CN203225949U - Improved circuit board connecting structure - Google Patents
Improved circuit board connecting structure Download PDFInfo
- Publication number
- CN203225949U CN203225949U CN 201320263011 CN201320263011U CN203225949U CN 203225949 U CN203225949 U CN 203225949U CN 201320263011 CN201320263011 CN 201320263011 CN 201320263011 U CN201320263011 U CN 201320263011U CN 203225949 U CN203225949 U CN 203225949U
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- Prior art keywords
- substrate
- conducting
- via hole
- coated
- conducting material
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- Expired - Fee Related
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Abstract
The utility model discloses an improved circuit board connecting structure. The improved circuit board connecting structure includes a substrate and a PCB arranged on the front face of the substrate. The back face of the substrate is provided with a conducting sheet. The conducting sheet is a conducting layer coated on the substrate. A via hole is arranged in the substrate at a position corresponding to the position of the conducting sheet. A connection part is arranged on the front face of the substrate. First conducting material is coated on the surface of the connection part and a conducting contact connected with the PCB is formed. The conducting contact is connected with the conducting layer through second conducting material coated on the inner wall of the via hole. The improved circuit board connecting structure has beneficial effects. The conducting layer is formed on the substrate through techniques of electroplating, chemical plating and coating and the like. Then the conducting layer is connected with the conducting contact of the PCB through the via hole and the coated conducting material. An integral structure is formed by the first conducting material on the conducting contact, the second conducting material in the via hole and the conducting sheet and is connected with the PCB directly. Therefore, the improved circuit board connecting structure has advantages that the improved circuit board connecting structure is good in electrical connection, simple in structure, stable in performance, convenient to process, low in cost and the like.
Description
Technical field
The utility model relates to wiring board, relates in particular to a kind of wiring board syndeton of improvement.
Background technology
Raising and development of science and technology along with people's living standard, digital electronic goods become an indispensable part in people's life, digital electronic goods generally comprise housing and pcb board, pcb board generally is fixedly installed in the described housing by a substrate, and the electronic devices and components on the pcb board or circuit generally need and the conducting strip of substrate another side (antenna for example, various interface etc.) electrically connect, the conducting strip of pcb board of the prior art and substrate another side is generally by arranging open slot at substrate, realize electrically connecting with passing open slot and pcb board after the conducting strip bending again, this syndeton, its complexity that is linked and packed, difficulty is big, and to pass through the conducting strip bending, operations such as substrate fluting, its production cycle is long, inefficiency, and the product quality of assembling is difficult to be guaranteed.
The utility model content
The purpose of this utility model is to overcome deficiency of the prior art and the wiring board syndeton of a kind of improvement of providing, and it is easy to connect, and is simple in structure, easy to process.
The technical scheme that the prior art problem that solves the utility model adopts is: a kind of wiring board syndeton of improvement, it comprises a substrate and is arranged at the pcb board of described substrate front side, the back side of described substrate is provided with conducting strip, and described conducting strip is to be coated with the conductive layer that is plated on the described substrate;
Be provided with via hole corresponding to described conducting strip position on the described substrate, the front of described substrate is provided with connecting portion, described connecting portion surface is coated with and is coated with first electric conducting material, form the conductive contact that is connected with described pcb board, described conductive contact and described conductive layer are by being coated with the second electric conducting material conducting that is plated on described via hole inwall.
Below technique scheme is further set forth:
Further, an end that is positioned at described substrate back on the described via hole is equipped with a cover layer, and described cover layer is positioned at described conducting strip surface.
Further, described via hole is front to the back side direction by described substrate, the pyramidal structure that its diameter reduces gradually.
Further, described cover layer is insulating material.
Further, the material of described conductive layer and described first electric conducting material and second electric conducting material are one or more in copper, nickel, silver and the gold.
The beneficial effects of the utility model are: the utility model is by electroplating, technology such as chemical plating and coating forms conductive layer at substrate, with this conductive layer as conducting strip, for the sheet metal of conventional fixed on substrate, it is simple in structure, directly be plated on the substrate, do not need other syndetons to be connected with substrate, simultaneously, further second electric conducting material by via hole and coating is connected with the conductive contact of pcb board, because conductive contact and via hole all are to form by the coating electric conducting material, therefore, first electric conducting material on the conductive contact, second electric conducting material in the via hole and conducting strip form integral structure, directly and the pcb board conducting, so, have it and be electrically connected well, simple in structure, stable performance, easy to process and low cost and other advantages.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment;
Fig. 2 is the schematic diagram of the integral structure that is connected to form of conducting strip in the utility model, via hole and conductive contact;
Fig. 3 is the cutaway view of conducting strip in the utility model, via hole and conductive contact connection status;
Among the figure: mobile phone shell 1; The mobile phone shell back side 101; Conductive layer 2; Via hole 201; First electric conducting material 3; Second electric conducting material 4; Connecting portion 5; Cover layer 6.
The realization of the utility model purpose, functional characteristics and advantage will be in conjunction with the embodiments, are described further with reference to accompanying drawing.
Embodiment
Describe the technical solution of the utility model in detail below with reference to drawings and the specific embodiments, so as clearer, understand invention essence of the present utility model intuitively.
Referring to figs. 1 through shown in Figure 3, the utility model provides a kind of wiring board syndeton of improvement, it comprises a substrate and is arranged at the pcb board of described substrate front side, described substrate can be mobile phone shell 1 etc., present embodiment is example with mobile phone shell 1 as substrate, the described mobile phone shell back side 101 is provided with conducting strip, and described conducting strip is to be coated with the conductive layer 2 that is plated on the described mobile phone shell 1; This conductive layer 2 can be made by laser engraving and electroplating technology, concrete, earlier conducting strip on the mobile phone shell 1 is formed the zone and carry out laser engraving, make mobile phone shell 1 surface active, carve out conductive region, electroplate at conductive region again, plated material can adopt one or more in copper, nickel, silver and the gold etc., so, can form and have described conductive layer 2, i.e. conducting strip.The conducting strip of this structure is directly to be plated on the mobile phone shell 1, does not need other syndetons that itself and mobile phone shell 1 is fixing, easy to process, is different from tradition and adopts sheet metal to be fixed in structure on the mobile phone shell 1.
Further, be provided with via hole 201 corresponding to described conducting strip position on the described mobile phone shell 1, the front of described mobile phone shell 1 is provided with outstanding connecting portion 5, described connecting portion 5 surfaces are coated with and are coated with first electric conducting material 3, form the conductive contact that is connected with described pcb board, described via hole 201 inwalls also are coated with and are coated with second electric conducting material 4, first electric conducting material 3, second electric conducting material 4 is identical with the electric conducting material that conducting strip adopts, can adopt copper, nickel, in silver and the gold one or more, first electric conducting material 3 on the connecting portion 5 is connected by being coated with second electric conducting material 4 that is plated on described via hole 201 inwalls with described conductive layer 2, form integral structure, so, described conductive contact and described conductive layer 2 are connected to form conductive path by being coated with second electric conducting material 4 that is plated on described via hole 201 inwalls.Equally, first electric conducting material 3 of described via hole 201 inwalls and second electric conducting material 4 on connecting portion 5 surfaces can also adopt similar conducting strip manufacture method to make, and namely laser engraving and electroplating technology are processed to form.The integral structure that is processed to form (first electric conducting material 3 in conducting strip, the via hole 201 on second electric conducting material 4 and the connecting portion 5 forms integral type), directly with the pcb board conducting, have and be electrically connected well, simple in structure, stable performance, easy to process and low cost and other advantages.
Further, an end that is positioned at described substrate back on the described via hole 201 is equipped with a cover layer 6, and described cover layer 6 is positioned at described conducting strip surface, and this cover layer 6 can adopt insulating material.So, the 201 one ends of the via hole on the mobile phone shell 1 form approximate closed state.Preferable, described via hole 201 is front to the back side direction by described substrate, and the pyramidal structure that its diameter reduces gradually so, is convenient to make via hole 201 inwalls plate second electric conducting material 4 by laser engraving machine and electroplating technology.
The above only is preferred embodiment of the present utility model; be not so limit claim of the present utility model; every equivalent structure or equivalent flow process conversion that utilizes the utility model specification and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present utility model.
Claims (5)
1. the wiring board syndeton of an improvement is characterized in that: it comprises a substrate and is arranged at the pcb board of described substrate front side, and the back side of described substrate is provided with conducting strip, and described conducting strip is to be coated with the conductive layer that is plated on the described substrate;
Be provided with via hole corresponding to described conducting strip position on the described substrate, the front of described substrate is provided with connecting portion, described connecting portion surface is coated with and is coated with first electric conducting material, form the conductive contact that is connected with described pcb board, described conductive contact and described conductive layer are by being coated with the second electric conducting material conducting that is plated on described via hole inwall.
2. according to the wiring board syndeton of the described improvement of claim 1, it is characterized in that: an end that is positioned at described substrate back on the described via hole is equipped with a cover layer, and described cover layer is positioned at described conducting strip surface.
3. according to the wiring board syndeton of the described improvement of claim 1, it is characterized in that: described via hole is front to the back side direction by described substrate, the pyramidal structure that its diameter reduces gradually.
4. according to the wiring board syndeton of the described improvement of claim 2, it is characterized in that: described cover layer is insulating material.
5. according to the wiring board syndeton of each described improvement in the claim 1 to 4, it is characterized in that: the material of described conductive layer and described first electric conducting material and second electric conducting material are one or more in copper, nickel, silver and the gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320263011 CN203225949U (en) | 2013-05-14 | 2013-05-14 | Improved circuit board connecting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320263011 CN203225949U (en) | 2013-05-14 | 2013-05-14 | Improved circuit board connecting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203225949U true CN203225949U (en) | 2013-10-02 |
Family
ID=49252939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320263011 Expired - Fee Related CN203225949U (en) | 2013-05-14 | 2013-05-14 | Improved circuit board connecting structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203225949U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110021810A (en) * | 2019-04-19 | 2019-07-16 | 歌尔科技有限公司 | A kind of electronic equipment and its antenna |
-
2013
- 2013-05-14 CN CN 201320263011 patent/CN203225949U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110021810A (en) * | 2019-04-19 | 2019-07-16 | 歌尔科技有限公司 | A kind of electronic equipment and its antenna |
| CN110021810B (en) * | 2019-04-19 | 2021-08-24 | 荣成歌尔科技有限公司 | Electronic equipment and antenna thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131002 Termination date: 20200514 |