TW201038168A - Housing and method for making the same - Google Patents

Housing and method for making the same Download PDF

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Publication number
TW201038168A
TW201038168A TW98111180A TW98111180A TW201038168A TW 201038168 A TW201038168 A TW 201038168A TW 98111180 A TW98111180 A TW 98111180A TW 98111180 A TW98111180 A TW 98111180A TW 201038168 A TW201038168 A TW 201038168A
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Taiwan
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layer
conductive
conductive layer
touch
combined
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TW98111180A
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Chinese (zh)
Inventor
Chin-Hsien Liang
Ben-Ding Tsao
Wen-Lin Xiong
Dian-Ming Zhu
Jiang-Ying Hu
Zhun Wang
Chong Cai
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Fih Hong Kong Ltd
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Priority to TW98111180A priority Critical patent/TW201038168A/en
Publication of TW201038168A publication Critical patent/TW201038168A/en

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Abstract

The invention provides a housing and a method of making the same. The housing includes a outside layer, a touch-controled layer that combined with the outside layer, a light emitting layer that combined with the touch-controled layer and a substrate layer that combined with the light emitting layer. The touch-control layer and the light emitting layer are set with electrical contacts. A method of making the housing includes: making a touch-controled layer; making a light emitting layer onto the touch-controled layer; molding a substrate layer onto the light emitting layer; setting electrical contacts to the touch-controled layer and the light emitting layer.

Description

201038168 substrate layer onto the light emitting layer; setting electrical contacts to the touch-controled layer and the light emitting layer. 四、指定代表圖: (一)本案指定代表圖為:第(1 )圖。 (二)本代表圖之元件符號簡單說明: 殼體 10 外表層 11 觸控層 13 發光層 15 基體層 17 第一薄膜層 131 第一導電層 133 絕緣層 135 第二導電層 137 第二薄膜層 139 第三導電層 151 發光材料層 153 介質層 155 第四導電層 157 五、本案若有化學式時,請揭示最能顯示發明特徵的化 〇 學式: 無 六、發明說明: 【發明所屬之技術領域】 本發明涉及一種殼體及該殼體之製作方法,尤其涉及一種具變 化外觀之殼體及該殼體之製作方法。 【先前技術】 習知可攜式電子產品之殼體大多採用IML (模内貼膜注塑)工 2 201038168 藝製成之殼體通常包括—透明之塑膠薄膜、在該 荦i之塑料成之雜或職、及—注塑於薄膜及商標或圖 ==^=’然該殼體之外觀單調、不具 【發明内容】 鑒於此’#鮮提供—種频具錢化躲之殼體。The specified representative map is as follows: (1) The designated representative figure of the case is: (1). (b) A brief description of the components of the representative drawing: housing 10 outer layer 11 touch layer 13 light emitting layer 15 base layer 17 first film layer 131 first conductive layer 133 insulating layer 135 second conductive layer 137 second film layer 139 Third conductive layer 151 Light-emitting material layer 153 Medium layer 155 Fourth conductive layer 157 V. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: None. Description of the invention: [Technology to which the invention belongs FIELD OF THE INVENTION The present invention relates to a housing and a method of fabricating the same, and more particularly to a housing having a varying appearance and a method of making the housing. [Prior Art] Most of the housings of the portable electronic products are made of IML (In-Mold Foil Injection Molding) 2 201038168. The housing usually includes a transparent plastic film, which is made of plastic in the 荦i. Jobs, and - injection molding in the film and trademark or map ==^= 'The appearance of the shell is monotonous, not [inventive content] In view of this '# fresh offer - the kind of frequency with money to hide the shell.

另外,還有必錢供—種上舰體之製作方法。 人體,其包括一外表層,所述殼體還包括一與外表層相結 ^觸控層、-與層械合讀綠及—經光層減合之基 體層’所述殼體痛控層及發光層設置有電性連接接口。 種设體之製作方法,其包括如下步驟: 製作一觸控層; 於該觸控層上製作一發光層; 於該發光層上結合一基體層; 在所述觸控層及發光層上設置電性連接接口。 本發明殼體藉由設置—觸控層及—發光層,當外力觸碰到殼體 之枝層《施加壓力於外表層時,殼體之觸控層即可感測該信號並 將該仏號進汹部轉換,進而使發光層發光,殼體表面相應出現亮 點,虽外力消失時,殼體之外觀恢復,如此使得本發明殼體具有變 化之外觀效果。 【實施方式】 請參閱圖1所示,本發明較佳實施方式之殼體1〇包括外表層 u、與外表層11相結合之觸控層13、與觸控層13相結合之發光層 15及與發光層15相結合之基體層17。 201038168 . 外表層11為透明塑膠層,該娜可為聚碳酸醋(PC)、聚對苯 .二甲酸乙二自旨(PET)、聚丙烯(pp)、聚_ (pA)及聚甲基丙婦 酸甲醋(PMMA)中之任—種。該外表層u可經硬化處理,以使其 表面光滑、防刮。外表層11之厚度約為0.05mm。 觸控層13包括-第一薄膜層131、與第一薄膜層i3i相結合之 -第-導電層133、與第一導電層133相結合之一絕緣層135、與絕 緣層135相結合之一第二導電層137及一與第二導電層137相結合 之第二薄膜層139。 〇 第-薄膜層131由塑膠製成,該塑膠可為聚碳酸醋(pc)、聚對 笨二曱酸乙二S旨(PET)、聚丙烯(pp)、雜胺(pA)及聚甲基丙 婦酸甲醋(PMMA)中之任一種。第一薄膜層131之厚度可在 0.075~0.125mm 之間。 第一導電層133可為氧化銦錫導電膜,其厚度可在0.25-0.35μιη 之間,優選為α3μιη。 絕緣層135為印刷絕緣油墨層,其呈規則之點狀設置於第—導 電層133與第二導電層137之間。所述絕緣層135之 〇 4.5-5·5μιη 之間,優選為 5 〇μιη。 第二導電層137可為氧化銦錫導電膜,其厚度可在〇 25_〇 35μιη 之間,優選為〇.3μιη。 第二薄膜層139由塑膠製成,該塑膠可為聚碳酸酯(pC)、聚對 笨二甲酸乙二酯(PET)、聚丙烯(pp)、聚醯胺(pA)及聚甲基丙 烯酸甲酯(PMMA)中之任一種。第二薄膜層139之厚度約為 〇.125mm。 發光層15包括一第三導電層151、一與第三導電層151相結合 之Ίχ光材料層153、一與發光材料層153相結合之介質層I%及一與 201038168 . ' . 介質層相結合之第四導電層157。 第一^r電層151可為氧化銦錫導電膜,其與所述第二薄膜層139 相、、.該第—導電層151之厚度可在7 25_8 5卿之間,優選為8啤。 發光材料層153之主要發光材料為硫化辞粒子。該發光材料層 153之厚度約為3〇μη^。 介質層155之材料主要為含鈦酸鋇之固化漿料。該介質層155 之厚度約為15叫1,其起到隔離發光材料層153與第四導電層157之 作用。 θ ¢) 細導電層為固化之導魏漿。所述導電銀漿之組分主要 有銀粉、玻璃粉及黏結劑。該第四導電層157之厚度約為8卿。 基體層17為-塑膠層,其與所述第四導電層157相結合。形成 基體層17之材料為聚乙烯(pE)、聚碳酸醋(pc)、丙稀赌苯乙滲 丁二烯共聚合物(ABS)、聚甲基丙烯酸m (PMMA)及聚 甲酸乙二酯(PET)等塑膠中之任一種。 ,所述殼體10之觸控層13及發光層15還設置有電性連接接口, 當殼體10組裝於電子裝置(如手機、PDA等)後,即可實現與該電 子裝1:電連接。當外力觸碰渺卜表層u或施加壓力於外表層u 時使觸控層13之第一導電層133與第二導電層137在觸碰點位置 相接觸而產生電位差,該電位差信號被置於電子裝置中之控製器備 測到後再藉由A/D内部轉換输製齡,進喊發光層15在觸碰點 位置發光,殼體10表面在該觸碰點位置出現亮點;當外力消失時, 殼體10恢復其原來之外觀。 本發明較佳實施方式殼體10之製作方法包括如下步驟: …明參晒1所示,提供一外表層1;1。外表…工由透明塑膠製成, «膠可為聚碳酸醋(PC)、聚對苯二甲酸乙二醋(PET)、聚丙婦 201038168 .(PP)、聚酿胺(PA)及聚甲基丙烯酸甲醋(PMMA)中之任一種。 . 該外表層11經硬化處理,其表面光滑、可防刮。 製作觸控層13。製作觸控層13包括如下步驟: 提供-第-薄膜層131。第—薄膜層131由塑膠製成,該鮮可 為聚碳酸醋⑽、聚對苯二甲酸乙二醋(pET)、聚丙婦(吟/聚 醯胺(PA)或聚甲基丙烯酸(pMMA)中之任 層m之厚度在0.075_0.125mm之間。 弟桃 “在所述第一薄膜層131之-表面上印刷第-導電層133。第一導 電層133可為氧化銦錫導電膜,其厚度在〇 25·〇.35μηι之間,優選為 〇.3μπι。 在所述第-導電層133上製作絕緣層135。製作該絕緣層135之 方法可為:先_絕緣油墨在第一導電層133上進行整版印刷献 後再利用侧之方法有規則地將部分印刷區域_掉。所述侧之 方法可以_無舰絲鑛溶贿躲潰_。所私機酸可為 稀鹽酸或稀俩,無機鹼可錢概_溶液或蘇打水。_時,In addition, there is a need for money to supply a method of making a hull. The human body includes an outer skin layer, and the casing further includes a contact layer, a touch layer, a green layer, and a base layer reduced by the light layer. And the light emitting layer is provided with an electrical connection interface. The method for fabricating a body includes the steps of: forming a touch layer; forming a light emitting layer on the touch layer; bonding a base layer to the light emitting layer; and setting the touch layer and the light emitting layer Electrical connection interface. The housing of the present invention can be sensed by applying a touch layer and a light-emitting layer when an external force touches the branch layer of the housing. When the pressure is applied to the outer layer, the touch layer of the housing senses the signal and the signal is sensed. The enthalpy is converted, and the luminescent layer is illuminated, and a bright spot appears correspondingly on the surface of the casing. When the external force disappears, the appearance of the casing is restored, so that the casing of the present invention has a varying appearance effect. [Embodiment] Referring to FIG. 1 , a housing 1 较佳 according to a preferred embodiment of the present invention includes an outer surface layer u, a touch layer 13 combined with the outer surface layer 11 , and a light emitting layer 15 combined with the touch layer 13 . And a base layer 17 combined with the luminescent layer 15. 201038168 . The outer layer 11 is a transparent plastic layer, which can be polycarbonate (PC), polyparaphenylene dicarboxylate (PET), polypropylene (pp), poly-(pA) and polymethyl. Any of the types of methyl acetoacetate (PMMA). The outer layer u can be hardened to make the surface smooth and scratch resistant. The outer skin 11 has a thickness of about 0.05 mm. The touch layer 13 includes a first film layer 131, a first conductive layer 133 combined with the first thin film layer i3i, an insulating layer 135 combined with the first conductive layer 133, and one of the insulating layers 135. The second conductive layer 137 and a second thin film layer 139 combined with the second conductive layer 137. The first-thin film layer 131 is made of plastic, and the plastic may be polycarbonate (pc), poly(p-benzoic acid), polyethylene (pp), heteroamine (pA) and polymethyl. Any of propylene glycolate (PMMA). The thickness of the first film layer 131 may be between 0.075 and 0.125 mm. The first conductive layer 133 may be an indium tin oxide conductive film having a thickness of between 0.25 and 0.35 μm, preferably α3 μm. The insulating layer 135 is a printed insulating ink layer which is disposed between the first conductive layer 133 and the second conductive layer 137 in a regular dot shape. The insulating layer 135 is preferably between -5 4.5 and 5 μmη, preferably 5 μm. The second conductive layer 137 may be an indium tin oxide conductive film having a thickness of between 〇 25 〇 35 μmη, preferably 〇. 3 μιη. The second film layer 139 is made of plastic, which may be polycarbonate (pC), polyethylene terephthalate (PET), polypropylene (pp), polyamine (pA), and polymethacrylic acid. Any of methyl esters (PMMA). The thickness of the second film layer 139 is about 125.125 mm. The luminescent layer 15 includes a third conductive layer 151, a luminescent material layer 153 combined with the third conductive layer 151, a dielectric layer I% combined with the luminescent material layer 153, and a dielectric layer of 201038168. The fourth conductive layer 157 is bonded. The first electrical layer 151 may be an indium tin oxide conductive film, and the second conductive layer 139 may have a thickness of between 7 25 and 8 5 , preferably 8 beer. The main luminescent material of the luminescent material layer 153 is a sulfided particle. The thickness of the luminescent material layer 153 is about 3 〇μη. The material of the dielectric layer 155 is mainly a cured slurry containing barium titanate. The dielectric layer 155 has a thickness of about 15 and which serves to isolate the luminescent material layer 153 from the fourth conductive layer 157. θ ¢) The fine conductive layer is a solidified conductive slurry. The components of the conductive silver paste are mainly silver powder, glass powder and a binder. The fourth conductive layer 157 has a thickness of about 8 sec. The base layer 17 is a plastic layer that is combined with the fourth conductive layer 157. The material forming the base layer 17 is polyethylene (pE), polycarbonate (pc), propylene styrene-butadiene copolymer (ABS), polymethacrylic acid m (PMMA) and polyethylene glycolate. Any of plastics such as (PET). The touch layer 13 and the light-emitting layer 15 of the housing 10 are also provided with an electrical connection interface. When the housing 10 is assembled in an electronic device (such as a mobile phone, a PDA, etc.), the electronic device can be realized: connection. When the external force touches the surface layer u or applies pressure to the outer surface layer u, the first conductive layer 133 of the touch layer 13 and the second conductive layer 137 are brought into contact at the touch point position to generate a potential difference, and the potential difference signal is placed. After the controller in the electronic device is ready for measurement, the A/D internal conversion is used to change the age, and the illuminating layer 15 emits light at the touch point position, and the surface of the casing 10 appears bright at the touch point; when the external force disappears At the time, the housing 10 returns to its original appearance. The manufacturing method of the housing 10 of the preferred embodiment of the present invention comprises the following steps: ... showing the outer surface layer 1; Appearance...work made of transparent plastic, «glue can be polycarbonate (PC), polyethylene terephthalate (PET), polypropylene 201038168. (PP), polyamine (PA) and polymethyl Any of acrylic acid vinegar (PMMA). The outer skin 11 is hardened and has a smooth surface and is scratch-resistant. The touch layer 13 is made. Making the touch layer 13 includes the following steps: Providing a -th film layer 131. The first film layer 131 is made of plastic, which may be polycarbonate (10), polyethylene terephthalate (pET), polypropylene (polyamide/polyamide) or polymethacrylic acid (pMMA). The thickness of the layer m is between 0.075 and 0.125 mm. The peach "prints the first conductive layer 133 on the surface of the first film layer 131. The first conductive layer 133 may be an indium tin oxide conductive film, The thickness of the film is between 〇25·〇.35μηι, preferably 〇.3μπι. The insulating layer 135 is formed on the first conductive layer 133. The method of fabricating the insulating layer 135 may be: first, the insulating ink is in the first conductive The layer 133 is printed on the layer 133 and the side of the printing side is used to regularly remove the part of the printing area. The method of the side can be _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Rare two, inorganic alkali can be money _ solution or soda. _,

=需要被_之印砸域可_菲林片並施加—定壓力來遮蔽。絕 緣層135之厚度可為4.5-5.5μιη,優選為5.0μιη。 提供-第二薄膜層139。第二薄膜層139由塑膠製成,該塑膠可 為聚碳_⑽、聚對苯二甲酸乙二醋(ρΕΤ)、聚丙烯(ρρ)、聚 醯胺(ΡΑ)或聚甲基丙烯酸㈣(ρΜΜΑ)中之任 層139之厚度約為〇.125醜。 弟一服 曾在所述第二薄膜層139之—絲上印刷一第二導電層放。第二 ¥電層137為氧化銦錫導電膜,該第二導電層137 〇.25-0.35μπι 之間,優選為 〇 3μιη。 又 所述第二導電層137印刷於第二薄膜層139後,將第二薄膜層 6 201038168 • 139與第一薄膜層131進行層壓’使第二導電層137與第—薄膜層 131之絕緣層135相貼合,製得所述觸控層13。 、曰 所述觸控層13製成後,利用層壓技術將外表層u結合 薄膜層131上。 製作發光層15。製作發光層15包括如下步驟: 在所述第二薄膜層139之另一表面上印刷—第三導電層i5i。第 三導電層m為氧化銦錫導電膜,其厚度可在725_8.5卿之間,優 選為8μηι。 Ο 在所述第二導電層151上設置-發光材料層153。發光材料層 153之主要發光材料為硫化鋅粒子,該發光材料層⑸可採用絲網印 刷之方式形成。發光材料層.153之厚度約為3〇卿。 在所述發光材料層153上設置—介歸155。介質層155亦可採 用絲網印刷之方式形成。印刷介質層155之材料主要為含欽酸鎖之 水料。該)丨貝層155之厚度約為15μιη,其起到隔離發光材料層 與第四導電層157之作用。 在所述介質層155上設置—第四導電層157,從而製成發光層 © 15 °第四導電層157為固化之導電銀漿,其採用絲網印刷之方式形 成。所述導電銀漿之組分主要有銀粉、玻璃粉及黏結劑。該第四導 電層157之厚度約為8μτη。 所述發光層15製成後,外表層u、觸控層13及發光層^即結 合成-整體。將該整體置於—成賴具巾,使其顔為殼體1〇之形 狀’並對周緣部分進行修剪。 將所述成型後之整體置於_注麵具中注塑—基體層17於第四 導電層157上。注塑基體層17之材料可為聚乙稀㈣、聚破酸賴 (PC)、丙烯腈-笨乙烯-丁二稀共聚合物(娜) 、聚曱基丙烯酸曱酉旨 201038168 (ΡΜΜΑ)及聚對笨-甲酿,_ - 甲乙—略(ΡΕΤ)塑膠t之任-插 斤述设體10製作完成後,再在 種 上設置電性連接接口。 -殼體10之觸控層 機等^^之殼心侧移動麵 【圖式簡單說明】 及發光層15 纖相 Ο 圖1為本發明铁佳 【主要元件符說說明】J 殼體 外又體之剖视示意圖 觸控層 基體層 第一導電層 第二導電層 第三導電層 介質層 10 13 17 133 137 151 155 外表層 發光層 第一薄膜層 絕緣層 第二薄膜層 發光材料層 第四導電層 〇 n 15 131 135 139 153 157 8= Need to be _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The insulating layer 135 may have a thickness of 4.5 to 5.5 μm, preferably 5.0 μm. A second film layer 139 is provided. The second film layer 139 is made of plastic, and the plastic may be polycarbon_(10), polyethylene terephthalate (ρΕΤ), polypropylene (ρρ), polydecylamine (ΡΑ) or polymethacrylic acid (four) ( The thickness of the layer 139 in ρΜΜΑ) is about 125.125 ugly. The younger one has printed a second conductive layer on the wire of the second film layer 139. The second electric layer 137 is an indium tin oxide conductive film, and the second conductive layer 137 is between 2525-0.35 μm, preferably 〇3μιη. After the second conductive layer 137 is printed on the second thin film layer 139, the second thin film layer 6 201038168 • 139 is laminated with the first thin film layer 131 to insulate the second conductive layer 137 from the first thin film layer 131. The layer 135 is attached to each other to form the touch layer 13. After the touch layer 13 is formed, the outer layer u is bonded to the film layer 131 by a lamination technique. A light-emitting layer 15 is produced. Fabricating the luminescent layer 15 includes the steps of: printing a third conductive layer i5i on the other surface of the second film layer 139. The third conductive layer m is an indium tin oxide conductive film, and has a thickness of 725 Å to 8.5 Å, preferably 8 μm. - A luminescent material layer 153 is disposed on the second conductive layer 151. The main luminescent material of the luminescent material layer 153 is zinc sulfide particles, and the luminescent material layer (5) can be formed by screen printing. The thickness of the luminescent material layer .153 is about 3 〇. A 155 is provided on the luminescent material layer 153. The dielectric layer 155 can also be formed by screen printing. The material of the printing medium layer 155 is mainly water containing a cis acid lock. The mussel layer 155 has a thickness of about 15 μm, which serves to isolate the luminescent material layer from the fourth conductive layer 157. A fourth conductive layer 157 is disposed on the dielectric layer 155 to form a light-emitting layer. The 15th fourth conductive layer 157 is a cured conductive silver paste which is formed by screen printing. The components of the conductive silver paste mainly include silver powder, glass powder and a binder. The fourth conductive layer 157 has a thickness of about 8 μτη. After the light-emitting layer 15 is formed, the outer surface layer u, the touch layer 13, and the light-emitting layer are combined and integrated. The whole is placed in a draping towel, and the face is shaped like a casing, and the peripheral portion is trimmed. The molded whole is placed in a mask to be injection molded - the base layer 17 is on the fourth conductive layer 157. The material of the injection molding substrate layer 17 may be polyethylene (four), polybromic acid lysate (PC), acrylonitrile-stupid ethylene-butadiene dipolymer (Na), poly(methacrylic acid), 201038168 (ΡΜΜΑ) and poly For stupid-brown, _ - A B - slightly (ΡΕΤ) plastic t - the plug-in body 10 is completed, and then set the electrical connection interface. - The touch layer machine of the casing 10, etc., the side of the shell side moving surface [simple description of the drawing] and the light-emitting layer 15 fiber phase Ο Figure 1 is the invention of the present invention [main component description] J shell outside the body Cross-sectional view of the touch layer base layer first conductive layer second conductive layer third conductive layer dielectric layer 10 13 17 133 137 151 155 outer surface light-emitting layer first film layer insulating layer second film layer light-emitting material layer fourth conductive层〇 n 15 131 135 139 153 157 8

Claims (1)

201038168 七、申請專利範圍: 1. -種殼體,其包括—外表層,其巾所述殼體還包括—與外表芦 :合之觸控層、—與觸控層相結合之發找及-與發光層才: 結合之基體層,所述殼體之觸控層及發光層設置有電性連接接 D 〇 2. 如申5月專利範圍第工項所述之殼體,其中所述觸控層包括—第 -薄膜層、與第—薄膜層相結合之—第一導電層、與第一導電 層相結合之-絕緣層、與絕緣層相結合之一第二導電層及—與 第一導電層相結合之第二薄膜層。 3. 如申明專利範圍第2項所述之殼體,其中所述第一導電層及第 -導電層為氧化銦錫導電膜,第一導電層及第二導電層之厚度 在 0.25-0.35μηι 之間。 4. 如申睛專利範圍第2項所述之殼體,其中所述絕緣層點狀分佈 於第-導電層與第二導電層之間,絕緣層之厚度在45 5 之間。 如申凊專利I巳圍第2項所述之殼體,其中所述發光層包括一第 :導電層、—與第三導電層相結合之發光材料層、—與發光材 料層相結合之介質層及一與介質層相結合之第四導電層。 •如申凊專利細第5項所述之殼體’其中所述第三導電層為氧 化銦錫導f膜,該第三導電層之厚度在725_8 5叫。 如申請專利範圍第5項所述之殼體,其中所述發光材料層之發 光材料含硫化鋅粒子,該發光材料層之厚度為3〇μιη。 如申請專利範圍第5項所述之殼體,其中所述介質層含鈦義, 該介質層之厚度為15μιη。 士申。月專利範圍苐5項所述之殼體’其中戶斤述第四導電層為固 9 9. 201038168 化之導電銀漿,帛四導電層之厚度為㈣。 10. -種殼體之製作方法,《包括如下步驟: 製作一觸控層; 於該觸控層上製作一發光層; 於該發光層上結告—基體層; 11.201038168 VII. Patent application scope: 1. A kind of casing, which comprises an outer surface layer, and the casing further comprises a touch layer combined with the outer surface of the reed, and a combination of the touch layer and the touch layer. - the light-emitting layer: the combined base layer, the touch layer and the light-emitting layer of the housing are provided with an electrical connection D 〇 2. The housing of the fifth aspect of the patent application, wherein The touch layer comprises a first film layer, a first conductive layer combined with the first conductive layer, an insulating layer combined with the first conductive layer, a second conductive layer combined with the insulating layer, and The first conductive layer is combined with the second film layer. 3. The casing of claim 2, wherein the first conductive layer and the first conductive layer are indium tin oxide conductive films, and the first conductive layer and the second conductive layer have a thickness of 0.25-0.35 μm between. 4. The casing of claim 2, wherein the insulating layer is dotted between the first conductive layer and the second conductive layer, and the insulating layer has a thickness of 45 5 . The casing of claim 2, wherein the luminescent layer comprises a first conductive layer, a luminescent material layer combined with the third conductive layer, and a medium combined with the luminescent material layer. a layer and a fourth conductive layer combined with the dielectric layer. The casing of the fifth aspect of the invention, wherein the third conductive layer is an indium tin oxide derivative film, and the third conductive layer has a thickness of 725 Å. The casing according to claim 5, wherein the luminescent material layer of the luminescent material layer contains zinc sulfide particles, and the luminescent material layer has a thickness of 3 μm. The casing of claim 5, wherein the dielectric layer contains titanium, and the dielectric layer has a thickness of 15 μm. Shishen. The patent of the scope of the patent is 苐5, wherein the fourth conductive layer is a conductive silver paste, and the thickness of the fourth conductive layer is (4). 10. A method for fabricating a housing, comprising the steps of: fabricating a touch layer; forming a light-emitting layer on the touch layer; and reporting a base layer on the light-emitting layer; 在所述觸控層及發光層上設置紐連接接口。 電層相結合 卿1G獅狀_之㈣綠,射製作所述 如下步驟:提供—第—薄臈層並在其—表面上印刷 m曰志在弟一耗層上設置—絕緣層;提供一第二薄膜 ^亚在其-表面上_—第二導電層;使所述絕緣層與第二導 讼如申請專利細第u項所述之殼體之製作方法其中設置 絕賴包括:採用絕緣油墨在第一導電層上進行整版印刷;利 用钱刻之方法有規則地將部分印刷區域钱刻掉。 13. 如申請專利細第U項所述之殼體之製作方法,其中製作所述 ❹ 發光層包括如下步驟:在所述第二薄膜層之另一表面上印刷第 二導電層;在第三導電層上印刷—發光材料層;在發光材料層 上印刷一介質層及在介質層上印刷一第四導電層。 14. 如申請專利範圍第U項所述之殼體之製作方法,其中所述觸控 層製作後於該觸控層之第一薄膜層上層壓一外表層,該外表層 由透明塑膠製成,該娜為聚碳酸g旨、聚對笨二情乙二醋θ、 聚丙烯、聚醯胺及聚曱基丙烯酸甲酯中之任一種。 曰A button connection interface is disposed on the touch layer and the light emitting layer. The electric layer is combined with the 1G lion-like (four) green, and the following steps are performed: providing the first-thin layer and printing on the surface thereof - the insulating layer is provided on the consumer layer; The second film is sub-surface--the second conductive layer; the insulating layer and the second method are as described in the manufacturing method of the casing described in the above-mentioned patent application. The ink is lithographically printed on the first conductive layer; the portion of the printed area is regularly scribbled by the method of money engraving. 13. The method of fabricating a casing according to claim U, wherein the fabricating the luminescent layer comprises the steps of: printing a second conductive layer on the other surface of the second film layer; Printing a layer of luminescent material on the conductive layer; printing a dielectric layer on the luminescent material layer and printing a fourth conductive layer on the dielectric layer. 14. The method of manufacturing the housing of claim U, wherein the touch layer is formed by laminating an outer skin layer on the first film layer of the touch layer, the outer layer being made of transparent plastic The genus is any one of a polycarbonate, a poly(p-form), a polypropylene, a polyamide, and a polymethyl methacrylate.曰
TW98111180A 2009-04-03 2009-04-03 Housing and method for making the same TW201038168A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI427475B (en) * 2010-12-24 2014-02-21 Azbil Corp Control the machine
US8939631B2 (en) 2009-09-11 2015-01-27 Azbil Corporation Controlling device with an insulating portion
TWI558293B (en) * 2011-02-25 2016-11-11 Taiwan Green Point Entpr Co A touch case and its manufacturing method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8939631B2 (en) 2009-09-11 2015-01-27 Azbil Corporation Controlling device with an insulating portion
TWI427475B (en) * 2010-12-24 2014-02-21 Azbil Corp Control the machine
TWI558293B (en) * 2011-02-25 2016-11-11 Taiwan Green Point Entpr Co A touch case and its manufacturing method

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