JPH0423000B2 - - Google Patents
Info
- Publication number
- JPH0423000B2 JPH0423000B2 JP59108906A JP10890684A JPH0423000B2 JP H0423000 B2 JPH0423000 B2 JP H0423000B2 JP 59108906 A JP59108906 A JP 59108906A JP 10890684 A JP10890684 A JP 10890684A JP H0423000 B2 JPH0423000 B2 JP H0423000B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- nickel
- tank
- plating solution
- empty
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 58
- 238000001914 filtration Methods 0.000 claims description 12
- DITXJPASYXFQAS-UHFFFAOYSA-N nickel;sulfamic acid Chemical compound [Ni].NS(O)(=O)=O DITXJPASYXFQAS-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 45
- 229910052759 nickel Inorganic materials 0.000 description 22
- 239000002253 acid Substances 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- 150000002500 ions Chemical class 0.000 description 7
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000005868 electrolysis reaction Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- 238000001802 infusion Methods 0.000 description 3
- PQMFVUNERGGBPG-UHFFFAOYSA-N (6-bromopyridin-2-yl)hydrazine Chemical compound NNC1=CC=CC(Br)=N1 PQMFVUNERGGBPG-UHFFFAOYSA-N 0.000 description 2
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 235000010215 titanium dioxide Nutrition 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、ニツケルメツキ浴を長期にわたり恒
常状態に保つことのできるニツケルめつき装置に
関し、例えば印刷回路板の端子部の下地ニツケル
めつき等に使用するニツケルめつき装置に関す
る。Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a nickel plating device that can maintain a nickel plating bath in a constant state for a long period of time, and is suitable for, for example, nickel plating on the base of terminals of printed circuit boards. Regarding the nickel plating device used.
（従来の技術）
印刷回路板は、第２図の端子部分周辺の断面図
に示すように、絶縁基板１の片面もしくは両面に
導電パターン状の銅層２が形成され、銅層２の主
要部にハンダ層３が積層され、端子部分には銅層
２の空気中における酸化を防ぐため、銅層２の上
にニツケル下地層４を介して接触抵抗の低い金メ
ツキ層５を積層して成るものが通常である。(Prior Art) As shown in the cross-sectional view around the terminal portion in FIG. 2, a printed circuit board has a copper layer 2 in the form of a conductive pattern formed on one or both sides of an insulating substrate 1, and the main parts of the copper layer 2 are A solder layer 3 is laminated on the terminal portion, and a gold plating layer 5 with low contact resistance is laminated on the copper layer 2 via a nickel base layer 4 in order to prevent the copper layer 2 from oxidizing in the air. Things are normal.
このニツケル下地層４はメツキされた金層５が
直接銅層２に接触して、金が銅層２に拡散するこ
とを防止するために設けられるもので、このニツ
ケル下地層４表面を無光沢のマツト状または梨地
状としてこのニツケル下地層４とこの上に形成さ
れる金層５との密着強度を向上するため、あるい
は工場において大量生産する際の高速性や作業性
の観点から、不溶性電極を使用し、スルフアミン
酸ニツケルを用いる高速ニツケル浴によりメツキ
形成されている。 This nickel base layer 4 is provided to prevent the plated gold layer 5 from coming into direct contact with the copper layer 2 and preventing the gold from diffusing into the copper layer 2. In order to improve the adhesion strength between the nickel base layer 4 and the gold layer 5 formed thereon, or from the viewpoint of high speed and workability during mass production in a factory, an insoluble electrode is used. The plating is formed using a high-speed nickel bath using nickel sulfamate.
（発明が解決しようとする課題）
しかしながら、このような不溶性電極を用いる
ニツケルめつき浴では、このスルフアミン酸ニツ
ケルの成分であるスルフアミン酸イオン
（H2NSO3 -）は、浴中で下記式の如くアゾジスル
フオン酸イオン（SO3N＝NSO3 2-）に変化する。(Problem to be Solved by the Invention) However, in a nickel plating bath using such an insoluble electrode, the sulfamate ion (H 2 NSO 3 - ), which is a component of this nickel sulfamate, is converted into the following formula in the bath: It changes to azodisulfonic acid ion (SO 3 N=NSO 3 2- ).
2H2NSO3 -→SO3N＝NSO3 2-＋4H+＋4e-
発生するアゾジスルフオン酸イオンは一種の光
沢剤であり、この浴を長期間使用して積算通電量
が増大するに従いこのアゾジスルフオン酸イオン
も増大し、上記ニツケル下地層４表面が光沢化
し、金層５との密着強度が低下するという現象が
みられた。2H 2 NSO 3 - →SO 3 N=NSO 3 2- +4H + +4e -The azodisulfonic acid ion generated is a kind of brightener, and as the bath is used for a long time and the cumulative amount of current increases, the azodisulfonic acid ion It was observed that the surface of the nickel base layer 4 became glossy and the adhesion strength with the gold layer 5 decreased.
本発明はこのような観点に従つてなされたもの
で、発生したアゾジスルフオン酸イオンをに除去
し、従つて長期間の使用に耐えてしかもニツケル
下地層４の無光沢状態を維持し、金層との密着強
度を長期間維持するめつき装置を提供することを
目的とするものである。 The present invention has been made in accordance with this point of view, and is capable of removing generated azodisulfonic acid ions, thereby enduring long-term use, maintaining the matte state of the nickel base layer 4, and making it possible to remove the generated azodisulfonic acid ions. The object of the present invention is to provide a plating device that maintains the adhesion strength for a long period of time.
（課題を解決するための手段）
すなわち、本発明は、
不溶性電極を備え、被メツキ物にめつきを施す
スルフアミン酸ニツケル液の本槽と、
該本槽のめつき液を無光沢で表面マツト状乃至
梨地状のめつきが可能にするめつき液とするのに
十分な電流密度の空電解処理を施す空電解槽と、
前記本槽と空電解槽の間でめつき液を循環させ
る循環機構と、
前記空電解槽に付設され、そのめつき液を濾過
する濾過装置、
から構成されることを特徴とする。(Means for Solving the Problems) That is, the present invention provides a main tank of a nickel sulfamic acid solution that is equipped with an insoluble electrode and that applies plating to objects to be plated, and a plating solution in the main tank that is provided with a matte surface. an empty electrolytic tank that performs empty electrolytic treatment at a current density sufficient to produce a plating solution that enables plating with a matte or satin-like plating; and a circulation mechanism that circulates the plating solution between the main tank and the empty electrolytic tank. and a filtration device attached to the empty electrolytic tank to filter the plating solution.
かかる技術的手段において、スルフアミン酸ニ
ツケル液の本槽とは、印刷配線板の端子部等の被
めつき物に金属ニツケルのめつき皮膜を形成する
電解めつき浴槽をいい、浴槽の中にスルフアミン
酸ニツケルを主成分とするめつき液を満たし、不
溶性電極から成るアノードと被めつき物から成る
カソードをこのめつき液中に浸漬したものをい
う。スルフアミン酸ニツケル液としては、たとえ
ば、下記組成のめつき液が使用できる。 In such technical means, the main tank for the nickel sulfamic acid solution refers to an electrolytic plating bath that forms a nickel metal plating film on objects to be plated, such as terminals of printed wiring boards, and the sulfamic acid solution is in the bath. It is filled with a plating solution whose main component is nickel acid, and the anode, which is an insoluble electrode, and the cathode, which is a plating material, are immersed in this plating solution. As the nickel sulfamic acid solution, for example, a plating solution having the following composition can be used.
●めつき液組成
スルフアミン酸ニツケル …495から660ｇ／
塩化ニツケル …５から８ｇ／
ホウ酸 …20から40ｇ／
PH値 …2.0から2.4
また、不溶性電極としては例えばチタン白のア
ノード電極が使用できる。●Plating liquid composition Nickel sulfamate...495 to 660g/Nickel chloride...5 to 8g/Boric acid...20 to 40g/PH value...2.0 to 2.4 Furthermore, as the insoluble electrode, for example, a titanium white anode electrode can be used.
また、かかる技術的手段において、空電解槽と
は、本槽において発生したアゾジスルフオン酸イ
オン（ADS）とNiを共析させる電解槽をいい、
例えば、めつき液を満たし、このめつき液に浸漬
されたアノードとカソードの間で0.1A／ｄm2程
度の微小電流を通電してめつき液を電解する空電
解槽が使用できる。また、濾過装置とは空電解に
伴つて発生する不純物や本槽で生じた不純物を濾
過して除去する装置をいい、例えばめつき液量１
リツトル当たり５から30ｇの粉末活性炭を使用し
た濾過槽が使用できる。またこの濾過装置はポン
プ等を介して空電解槽に接続されることにより空
電解槽に付設されることができる。 In addition, in such technical means, the empty electrolytic cell refers to an electrolytic cell in which azodisulfonic acid ions (ADS) generated in the main cell and Ni are eutectoid;
For example, an empty electrolytic tank can be used which is filled with a plating solution and electrolyzes the plating solution by passing a minute current of about 0.1 A/dm 2 between an anode and a cathode immersed in the plating solution. In addition, a filtration device is a device that filters and removes impurities generated due to empty electrolysis and impurities generated in the main tank. For example, the plating liquid volume 1
A filtration tank using 5 to 30 g of powdered activated carbon per liter can be used. Further, this filtration device can be attached to an empty electrolytic tank by being connected to the empty electrolytic tank via a pump or the like.
本発明のめつき装置は、本槽の運転を一定期間
行い、めつき液の性状の変化に応じて、本槽のめ
つき液の全てを空電解槽に移し、空電解及び濾過
することにより使用することができる。また、本
槽と空電解槽の間でめつき液を絶えず循環させな
がら、空電解槽に常時通電してめつき液を恒常状
態に保ち、本槽のめつきとリアルタイムにめつき
液の空電解及び濾過をすることによつて使用して
もよい。 The plating apparatus of the present invention operates the main tank for a certain period of time, and depending on changes in the properties of the plating solution, all of the plating solution in the main tank is transferred to an empty electrolytic tank, and subjected to empty electrolysis and filtration. can be used. In addition, while constantly circulating the plating solution between the main tank and the empty electrolytic tank, the empty electrolytic tank is constantly energized to keep the plating solution in a constant state, and the plating in the main tank is updated in real time. It may also be used by electrolysis and filtration.
（作用）
本発明においては、
ニツケルめつきを施す本槽と空電解槽を循環機
構を介して接続したから、ADSをNiと共析する
ことが可能となり、
また濾過装置を空電解槽に付設したから、この
共析物を他の不純物と共に除去することが可能に
なる。(Function) In the present invention, since the main tank for nickel plating and the empty electrolytic tank are connected via a circulation mechanism, it is possible to eutectoid ADS with Ni, and a filtration device is attached to the empty electrolytic tank. Therefore, it becomes possible to remove this eutectoid along with other impurities.
（実施例）
以下、図面を参照して本発明の実施例を説明す
る。(Example) Hereinafter, an example of the present invention will be described with reference to the drawings.
第１図において、６は本槽を示しており、下記
組成のめつき液を2000収容した。 In FIG. 1, 6 indicates the main tank, which contained 2000 plating solutions having the following composition.
●めつき液組成
スルフアミン酸ニツケル …495から660ｇ／
塩化ニツケル …５から８ｇ／
ホウ酸 …20から40ｇ／
PH値 …2.0から2.4
この本槽６には、アノードとしてチタン白の不
溶性電極７を使用し、またカソード８には被めつ
き物として印刷配線板をつりさげた。なお、図示
を省略しているが、本槽６はめつき液を循環させ
る高速めつき法に用いる米国マイクロプレート社
製の液循環式高速めつき装置である。●Plating liquid composition Nickel sulfamate...495 to 660g/Nickel chloride...5 to 8g/Boric acid...20 to 40g/PH value...2.0 to 2.4 This main tank 6 uses a titanium white insoluble electrode 7 as an anode. Moreover, a printed wiring board was suspended from the cathode 8 as a covering material. Although not shown in the drawings, the main tank 6 is a liquid circulation type high-speed plating device manufactured by Microplate Co., Ltd. in the United States, which is used for a high-speed plating method in which a plating liquid is circulated.
この本槽６は、ポンプ９を付設した輸液管１０
から成る循環機構を介して空電解槽１１に接続さ
れており、この空電解槽１１には、チタンケース
１２がめつき液中に浸漬されており、このチタン
ケース１２中にはニツケルチツプから成るアノー
ドが収容されている。また、この空電解槽１１の
カソード１３としては、電極表面積を大きくする
ため、ステンレスメツシユを巻いた網状電極を使
用した。 This main tank 6 includes an infusion pipe 10 equipped with a pump 9.
A titanium case 12 is immersed in a plating solution, and an anode made of nickel chips is connected to the empty electrolytic tank 11 through a circulation mechanism consisting of a plating solution. It is accommodated. Further, as the cathode 13 of this empty electrolytic cell 11, a mesh electrode wrapped with stainless steel mesh was used in order to increase the electrode surface area.
また、この空電解槽１１にはポンプ１５を付設
した輸液管を介して濾過槽１４が接続されてお
り、この濾過槽１４には2000ｇの粉末活性炭が収
容されている。 Further, a filtration tank 14 is connected to the empty electrolytic tank 11 via an infusion pipe equipped with a pump 15, and this filtration tank 14 contains 2000 g of powdered activated carbon.
かかる装置を使用して、印刷配線板の端子部の
ニツケルめつきを以下の如く実施した。 Using this apparatus, nickel plating of the terminal portion of a printed wiring board was carried out as follows.
すなわち、本槽６のめつき液温度（浴温度）は
55℃であり、電流密度は10から25A／ｄm2であ
る。スルフアミン酸ニツケルは使用して消費した
分だけ外部から補給した。この状態で５日間連続
運転を行い、しかる後めつき液を全て空電解槽１
１に移し、めつき液温度40℃、電流密度0.1A／
ｄm2の空電解を24時間行つた。なお、空電解と同
時にポンプ１５を使用してめつき液を空電解槽１
１と濾過槽１４の間を強制循環させた。 In other words, the plating liquid temperature (bath temperature) in main tank 6 is
The temperature is 55° C. and the current density is 10 to 25 A/dm 2 . Nickel sulfamate was replenished externally in the amount used and consumed. Continuous operation was carried out in this state for 5 days, and then all the plating solution was removed from the empty electrolytic tank 1.
1, plating solution temperature 40℃, current density 0.1A/
Empty electrolysis at dm 2 was carried out for 24 hours. In addition, at the same time as the empty electrolysis, the plating solution is pumped into the empty electrolytic tank 1 using the pump 15.
Forced circulation was performed between the filter tank 1 and the filter tank 14.
空電解の終了しためつき液を再度本槽６に戻
し、再び印刷配線板のニツケルめつきを行つた。
めつき液１リツトル当たり通電量50Ah以上にわ
たつて無光沢でマツト状または梨地状のニツケル
めつき膜が形成され、その上に積層した金めつき
層との密着性も強固で良好なものであつた。 After the dry electrolysis, the tamping solution was returned to the main tank 6, and the printed wiring board was plated with nickel again.
A matte, matte or satin-like nickel plating film is formed when an electric current of 50Ah or more is applied per liter of plating solution, and the adhesion to the gold plating layer laminated on top of the nickel plating film is strong and good. It was hot.
（効果）
以上のように本発明によれば、
ニツケルめつきに使用したスルフアミン酸ニツ
ケル液から、めつきに伴つて発生するアゾジスル
フオン酸イオンを除去することができるから、
このスルフアミン酸ニツケル液を長期にわたつ
て使用して、しかも表面が無光沢でマツト状また
は梨地状のニツケルめつき膜を形成することがで
き、
従つてこの上に積層される金層との密着性を十
分な強度に維持することができる。(Effects) As described above, according to the present invention, azodisulfonate ions generated during plating can be removed from the nickel sulfamate solution used for nickel plating, so the nickel sulfamate solution can be used for a long period of time. It can be used for a long period of time to form a matte or satin-like nickel plating film with a matte surface, which maintains sufficient adhesion with the gold layer laminated on top. can do.
第１図は本発明のニツケルめつき装置の概略説
明図、第２図は印刷回路板の電極端子部周辺を示
す断面図である。
６……本槽、７……不溶性電極、８……カソー
ド、９……ポンプ、１０……輸液管、１１……空
電解槽、１２……チタンケース、１３……カソー
ド、１４……濾過槽、１５……ポンプ。
FIG. 1 is a schematic explanatory diagram of a nickel plating apparatus of the present invention, and FIG. 2 is a sectional view showing the vicinity of an electrode terminal portion of a printed circuit board. 6... main tank, 7... insoluble electrode, 8... cathode, 9... pump, 10... infusion tube, 11... empty electrolytic tank, 12... titanium case, 13... cathode, 14... filtration Tank, 15...pump.
Claims (1)
すスルフアミン酸ニツケル液の本槽と、 該本槽のめつき液を無光沢で表面マツト状乃至
梨地状のめつきが可能にするめつき液とするのに
十分な電流密度の空電解処理を施す空電解槽と、 前記本槽と空電解槽の間でめつき液を循環させ
る循環機構と、 前記空電解槽に付設され、そのめつき液を濾過
する濾過装置、 から構成されることを特徴とするニツケルめつき
装置。[Scope of Claims] 1. A main tank of a nickel sulfamic acid solution that is equipped with an insoluble electrode and is used to plate objects to be plated, and a plating solution in the main tank that is used to produce matte or satin-like plating on the surface. an empty electrolytic tank that performs empty electrolytic treatment with a current density sufficient to produce a plating solution that can be used as a plating solution; a circulation mechanism that circulates the plating solution between the main tank and the empty electrolytic tank; and a circulation mechanism attached to the empty electrolytic tank. and a filtration device for filtering the plating solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10890684A JPS60251294A (en) | 1984-05-28 | 1984-05-28 | Nickel plating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10890684A JPS60251294A (en) | 1984-05-28 | 1984-05-28 | Nickel plating apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60251294A JPS60251294A (en) | 1985-12-11 |
| JPH0423000B2 true JPH0423000B2 (en) | 1992-04-21 |
Family
ID=14496628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10890684A Granted JPS60251294A (en) | 1984-05-28 | 1984-05-28 | Nickel plating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60251294A (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8911566D0 (en) * | 1989-05-19 | 1989-07-05 | Sun Ind Coatings | Plating system |
| JP4645114B2 (en) * | 2004-09-22 | 2011-03-09 | 凸版印刷株式会社 | Wiring board manufacturing method |
| JP2009099548A (en) * | 2007-09-26 | 2009-05-07 | Furukawa Electric Co Ltd:The | Silver-clad composite material for movable contact and its manufacturing method |
| KR101501309B1 (en) * | 2007-09-26 | 2015-03-10 | 후루카와 덴키 고교 가부시키가이샤 | Silver-coated composite material for movable contact and method for manufacturing the same |
| JP4558823B2 (en) * | 2007-09-26 | 2010-10-06 | 古河電気工業株式会社 | Silver-coated composite material for movable contact and method for producing the same |
| KR100922505B1 (en) * | 2007-12-07 | 2009-10-21 | 한국과학기술원 | METHOD FOR MANUFACTURING STAMP HAVING FLEXIBILITY THEREOF USING Ni ELECTROPLATING SOLUTION |
| JP6180893B2 (en) * | 2013-11-13 | 2017-08-16 | 矢崎総業株式会社 | Plating equipment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4948526A (en) * | 1972-05-08 | 1974-05-10 | ||
| JPS58121375A (en) * | 1982-01-09 | 1983-07-19 | Jitsuo Sakamoto | Gas leak interceptor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58121375U (en) * | 1982-02-10 | 1983-08-18 | 上村工業株式会社 | electroplating device |
-
1984
- 1984-05-28 JP JP10890684A patent/JPS60251294A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4948526A (en) * | 1972-05-08 | 1974-05-10 | ||
| JPS58121375A (en) * | 1982-01-09 | 1983-07-19 | Jitsuo Sakamoto | Gas leak interceptor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60251294A (en) | 1985-12-11 |
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