383902Y (en) * | 2009-02-27 | 2010-01-13 | 深圳市博敏兴电子有限公司 | Metal-base printed wiring board |
| CN102215641A (en) * | 2011-05-04 | 2011-10-12 | 深圳市博敏电子有限公司 | Manufacturing process of high-density printed board with holes in pads |
| CN102387660A (en) * | 2011-10-31 | 2012-03-21 | 景旺电子（深圳）有限公司 | Metal base PCB (Printed Circuit Board) and production method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106572609A (en) * | 2016-11-04 | 2017-04-19 | 深圳市深联电路有限公司 | Manufacture method for manufacturing high-thermal-conductivity and single-sided aluminum substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103002673A (en) | 2013-03-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103002673B (en) | A kind of manufacture method of aluminium base and line layer conduction panel | |
| CN103687312B (en) | Gold-plated method for manufacturing circuit board | |
| CN103249253B (en) | High-accuracy aluminium base circuit board manufacturing process and system thereof | |
| CN105183246B (en) | Capacitance type touch-control panel | |
| CN106550538A (en) | Board structure of circuit and processing method that a kind of metal derby is turned on internal layer circuit | |
| CN102497737A (en) | Method for manufacturing printed circuit board (PCB) with step-shaped grooves | |
| CN104582319A (en) | Metallized semi-hole forming method and printed circuit board manufacturing method | |
| CN104602452A (en) | Manufacturing method of circuit board | |
| CN103430133A (en) | Method for manufacturing pad for touch panel, and pad for touch panel manufactured by method | |
| CN101699932B (en) | Method for producing high thermal conductivity ceramic circuit board | |
| CN103619126A (en) | Method for manufacturing outer layer circuit of metal-based thick copper plate | |
| CN108154968A (en) | A kind of electronic information shows the preparation method with metal nano network flexible panel | |
| CN104363743A (en) | Electromagnetic wave radiation shield cover for printed circuit board | |
| CN102508583B (en) | Preparation method for metal lead of capacitance type touch screen | |
| CN107709262A (en) | The manufacture method of membrane glass plate | |
| CN204069469U (en) | A kind of two-sided precise circuit board of high efficiency and heat radiation | |
| CN103025066B (en) | A kind of preparation method of metal base single-sided doubling plate | |
| CN203301868U (en) | Manufacturing system for high-precision aluminum-base circuit board | |
| CN109587934A (en) | A kind of circuit board | |
| CN205124121U (en) | PCB circuit board | |
| CN204119659U (en) | The anticorrosion process equipment of copper plate electric and multilayer aluminum substrate is sunk for multilayer aluminum substrate | |
| Xia et al. | Rapid preparation of patterned conductive films based on in situ voltaic cell templated 3D controllable metal deposition | |
| CN101699934B (en) | Method for producing conductive high heat conduction ceramic circuit board | |
| KR101380774B1 (en) | Method of preparing conducting layer of metal plate | |
| CN109587935A (en) | A kind of manufacturing method of circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |