CN209895783U - A transparent conductive film - Google Patents
A transparent conductive film Download PDFInfo
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- CN209895783U CN209895783U CN201920956521.2U CN201920956521U CN209895783U CN 209895783 U CN209895783 U CN 209895783U CN 201920956521 U CN201920956521 U CN 201920956521U CN 209895783 U CN209895783 U CN 209895783U
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- Prior art keywords
- layer
- transparent conductive
- conductive film
- optical
- optical cement
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- 230000003287 optical effect Effects 0.000 claims abstract description 83
- 239000010410 layer Substances 0.000 claims abstract description 51
- 239000004568 cement Substances 0.000 claims abstract description 40
- 239000012790 adhesive layer Substances 0.000 claims abstract description 30
- 238000002834 transmittance Methods 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 13
- 229920002120 photoresistant polymer Polymers 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 abstract description 9
- 239000003292 glue Substances 0.000 abstract description 9
- 238000003475 lamination Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 238000005452 bending Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 47
- 238000000034 method Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 10
- 239000002313 adhesive film Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000010030 laminating Methods 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- -1 Polyethylene terephthalate Polymers 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a transparent conductive film, including smooth glue film, base film and optical cement layer, smooth glue film sets up the surface of optical cement layer, the base film sets up optical cement layer is kept away from the opposite side surface of smooth glue film, smooth glue film keeps away from the surface of optical cement layer is seted up flutedly, is equipped with the conducting layer in the recess. The optical adhesive layer greatly facilitates the lamination of the transparent conductive film, and effectively solves the problems of poor lamination effect and high lamination difficulty of the conventional transparent conductive film during lamination; meanwhile, the groove is manufactured, and the conductive material is filled in the groove to form the conductive layer, so that the flexibility of the transparent conductive film is ensured, the conductivity, the transmittance and the bending resistance of the transparent conductive film are greatly improved, the thickness and the processing difficulty of the transparent conductive film are reduced, and the cost is reduced.
Description
Technical Field
The utility model relates to a conductive film technical field especially relates to a transparent conductive film.
Background
The existing metal grid conductive film generally needs to be processed on a layer of substrate, and the substrate generally is glass or high molecular polyester (PET, PC, PMMA, etc.). The conductive film is prepared by filling a conductive material after stamping grooves on a substrate, and the conductive film is also prepared by ink-jet printing the conductive material on the substrate. The conductive films almost need to be bonded by optical glue in the using process, so that bubbles are easy to appear between the conductive films and a bonded product in the bonding process, the bonding effect is poor, and the product quality is not affected; meanwhile, the difficulty of lamination is high, and the cost is increased.
The foregoing description is provided for general background information and is not admitted to be prior art.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a transparent conductive film of convenient laminating.
The utility model provides a transparent conductive film, including smooth glue film, base film and optical cement layer, smooth glue film sets up the surface of optical cement layer, the base film sets up optical cement layer is kept away from the opposite side surface of smooth glue film, smooth glue film keeps away from the surface of optical cement layer is seted up flutedly, is equipped with the conducting layer in the recess.
In one embodiment, the width of the groove is 1-20 μm, and the depth is 1-15 μm.
In one embodiment, the thickness of the optical adhesive layer is 50-250 μm, and the light transmittance of the optical adhesive layer is more than 95%.
In one embodiment, the optical adhesive layer is made of an acrylic material or a siloxane material.
In one embodiment, the optical adhesive layer is an OCA optical adhesive layer.
In one embodiment, the material of the optical adhesive layer is UV optical adhesive.
In one embodiment, the conductive layer is made of any one of silver, copper, and graphene.
In one embodiment, the base film is a release film made of PET.
The utility model provides a transparent conductive film, through the optical cement layer, greatly facilitates the laminating of transparent conductive film, effectively solves the problems of poor laminating effect and large laminating difficulty when the existing transparent conductive film is laminated on a touch screen; meanwhile, the groove is manufactured, and the conductive material is filled in the groove to form the conductive layer, so that the flexibility of the transparent conductive film is ensured, the conductivity, the transmittance and the bending resistance of the transparent conductive film are improved greatly, the thickness and the processing difficulty of the transparent conductive film are reduced, and the cost is reduced.
Drawings
Fig. 1 is a schematic structural view of the transparent conductive film of the present invention;
fig. 2 is a flowchart illustrating steps of a method for manufacturing a transparent conductive film according to a first embodiment of the present invention;
fig. 3 is a process flow chart of a method for manufacturing a transparent conductive film according to a first embodiment of the present invention;
fig. 4 is a flowchart illustrating steps of a method for manufacturing a transparent conductive film according to a second embodiment of the present invention.
Detailed Description
The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
Referring to fig. 1, the present invention provides a transparent conductive film, which includes an optical adhesive layer 3, a base film 1 and an optical adhesive layer 2, wherein the optical adhesive layer 3 is disposed on the surface of the optical adhesive layer 2, and the base film 1 is disposed on the other side surface of the optical adhesive layer 2, which is far away from the optical adhesive layer 3. The surface of the optical adhesive layer 3 far away from the optical adhesive layer 2 is provided with a groove 31, and a conductive layer 4 is arranged in the groove 31.
The base film 1 is a release film 1 made of PET (Polyethylene terephthalate). The release film 1 can be physically separated from the optical adhesive layer 2 and does not blister when the conductive material in the conductive layer 4 is cured at a low temperature. Through the design from type membrane 1, make things convenient for transparent conductive film's use and storage.
The optical adhesive is a better adhesive for adhering the conductive film to the touch screen, and has the characteristics of being colorless and transparent, having the light transmittance of more than 90 percent, having good bonding strength, being capable of being cured at room temperature or intermediate temperature, having small curing shrinkage and the like. Therefore, the material of the optical adhesive layer is usually acrylic material or siloxane material.
In this embodiment, the material of the optical adhesive layer 2 is oca (optical Clear adhesive) optical adhesive; the OCA optical cement is a double-sided adhesive tape without a base material. The thickness of the optical adhesive layer 2 is 50-250 μm, and the light transmittance is more than 95%.
The material of the optical cement layer 3 is UV optical cement, and the optical cement layer 3 is obtained through ultraviolet light curing.
The width of the groove 31 is 1-20 μm, and the depth is 1-15 μm.
The material of the conductive layer 4 is any one of silver, copper, graphene or other conductive materials. It should be noted that the conductive material forming the conductive layer 4 can be cured at a low temperature, and the curing temperature is lower than the upper temperature limit of the optical adhesive.
First embodiment
Referring to fig. 2 to 3, a method for manufacturing a transparent conductive film according to a first embodiment of the present invention is used for manufacturing the transparent conductive film, and the method includes:
s1: providing a substrate 5, coating a layer of optical cement on the substrate 5, and forming a groove 31 on the optical cement layer 3;
s2: removing the substrate 5;
s3: providing an optical adhesive film which comprises an optical adhesive layer 2 and a base film 1, and pressing the optical adhesive film on an optical adhesive layer 3;
s5: the groove 31 is filled with a conductive material to form a conductive layer 4.
In the method, the optical cement is UV optical cement.
In step S1: and (4) stamping the mold 6 on the optical cement, so that the mold 6 and the optical cement are adhered together. And forming the optical cement layer 3 with the groove 31 after ultraviolet curing.
In step S2: the substrate 5 is separated from the photoresist layer 3 manually, during which the mold 6 is bonded to the photoresist layer 3 at all times.
In practical application, the optical film needs to be processed. In step S3, the optical adhesive film is pressed on the surface of the substrate 5 side of the optical adhesive layer with the mold 6 by pressing, so that the base film 1 and the optical adhesive layer 2 are bonded together to form the optical adhesive film. Meanwhile, the optical adhesive film needs to be subjected to laser cutting so as to meet the shape and size of the required conductive film.
After step S3, a demolding step S4 is also included. Due to the fact that the optical cement is high in viscosity, the viscosity between the optical cement layer 2 and the optical cement layer 3 is larger than the viscosity between the optical cement layer 3 and the mold 6. Therefore, the demolding step S4 specifically includes: the mold 6 is separated from the optical cement layer 3 manually.
Second embodiment
The difference between the transparent conductive film method provided by the second embodiment of the present invention and the first embodiment is that, in this embodiment, the optical cement is directly coated on the optical cement film.
Specifically, referring to fig. 4, a method for manufacturing a transparent conductive film according to a second embodiment of the present invention is used to manufacture the transparent conductive film, and the method includes:
s7: providing an optical adhesive film, which comprises an optical adhesive layer and a base film, and preparing the optical adhesive layer with a groove on the optical adhesive film;
s8: filling a conductive material in the groove to form a conductive layer;
in step S7: firstly, a coating mode is adopted, and a layer of optical cement is coated on the surface of one side, far away from the base film, of the optical cement layer to form the optical cement layer. And then, stamping the photoresist layer by using a mold, and manually demolding after curing to form a groove on the photoresist layer. Wherein the optical cement is UV optical cement.
In other embodiments, the grooves may be formed on the photoresist layer by etching.
In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. It will be understood that when an element such as a layer, region or substrate is referred to as being "formed on," "disposed on" or "located on" another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly formed on" or "directly disposed on" another element, there are no intervening elements present.
In this document, the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "vertical", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for the sake of clarity and convenience of description of the technical solutions, and thus, should not be construed as limiting the present invention.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, including not only those elements listed, but also other elements not expressly listed.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (8)
1. The utility model provides a transparent conducting film, its characterized in that includes optical cement layer, base film and optical cement layer, the optical cement layer sets up the surface of optical cement layer, the base film sets up the optical cement layer is kept away from the opposite side surface of optical cement layer, the optical cement layer is kept away from the surface of optical cement layer is seted up flutedly, is equipped with the conducting layer in the recess.
2. The transparent conductive film according to claim 1, wherein the groove has a width of 1 to 20 μm and a depth of 1 to 15 μm.
3. The transparent conductive film according to claim 1, wherein the optical adhesive layer has a thickness of 50 to 250 μm, and the optical adhesive layer has a light transmittance of 95% or more.
4. The transparent conductive film according to claim 1, wherein the optical adhesive layer is made of acrylic material or siloxane material.
5. The transparent conductive film of claim 4, wherein the optical clear adhesive layer is an OCA optical clear adhesive layer.
6. The transparent conductive film according to claim 1, wherein the material of the photoresist layer is UV photoresist.
7. The transparent conductive film according to claim 1, wherein the conductive layer is made of any one of silver, copper, and graphene.
8. The transparent conductive film according to claim 1, wherein the base film is a release film made of PET.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920956521.2U CN209895783U (en) | 2019-06-24 | 2019-06-24 | A transparent conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920956521.2U CN209895783U (en) | 2019-06-24 | 2019-06-24 | A transparent conductive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209895783U true CN209895783U (en) | 2020-01-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920956521.2U Active CN209895783U (en) | 2019-06-24 | 2019-06-24 | A transparent conductive film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209895783U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111883604A (en) * | 2020-08-11 | 2020-11-03 | 杭州福斯特应用材料股份有限公司 | Photovoltaic module and method of making the same |
| CN112133472A (en) * | 2019-06-24 | 2020-12-25 | 苏州维业达触控科技有限公司 | A kind of transparent conductive film and its production method |
| US11987734B2 (en) | 2020-06-29 | 2024-05-21 | Hangzhou First Applied Material Co., Ltd. | Anti-PID encapsulation adhesive film, photovoltaic module, and photovoltaic module manufacturing method |
-
2019
- 2019-06-24 CN CN201920956521.2U patent/CN209895783U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112133472A (en) * | 2019-06-24 | 2020-12-25 | 苏州维业达触控科技有限公司 | A kind of transparent conductive film and its production method |
| CN112133472B (en) * | 2019-06-24 | 2025-01-28 | 苏州维业达科技有限公司 | A transparent conductive film and a method for manufacturing the same |
| US11987734B2 (en) | 2020-06-29 | 2024-05-21 | Hangzhou First Applied Material Co., Ltd. | Anti-PID encapsulation adhesive film, photovoltaic module, and photovoltaic module manufacturing method |
| CN111883604A (en) * | 2020-08-11 | 2020-11-03 | 杭州福斯特应用材料股份有限公司 | Photovoltaic module and method of making the same |
| CN111883604B (en) * | 2020-08-11 | 2023-06-13 | 杭州福斯特应用材料股份有限公司 | Photovoltaic module and manufacturing method thereof |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No.68 Xinchang Road, Suzhou Industrial Park, Suzhou, Jiangsu Province Patentee after: Suzhou Weiyeda Technology Co.,Ltd. Patentee after: SOOCHOW University Address before: No.68 Xinchang Road, Suzhou Industrial Park, Suzhou, Jiangsu Province Patentee before: IVTOUCH Co.,Ltd. Patentee before: SOOCHOW University |
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| CP01 | Change in the name or title of a patent holder |