CN214753417U - Electrode plate structure of microswitch - Google Patents
Electrode plate structure of microswitch Download PDFInfo
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- CN214753417U CN214753417U CN202120868922.XU CN202120868922U CN214753417U CN 214753417 U CN214753417 U CN 214753417U CN 202120868922 U CN202120868922 U CN 202120868922U CN 214753417 U CN214753417 U CN 214753417U
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Abstract
The utility model discloses a micro-gap switch's plate electrode structure. The contact electrode plate I, the contact electrode plate II and the contact electrode plate tee are overlapped together through a tinning process and are provided with holes; the electrode contacts are nested and assembled with the electrode contact mounting holes, and a first tin-plated layer is arranged on the inner circumferential surface of each electrode contact mounting hole; the first connecting terminal electrode plate, the second connecting terminal electrode plate and the third connecting terminal electrode plate are overlapped together through a tinning process and are provided with openings; the wiring terminal is assembled with the wiring terminal mounting hole in a nested manner, and a second tin-plated layer is arranged on the inner circumferential surface of the wiring terminal mounting hole; and a connecting terminal cylinder is fixed below the connecting terminal. The utility model discloses a multilayer design, more traditional electrode plate structure has increased conduction area, and has carried out tin-plating, has improved the reliability of micro-gap switch when using to its life has been prolonged.
Description
Technical Field
The utility model relates to a small-size micro-gap switch design field especially relates to a micro-gap switch's plate electrode structural design.
Background
In the micro-switch electrode plate structure design in the prior art, the electrode plate is of a single-layer structure, the contact area is limited, and when the micro-switch electrode plate is installed, any coating treatment does not exist between an electrode contact and the like and an installation hole of the electrode plate fixing support, so that the operating efficiency and the service life of the micro-switch can be influenced when the micro-switch electrode plate is used.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome above-mentioned prior art not enough, provide a micro-gap switch's plate electrode structure.
The utility model is realized in such a way that a micro-gap switch electrode plate structure comprises an electrode contact, a contact electrode plate I, a contact electrode plate II, a contact electrode plate III, an electrode contact mounting hole site, a connecting terminal electrode plate I, a connecting terminal electrode plate II, a connecting terminal electrode plate III, a connecting terminal mounting hole site, a connecting terminal and a connecting terminal cylinder;
the contact electrode plate I, the contact electrode plate II and the contact electrode plate tee are overlapped together through a tinning process; the contact electrode plate I, the contact electrode plate II and the contact electrode plate III are provided with openings and form electrode contact mounting hole positions after being superposed;
the electrode contacts are nested and assembled with the electrode contact mounting holes, and a first tin-plated layer is arranged on the inner circumferential surface of each electrode contact mounting hole;
the first connecting terminal electrode plate, the second connecting terminal electrode plate and the tee connecting terminal electrode plate are overlapped together through a tinning process;
the first wiring terminal electrode plate, the second wiring terminal electrode plate and the third wiring terminal electrode plate are provided with openings, and wiring terminal mounting hole sites are formed after superposition;
the wiring terminal is assembled with the wiring terminal mounting hole in a nested manner, and a second tin-plated layer is arranged on the inner circumferential surface of the wiring terminal mounting hole; and a connecting terminal cylinder is fixed below the connecting terminal.
And electroplated layers are respectively arranged on the surfaces of the electrode contact, the first contact electrode plate, the second contact electrode plate, the third contact electrode plate, the electrode contact mounting hole position, the first connecting terminal electrode plate, the second connecting terminal electrode plate, the third connecting terminal electrode plate, the connecting terminal mounting hole position, the connecting terminal and the connecting terminal cylinder.
The wiring terminal and the wiring terminal cylinder are of an integrated structure.
The utility model provides a micro-gap switch electrode plate structural design adopts the multilayer design, and more traditional electrode plate structure has increased conduction area, and has carried out the cladding material design between electrode contact and mounting hole position, and when electrode contact, binding post and plate electrode were assembled simultaneously, tin-plating treatment had also all been carried out in the mounting hole position, had improved the reliability of micro-gap switch when using to its life has been prolonged.
Drawings
Fig. 1 is a schematic diagram of a structural design of an electrode plate of a micro switch provided by the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
As shown in fig. 1, the utility model provides a plate electrode structural design of micro-gap switch, include electrode contact 1, contact plate electrode one 2-1, contact plate electrode two 2-2, contact plate electrode three 2-3, electrode contact installation hole site 3, binding post plate electrode one 4-1, binding post plate electrode two 4-2, binding post plate electrode three 4-3, binding post installation hole site 5, binding post 6 and binding post cylinder 7; the contact electrode plate I2-1, the contact electrode plate II 2-2 and the contact electrode plate III 2-3 are overlapped together through a tinning process to form a contact electrode plate; the contact electrode plate I2-1, the contact electrode plate II 2-2 and the contact electrode plate III 2-3 are respectively provided with an opening, and an electrode contact mounting hole position 3 is formed after superposition; the electrode contact 1 is nested with the electrode contact mounting hole position 3, and a first tin-plated layer is arranged on the inner circumferential surface of the electrode contact mounting hole position 3; the wiring terminal plate I4-1, the wiring terminal plate II 4-2 and the wiring terminal plate III 4-3 are overlapped together through a tinning process, openings are formed in the wiring terminal plate I4-1, the wiring terminal plate II 4-2 and the wiring terminal plate III 4-3, and a wiring terminal mounting hole position 5 is formed after overlapping; the wiring terminal 6 is nested with the wiring terminal mounting hole 5, and a second tin-plated layer is arranged on the inner circumferential surface of the wiring terminal mounting hole 5; the wiring terminal 6 and the wiring terminal cylinder 7 are of an integrated structure; the surfaces of the electrode contact 1, the contact electrode plate I2-1, the contact electrode plate II 2-2, the contact electrode plate III 2-3, the electrode contact mounting hole position 3, the connecting terminal electrode plate I4-1, the connecting terminal electrode plate II 4-2, the connecting terminal electrode plate III 4-3, the connecting terminal mounting hole position 5, the connecting terminal 6 and the connecting terminal cylinder 7 are all provided with electroplated layers.
The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations are also considered as the protection scope of the present invention.
Claims (3)
1. A plate electrode structure of a microswitch is characterized by comprising an electrode contact, a contact plate electrode I, a contact plate electrode II, a contact plate electrode III, an electrode contact mounting hole site, a connecting terminal plate electrode I, a connecting terminal plate electrode II, a connecting terminal plate electrode III, a connecting terminal mounting hole site, a connecting terminal and a connecting terminal cylinder;
the contact electrode plate I, the contact electrode plate II and the contact electrode plate tee are overlapped together through a tinning process; the contact electrode plate I, the contact electrode plate II and the contact electrode plate III are provided with openings and form electrode contact mounting hole positions after being superposed;
the electrode contacts are nested and assembled with the electrode contact mounting holes, and a first tin-plated layer is arranged on the inner circumferential surface of each electrode contact mounting hole;
the first connecting terminal electrode plate, the second connecting terminal electrode plate and the tee connecting terminal electrode plate are overlapped together through a tinning process;
the first wiring terminal electrode plate, the second wiring terminal electrode plate and the third wiring terminal electrode plate are provided with openings, and wiring terminal mounting hole sites are formed after superposition;
the wiring terminal is assembled with the wiring terminal mounting hole in a nested manner, and a second tin-plated layer is arranged on the inner circumferential surface of the wiring terminal mounting hole; and a connecting terminal cylinder is fixed below the connecting terminal.
2. The micro-switch electrode plate structure according to claim 1, wherein the surfaces of the electrode contact, the first contact electrode plate, the second contact electrode plate, the third contact electrode plate, the electrode contact mounting hole site, the first terminal electrode plate, the second terminal electrode plate, the third terminal electrode plate, the terminal mounting hole site, the terminal and the terminal post are respectively provided with an electroplated layer.
3. The microswitch electrode plate structure of claim 1, wherein the terminal and terminal post are a unitary structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120868922.XU CN214753417U (en) | 2021-04-26 | 2021-04-26 | Electrode plate structure of microswitch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120868922.XU CN214753417U (en) | 2021-04-26 | 2021-04-26 | Electrode plate structure of microswitch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214753417U true CN214753417U (en) | 2021-11-16 |
Family
ID=78613586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120868922.XU Active CN214753417U (en) | 2021-04-26 | 2021-04-26 | Electrode plate structure of microswitch |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214753417U (en) |
-
2021
- 2021-04-26 CN CN202120868922.XU patent/CN214753417U/en active Active
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