CN102693054B - Touch-control casing and manufacture method thereof - Google Patents
Touch-control casing and manufacture method thereof Download PDFInfo
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- CN102693054B CN102693054B CN201210037238.2A CN201210037238A CN102693054B CN 102693054 B CN102693054 B CN 102693054B CN 201210037238 A CN201210037238 A CN 201210037238A CN 102693054 B CN102693054 B CN 102693054B
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Abstract
A kind of touch-control casing and manufacture method thereof, this touch-control casing comprises: an enclosure wall, has an insulating surface; A capacitance touching control pad in arrayed, is formed in this insulating surface, to provide touch controllable function; Several conducting connection pad sheet, is formed in this insulating surface; And several wires, be formed in this insulating surface, and connect aforementioned capacitance touching control pad and conducting connection pad sheet respectively, each wire and capacitance touching control pad and conducting connection pad sheet define a touch control unit jointly.This touch control unit has a sandwich construction, this sandwich construction has a reactive metal layer and the electroless plated metal layer of an electroless plating in this reactive metal layer, this reactive metal layer is made up of an active metal material, and this active metal material has the active metal that can be started electroless plating reaction catalyst.
Description
Technical field
The present invention relates to a kind of touch-control casing and manufacture method thereof, particularly relate to a kind of touch-control casing with the electroless plated metal layer be formed in a reactive metal layer.
Background technology
United States Patent (USP) the 7th, 656, No. 393 disclose a kind of touch-control casing.This touch-control casing comprises an enclosure wall and a touch-control sensing being incorporated into this enclosure wall is surperficial.This touch-control sensing surface has sensing element in arrayed and a data acquisition circuitry.This touch-control sensing surface has one and discloses the 10/949th in early days with United States Patent (USP), the structure that structure disclosed in No. 060 is similar.The formation of the structure on this touch-control sensing surface existing normally by forming a metal level on a base material, then with micro-shadow and this metal level of etching mode patterning to form required touch-control sensing pad.But classic method not easily forms patterned metal layer on a curved surface.
Electroless plating mode is utilized to form patterned electricity line conductor for known technology.Classic method is included on an insulating substrate and forms a reactive metal layer, with this reactive metal layer of laser-induced thermal etching mode patterning to form active metal wire, then on foregoing active plain conductor electroless plating layer metal level and form circuit lead.But, the circuit lead so formed and the bond strength of this insulating substrate more weak.For overcoming this shortcoming, United States Patent (USP) the 4th, 898, No. 648 disclose a kind of method forming patterned electricity line conductor on insulating substrate.Consult Figure 1A-Fig. 1 D, the method is included on a circuit substrate 91 and forms a reactive metal layer 92, electroless plating electroless plated metal layer 93 in this reactive metal layer 92, active metal wire 921 and the electroless plated metal wire 931 respectively on foregoing active plain conductor 921 is formed with this electroless plated metal layer 93 of laser-induced thermal etching mode patterning and this reactive metal layer 92, on aforementioned electroless plated metal wire 931, form a layer electroplated metal layer 94 again, on this circuit board 91, form circuit lead whereby.The shortcoming of said method comprises: because the area of laser-induced thermal etching is large, must expends more time and the energy, and easily cause the damage of circuit substrate 91 larger area.
Summary of the invention
The object of the present invention is to provide a kind of touch-control casing and manufacture method thereof.This manufacture method have save time, energy-conservation and the advantage of circuit lead can be formed on a curved surface.
A kind of touch-control casing of the present invention, it comprises:
An enclosure wall, has an insulating surface;
A capacitance touching control pad in arrayed, is formed in this insulating surface, to provide touch controllable function;
Several conducting connection pad sheet, is formed in this insulating surface;
Several wires, is formed in this insulating surface, and connects aforementioned capacitance touching control pad and conducting connection pad sheet respectively, and each wire and capacitance touching control pad and conducting connection pad sheet define a touch control unit jointly; This touch control unit has a sandwich construction, this sandwich construction has a reactive metal layer and the electroless plated metal layer of an electroless plating in this reactive metal layer, this reactive metal layer is made up of a kind of active metal material, and this active metal material has a kind of active metal that can start electroless plating reaction catalyst.
A kind of touch-control casing of the present invention, this active metal be select from palladium, rhodium, platinum, iridium, osmium, gold, nickel, iron and combination one.
A kind of touch-control casing of the present invention, this enclosure wall has a bottom and a circumference, there is bottom this outer rim, this circumference makes this circumference from the extension of this bottom outer-edge and jointly defines the structure that has U-type profile bottom this, and aforementioned capacitance touching control pad is formed at this circumference.
A kind of touch-control casing of the present invention, this circumference has the shape of a curve, and each capacitance touching control pad has a shape similar to the curve shape of this circumference.
A kind of touch-control casing of the present invention, aforesaid conductive attachment spacers is formed in bottom this.
A kind of touch-control casing of the present invention, the material of this electroless plated metal layer is the one being selected from copper, gold, silver and nickel.
A kind of touch-control casing of the present invention, this sandwich construction also has an electroplated metal layer be formed on this electroless plated metal layer, and the material of this electroplated metal layer is the one being selected from copper, gold, silver and nickel.
A kind of touch-control casing of the present invention, the material of this enclosure wall is the one being selected from polycarbonate, glass, pottery, timber and cloth.
A kind of method manufacturing touch-control casing of the present invention, comprises: on an enclosure wall, form a non-patterned reactive metal layer; Make this non-patterned reactive metal layer form a patterning reactive metal layer with this non-patterned reactive metal layer of laser-induced thermal etching mode patterning, this patterning reactive metal layer comprises several electroplating region of separating and several electroless coating district separated with electroplating region; In this patterning reactive metal layer, electroless plating electroless plated metal floor makes this electroless plated metal floor have and is severally respectively formed at the first area of aforementioned electroplating region and several second area being respectively formed at aforementioned electroless coating district.
A kind of method manufacturing touch-control casing of the present invention, also comprises and optionally on the aforementioned first area of this electroless plated metal layer, electroplates an electroplated metal layer.
A kind of method manufacturing touch-control casing of the present invention, also comprises the aforementioned electroless coating district of aforementioned second area and this patterning reactive metal layer removing this electroless plated metal floor.
A kind of method manufacturing touch-control casing of the present invention, this enclosure wall has a bottom and a circumference, there is bottom this periphery, this circumference makes this circumference from the extension of this bottom peripheral edge and jointly defines the structure that has U-type profile bottom this, and aforementioned capacitance touching control pad is formed at this circumference.
A kind of method manufacturing touch-control casing of the present invention, the aforementioned electroless coating district of the aforementioned second area and this patterning reactive metal layer that remove this electroless plated metal floor is removed by chemical cleaning mode.
A kind of method manufacturing touch-control casing of the present invention, the formation of this non-patterned reactive metal layer is by this enclosure wall is immersed a water-soluble active metallic solution, then is removed in this water-soluble active metallic solution by this enclosure wall and formed.
Beneficial effect of the present invention is: utilize contact water-soluble active metallic solution and reach can form a reactive metal layer easily on a curved surface of an insulation case wall, and utilize this reactive metal layer of laser-induced thermal etching and form electroplating region and electroless coating district and reach save time, energy-conservation advantage.In addition, after this electroplating region and electroless coating district forming an electroless plated metal floor, removing the electroless plated metal floor in this electroless coating district simultaneously again, having than preventing the effort forming this electroless plated metal floor in electroless coating district from also saving time and the advantage of cost-saving in order to what only form that this electroless plated metal floor does at this electroplating region.
Accompanying drawing explanation
Figure 1A-Fig. 1 D is a kind of existing methodical schematic diagram forming patterned electricity line conductor on insulating substrate of display;
Fig. 2 is the stereographic map that display has the electronic installation of the touch-control casing of a preferred embodiment of the present invention;
Fig. 3 is the stereographic map of the structure of the touch-control casing showing this preferred embodiment of the present invention;
Fig. 4 is the sectional view along the cutting line IV-IV in Fig. 3;
Fig. 5 is the sectional view along the cutting line V-V in Fig. 3;
Fig. 6 A-Fig. 6 E is the sectional view along the cutting line VI-VI in Fig. 3, and the Making programme of the touch-control casing of this preferred embodiment of the present invention is described.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, below in conjunction with accompanying drawing, the specific embodiment of the present invention is elaborated.First it should be noted that, the present invention is not limited to following embodiment, and the spirit that those skilled in the art should embody from following embodiment is to understand the present invention, and each technical term can do the most wide in range understanding based on Spirit Essence of the present invention.In figure, same or analogous component uses the same reference numerals to represent.
Consult Fig. 2,3,4,5, show a kind of have a preferred embodiment of the present invention the electronic installation 100 of touch-control casing, such as mobile phone.This electronic installation 100 separately comprises the pliability flat cable 8 that a circuit board 7 and are connected to this circuit board 7.
The touch-control casing of a preferred embodiment of the present invention comprises: an enclosure wall 2, has an insulating surface; And a circuit pattern being formed in this insulating surface.
This circuit pattern has: the capacitance touching control pad 3 that two arrays 10 arrange, and is formed in this insulating surface, to provide the touch controllable function needed for this electronic installation 100, spool display, page such as, moves, page moves down, volume adjusts, amplifies, reduces; Several conducting connection pad sheet 5, is formed in this insulating surface, and is connected to this circuit board 7 by this pliability flat cable 8; And several wires 4, be formed in this insulating surface, and connect aforementioned capacitance touching control pad 3 and conducting connection pad sheet 5 respectively, each wire 4 defines a touch control unit 6 jointly with capacitance touching control pad 3 and conducting connection pad sheet 5.This touch control unit 6 has a sandwich construction, and this sandwich construction has the electroless plated metal layer 62 of a reactive metal layer 61, electroless plating in this reactive metal layer 61 and an electroplated metal layer 63 be formed on this electroless plated metal layer 62.This reactive metal layer 61 is made up of a kind of active metal material, and this active metal material has a kind of active metal that can start electroless plating reaction catalyst.
During when the finger contact of user or close to this enclosure wall 2 and near one or more capacitance touching control pad 3, the finger of user can form capacitive battery with the capacitance touching control pad 3 of aforementioned vicinity and be connected, and changes the electric capacity of the capacitance touching control pad 3 of aforementioned vicinity whereby.This capacitance variations can be detected by an integrated circuit controller (not shown) and the touch controllable function that execution one is corresponding according to this.
Under better, this active metal be select from palladium, rhodium, platinum, iridium, osmium, gold, nickel, iron and etc. combination one.
In this preferred embodiment, this enclosure wall 2 is the lid of this electronic installation 100, and has a bottom 21 and a circumference 22.There is bottom this outer rim, this circumference 22 21 outer rims bottom this extend make this circumference 22 with this bottom 21 jointly define the structure that has U-type profile.The aforementioned capacitance touching control pad 3 of one of them of these two arrays 10 is formed at this circumference 22, and another array 10 to be formed at bottom this 21.Aforesaid conductive attachment spacers 5 to be formed at bottom this 21.This circumference 22 has the shape of a curve, and each the capacitance touching control pad 3 be positioned on this circumference 22 has a shape similar to the curve shape of this circumference 22.
Preferably, the material of this electroless plated metal layer 62 is that the one being selected from copper, gold, silver and nickel formed.
Preferably, the material of this electroplated metal layer 63 is that the one being selected from copper, gold, silver and nickel formed.
Preferably, the material of this enclosure wall 2 is that the one being selected from polycarbonate, glass, pottery, timber and cloth formed.
Consult Fig. 6 A-Fig. 6 E, the method for this touch-control casing of manufacture of display a preferred embodiment of the present invention.The method comprises the following steps: to form a non-patterned reactive metal layer 64 (consulting Fig. 6 A) on an enclosure wall 2; This non-patterned reactive metal layer 64 is made to form a patterning reactive metal layer 65 (consulting Fig. 6 B) with this non-patterned reactive metal layer 64 of laser-induced thermal etching mode patterning, this patterning reactive metal layer 65 comprises several electroplating region 651 of separating and several electroless coating district 652 separated with electroplating region 651, and this electroplating region 651 has one and corresponds to the required pattern being formed at the circuit pattern on this enclosure wall 2; In this patterning reactive metal layer 65, electroless plating electroless plated metal floor 66 makes this electroless plated metal floor 66 have and is severally respectively formed at the first area 661 of aforementioned electroplating region 651 and several second area 662 (consulting Fig. 6 C) being respectively formed at aforementioned electroless coating district 652; In aforementioned first district 661 of this electroless plated metal floor 66, an electroplated metal layer 67 (consulting Fig. 6 D) is optionally electroplated by being electrically connected 661 to one, the aforementioned first area power supply (not shown) of this electroless plated metal floor 66; And the aforementioned electroless coating district 652 (consulting Fig. 6 E) in aforementioned second district 662 and this patterning reactive metal layer 65 that remove this electroless plated metal floor 66 by chemical cleaning mode to form this circuit pattern on this enclosure wall 2.
Preferably, the formation of this non-patterned reactive metal layer 64 is by this enclosure wall 2 being immersed the water-soluble active metallic solution (such as palladium-tin colloid solution (Pd-Tin colloidsolution)) that has 10-70ppm palladium concentration, again this enclosure wall 2 is removed in this water-soluble active metallic solution, with dilute sulfuric acid cleaning, washing and dry and formed.Because the mode how forming reactive metal layer 64 is known, such as United States Patent (USP) the 4th, 898,648,5,086,966, and 6,325, disclosed by No. 910, be therefore succinct object, do not repeat them here.
Preferably, this non-patterned reactive metal layer 64 of laser-induced thermal etching uses yttrium-aluminium garnet (yttriumaluminum garnet) laser light to complete.The operating conditions of this laser light is: 4-10W laser energy (laserpower), 5-30KHz frequency (power frequency), and the electric energy density of 1-7% (power density).Such as, because laser-induced thermal etching metal level is known, United States Patent (USP) the 4th, 898, No. 648 and in early days disclose No. 13/035531 and disclosed, be therefore succinct object, do not repeat them here.
When electroless solution is that when using copper chemical plating fluid to form this electroless plated metal layer 66 in this patterning reactive metal layer 65, electroless plating operates in temperature and the activity time of 2-5 minute (processing time) of one 50-55 DEG C.When electroless solution is that when using nickel chemical plating fluid to form this electroless plated metal layer 66 on this patterning active metal 65 layers, electroless plating operates in temperature and the activity time of 2-5 minute of one 40-45 DEG C.
When the solution electroplated is that when using nickel plating bath to form this electroplated metal layer 67 on this electroless plated metal layer 66, electroplating operations is at the temperature of 50-55 DEG C and the activity time of 2-5 minute.When the solution electroplated is that when using copper electrolyte to form this electroplated metal layer 67 on this electroless plated metal layer 66, electroplating operations is at the temperature of 50-55 DEG C and the activity time of 15-25 minute.
More noticeable be form an electroless plated metal floor at this electroplating region 651 with electroless coating district 652 to remove the electroless plated metal floor 66 in this electroless coating district 652 more simultaneously, has than preventing the effort forming this electroless plated metal floor 66 in electroless coating district 652 from also saving time and the advantage of cost-saving in order to what only form that this electroless plated metal floor 66 does at this electroplating region 651.
From illustrating above, the present invention utilizes contact water-soluble active metallic solution and reaches on a curved surface of an insulation case wall 2, form a non-patterned reactive metal layer 64 easily, and utilize this non-patterned reactive metal layer 64 of laser-induced thermal etching and formed there is electroplating region 651 and the patterning reactive metal layer 65 in electroless coating district 652 and reach save time, energy-conservation advantage.
Should be understood that those skilled in the art can make various changes or modifications the present invention, and these equivalent form of values fall within the application's appended claims limited range equally after having read above-mentioned instruction content of the present invention.
Claims (12)
1. a touch-control casing, is characterized in that it comprises:
An enclosure wall, has an insulating surface, and has a bottom and a circumference;
A capacitance touching control pad in arrayed, is formed in this insulating surface, and is positioned at this circumference of this enclosure wall, to provide touch controllable function;
Several conducting connection pad sheet, is formed in this insulating surface, and be positioned at this enclosure wall this bottom;
Several wires, is formed in this insulating surface, and connects aforementioned capacitance touching control pad and conducting connection pad sheet respectively, and each capacitance touching control pad is connected to a conducting connection pad sheet jointly to define a touch control unit by a wire; This touch control unit has a sandwich construction, this sandwich construction has a reactive metal layer and the electroless plated metal layer of an electroless plating in this reactive metal layer, this reactive metal layer is made up of a kind of active metal material, and this active metal material has a kind of active metal that can start electroless plating reaction catalyst.
2. touch-control casing as claimed in claim 1, is characterized in that: the one from palladium, rhodium, platinum, iridium, osmium, gold, nickel, iron and combination thereof selected by this active metal.
3. touch-control casing as claimed in claim 1, is characterized in that: have an outer rim bottom this, and this circumference makes this circumference from the extension of this bottom outer-edge and jointly defines the structure that has U-type profile bottom this.
4. touch-control casing as claimed in claim 3, it is characterized in that: this circumference has the shape of a curve, each capacitance touching control pad has a shape similar to the curve shape of this circumference.
5. touch-control casing as claimed in claim 1, is characterized in that: the material of this electroless plated metal layer is the one being selected from copper, gold, silver and nickel.
6. touch-control casing as claimed in claim 1, is characterized in that: this sandwich construction also has an electroplated metal layer be formed on this electroless plated metal layer, and the material of this electroplated metal layer is the one being selected from copper, gold, silver and nickel.
7. touch-control casing as claimed in claim 1, is characterized in that: the material of this enclosure wall is the one being selected from polycarbonate, glass, pottery, timber and cloth.
8. manufacture a method for touch-control casing, it is characterized in that it comprises:
An enclosure wall forms a non-patterned reactive metal layer, this enclosure wall has a bottom and a circumference, have a periphery bottom this, this circumference makes this circumference from the extension of this bottom peripheral edge and jointly defines the structure that has U-type profile bottom this;
This non-patterned reactive metal layer is made to form a patterning reactive metal layer with this non-patterned reactive metal layer of laser-induced thermal etching mode patterning, this patterning reactive metal layer comprises several electroplating region of separating and several electroless coating district separated with electroplating region, and this electroplating region is formed at this circumference;
In this patterning reactive metal layer, electroless plating electroless plated metal floor makes this electroless plated metal floor have and is severally respectively formed at the first area of described electroplating region and several second area being respectively formed at described electroless coating district, and this first area is positioned at this circumference.
9. method as claimed in claim 8, is characterized in that: also comprise and optionally on the described first area of this electroless plated metal layer, electroplate an electroplated metal layer.
10. method as claimed in claim 9, is characterized in that: the described electroless coating district also comprising described second area and this patterning reactive metal layer removing this electroless plated metal floor.
11. methods as claimed in claim 10, is characterized in that: the described electroless coating district of the described second area and this patterning reactive metal layer that remove this electroless plated metal floor is removed by chemical cleaning mode.
12. methods as claimed in claim 8, is characterized in that: the formation of this non-patterned reactive metal layer is by this enclosure wall is immersed a water-soluble active metallic solution, then is removed in this water-soluble active metallic solution by this enclosure wall and formed.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/035,531 US8621749B2 (en) | 2010-03-12 | 2011-02-25 | Non-deleterious technique for creating continuous conductive circuits |
| US13/035,531 | 2011-02-25 | ||
| US13/285,219 | 2011-10-31 | ||
| US13/285,219 US8692790B2 (en) | 2011-02-25 | 2011-10-31 | Capacitive touch sensitive housing and method for making the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102693054A CN102693054A (en) | 2012-09-26 |
| CN102693054B true CN102693054B (en) | 2015-08-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210037238.2A Active CN102693054B (en) | 2011-02-25 | 2012-02-17 | Touch-control casing and manufacture method thereof |
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| CN (1) | CN102693054B (en) |
| TW (1) | TWI558293B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103906384B (en) * | 2012-12-29 | 2018-09-25 | 深圳富泰宏精密工业有限公司 | The shell of electronic device |
| KR101641690B1 (en) * | 2013-09-25 | 2016-07-21 | 엘지디스플레이 주식회사 | Display device with integrated touch screen |
| TWI524229B (en) * | 2014-03-04 | 2016-03-01 | 綠點高新科技股份有限公司 | Housing with two-dimensional touch structure and manufacture method thereof |
| TWI563620B (en) * | 2015-05-12 | 2016-12-21 | Taiwan Green Point Entpr Co | Electronic device and method for making the same |
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| JPH10209607A (en) * | 1997-01-23 | 1998-08-07 | Matsushita Electric Works Ltd | Manufacture of circuit board |
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| US4898648A (en) * | 1988-11-15 | 1990-02-06 | Pacific Bell | Method for providing a strengthened conductive circuit pattern |
| US4988412A (en) * | 1988-12-27 | 1991-01-29 | General Electric Company | Selective electrolytic desposition on conductive and non-conductive substrates |
| US6325910B1 (en) * | 1994-04-08 | 2001-12-04 | Atotch Deutschland Gmbh | Palladium colloid solution and its utilization |
| DE10063696A1 (en) * | 2000-12-20 | 2002-07-18 | Siemens Ag | Method for producing a housing of a mobile communication terminal, housing and mobile communication terminal |
| DE10119531A1 (en) * | 2001-04-12 | 2002-10-24 | Siemens Ag | Mobile computer or PDA with a radio or mobile communications module has the aerial integrated into the device lid, so that when it is opened out for use, the aerial is an optimum operating position |
| US7656393B2 (en) * | 2005-03-04 | 2010-02-02 | Apple Inc. | Electronic device having display and surrounding touch sensitive bezel for user interface and control |
| CN101133385B (en) * | 2005-03-04 | 2014-05-07 | 苹果公司 | Hand held electronic device, hand held device and operation method thereof |
| CN100556250C (en) * | 2005-10-14 | 2009-10-28 | 鸿富锦精密工业（深圳）有限公司 | Multifunctional portable electronic apparatus |
| TWM374618U (en) * | 2009-02-20 | 2010-02-21 | Acrosense Technology Co Ltd | A capacitive touch panel includes a substrate and a patterned conductive layer formed on the substrate. |
| TW201038168A (en) * | 2009-04-03 | 2010-10-16 | Fih Hong Kong Ltd | Housing and method for making the same |
| TWM381837U (en) * | 2010-01-28 | 2010-06-01 | He Wei Technology Co Ltd | Touch control module |
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2012
- 2012-01-13 TW TW101101448A patent/TWI558293B/en active
- 2012-02-17 CN CN201210037238.2A patent/CN102693054B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10209607A (en) * | 1997-01-23 | 1998-08-07 | Matsushita Electric Works Ltd | Manufacture of circuit board |
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| Publication number | Publication date |
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| TW201236540A (en) | 2012-09-01 |
| TWI558293B (en) | 2016-11-11 |
| CN102693054A (en) | 2012-09-26 |
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