CN102693054A - Touch control housing and manufacturing method - Google Patents
Touch control housing and manufacturing method Download PDFInfo
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- CN102693054A CN102693054A CN2012100372382A CN201210037238A CN102693054A CN 102693054 A CN102693054 A CN 102693054A CN 2012100372382 A CN2012100372382 A CN 2012100372382A CN 201210037238 A CN201210037238 A CN 201210037238A CN 102693054 A CN102693054 A CN 102693054A
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Abstract
The invention provides a touch control housing and a manifacturing method. The contact housing includes a housing wall provided with an insulating surface; a capacitor touch control gasket arranged in array and formed on the insulating surface to provide a touch control function; a plurality of conducting connection gaskets formed on the insulating surface; and a plurality of leads formed in the insulating surface and connecting with the capacitor touch control gasket and the conducting connection gaskets respectively. Each of the leads and the capacitor touch control gaskets and the conducting connection gaskets define a touch control module together. The touch control module is provided with a multi-layer structure. The multi-layer structure is provided with an active metal layer and an electrodeless plating metal layer non-electro-plating on the active metal layer. The active metal layer is composed of active metal material. The active metal material is provided with an active metal initiating electrodeless plating reaction accelerantly.
Description
Technical field
The present invention relates to a kind of touch-control casing and manufacturing approach thereof, particularly relate to a kind of touch-control casing that is formed on an electroless plated metal layer on the reactive metal layer that has.
Background technology
United States Patent (USP) the 7th, 656 discloses a kind of touch-control casing No. 393.This touch-control casing comprises an enclosure wall and a touch-control sensing surface that is incorporated into this enclosure wall.This touch-control sensing surface has sensing element and data acquisition circuit that is arrayed.This touch-control sensing surface has one and the early stage structure that discloses the structure similar that is disclosed in the 10/949th, No. 060 of United States Patent (USP).The formation of the structure on existing this touch-control sensing surface is normally through forming a metal level on a base material, again with little shadow and this metal level of etching mode patterning to form required touch-control sensing pad.Yet classic method is difficult on a curved surface, forming patterned metal layer.
Utilize the electroless plating mode to form the patterned electricity line conductor and be known technology.Classic method is included on the insulating substrate and forms a reactive metal layer, with this reactive metal layer of laser-induced thermal etching mode patterning to form the active metal lead, layer metal level of electroless plating and form circuit lead on aforementioned active metal lead again.Yet, the circuit lead that so forms and the bond strength of this insulating substrate a little less than.For overcoming this shortcoming, United States Patent (USP) the 4th, 898, a kind of method that on insulating substrate, forms the patterned electricity line conductor of No. 648 exposure.Consult Figure 1A-Fig. 1 D; This method is included in and forms a reactive metal layer 92 on the circuit substrate 91; Electroless plated metal layer 93 of electroless plating on this reactive metal layer 92; Form active metal lead 921 and the electroless plated metal lead 931 on aforementioned active metal lead 921 respectively with this electroless plated metal layer 93 of laser-induced thermal etching mode patterning and this reactive metal layer 92; On aforementioned electroless plated metal lead 931, form a layer electroplated metal layer 94 again, on this circuit board 91, form circuit lead whereby.The shortcoming of said method comprises: because of the area of laser-induced thermal etching is big, must expend the more time and the energy, and cause the damage of circuit substrate 91 larger areas easily.
Summary of the invention
The object of the present invention is to provide a kind of touch-control casing and manufacturing approach thereof.This manufacturing approach have save time, energy-conservation and can on a curved surface, form the advantage of circuit lead.
A kind of touch-control casing of the present invention, it comprises:
An enclosure wall has an insulating surface;
A capacitance touching control pad that is arrayed is formed on this insulating surface, so that touch controllable function to be provided;
Several conductions connect pad, are formed on this insulating surface;
Several wires is formed on this insulating surface, and connects aforementioned condenser type touch-control pad respectively and is connected pad with conduction, and each bar lead is connected pad and defines a touch control unit jointly with capacitance touching control pad and conduction; This touch control unit has a sandwich construction; This sandwich construction has a reactive metal layer and the electroless plated metal layer of an electroless plating on this reactive metal layer; This reactive metal layer is to be made up of a kind of active metal material, this active metal material have a kind of can catalyst ground starting electroless plating reactive activity metal.
A kind of touch-control casing of the present invention, this active metal are to select a kind of from palladium, rhodium, platinum, iridium, osmium, gold, nickel, iron and combination thereof.
A kind of touch-control casing of the present invention; This enclosure wall has a bottom and a circumference; This bottom has an outer rim; This circumference extends from this bottom outer rim makes this circumference and this bottom define a structure with U-type profile jointly, and aforementioned condenser type touch-control pad is formed at this circumference.
A kind of touch-control casing of the present invention, this circumference has the shape of a curve, and each capacitance touching control pad has a curve shape shapes similar with this circumference.
A kind of touch-control casing of the present invention, aforementioned conduction connect pad and are formed on this bottom.
A kind of touch-control casing of the present invention, the material of this electroless plated metal layer is be selected from copper, gold, silver and nickel a kind of.
A kind of touch-control casing of the present invention, this sandwich construction also have an electroplated metal layer that is formed on this electroless plated metal layer, and the material of this electroplated metal layer is be selected from copper, gold, silver and nickel a kind of.
A kind of touch-control casing of the present invention, the material of this enclosure wall is be selected from polycarbonate, glass, pottery, timber and cloth a kind of.
A kind of method of making the touch-control casing of the present invention comprises: on an enclosure wall, form a non-patterning reactive metal layer; Making with this non-patterning reactive metal layer of laser-induced thermal etching mode patterning should patterning reactive metal layer of non-patterning reactive metal layer formation, and this patterning reactive metal layer comprises the electroless coating district that electroplating region that several separate and several and electroplating region separate; Electroless plated metal layer of electroless plating makes this electroless plated metal layer have several first areas that are respectively formed at aforementioned electroplating region and several are respectively formed at the second area in aforementioned electroless coating district on this patterning reactive metal layer.
A kind of method of making the touch-control casing of the present invention also comprises and optionally on the aforementioned first area of this electroless plated metal layer, electroplates an electroplated metal layer.
A kind of method of making the touch-control casing of the present invention also comprises the aforementioned second area that removes this electroless plated metal layer and the aforementioned electroless coating district of this patterning reactive metal layer.
A kind of method of making the touch-control casing of the present invention; This enclosure wall has a bottom and a circumference; This bottom has a periphery; This circumference extends from this bottom peripheral edge makes this circumference and this bottom define a structure with U-type profile jointly, and aforementioned condenser type touch-control pad is formed at this circumference.
A kind of method of making the touch-control casing of the present invention removes the aforementioned second area of this electroless plated metal layer and the aforementioned electroless coating district of this patterning reactive metal layer and removes through the chemical cleaning mode.
A kind of method of making the touch-control casing of the present invention, the formation of this non-patterning reactive metal layer are through this enclosure wall being immersed a water-soluble active metallic solution, again this enclosure wall being removed in this water-soluble active metallic solution and formed.
Beneficial effect of the present invention is: utilize a water-soluble active metallic solution of contact and be able on a curved surface of an insulation case wall, form easily a reactive metal layer, and utilize this reactive metal layer of laser-induced thermal etching and form electroplating region and electroless coating district and reach save time, energy-saving advantages.In addition; After this electroplating region and electroless coating district form an electroless plated metal layer simultaneously, remove the electroless plated metal layer in this electroless coating district again, have than also save time and the advantage of cost-saving for the effort that only forms this electroless plated metal layer in the electroless coating district this electroplating region preventing of forming that this electroless plated metal layer done.
Description of drawings
Figure 1A-Fig. 1 D shows a kind of synoptic diagram that on insulating substrate, forms the existing method of patterned electricity line conductor;
Fig. 2 is the stereographic map that shows the electronic installation of the touch-control casing with preferred embodiment of the present invention;
Fig. 3 is the stereographic map of structure that shows the touch-control casing of this preferred embodiment of the present invention;
Fig. 4 is the sectional view along the cutting line IV-IV among Fig. 3;
Fig. 5 is the sectional view along the cutting line V-V among Fig. 3;
Fig. 6 A-Fig. 6 E is the sectional view along the cutting line VI-VI among Fig. 3, and the making flow process of the touch-control casing of this preferred embodiment of the present invention is described.
Embodiment
For let above-mentioned purpose of the present invention, feature and advantage can be more obviously understandable, elaborate below in conjunction with the accompanying drawing specific embodiments of the invention.Need to prove that at first the present invention is not limited to following embodiment, those skilled in the art should understand the present invention from the spirit that following embodiment embodied, and each technical term can be done the most wide in range understanding based on spirit of the present invention.Same or analogous member uses the same reference numerals to represent among the figure.
Consult Fig. 2,3,4,5, show a kind of have a preferred embodiment of the present invention the electronic installation 100 of touch-control casing, mobile phone for example.This electronic installation 100 comprises a circuit board 7 and a pliability flat cable 8 that is connected to this circuit board 7 in addition.
The touch-control casing of a preferred embodiment of the present invention comprises: an enclosure wall 2 has an insulating surface; And circuit pattern that is formed on this insulating surface.
This circuit pattern has: the capacitance touching control pads 3 that two arrays 10 are arranged, be formed on this insulating surface, and to provide this electronic installation 100 required touch controllable function, for example spool shows, move on the page or leaf, page or leaf moves down, volume is adjusted, amplify, dwindle etc.; Several conductions connect pad 5, are formed on this insulating surface, and are connected to this circuit board 7 through this pliability flat cable 8; And several wires 4, being formed on this insulating surface, and connecting aforementioned condenser type touch-control pad 3 respectively and is connected pad 5 with conduction, each bar lead 4 is connected pad 5 and defines a touch control unit 6 jointly with capacitance touching control pad 3 and conduction.This touch control unit 6 has a sandwich construction, and this sandwich construction has 61, one electroless platings of a reactive metal layer in the electroless plated metal layer 62 on this reactive metal layer 61 and an electroplated metal layer 63 that is formed on this electroless plated metal layer 62.This reactive metal layer 61 is to be made up of a kind of active metal material, this active metal material have a kind of can catalyst ground starting electroless plating reactive activity metal.
During when the contact of user's finger or near this enclosure wall 2 and near one or more capacitance touching control pad 3; User's finger can form condenser type with the capacitance touching control pad 3 of aforementioned vicinity and be electrically connected, and changes the electric capacity of the capacitance touching control pad 3 of aforementioned vicinity whereby.This capacitance variations can detect and carry out according to this a corresponding touch controllable function through an integrated circuit controller (not shown).
Preferable down, this active metal be select from palladium, rhodium, platinum, iridium, osmium, gold, nickel, iron and etc. combination a kind of.
In this preferred embodiment, this enclosure wall 2 is the lid of this electronic installation 100, and has a bottom 21 and a circumference 22.This bottom has an outer rim, and this circumference 22 extends from these bottom 21 outer rims makes this circumference 22 define a structure with U-type profile jointly with this bottom 21.The aforementioned condenser type touch-control pad 3 of one of them of these two arrays 10 is formed at this circumference 22, and 10 of another arrays are formed at this bottom 21.Aforementioned conduction connects pad 5 and is formed at this bottom 21.This circumference 22 has the shape of a curve, is positioned at each capacitance touching control pad 3 on this circumference 22 and has a curve shape shapes similar with this circumference 22.
Preferably, the material of this electroless plated metal layer 62 is to be selected from a kind of of copper, gold, silver and nickel to form.
Preferably, the material of this electroplated metal layer 63 is to be selected from a kind of of copper, gold, silver and nickel to form.
Preferably, the material of this enclosure wall 2 is to be selected from a kind of of polycarbonate, glass, pottery, timber and cloth to form.
Consult Fig. 6 A-Fig. 6 E, show the method for this touch-control casing of manufacturing of a preferred embodiment of the present invention.This method comprises the following steps: on an enclosure wall 2, to form a non-patterning reactive metal layer 64 (consulting Fig. 6 A); Make this non-patterning reactive metal layer 64 form a patterning reactive metal layer 65 (consulting Fig. 6 B) with this non-patterning reactive metal layer 64 of laser-induced thermal etching mode patterning; This patterning reactive metal layer 65 comprises the electroless coating district 652 that several electroplating regions that separate 651 and several and electroplating region 651 separate, and this electroplating region 651 has one corresponding to the desired pattern that is formed at the circuit pattern on this enclosure wall 2; Electroless plated metal layer 66 of electroless plating makes this electroless plated metal layer 66 have several first areas that are respectively formed at aforementioned electroplating region 651 661 and several are respectively formed at the second area 662 (consulting Fig. 6 C) in aforementioned electroless coating district 652 on this patterning reactive metal layer 65; Optionally in aforementioned first district 661 of this electroless plated metal layer 66, electroplate an electroplated metal layer 67 (consulting Fig. 6 D) through 661 to the power supply (not shown)s in aforementioned first area that are electrically connected this electroless plated metal layer 66; And the aforementioned electroless coating district 652 (consulting Fig. 6 E) of aforementioned second district 662 that removes this electroless plated metal layer 66 through the chemical cleaning mode and this patterning reactive metal layer 65 is to form this circuit pattern on this enclosure wall 2.
Preferably; The formation of this non-patterning reactive metal layer 64 is through this enclosure wall 2 is immersed the water-soluble active metallic solution (for example palladium-tin colloid solution (Pd-Tin colloid solution)) with 10-70ppm palladium concentration; Again this enclosure wall 2 is removed in this water-soluble active metallic solution; Clean washing and dry and form with dilute sulfuric acid.Because how to form the mode of reactive metal layer 64 know, for example United States Patent (USP) the 4th, 898,648,5,086,966, and disclosed in 6,325, No. 910, be succinct purpose therefore, repeat no more at this.
Preferably, this non-patterning reactive metal layer 64 of laser-induced thermal etching is to use yttrium-aluminium garnet (yttrium aluminum garnet) laser light to accomplish.The operating conditions of this laser light is: 4-10W laser energy (laser power), 5-30KHz frequency (power frequency), and the electric energy density (power density) of 1-7%.Because metal level of laser-induced thermal etching is known, for example United States Patent (USP) the 4th, 898, No. 648 and disclose No. 13/035531 in early days disclose, so be succinct purpose, repeat no more at this.
When electroless solution was to use the copper chemical plating fluid with this electroless plated metal layer 66 of formation on this patterning reactive metal layer 65, electroless plating operated in one 50-55 ℃ a temperature and an activity time of 2-5 minute (processing time).When electroless solution is to use the nickel chemical plating fluid when on 65 layers of this patterning active metals, forming this electroless plated metal layer 66, electroless plating operates in temperature and an activity time of 2-5 minute of one 40-45 ℃.
When the solution of electroplating is to use nickel plating bath when on this electroless plated metal layer 66, forming this electroplated metal layer 67, electroplating operations is at temperature and an activity time of 2-5 minute of one 50-55 ℃.When the solution of electroplating is to use copper electrolyte when on this electroless plated metal layer 66, forming this electroplated metal layer 67, electroplating operations is at temperature and an activity time of 15-25 minute of one 50-55 ℃.
More noticeable is to form an electroless plated metal layer at this electroplating region 651 simultaneously with electroless coating district 652 to remove the electroless plated metal layer 66 in this electroless coating district 652 again, have than for only this electroplating region 651 form that these electroless plated metal layers 66 are done prevent in the electroless coating district 652 form these electroless plated metal layers 66 effort also save time and the advantage of cost-saving.
Can know by above explanation; The present invention utilizes a water-soluble active metallic solution of contact and reaches easily and on a curved surface of an insulation case wall 2, to form a non-patterning reactive metal layer 64, and utilize laser-induced thermal etching this non-patterning reactive metal layer 64 and form patterning reactive metal layer 65 with electroplating region 651 and electroless coating district 652 and reach save time, energy-saving advantages.
Should be understood that after having read above-mentioned teachings of the present invention, those skilled in the art can do various changes or modification to the present invention, these equivalent form of values fall within the application's appended claims institute restricted portion equally.
Claims (14)
1. touch-control casing is characterized in that it comprises:
An enclosure wall has an insulating surface;
A capacitance touching control pad that is arrayed is formed on this insulating surface, so that touch controllable function to be provided;
Several conductions connect pad, are formed on this insulating surface;
Several wires is formed on this insulating surface, and connects aforementioned condenser type touch-control pad respectively and is connected pad with conduction, and each bar lead is connected pad and defines a touch control unit jointly with capacitance touching control pad and conduction; This touch control unit has a sandwich construction; This sandwich construction has a reactive metal layer and the electroless plated metal layer of an electroless plating on this reactive metal layer; This reactive metal layer is to be made up of a kind of active metal material, this active metal material have a kind of can catalyst ground starting electroless plating reactive activity metal.
2. touch-control casing as claimed in claim 1 is characterized in that: this active metal is to select a kind of from palladium, rhodium, platinum, iridium, osmium, gold, nickel, iron and combination thereof.
3. touch-control casing as claimed in claim 1; It is characterized in that: this enclosure wall has a bottom and a circumference; This bottom has an outer rim; This circumference extends from this bottom outer rim makes this circumference and this bottom define a structure with U-type profile jointly, and said capacitance touching control pad is formed at this circumference.
4. touch-control casing as claimed in claim 3 is characterized in that: this circumference has the shape of a curve, and each capacitance touching control pad has a curve shape shapes similar with this circumference.
5. touch-control casing as claimed in claim 3 is characterized in that: said conduction connects pad and is formed on this bottom.
6. touch-control casing as claimed in claim 1 is characterized in that: the material of this electroless plated metal layer is be selected from copper, gold, silver and nickel a kind of.
7. touch-control casing as claimed in claim 1 is characterized in that: this sandwich construction also has an electroplated metal layer that is formed on this electroless plated metal layer, and the material of this electroplated metal layer is be selected from copper, gold, silver and nickel a kind of.
8. touch-control casing as claimed in claim 1 is characterized in that: the material of this enclosure wall is be selected from polycarbonate, glass, pottery, timber and cloth a kind of.
9. method of making the touch-control casing is characterized in that it comprises:
On an enclosure wall, form a non-patterning reactive metal layer;
Making with this non-patterning reactive metal layer of laser-induced thermal etching mode patterning should patterning reactive metal layer of non-patterning reactive metal layer formation, and this patterning reactive metal layer comprises the electroless coating district that electroplating region that several separate and several and electroplating region separate;
Electroless plated metal layer of electroless plating makes this electroless plated metal layer have several first areas that are respectively formed at said electroplating region and several are respectively formed at the second area in said electroless coating district on this patterning reactive metal layer.
10. method as claimed in claim 9 is characterized in that: also comprise and optionally on the said first area of this electroless plated metal layer, electroplate an electroplated metal layer.
11. method as claimed in claim 10 is characterized in that: also comprise the said second area that removes this electroless plated metal layer and the said electroless coating district of this patterning reactive metal layer.
12. method as claimed in claim 9; It is characterized in that: this enclosure wall has a bottom and a circumference; This bottom has a periphery; This circumference extends from this bottom peripheral edge makes this circumference and this bottom define a structure with U-type profile jointly, and said capacitance touching control pad is formed at this circumference.
13. method as claimed in claim 11 is characterized in that: remove the said second area of this electroless plated metal layer and the said electroless coating district of this patterning reactive metal layer and remove through the chemical cleaning mode.
14. method as claimed in claim 9 is characterized in that: the formation of this non-patterning reactive metal layer is through this enclosure wall being immersed a water-soluble active metallic solution, again this enclosure wall being removed in this water-soluble active metallic solution and formed.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/035,531 | 2011-02-25 | ||
| US13/035,531 US8621749B2 (en) | 2010-03-12 | 2011-02-25 | Non-deleterious technique for creating continuous conductive circuits |
| US13/285,219 | 2011-10-31 | ||
| US13/285,219 US8692790B2 (en) | 2011-02-25 | 2011-10-31 | Capacitive touch sensitive housing and method for making the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102693054A true CN102693054A (en) | 2012-09-26 |
| CN102693054B CN102693054B (en) | 2015-08-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210037238.2A Active CN102693054B (en) | 2011-02-25 | 2012-02-17 | Touch-control casing and manufacture method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102693054B (en) |
| TW (1) | TWI558293B (en) |
Cited By (3)
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| CN103906384A (en) * | 2012-12-29 | 2014-07-02 | 深圳富泰宏精密工业有限公司 | Shell of electronic equipment |
| CN104902710A (en) * | 2014-03-04 | 2015-09-09 | 绿点高新科技股份有限公司 | Housing with two-dimensional circuit structure and manufacturing method thereof |
| CN106158670A (en) * | 2015-05-12 | 2016-11-23 | 绿点高新科技股份有限公司 | Electronic device and method for manufacturing the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101641690B1 (en) * | 2013-09-25 | 2016-07-21 | 엘지디스플레이 주식회사 | Display device with integrated touch screen |
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| CN106158670A (en) * | 2015-05-12 | 2016-11-23 | 绿点高新科技股份有限公司 | Electronic device and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102693054B (en) | 2015-08-19 |
| TW201236540A (en) | 2012-09-01 |
| TWI558293B (en) | 2016-11-11 |
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