CN206212420U - Semi-finished product circuit board and shell fragment circuit board, haptic element circuit board - Google Patents
Semi-finished product circuit board and shell fragment circuit board, haptic element circuit board Download PDFInfo
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- CN206212420U CN206212420U CN201621297088.9U CN201621297088U CN206212420U CN 206212420 U CN206212420 U CN 206212420U CN 201621297088 U CN201621297088 U CN 201621297088U CN 206212420 U CN206212420 U CN 206212420U
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- circuit board
- pad area
- semi
- finished product
- product circuit
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Abstract
The application is related to mobile terminal production technical field, more particularly to a kind of semi-finished product circuit board and shell fragment circuit board, haptic element circuit board.Semi-finished product circuit board includes substrate and isolation structure, the substrate is provided with the first pad area and the second pad area, first pad area is used to be fitted with elastic haptic element, second pad area can be used in depositing scolding tin, and first pad area is separated with second pad area by the isolation structure.The application can simultaneously be applied to the circuit board on two kinds of antennas, even if customer requirement changes, will not also produce slow-witted material, improve the utilization rate of semi-finished product circuit board.
Description
Technical field
The application is related to mobile terminal production technical field, more particularly to a kind of semi-finished product circuit board and shell fragment circuit
Plate, haptic element circuit board.
Background technology
With the development of mechanics of communication, mobile terminal such as mobile phone increasingly becomes the essential product of life.It is existing
Mobile phone productses are designed with antenna, and antenna generally has FPC (Flexible Printed Circuit, flexible PCB) antennas and steel
Chip antenna, wherein, FPC antenna is chip aerial, is attached at housing, and when housing is fastened, its golden finger is electrically connected by shell fragment
Be welded in the pad of circuit board in circuit board, i.e. shell fragment, shell fragment is in order to adapt to golden finger, and its size is smaller, pad size also compared with
It is small, and need soldering-tin layer；And steel disc antenna is directly mounted at housing, it carries flexible haptic element, when housing is fastened, elasticity
Pad directly contact on haptic element and circuit board, in order to easy to process, the size of elastic haptic element is big compared with the size of shell fragment, therefore,
The size of pad is also larger.
Because shell fragment is different from elastic contact pin construction, the two requirement to pad is also different, in the prior art, generally makes
Make two kinds of semi-finished product circuit boards, be respectively provided with the pad for being applied to different antennae, if customer requirement has a change, one of which half into
Product circuit board will be as slow-witted material, so as to cause irremediable loss to enterprise.
Utility model content
This application provides a kind of semi-finished product circuit board and shell fragment circuit board, haptic element circuit board, above-mentioned asking is can solve the problem that
Topic.
The first aspect of the application provides a kind of semi-finished product circuit board, including substrate and isolation structure, on the substrate
The first pad area and the second pad area are provided with, first pad area is used to be fitted with elastic haptic element, the second pad area energy
Deposition scolding tin is enough in, and first pad area is separated with second pad area by the isolation structure.
Preferably, second pad area is electrically connected by the isolation structure with first pad area.
Preferably, along the thickness direction of the substrate, the projection of second pad area is positioned at first pad area
In projection.
Preferably, the isolation structure is loop configuration, and the loop configuration includes inner ring and outer shroud.
Preferably, along the circumference of the loop configuration,
The inner ring is fitted with second pad area, and/or the outer shroud is fitted with first pad area.
Preferably, the radial dimension of the loop configuration is not less than 0.3 millimeter.
Preferably, the isolation structure second pad area is raised to the direction away from the substrate.
Preferably, the material of the isolation structure is graphite.
The second aspect of the application provides a kind of shell fragment circuit board, including the as above semi-finished product circuit board described in any one
And soldering-tin layer, the soldering-tin layer covering second pad area.
The third aspect of the application also provides a kind of haptic element circuit board, including the as above semi-finished product circuit described in any one
Plate.
The technical scheme that the application is provided can reach following beneficial effect：
Semi-finished product circuit board provided herein, by setting the first pad area and the second pad area on substrate, when
During for FPC antenna, in subsequent deposition scolding tin, the second scolding tin hole corresponding with the second pad area is set on steel mesh,
So as to cover one layer of soldering-tin layer in the second pad area, shell fragment circuit board is formed；When steel disc antenna, in subsequent deposition scolding tin
When, directly by the second scolding tin hole plug corresponding with the second pad area on steel mesh, so as to be deposited in the second pad area
Soldering-tin layer, forms haptic element circuit board.Therefore, this semi-finished product circuit board, can simultaneously be applied to the circuit board on two kinds of antennas,
Even if customer requirement changes, slow-witted material will not be also produced, improve the utilization rate of semi-finished product circuit board.
It should be appreciated that the general description of the above and detailed description hereinafter are only exemplary, this can not be limited
Application.
Brief description of the drawings
Fig. 1 is a kind of structural representation of specific embodiment of semi-finished product circuit board provided herein；
Fig. 2 is semi-finished product circuit board provided herein and a kind of structural representation of specific embodiment of steel mesh.
Reference：
10- semi-finished product circuit boards；
11- substrates；
The pad areas of 111- first；
The pad areas of 112- second；
The pad areas of 113- the 3rd；
12- isolation structures；
20- steel meshes；
The first scolding tin of 21- hole；
The second scolding tin of 22- hole.
Accompanying drawing herein is merged in specification and constitutes the part of this specification, shows the implementation for meeting the application
Example, and it is used to explain the principle of the application together with specification.
Specific embodiment
The application is described in further detail below by specific embodiment and with reference to accompanying drawing.
The embodiment of the present application provides a kind of semi-finished product circuit board 10, for the antenna circuit on mobile terminal such as mobile phone
Plate, both can be used for adapting to the shell fragment circuit board of FPC antenna, it is also possible to the haptic element circuit board for adapting to steel disc antenna.
Specifically, as shown in figure 1, including substrate 11 and isolation structure 12, substrate 11 is provided with the first pad area 111 and
Two pad areas 112, the first pad area 111 is used to be fitted with elastic haptic element, and the second pad area 112 can be used in depositing scolding tin, i.e.,
When deposition scolding tin is needed, can deposit scolding tin to form soldering-tin layer on the second pad area 112.And first pad area 111
Separated by isolation structure 12 with the second pad area 112.Generally, the 3rd pad area 113, the 3rd pad area are additionally provided with substrate 11
113 are used to deposit scolding tin, to facilitate the connection of finished circuit board and other devices.
The semi-finished product circuit board 10 of above-described embodiment, by setting the first pad area 111 and the second pad on the substrate 11
Area 112, in subsequent deposition soldering tin technique, as shown in Fig. 2 setting corresponding with the second pad area 112 the on steel mesh 20
Two scolding tin holes 22, the first scolding tin hole 21 corresponding with the 3rd pad area 113, usually, the second scolding tin hole 22 and the second pad
The appearance profile in area 112 is consistent, and the first scolding tin hole 21 is consistent with the appearance profile of the 3rd pad area 113.Work as semi-finished product cell
When road plate 10 is used for FPC antenna, in subsequent deposition scolding tin, scolding tin is deposited on the second pad area by area the second scolding tin hole 22
112, scolding tin is deposited on the 3rd pad area 113 by the first scolding tin hole 21, in the second pad area 112, the overlying of the 3rd pad area 113
One layer of soldering-tin layer is covered, so as to form shell fragment circuit board；When semi-finished product circuit board 10 is used for steel disc antenna, in subsequent deposition weldering
During tin, directly the second scolding tin hole 22 on steel mesh 20 is blocked, then will not deposit soldering-tin layer in the second pad area, scolding tin is only
It is deposited on the 3rd pad area 113 by the first scolding tin hole 21, so as to form haptic element circuit board.Therefore, this semi-finished product circuit
Plate 10, can simultaneously be applied to the circuit board on two kinds of antennas, even if customer requirement changes, will not also produce slow-witted material, improve
The utilization rate of semi-finished product circuit board 10.
First pad area 111 can be turned on the second pad area 112, it is also possible to be insulated, especially in semi-finished product circuit board 10
For steel disc antenna haptic element circuit board when, due to processing and rigging error, the elastic haptic element and the first pad area of steel disc antenna
111 are likely to occur relative position is shifted, and elastic haptic element is directly contacted with the pad area 112 of isolation structure 12 or second, is
The electric insulation of now elastic haptic element and the first pad area 111 is prevented, second pad area 112 is by the weldering of isolation structure 12 and first
Panel 111 is electrically connected by isolation structure 12, and certain second pad area 112 can also be by other structures or wire and first
Pad area 111 is electrically connected.
Usually, the material of isolation structure 12 is graphite, when semi-finished product circuit board 10 is manufactured, first on the substrate 11 by heavy
Gold process forms a larger pad area (including the first pad area 111 and second pad area 112), then by Carbon deposition technique
Isolation structure 12 is formed on larger pad area, so as to larger pad is divided into the first pad area 111, the second pad area
112 and with the area of coverage for being isolated the covering of structure 12, by this graphite material, can protect the copper face of depositing operation not by
Oxidation, and electric conductivity is able to maintain that, especially when the first pad area 111 is electrically connected with the second pad area 112, this structure can
Facilitate the structure setting of the two.
Generally, relative to the position of mobile phone, shell fragment is close with the position of the elastic haptic element of steel disc antenna, in order to improve substrate
11 space availability ratio, along the thickness direction of substrate 11, the second pad area 112 is projected in the projection of the first pad area 111,
That is the second pad area 112 projection on the substrate 11 is located in the projection on the substrate 11 of the first pad area 111.
Further, the projection in the second pad area 112 on the substrate 11 is located at the throwing on the substrate 11 of the first pad area 111
When in shadow, structure 12 is preferably isolated for loop configuration, loop configuration includes that inner ring and outer shroud, i.e. the second pad area 112 are located at ring
The inside of shape structure, the first pad area 111 is located at the outside of loop configuration, with play preferably isolate the first pad area 111 with
Second pad area 112, and then prevent the scolding tin in subsequent deposition scolding tin from entering the first pad area 111.
When the second pad area 112 is electrically connected by isolation structure 12 with the first pad area 111, along the week of loop configuration
To inner ring can fit completely with the second pad area 112, it is also possible to which only part is fitted with the second pad area 112；Similarly, along ring
The circumference of shape structure, outer shroud can be fitted completely with the first pad area 111, or only part is fitted.It is preferred that along loop configuration
Circumferential, inner ring is fitted with the second pad area 112, and outer shroud is fitted with the first pad area 111, to increase by the first pad area 111
The reliability electrically connected with the second pad area 112.
Further, isolation structure 12 can be straight-flanked ring, circular rings or other loop configuration, add generally for convenient
Work is manufactured, and is adapted to shell fragment or elastic haptic element, is preferably isolated structure 12 for straight-flanked ring.
Because in subsequent deposition scolding tin, when especially semi-finished product circuit board 10 is used for shell fragment circuit board, scolding tin easily flows
Cross isolation structure 12 and enter into the first pad area 111, cause shell fragment loose contact, in order to avoid above mentioned problem, loop configuration
Radial dimension is preferably not less than 0.3 millimeter, i.e., along the radial direction of loop configuration, inner ring is not less than 0.3 millimeter with the distance of outer shroud, such as
0.3 millimeter, 0.4 millimeter, 0.6 millimeter etc..
In subsequent deposition scolding tin, isolation structure 12 into the first pad area 111 is flowed through in order to be better protected from scolding tin, every
It is raised to the direction away from substrate 11 compared with the second pad area 112 from structure 12.
Certainly, the first pad area 111, isolation structure 12 and the second pad area 112 can also three be sequentially arranged.
Additionally, present invention also provides a kind of shell fragment circuit board, for the circuit board matched in FPC antenna, shell fragment electricity
Road plate includes semi-finished product circuit board 10 and soldering-tin layer as above described in any embodiment, and soldering-tin layer covers the second pad area 112,
During assembling, shell fragment is welded in the soldering-tin layer on the second pad area 112, and the haptic element of shell fragment is fitted with the golden finger of FPC antenna.
In addition, a kind of haptic element circuit board that the application is also provided, for the circuit board that steel disc antenna matches, including as above
Semi-finished product circuit board 10 described in any one, during assembling, the elastic haptic element of steel disc antenna is directly fitted with the first pad area 111.
The preferred embodiment of the application is the foregoing is only, the application is not limited to, for the skill of this area
For art personnel, the application can have various modifications and variations.It is all within spirit herein and principle, made any repair
Change, equivalent, improvement etc., should be included within the protection domain of the application.
Claims (10)
1. a kind of semi-finished product circuit board, it is characterised in that including substrate and isolation structure, the substrate is provided with the first pad area
With the second pad area, for being fitted with elastic haptic element, second pad area can be used in depositing scolding tin first pad area,
And first pad area is separated with second pad area by the isolation structure.
2. semi-finished product circuit board according to claim 1, it is characterised in that second pad area is by the isolation junction
Structure is electrically connected with first pad area.
3. semi-finished product circuit board according to claim 2, it is characterised in that along the thickness direction of the substrate, described
The projection of two pad areas is in the projection of first pad area.
4. semi-finished product circuit board according to claim 3, it is characterised in that the isolation structure is loop configuration, described
Loop configuration includes inner ring and outer shroud.
5. semi-finished product circuit board according to claim 4, it is characterised in that along the circumference of the loop configuration,
The inner ring is fitted with second pad area, and/or the outer shroud is fitted with first pad area.
6. semi-finished product circuit board according to claim 4, it is characterised in that the radial dimension of the loop configuration is not less than
0.3 millimeter.
7. the semi-finished product circuit board according to claim any one of 1-6, it is characterised in that the isolation structure more described
Two pad areas are raised to the direction away from the substrate.
8. the semi-finished product circuit board according to claim any one of 2-6, it is characterised in that the material of the isolation structure is
Graphite.
9. a kind of shell fragment circuit board, it is characterised in that including the semi-finished product circuit board as described in claim any one of 1-8 and weldering
Tin layers, the soldering-tin layer covers second pad area.
10. a kind of haptic element circuit board, it is characterised in that including the semi-finished product circuit board as described in claim any one of 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621297088.9U CN206212420U (en) | 2016-11-28 | 2016-11-28 | Semi-finished product circuit board and shell fragment circuit board, haptic element circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621297088.9U CN206212420U (en) | 2016-11-28 | 2016-11-28 | Semi-finished product circuit board and shell fragment circuit board, haptic element circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206212420U true CN206212420U (en) | 2017-05-31 |
Family
ID=58750943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621297088.9U Expired - Fee Related CN206212420U (en) | 2016-11-28 | 2016-11-28 | Semi-finished product circuit board and shell fragment circuit board, haptic element circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206212420U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106358365A (en) * | 2016-11-28 | 2017-01-25 | 深圳天珑无线科技有限公司 | Semifinished product circuit board, leaf spring circuit board and contact pin circuit board |
| CN108281787A (en) * | 2018-01-17 | 2018-07-13 | 广东欧珀移动通信有限公司 | Electronic device |
-
2016
- 2016-11-28 CN CN201621297088.9U patent/CN206212420U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106358365A (en) * | 2016-11-28 | 2017-01-25 | 深圳天珑无线科技有限公司 | Semifinished product circuit board, leaf spring circuit board and contact pin circuit board |
| CN108281787A (en) * | 2018-01-17 | 2018-07-13 | 广东欧珀移动通信有限公司 | Electronic device |
| CN108281787B (en) * | 2018-01-17 | 2021-04-16 | Oppo广东移动通信有限公司 | Electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170531 Termination date: 20181128 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |