CN102347542B - Linear joint-plug terminal and manufacturing method thereof - Google Patents

Linear joint-plug terminal and manufacturing method thereof Download PDF

Info

Publication number
CN102347542B
CN102347542B CN 201110252224 CN201110252224A CN102347542B CN 102347542 B CN102347542 B CN 102347542B CN 201110252224 CN201110252224 CN 201110252224 CN 201110252224 A CN201110252224 A CN 201110252224A CN 102347542 B CN102347542 B CN 102347542B
Authority
CN
China
Prior art keywords
nickel
palladium
plug terminal
linear joint
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN 201110252224
Other languages
Chinese (zh)
Other versions
CN102347542A (en
Inventor
贾建江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wenzhou Yihua Connector Co Ltd
Original Assignee
WENZHOU YIHUA COMMUNICATED CONNECTOR CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WENZHOU YIHUA COMMUNICATED CONNECTOR CO Ltd filed Critical WENZHOU YIHUA COMMUNICATED CONNECTOR CO Ltd
Priority to CN 201110252224 priority Critical patent/CN102347542B/en
Publication of CN102347542A publication Critical patent/CN102347542A/en
Application granted granted Critical
Publication of CN102347542B publication Critical patent/CN102347542B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

The invention discloses a joint-plug terminal comprising a substrata and an electroplated layer attached to the substrata, wherein the electroplated layer comprises a nickel layer, a palladium nickel layer and a gold layer in sequence from inside to outside. The joint-plug terminal solves the technical problems of high cost and poorer wear resistance of the existing gold-plated joint-plug terminal, and is widely suitable for functional joint-plug-part connectors. The invention also discloses a manufacturing method of the joint-plug terminal, nickel plating is performed in a nickel plating solution without adding any brightening agent and leveling agent, and activating treatment is performed before the palladium nickel layer and the gold layer are plated, so that the plated metal layers are bonded well, and the method can be used for manufacturing linear terminals with very high requirement on bonding force.

Description

A kind of Linear joint-plug terminal and manufacture method thereof
Technical field
The present invention relates to the electric connector connector, particularly a kind of manufacturing of Linear joint-plug terminal.
Background technology
In the existing connector connector, plug terminal all is at conductor layer outer surface electrogilding, with the raising electric conductivity, and the brightness on surface; But the cost of gold is very high, and resistance to wear is relatively poor simultaneously; Therefore, provide the low while of a kind of cost can guarantee that the plug terminal of electric conductivity and anti-wear performance becomes the technique direction in this field.In recent years, as the palladium of noble metal, owing to have electric conductivity and the ratio golden high resistance to wear near with metallographic, and relatively low price is subject to these those skilled in the art's favor.But the adhesion of palladium and other metals is relatively poor, the poor stability of product after electroplating, and particularly for the wire plating piece of thickness of coating greater than 30 microinch, because surface area is tiny, it is particularly outstanding that the poor problem of electrodeposited coating adhesion shows.
Chinese patent file CN101994104A provides a kind of non-electrolytic nickel-palladium-Jin method for plating, and it can carry out non-electrolytic nickel-palladium-Jin plating in the terminal part of printed substrate.This method for plating with Metal Palladium replacement part gold can reduce the cost of product, but this method has following shortcoming: 1. adopt the sal-ammoniac palladium to originate as palladium metal in this method for plating, it is shaped to pure palladium layer, cost is relatively also very high, its operation pH value is between 10-14 simultaneously, the ammonia concentration of electroplating environment is higher, and temperature requirement is high, and production environment is very poor.2. this method for plating is by chemical plating base material to be carried out plating, and it needs palladium catalyst to carry out catalysis, and simultaneously, in order to prevent in the stage of electroless palladium plating, unusually separating out of palladium need to be carried out surface treatment near the resin surface the machine of terminal part; Its production cost improves, and processing step is complicated; 3. because the adhesion of palladium is relatively poor, this method for plating does not provide the step of the adhesion that strengthens palladium and nickel, it affects less for the conductor of the very thin flat basic unit of coating, but for the thicker linear conductor of coating, adopt this this method for plating, the adhesion of coating is difficult to be guaranteed.
Chinese patent CN102098880A discloses a kind of surface treatment method of printed substrate, may further comprise the steps: apply uniformly layer of metal nickel on printed substrate; Then then electroplating palladium-nickel alloy electroplates the gold layer of 0.1 μ m.But only it is washed behind the plating nickel dam in this processing method, then plate the palladium nickel dam, also only passed through washing behind the plating palladium nickel dam, Gold plated Layer then, the finished product adhesion that this method makes is relatively poor; In addition, during the palladium plating nickel dam, the palladium ion concentration of electroplate liquid is 6-9g/L, nickel ion concentration is 5-8g/L, and the pH value is 4.6-5.8, and the mass ratio of palladium nickel differs less, electric conductivity and the anti-wear performance of finished product are relatively poor, are unsuitable for the plating of linear Linear joint-plug terminal.
Summary of the invention
For this reason, first technical problem to be solved by this invention is to provide a kind of cost lower, can guarantee the Linear joint-plug terminal of conductivity and resistance to wear simultaneously.
Second technical problem to be solved by this invention provides a kind of manufacture method that can guarantee the Linear joint-plug terminal of binding force of cladding material.
For solving the problems of the technologies described above, the present invention discloses a kind of manufacture method of Linear joint-plug terminal, may further comprise the steps:
A, with the oil removing of linear basic unit, deoxidation film;
B, product to be plated are positioned in 50-55 ℃ the nickel plating solution, described product to be plated are connected negative electrode, and the nickel cake in the electroplate liquid is connected anode and electroplated, and the pH of described nickel plating solution is 3.8-4.2, and nickel ion concentration is 100-120g/l, electroplates 1-3 minute;
C, activation processing is carried out on the nickel top layer, product to be plated after the activation processing are positioned in the 50-55 ℃ of palladium nickel plating solution, described product to be plated are connected negative electrode, platinum niobium net in the electroplate liquid is connected anode and is electroplated, the pH of described palladium nickel plating solution is 7.2-7.8, palladium ion concentration is 15-25g/L, and nickel ion concentration is 5-8g/L, electroplates 0.5-2 minute;
D, activation processing is carried out on palladium nickel top layer, product to be plated after the activation processing are positioned in the 50-55 ℃ of gold plating bath, described product to be plated are connected negative electrode, platinum niobium net in the electroplate liquid is connected anode and is electroplated, the PH of described gold plating bath is 4.2-4.6, gold ion concentration was electroplated 0.5-2 minute at 3-10g/L;
E, the anti-variable color protection of process post-drying obtain.
Basic unit described in the step a is phosphor-bronze wire.
Step c, the dilute sulfuric acid that among the d described plug terminal is positioned over concentration and is 5-15% activates the top layer at normal temperatures.
Described nickel plating solution is the nickel sulfamic acid of 800-850g/L, the mixed liquor of the nickel chloride of 80-85g/L and the boric acid of 45-55g/L.
The present invention discloses the Linear joint-plug terminal of making according to said method, it comprises basic unit and is attached to electrodeposited coating in the described basic unit, and described electrodeposited coating is followed successively by nickel dam, palladium nickel dam and gold layer from inside to outside.
Described basic unit is phosphor-bronze wire.
Described nickel layer thickness is 1.25-2.5 μ m.
Described palladium nickel layer thickness is 0.15-1.25 μ m.
The mass ratio of palladium and nickel is (80-85) in the described palladium nickel dam: (20-15).
Described golden layer thickness is 0.05-0.125 μ m.Described golden layer thickness is preferably 0.075 μ m.
Technique scheme of the present invention has the following advantages compared to existing technology:
Linear joint-plug terminal of the present invention is electroplate with nickel dam, palladium nickel dam and gold layer.Replace part gold layer of the prior art by the palladium nickel dam, because palladium is all lower than the price of gold with nickel, the cost of this Linear joint-plug terminal.
Preferably, the mass ratio of palladium and nickel is controlled at is (80-85%): (20-15%), the palladium nickel dam of this mass ratio, electric conductivity and the anti-wear performance of palladium both can have been guaranteed, simultaneously, reduced cost of material than existing pure palladium layer, and improved the hardness of product.
Simultaneously, the hardness of gold layer of the present invention is at 160-180HV, and the palladium nickel layer hardness is at 300-400HV; The applicant is the wear-resisting experiment of wire terminal process of 0.75 μ m to thickness of coating, and concrete experiment condition is as follows:
With two diameters be
Figure GDA00002526792400031
0.46 be coated with nickel-palladium nickel-Jin and the binding post that is coated with nickel-Jin, the palladium nickel layer thickness of the first plug terminal is 0.75 μ m, the golden layer thickness of the second plug terminal is 0.75 μ m; Be welded in respectively one can reciprocating flat board on, a top born a heavy burden has the grinding head of 110g counterweight to be positioned on this binding post, binding post is with 30 beats/mins speed reciprocating motion, Thickness Measurement by Microwave is once after operation a period of time.
The thickness of coating comparison situation of two kinds of Linear joint-plug terminals is as shown in table 1.Can find out by table 1, be electroplate with the Linear joint-plug terminal of palladium nickel dam in the situation that be existing direct gold-plated golden the measuring less than 1/10th of using with golden measuring, after 40000 wearing and tearing, the wear-resisting palladium nickel layer thickness of Linear joint-plug terminal of the present invention is about 10 times of existing plug terminal gold layer thickness.
The wear-resisting experiment contrast table of table 1
Figure GDA00002526792400041
In addition, Linear joint-plug terminal of the present invention adopts electro-plating method to make, its at first plating do not add the metallic nickel of any brightener, leveling agent, it is sealed basic unit, prevent copper contact outside air environment and corrode; The nickel plating solution that does not add any brightener, leveling agent strengthens the absorption property of nickel dam and adhesion greatly; For preventing the nickel dam passivation, palladium plating nickel dam behind the overactivation top layer again, the adhesion between palladium nickel dam and the nickel dam is further strengthened; Electroplated behind the palladium nickel dam again through the overactivation top layer, the electrogilding layer has strengthened the adhesion of palladium nickel dam with the gold layer.Therefore, use the manufacture method of Linear joint-plug terminal of the present invention, being combined between the electroplated metal layer used this method and can be made the exigent wire terminal of adhesion.
Metal source of the present invention is sulfuric acid four ammonia palladium systems, it adopts galvanoplastic to electroplate, the palladium concentration of control palladium nickel groove the inside is at 15g/L, nickel ion concentration is at 6g/L, PH is the low ammono-system of 7.2-7.8, the ratio that plating can be controlled the palladium nickel coating is at (80-85): (20-15), compared to existing technology in, the present invention's production cost on the basis that electric conductivity and anti-wear performance can guarantee further reduces; Simultaneously, the ammonia concentration at plating scene is very low.
Description of drawings
For content of the present invention is more likely to be clearly understood, the below according to a particular embodiment of the invention and by reference to the accompanying drawings, the present invention is further detailed explanation, wherein
Fig. 1 is Linear joint-plug terminal sectional view of the present invention.
Reference numeral is expressed as among the figure: the 2-of 1-basic unit nickel dam 3-palladium nickel dam 4-gold layer.
Embodiment
The electroplating formula of Linear joint-plug terminal of the present invention, consumption and operating parameter are as shown in table 2: below with reference to accompanying drawing, use following examples that the present invention is further set forth.
Table 2
Figure GDA00002526792400051
Embodiment 1
Fig. 1 is the Linear joint-plug terminal sectional view in the present embodiment, and it comprises the basic unit 1 that phosphor-bronze wire forms, and upwards is electroplate with successively nickel dam 2, palladium nickel dam 3 and gold layer 4 in described phosphor-bronze wire week.Phosphor-copper in the present embodiment is that cross section is circular, and it is as the female terminal of Linear joint-plug terminal.
The manufacture method of the Linear joint-plug terminal in the present embodiment may further comprise the steps:
A, with the logical cathodic electricity of phosphor-bronze wire, wire drawing greasy dirt and the product to be plated surface of removing the surface are dirty dirty; And then 10% remove the copper wire surface film oxide in the dilution heat of sulfuric acid, makes the copper metal fully exposed;
B, product to be plated are positioned in 50-55 ℃ the non-additive nickel plating solution, described product to be plated are connected negative electrode, nickel cake in the electroplate liquid is connected anode and is electroplated, described nickel plating solution is for being the nickel sulfamic acid of 450-550g/L by concentration, the nickel chloride of 8-10g/L, the solution 400L that the boric acid of 45-55g/L forms, its pH is 3.8-4.2, to guarantee that nickel ion concentration is as 100-120g/l; , electrical current is 25-30A, switches on 2.6 minutes, makes basic unit sealing, prevents copper contact outside air environment and corrodes;
It is after 10% dilute sulfuric acid activates the top layer that c, the phosphor-bronze wire that will be coated with nickel are positioned over concentration, place 50-55 ℃ of palladium nickel plating solution, described product to be plated are connected negative electrode, platinum niobium net in the electroplate liquid is connected anode and is electroplated, described palladium nickel plating solution is the solution 150L that the sulfuric acid four ammonia palladiums of PALLACOR HSN (S) high speed sulfate of ammoniac palladium-nickel alloy 90L and 38.5g/L form, the pH of electroplate liquid is 7.2-7.8, palladium ion concentration is 15g/L, nickel ion concentration is 6g/L, electrical current 40-45A switched on 1.3 minutes;
It is after 10% dilute sulfuric acid activates the top layer that d, the phosphor-bronze wire that will be coated with palladium nickel are positioned over concentration, place 50-55 ℃ of gold plating bath, described product to be plated are connected negative electrode, platinum niobium net in the electroplate liquid is connected anode and is electroplated, and described gold plating bath is the gold-plated prescription of HG24 100L, the HG24K gold liquid medicine solution 100L that the gold potassium cyanide of 10g/L forms, its PH is 4.2-4.6, gold ion concentration is at 10g/L, and electrical current 2.5-3A switched on 1.3 minutes;
E, the anti-variable color protection of process post-drying obtain this Linear joint-plug terminal.
Through above electroplating work procedure, described nickel layer thickness is 1.25 μ m.Described palladium nickel layer thickness is 1.25 μ m, and the mass ratio of palladium and nickel is 17:3 in the palladium nickel dam.Described golden layer thickness is 0.05 μ m.Palladium nickel dam in the present embodiment is thicker, the oxidation resistance of product, and ducting capacity and rub resistance ability all have a very significant increase.
Embodiment 2
Basic unit in the present embodiment is that the cross section is the copper wire of rectangle, and it is as the female terminal of Linear joint-plug terminal.
The manufacture method of the Linear joint-plug terminal in the present embodiment may further comprise the steps:
A, with the logical cathodic electricity of phosphor-bronze wire, wire drawing greasy dirt and the product to be plated surface of removing the surface are dirty dirty; And then 10% remove the copper wire surface film oxide in the dilution heat of sulfuric acid, makes the copper metal fully exposed;
B, product to be plated are positioned in 50-55 ℃ the non-additive nickel plating solution, described product to be plated are connected negative electrode, nickel cake in the electroplate liquid is connected anode and is electroplated, described nickel plating solution is for being the nickel sulfamic acid of 450-550g/L by concentration, the nickel chloride of 8-10g/L, the solution 400L that the boric acid of 45-55g/L forms, its pH is 3.8-4.2, to guarantee that nickel ion concentration is as 100-120g/l; , electrical current is 30-35A, switches on 2 minutes, makes basic unit sealing, prevents copper contact outside air environment and corrodes;
It is after 10% dilute sulfuric acid activates the top layer that c, the phosphor-bronze wire that will be coated with nickel are positioned over concentration, place 50-55 ℃ of palladium nickel plating solution, described product to be plated are connected negative electrode, platinum niobium net in the electroplate liquid is connected anode and is electroplated, described palladium nickel plating solution is the solution 150L that the sulfuric acid four ammonia palladiums of PALLACOR HSN (S) high speed sulfate of ammoniac palladium-nickel alloy 90L and 38.5g/L form, the pH of electroplate liquid is 7.2-7.8, palladium ion concentration is 15g/L, nickel ion concentration is 6g/L, electrical current 12-15A switched on 1 minute;
It is after 10% dilute sulfuric acid activates the top layer that d, the phosphor-bronze wire that will be coated with palladium nickel are positioned over concentration, place 50-55 ℃ of gold plating bath, described product to be plated are connected negative electrode, platinum niobium net in the electroplate liquid is connected anode and is electroplated, and described gold plating bath is the gold-plated prescription of HG24 100L, the HG24K gold liquid medicine solution 100L that the gold potassium cyanide of 10g/L forms, its PH is 4.2-4.6, gold ion concentration is at 10g/L, and electrical current 3-4A switched on 1 minute;
E, the anti-variable color protection of process post-drying obtain this Linear joint-plug terminal.
Through above electroplating work procedure, described nickel layer thickness is 2.5 μ m.Described palladium nickel layer thickness is 0.375 μ m, and the mass ratio of palladium and nickel is 4:1 in the palladium nickel dam.Described golden layer thickness is 0.125 μ m.In the present embodiment, golden layer thickness is thicker, and the ducting capacity of product is stronger, and the product surface light prevents the passivation of palladium nickel dam, strengthens the upper tin ability of product.
Embodiment 3
Basic unit in the present embodiment is that the cross section is the copper cash of rectangle, and it is as the female terminal of Linear joint-plug terminal.
The manufacture method of the Linear joint-plug terminal in the present embodiment may further comprise the steps:
A, with the logical cathodic electricity of phosphor-bronze wire, wire drawing greasy dirt and the product to be plated surface of removing the surface are dirty dirty; And then 10% remove the copper wire surface film oxide in the dilution heat of sulfuric acid, makes the copper metal fully exposed;
B, product to be plated are positioned in 50-55 ℃ the non-additive nickel plating solution, described product to be plated are connected negative electrode, nickel cake in the electroplate liquid is connected anode and is electroplated, described nickel plating solution is for being the nickel sulfamic acid of 450-550g/L by concentration, the nickel chloride of 8-10g/L, the solution 400L that the boric acid of 45-55g/L forms, its pH is 3.8-4.2, to guarantee that nickel ion concentration is as 100-120g/l; , electrical current is 25-30A, switches on 2.4 minutes, makes basic unit sealing, prevents copper contact outside air environment and corrodes;
It is after 10% dilute sulfuric acid activates the top layer that c, the phosphor-bronze wire that will be coated with nickel are positioned over concentration, place 50-55 ℃ of palladium nickel plating solution, described product to be plated are connected negative electrode, platinum niobium net in the electroplate liquid is connected anode and is electroplated, described palladium nickel plating solution is the solution 150L that the sulfuric acid four ammonia palladiums of PALLACOR HSN (S) high speed sulfate of ammoniac palladium-nickel alloy 90L and 38.5g/L form, the pH of electroplate liquid is 7.2-7.8, palladium ion concentration is 15g/L, nickel ion concentration is 6g/L, electrical current 40-45A switched on 1.1 minutes;
It is after 10% dilute sulfuric acid activates the top layer that d, the phosphor-bronze wire that will be coated with palladium nickel are positioned over concentration, place 50-55 ℃ of gold plating bath, described product to be plated are connected negative electrode, platinum niobium net in the electroplate liquid is connected anode and is electroplated, and described gold plating bath is the gold-plated prescription of HG24 100L, the HG24K gold liquid medicine solution 100L that the gold potassium cyanide of 10g/L forms, its PH is 4.2-4.6, gold ion concentration is at 10g/L, and electrical current 2.5-3A switched on 1.2 minutes;
E, the anti-variable color protection of process post-drying obtain this Linear joint-plug terminal.
Through above electroplating work procedure, described nickel layer thickness is 2 μ m.Described palladium nickel layer thickness is 1 μ m, and the mass ratio of palladium and nickel is 4:1 in the palladium nickel dam.Described golden layer thickness is 0.1 μ m.
Embodiment 4
Basic unit in the present embodiment is that the cross section is oval-shaped copper wire, and it is as the female terminal of Linear joint-plug terminal.
The manufacture method of the Linear joint-plug terminal in the present embodiment may further comprise the steps:
A, with the logical cathodic electricity of phosphor-bronze wire, wire drawing greasy dirt and the product to be plated surface of removing the surface are dirty dirty; And then 10% remove the copper wire surface film oxide in the dilution heat of sulfuric acid, makes the copper metal fully exposed;
B, product to be plated are positioned in 50-55 ℃ the non-additive nickel plating solution, described product to be plated are connected negative electrode, nickel cake in the electroplate liquid is connected anode and is electroplated, described nickel plating solution is for being the nickel sulfamic acid of 450-550g/L by concentration, the nickel chloride of 8-10g/L, the solution 400L that the boric acid of 45-55g/L forms, its pH is 3.8-4.2, to guarantee that nickel ion concentration is as 100-120g/l; , electrical current 30-35A switched on 2 minutes, made basic unit sealing, prevented copper contact outside air environment and corroded;
It is after 10% dilute sulfuric acid activates the top layer that c, the phosphor-bronze wire that will be coated with nickel are positioned over concentration, place 50-55 ℃ of palladium nickel plating solution, described product to be plated are connected negative electrode, platinum niobium net in the electroplate liquid is connected anode and is electroplated, described palladium nickel plating solution is the solution 150L that the sulfuric acid four ammonia palladiums of PALLACOR HSN (S) high speed sulfate of ammoniac palladium-nickel alloy 90L and 38.5g/L form, the pH of electroplate liquid is 7.2-7.8, palladium ion concentration is 15g/L, nickel ion concentration is 6g/L, electrical current 25-30A switched on 1 minute;
It is after 10% dilute sulfuric acid activates the top layer that d, the phosphor-bronze wire that will be coated with palladium nickel are positioned over concentration, place 50-55 ℃ of gold plating bath, described product to be plated are connected negative electrode, platinum niobium net in the electroplate liquid is connected anode and is electroplated, and described gold plating bath is the gold-plated prescription of HG24 100L, the HG24K gold liquid medicine solution 100L that the gold potassium cyanide of 10g/L forms, its PH is 4.2-4.6, gold ion concentration is at 10g/L, and electrical current 3-4A switched on 1 minute;
E, the anti-variable color protection of process post-drying obtain this Linear joint-plug terminal.
Through above electroplating work procedure, described nickel layer thickness is 2.125 μ m.Described palladium nickel layer thickness is 0.75 μ m, and the mass ratio of palladium and nickel is 42:13 in the palladium nickel dam.Described golden layer thickness is 0.075 μ m.
Embodiment 5
Basic unit in the present embodiment is that the cross section is oval-shaped copper wire, and it is as the female terminal of Linear joint-plug terminal.
The manufacture method of the Linear joint-plug terminal in the present embodiment may further comprise the steps:
A, with the logical cathodic electricity of phosphor-bronze wire, wire drawing greasy dirt and the product to be plated surface of removing the surface are dirty dirty; And then 10% remove the copper wire surface film oxide in the dilution heat of sulfuric acid, makes the copper metal fully exposed;
B, product to be plated are positioned in 50-55 ℃ the non-additive nickel plating solution, described product to be plated are connected negative electrode, nickel cake in the electroplate liquid is connected anode and is electroplated, described nickel plating solution is for being the nickel sulfamic acid of 450-550g/L by concentration, the nickel chloride of 8-10g/L, the solution 400L that the boric acid of 45-55g/L forms, its pH is 3.8-4.2, to guarantee that nickel ion concentration is as 100-120g/l; , energising 30-35A switch on 1.5 minutes, made basic unit sealing, prevented that copper from contacting the outside air environment and corrode;
It is after 10% dilute sulfuric acid activates the top layer that c, the phosphor-bronze wire that will be coated with nickel are positioned over concentration, place 50-55 ℃ of palladium nickel plating solution, described product to be plated are connected negative electrode, platinum niobium net in the electroplate liquid is connected anode and is electroplated, described palladium nickel plating solution is the solution 150L that the sulfuric acid four ammonia palladiums of PALLACOR HSN (S) high speed sulfate of ammoniac palladium-nickel alloy 90L and 38.5g/L form, the pH of electroplate liquid is 7.2-7.8, palladium ion concentration is 15g/L, nickel ion concentration is 6g/L, electrical current 12-15A switched on 0.8 minute;
It is after 10% dilute sulfuric acid activates the top layer that d, the phosphor-bronze wire that will be coated with palladium nickel are positioned over concentration, place 50-55 ℃ of gold plating bath, described product to be plated are connected negative electrode, platinum niobium net in the electroplate liquid is connected anode and is electroplated, and described gold plating bath is the gold-plated prescription of HG24 100L, the HG24K gold liquid medicine solution 100L that the gold potassium cyanide of 10g/L forms, its PH is 4.2-4.6, gold ion concentration is at 10g/L, and 3-4A switched on 0.6 minute;
E, the anti-variable color protection of process post-drying obtain this Linear joint-plug terminal.
Through above electroplating work procedure, described nickel layer thickness is 1.5 μ m.Described palladium nickel layer thickness is 0.15 μ m, and the mass ratio of palladium and nickel is 41:9 in the palladium nickel dam.Described golden layer thickness is 0.075 μ m.
Obviously, above-described embodiment only is for example clearly is described, and is not the restriction to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here need not also can't give all execution modes exhaustive.And the apparent variation of being extended out thus or change still are among the protection range of the invention.

Claims (11)

1. the manufacture method of a Linear joint-plug terminal is characterized in that, may further comprise the steps:
A, with the oil removing of linear basic unit, deoxidation film;
B, product to be plated are positioned in 50-55 ℃ the nickel plating solution, described product to be plated are connected negative electrode, and the nickel cake in the electroplate liquid is connected anode and electroplated, and the pH of described nickel plating solution is 3.8-4.2, and nickel ion concentration is 100-120g/l, electroplates 1-3 minute;
C, activation processing is carried out on the nickel top layer, product to be plated after the activation processing are positioned in the 50-55 ℃ of palladium nickel plating solution, described product to be plated are connected negative electrode, platinum niobium net in the electroplate liquid is connected anode and is electroplated, the pH of described palladium nickel plating solution is 7.2-7.8, palladium ion concentration is 15-25g/L, and nickel ion concentration is 5-8g/L, electroplates 0.5-2 minute;
D, activation processing is carried out on palladium nickel top layer, product to be plated after the activation processing are positioned in the 50-55 ℃ of gold plating bath, described product to be plated are connected negative electrode, platinum niobium net in the electroplate liquid is connected anode and is electroplated, the PH of described gold plating bath is 4.2-4.6, gold ion concentration was electroplated 0.5-2 minute at 3-10g/L;
E, the anti-variable color protection of process post-drying obtain.
2. the manufacture method of Linear joint-plug terminal according to claim 1 is characterized in that:
Basic unit described in the step a is phosphor-bronze wire.
3. the manufacture method of Linear joint-plug terminal according to claim 1 and 2 is characterized in that:
Step c, the dilute sulfuric acid that among the d described plug terminal is positioned over concentration and is 5-15% activates the top layer at normal temperatures.
4. the manufacture method of Linear joint-plug terminal according to claim 1 and 2 is characterized in that:
Described nickel plating solution is the nickel sulfamic acid of 800-850g/L, the mixed liquor of the nickel chloride of 80-85g/L and the boric acid of 45-55g/L.
5. the Linear joint-plug terminal made of either method according to claim 1-4, it comprises basic unit and is attached to electrodeposited coating in the described basic unit, it is characterized in that:
Described electrodeposited coating is followed successively by nickel dam, palladium nickel dam and gold layer from inside to outside.
6. Linear joint-plug terminal according to claim 5 is characterized in that:
Described basic unit is phosphor-bronze wire.
7. it is characterized in that according to claim 5 or 6 described Linear joint-plug terminals:
Described nickel layer thickness is 1.25-2.5 μ m.
8. it is characterized in that according to claim 5 or 6 described Linear joint-plug terminals:
Described palladium nickel layer thickness is 0.15-1.25 μ m.
9. Linear joint-plug terminal according to claim 8 is characterized in that:
The mass ratio of palladium and nickel is (80-85) in the described palladium nickel dam: (20-15).
10. it is characterized in that according to claim 5 or 6 described Linear joint-plug terminals:
Described golden layer thickness is 0.05-0.125 μ m.
11. Linear joint-plug terminal according to claim 10 is characterized in that:
Described golden layer thickness is 0.075 μ m.
CN 201110252224 2011-08-30 2011-08-30 Linear joint-plug terminal and manufacturing method thereof Active CN102347542B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201110252224 CN102347542B (en) 2011-08-30 2011-08-30 Linear joint-plug terminal and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201110252224 CN102347542B (en) 2011-08-30 2011-08-30 Linear joint-plug terminal and manufacturing method thereof

Publications (2)

Publication Number Publication Date
CN102347542A CN102347542A (en) 2012-02-08
CN102347542B true CN102347542B (en) 2013-04-17

Family

ID=45545940

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201110252224 Active CN102347542B (en) 2011-08-30 2011-08-30 Linear joint-plug terminal and manufacturing method thereof

Country Status (1)

Country Link
CN (1) CN102347542B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106711654A (en) * 2015-07-14 2017-05-24 鸿富锦精密工业(武汉)有限公司 Connector terminal and electroplating method thereof
CN109004405A (en) * 2018-07-27 2018-12-14 北京小米移动软件有限公司 Inserting terminal, grafting pin processing technology and electronic equipment
CN110350339B (en) * 2018-08-29 2022-04-22 富士康(昆山)电脑接插件有限公司 Conductive terminal, manufacturing method thereof and electric connector
CN113571943A (en) * 2021-08-17 2021-10-29 长春捷翼汽车零部件有限公司 Flat belt and terminal insertion structure and motor vehicle
CN113789558B (en) * 2021-09-28 2023-06-16 万明电镀智能科技(东莞)有限公司 Plug-resistant non-porous nickel-based composite coating and preparation method thereof
CN113737236B (en) * 2021-09-28 2023-06-16 万明电镀智能科技(东莞)有限公司 High-corrosion-resistance composite coating and preparation method and application thereof
CN113699566B (en) * 2021-09-28 2023-07-04 万明电镀智能科技(东莞)有限公司 Palladium-nickel combined plating layer resistant to anodic electrolytic corrosion and electroplating method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100407503C (en) * 2003-08-30 2008-07-30 富士康(昆山)电脑接插件有限公司 Terminal and its electroplating method
JP2006083410A (en) * 2004-09-14 2006-03-30 Shinei Hitec:Kk Method for manufacturing electronic part
JP2006252862A (en) * 2005-03-09 2006-09-21 Sony Corp Memory card, mobile information terminal unit and charger
JP2009135097A (en) * 2007-11-02 2009-06-18 Furukawa Electric Co Ltd:The Metal material for electric and electronic equipment, method of manufacturing metal material for electric and electronic equipment

Also Published As

Publication number Publication date
CN102347542A (en) 2012-02-08

Similar Documents

Publication Publication Date Title
CN102347542B (en) Linear joint-plug terminal and manufacturing method thereof
US6677056B2 (en) Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the plating film
JP2013076127A (en) Silver plating material and production method therefor
CN106400070A (en) Electroplating method for partial silver-plating for iron substrate lead frame
CN114892225B (en) Plating solution for electroplating gold on nickel coating and method for electroplating gold on nickel coating, gold-plated part and application
KR101057025B1 (en) Gold and silver plating method on conductive fiber
CN100407503C (en) Terminal and its electroplating method
CN102098880A (en) Surface processing method of PCB (printed circuit board)
CN202205928U (en) Linear plug terminal
JP2004534151A (en) How to regenerate plating solution
CN103540978B (en) A kind of alkaline non-cyanide is electroplated the method for Ag-Ni alloy
KR20130029990A (en) Light emitting diode lead frame having high reflectivity and method for plating thereof
TWI434964B (en) A plating solution containing gold
CN116083890A (en) Substrate surface treatment method and application thereof
CN101593710A (en) A kind of interconnected process of scolder that on ferronickel pad, realizes
JP2005105307A (en) REFLOW-Sn-PLATED MEMBER, METHOD FOR MANUFACTURING THE MEMBER, AND COMPONENT FOR ELECTRICAL AND ELECTRONIC EQUIPMENT USING THE MEMBER
US10914018B2 (en) Porous Cu on Cu surface for semiconductor packages
JP7162341B2 (en) Method for manufacturing plated laminate and plated laminate
JPH0423000B2 (en)
CN112376095A (en) Electroplating process for preventing high-temperature tin melting
CN1307327C (en) Electroplating method
CN103484839A (en) Metal surface treatment reagent for cyanide-free chemical plating or cyanide-free electroplating, and metal surface treatment method
JP7364755B2 (en) Plating material and its manufacturing method
CN216087117U (en) Cost-reduced nickel alloy multilayer gold-plating for printed circuit board
JP7083662B2 (en) Plating material

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: WENZHOU YIHUA CONNECTOR CO., LTD.

Free format text: FORMER NAME: WENZHOU YIHUA COMMUNICATED CONNECTOR CO., LTD.

CP01 Change in the name or title of a patent holder

Address after: 325600 Zhejiang city of Wenzhou province Yueqing City Weng Sanyang Street West Industrial Zone

Patentee after: Wenzhou Yihua Connector Co., Ltd.

Address before: 325600 Zhejiang city of Wenzhou province Yueqing City Weng Sanyang Street West Industrial Zone

Patentee before: Wenzhou Yihua Communicated Connector Co., Ltd.