CN1307327C - Electroplating method - Google Patents
Electroplating method Download PDFInfo
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- CN1307327C CN1307327C CNB011123761A CN01112376A CN1307327C CN 1307327 C CN1307327 C CN 1307327C CN B011123761 A CNB011123761 A CN B011123761A CN 01112376 A CN01112376 A CN 01112376A CN 1307327 C CN1307327 C CN 1307327C
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The present invention provided a convenient lead-free soldering method to meet the demand of environmental protection. A conductive member 21 is dipped in a first plating solution and then in a second plating solution to deposit two plating films 22 and 23 each of a different metallic material by this plating method. The first plating solution and the second plating solution have the same composition except a metallic material and an acidic solvent to dissolve the metallic material, hence a water washing bath is not needed, and a plating method is realized wherein the concentration control of the plating solution is facilitated.
Description
The invention relates to electro-plating method, particularly about unleaded plating and form the electro-plating method of soldering performance good metal material electroplating film continuously.
The lead-in wire material that forms with the conductive component surface of the electrolytic coating of Sn monomer or Sn alloy lining Cu monomer, Cu alloy or Fe-Ni alloy and so on, it is the high-performance conductor, have good electric conductivity and physical strength that Cu monomer, Cu alloy are possessed, but also have solidity to corrosion that Sn monomer or Sn alloy possessed and good solderability, be used for electric and electronic fields such as various terminals, joint, lead-in wire or power cable field etc. in a large number.
In addition, when on circuit substrate, carrying semi-conductor chip, use the hot dip process or the plating of Sn alloy, improve the solderability of this outer lead part thus at the outer lead part of semi-conductor chip.The typical example of such Sn alloy for example is solder (a Sn-Pb alloy), because solderability, solidity to corrosion etc. are good, so be widely used as the industrial plating of the industrial parts of electric and electronic such as joint or lead frame.
But the Pb that uses in solder causes ill effect to human body, thereby points out hazardous property, produces the proposal of the use of restriction Pb in the world.For example, discard in outdoor electronic installation class etc., if be exposed in the acid rain, Pb causes underground water or river pollution just from the inner solder (Sn-Pb alloy) that uses of this device or be dissolved out the solder coating that the surface of electronic unit applies.In order to prevent the pollution of the environment, preferably use the Sn alloy that does not contain Pb.Developing the new electroplate liquid that does not contain Pb of replacement Sn-Pb electroplate liquid in the past for this reason.Having developed at present what do not contain Pb is the electroplate liquid of principal constituent with Sn, the electroplate liquid of Sn-Bi system, Sn-Ag system, Sn-Cu system for example, and progressively substituting original electroplate liquid.
Fig. 3 is the sectional drawing of the basic comprising of expression lead-in wire material.For example, conductive component 21 is that the Cu of principal constituent is an alloy by Cu, with Cu or is that the Fe-Ni of principal constituent is that alloy constitutes with Fe-Ni.And, on the surface of these conductive components 21 plating 2 layers of electroplating film of different metal material.For example, in turn form the 1st electroplating film 22 of Sn and the 2nd electroplating film 23 of Sn-Bi.At this, know that the thickness of establishing the 1st electroplating film 22 is t
1, the thickness of establishing the 2nd electroplating film 23 is t
2The time, if t
1Setting is into about 3～15 μ m, t
2Setting is into about 1～5 μ m, t
2/ t
1Setting is into about 0.1～0.5, and no matter aspect cost, solderability and thermotolerance aspect, or the welding strength of solder or good characteristic is all arranged with the welding strength aspect of the weld part of aluminum steel etc. obtain improving as the performance of lead-in wire material, are suitable therefore.
Fig. 4 is all plot plans of automatic plating machine.At first, clean in the liquid bath 31 the pollution impurity of the tack of the lip-deep obstruction solder plating tunicle of removal conductive component 21 or organic property such as grease of solderability in alkaline electrolysis.Then, washing with after cleaning in the liquid bath 32, in chemical corrosion liquid bath 33, carry out chemical corrosion and handle (utilizing the processing of oxidation-reduction reaction basically), make the surperficial homogenizing that becomes the conductive component 21 of uneven surface owing to the existence of crystal boundary or inclusion etc.
Then, with after cleaning in the liquid bath 34, in acid activity liquid bath 35, remove the oxide film that in washing, adheres in washing with liquid bath 34.Subsequently,, in solder electroplanting device 37, implement and electroplate with after cleaning in the liquid bath 36 in washing.The solder electroplate liquid is highly acid, and the surface after therefore electroplating becomes acidity.Such surface process in time, tunicle variable color, solderability deterioration.For this reason, in washing liquid bath 38, neutralizing treatment groove 39, neutralization remains in the acid on electrolytic coating surface, removes adsorbed organic matter.After this, clean in drying installation 42 drying galvanized conductive component with liquid bath 40, hot water wash in liquid bath 41 in washing.
Fig. 5 is a detailed plot plan of implementing galvanized part in electroplanting device 37 in the past.In this electro-plating method, conductive component 21 is immersed in the preimpregnation groove 371, remove the hydroxide film on surface, be immersed in the electroplate liquid of the 1st electric bath groove 372, after applying the 1st electroplating film 22, conductive component 21 is immersed in washing between the electroplate liquid of the electroplate liquid that is arranged on the 1st electric bath groove 372 and the 2nd electric bath groove 374, removes the 1st electroplate liquid with in the pure water of liquid bath 373, then conductive component 21 is immersed in the electroplate liquid of the 2nd electric bath groove 374, applies the 2nd electroplating film 23.At last at the washing plating face of cleaning in the liquid bath 375.
In above-mentioned electro-plating method, apply the electroplate liquid and the electroplate liquid that applies the 2nd electric bath groove 374 of the 2nd electroplating film of the 1st electric bath groove 372 of the 1st electroplating film 22, except the metallic substance that constitutes electroplate liquid separately and dissolve the acid solvent of these metallic substance, just not that identical liquid constitutes.For example, be made of the Sn monomer at the 1st electroplating film 22, when the 2nd electroplating film 23 was made of the Sn-Bi alloy, in the formation of the electroplate liquid of the 1st electric bath groove 372 and the 2nd electric bath groove 374, about organic acid, solvent and pure water, use was the material that identical liquid constitutes.But, about additive, the additive that the former generally uses the solder electroplate liquid to use, the additive that the latter generally uses the Sn-Bi electroplate liquid to use.
In addition, the 1st electric bath groove 372 and the 2nd electric bath groove 374 often use identical shaped electric bath groove.
Such electro-plating method is opened existing explanation in the flat 10-229152 communique the spy.
At first, apply the electroplate liquid and the electroplate liquid that applies the 2nd electric bath groove 374 of the 2nd electroplating film 23 of the 1st electric bath groove 372 of the 1st above-mentioned electroplating film 22, if except the metallic substance that constitutes electroplate liquid separately and dissolve the acid solvent of these metallic substance, just not that identical liquid constitutes.Therefore, the electroplate liquid of the 1st electric bath groove 372 is attached on the conductive component 21, washing is set with liquid bath 373, so that the electroplate liquid of the 1st electric bath groove 372 can directly not brought in the electroplate liquid of the 2nd electric bath groove 374 between the electroplate liquid of the electroplate liquid of the 1st electric bath groove 372 and the 2nd electric bath groove 374.And must use the pure water of this washing with liquid bath 373, remove the electroplate liquid of the 1st electric bath groove 372.Therefore, electro-plating method in the past makes to wash with water with liquid bath 373 and is absolutely necessary, and just there is the problem that needs unnecessary operation in this.
In addition, in the electroplate liquid of the 2nd electric bath groove 374 that applies the 2nd electroplating film 23, the conductive component 21 that has applied the 1st electroplating film 22 is immersed in the electroplate liquid of the 2nd electric bath groove 374 washing with after cleaning in the liquid bath 373.At this moment, washing is sneaked in the electroplate liquid of the 2nd electric bath groove 374 with the pure water of liquid bath 373, thereby the electroplate liquid of the 2nd electric bath groove 374 is diluted.Therefore, need control, cause the complex managementization of technological process the formation and the concentration of the electroplate liquid of the 2nd electric bath groove 374.
And then the metallic substance that comprises in the electroplate liquid of the electroplate liquid of the 1st electric bath groove 372 and the 2nd electric bath groove 374 except electroplating on the conductive component 21, is also replaced on anode and is separated out.But, constitute Bi, the Ag of the 2nd electroplate liquid and Cu on anode significantly displacement separate out, thereby the amount of replenishing above-mentioned metal also becomes many significantly.On the other hand, (special Bi, Ag and Cu) is very expensive for metallic substance, thereby causes production cost to increase.
The present invention finishes in view of above-mentioned problem in the past, purpose is, on the surface of conductive component, apply different metallic substance or identical metallic substance, but in the 1st electroplating film of 2 layers of electroplating film that the ratio of components of metallic substance is different and the electro-plating method of the 2nd electroplating film, provide the electro-plating method that can shorten operation process, can simplify concentration control.
To achieve the above object, in the present invention, if the metallic substance in being included in the 1st electroplate liquid and the 2nd electroplate liquid constitutes and dissolves the acid solvent of this metallic substance, the formation of electroplate liquid is identical basically.Specifically, organic acid, solvent, additive and the pure water except the metallic substance that comprises in the 1st electroplate liquid and the 2nd electroplate liquid and the acid solvent that dissolves this metallic substance is that identical liquid constitutes basically.
Fig. 1 is the figure that the solder electroplanting device that uses in electro-plating method of the present invention is described.
Fig. 2 is the 1st electric bath groove that uses in electro-plating method of the present invention of explanation and the figure of the 2nd electric bath groove.
Fig. 3 is explanation the present invention and the figure that has applied 2 layers of galvanized conductive component in the past.
Fig. 4 is explanation the present invention and all plot plans of automatic plating machine in the past.
Fig. 5 is the plot plan that solder electroplanting device part in the past is described.
Fig. 1 be expression to be used for implementing be the plating part plot plan of the automatic plating machine of electro-plating method of the present invention, be equivalent to the solder electroplanting device 37 of all electroplanting devices that Fig. 4 represents.
In Fig. 1, automatic plating machine is made of with liquid bath 4 preimpregnation liquid bath the 1, the 1st electric bath groove the 2, the 2nd electric bath groove 3 and washing.Attached to the oxide film on the conductive component 21 (with reference to Fig. 3), make the surface of conductive component 21 be in active condition when in preimpregnation liquid bath 1, cleaning in the removal washing usefulness liquid bath 36 (with reference to Fig. 4) in front.In the 1st electric bath groove 2, on conductive component 21, apply the 1st electroplating film 22, in the 2nd electric bath groove 3, on conductive component 21, apply the 2nd electroplating film 23 then.At this, about electroplating thickness, according in the past, the thickness of establishing the 1st electroplating film 22 is t
1, the thickness of establishing above-mentioned the 2nd electroplating film 23 is t
2The time, t
1Become about 3～15 μ m, t
2Become about 1～5 μ m, t
2/ t
1Become about 0.1～0.5 ground and implement plating.The structure of lead-in wire material is identical with Fig. 3, so symbol is identical.
In the present invention, make in the electroplate liquid of the electroplate liquid of the 1st electric bath groove 2 and the 2nd electric bath groove 3, comprise the 1st with the 2nd metallic substance and dissolve solution the acid solvent of these metallic substance and form identical liquid and constitute.Thus, have following feature, that is, in the electroplate liquid of the 1st electric bath groove 2 dipping conductive component 21, apply the 1st electroplating film 22 after, can then be immersed in the electroplate liquid of the 2nd electric bath groove 3, apply the 2nd electroplating film 23.
That is,, as whole or most the 1st metallic substance, except this metallic substance and dissolve the solution of the acid solvent of this metallic substance, constitute with organic acid, solvent, additive and pure water with Sn as the formation of the electroplate liquid of the 1st electric bath groove 2.For example, organic acid comprises methylsulfonic acid or propyl alcohol sulfonic acid (プ ロ パ ノ one Le ス Le ホ Application acid), and solvent comprises Virahol.And, formation as the electroplate liquid of the 2nd electric bath groove 3, to be selected from the 2nd at least a metallic substance among Bi, Ag and the Cu and to comprise it being that the metallic substance of Sn of the 1st metallic substance is as metallic substance, except these metallic substance and dissolve the solution of the acid solvent of these metallic substance, constitute with organic acid, solvent and pure water.For example, identical with the 1st electric bath groove 2, organic acid comprises methylsulfonic acid or propyl alcohol sulfonic acid, and solvent comprises Virahol.
Therefore, in this electro-plating method, the electroplate liquid that on conductive component 21, adheres to the 1st electric bath groove 2, bring in the electroplate liquid of the 2nd electric bath groove 3, even sneak into 2 kinds of electroplate liquids, except the 1st and the 2nd metallic substance and dissolve the acid solvent of these metallic substance, constitute owing to form identical liquid, so the formation of the electroplate liquid of the 2nd electric bath groove 3 can not upset yet.
Generally when the formation electroplate liquid, metallic substance is dissolved in the acid solvent and uses.Therefore but this acid solvent is compared with the amount of electroplate liquid, is minute quantity, no matter what contains, and the formation of this electroplate liquid is not produced any influence.
Therefore, in the electroplate liquid of the 1st electric bath groove 2 dipping conductive component 21, apply the 1st electroplating film 22 after, can continuously conductive component 21 be immersed in the electroplate liquid of the 2nd electric bath groove 3, apply the 2nd electroplating film 23.Therefore, the 1st electroplating film 22 backs that apply that can omit in the past utilize washing to use cleaning of liquid bath, reach the shortening of operation process and activity duration.
Then,, as mentioned above, in this electroplating activity process, adhered to the electroplate liquid of the 1st electric bath groove 2 on the conductive component 21, sneaked in the electroplate liquid of the 2nd electric bath groove 3 about the electroplate liquid of the 2nd electric bath groove 3.At this moment, in the electroplate liquid of the 2nd electric bath groove 3, brought into attached to being the Sn of the 1st metallic substance on the conductive component 21.But, do not bring the 2nd metallic substance that uses among Bi, Ag and the Cu into.And, use the 2nd metallic substance conduct on conductive component 21 among Bi, Ag and the Cu to separate out with the alloy of Sn, in addition, on anode, replace and separate out.In addition, in addition, use the 2nd metallic substance among these Bi, Ag and the Cu attached on the conductive component 21 and take away, thereby compare, reduce especially significantly with the 1st metallic substance Sn.
On the other hand, generally in plating, by the thickness and the electroplating film composition of current density, electroplating time and electroplate liquid concentration control electroplating film, therefore by making current density, electroplating time and electroplate liquid concentration keep certain, carry out the management of electroplating thickness and electroplating film composition.Whereby, metallic substance amount or the electroplate liquid concentration of separating out on electroplating film is managed,, can replenish seeing under the situation that causes the metallic substance minimizing by separating out.As mentioned above, the metallic substance of the electroplate liquid of the 1st electric bath groove 2 and the 2nd electric bath groove 3 also exists owing to the minimizing that causes is separated out and taken away by conductive component 21 in displacement on anode.But, the anode of the 1st electric bath groove 2 and the 2nd electric bath groove 3 is with for example formation of the Sn more than 99.9% of purity, thereby the 1st metallic substance Sn of electroplate liquid, except mainly replenishing by the anodic dissolving, by regular analysis, carry out solution as required and replenish.
For example, when carrying out Sn and be the concentration management of electroplate liquid of 100 (weight %), as various liquid concentration, the concentration of electroplate liquid remains on Sn
2+Concentration is that 30～60 (g/L), free acid concentration are that 120～160 (g/L), additive concentration are the management of carrying out Sn between 20～50 (ml/L).But as mentioned above, in the management of the 1st electric bath groove 2, there is anode dissolution in Sn, does not therefore need as the management of the 2nd electric bath groove 3 frequent.
In the electroplate liquid of the 2nd electric bath groove 3, as mentioned above, the 1st metallic substance Sn is replenished by the anodic dissolving, and therefore, the concentration that is selected from the 2nd metallic substance among Bi, Ag and the Cu of remarkable minimizing is compared in major control with Sn.
For example, carrying out Sn: Bi=97 (weight %): when the concentration of the electroplate liquid of 3 (weight %) was managed, as liquid concentration separately, the concentration of electroplate liquid remained on Sn
2+Concentration is 50～60 (g/L), Bi
3+Concentration is that 3.0～4.2 (g/L), free acid concentration are that 120～160 (g/L), additive concentration are the management of carrying out Bi between 20～40 (ml/L).
As mentioned above, utilize certainization of the operating speed of production line operation generation, and can make the current density in the 1st electric bath groove 2 and the 2nd electric bath groove 3 keep certain, therefore the management of the concentration of the 2nd metallic substance Bi, the Ag of the 2nd electric bath groove 3 and Cu also becomes easy.That is to say, in the 2nd electric bath groove 3,, can carry out the concentration management simply by replenishing Bi, Ag and Cu grade in an imperial examination 2 metallic substance termly.Its result can make the metallic substance concentration of the electroplate liquid of the 2nd electric bath groove 3 keep certain, and the thickness of the 2nd electroplating film 23 and plated film are formed evenly.
That is to say, in this electro-plating method,, can suppress the fluctuation that metal is separated out the film thickness ratio of the homogenizing of particle diameter and 2 layers by the current density in the 1st electric bath groove 2 and the 2nd electric bath groove 3 is set in optimum current density.Thus, in certainization of operating speed of utilizing production line operation to produce and the electro-plating method under certain current density, electroplating thickness t
1, t
2Satisfy t
1＞t
2The time, establishing conductive component 21 mobile distance in the 1st electroplate liquid is D
1, establishing conductive component 21 mobile distance in the 2nd electroplate liquid is D
2The time, D
1, D
2Set up D significantly
1＞D
2Relation.
Fig. 2 represents the relation of the 1st electric bath groove 2 and the 2nd electric bath groove 3.As mentioned above, electroplate thickness t
1, t
2Satisfy t
1＞t
2The time, the operator who establishes the 1st electric bath groove to length be Z
1, the operator of the 2nd electric bath groove to length be Z
2The time, if identical basal area (X
1* Y
1=X
2* Y
2), Z then
1, Z
2Set up Z
1＞Z
2Relation.Therefore, clearly illustrate that the liquid measure of establishing the 1st electroplate liquid is V as Fig. 2
1(=X
1* Y
1* Z
1), the liquid measure of establishing the 2nd electroplate liquid is V
2(=X
2* Y
2* Z
2) time, V
1And V
2Set up V significantly
1＞V
2Relation.
That is to say, in the liquid measure of the electroplate liquid of the 2nd electric bath groove 3, the liquid measure of the electroplate liquid of the 2nd electric bath groove 3 is reduced significantly.Promptly in the electroplate liquid of the 2nd electric bath groove 3, price is higher than Bi, the Ag of the 1st metallic substance Sn and the usage quantity of Cu grade in an imperial examination 2 metallic substance also can reduce significantly, thereby can reduce cost.
Narrate other embodiments of the present invention below.
In the present invention, the electroplate liquid of the electroplate liquid of the 1st electric bath groove 2 and the 2nd electric bath groove 3, though the ratio of components difference of metallic substance separately, it is identical that liquid constitutes.Therefore, have following feature, that is, conductive component 21 be immersed in the electroplate liquid of the 1st electric bath groove 2, apply the 1st electroplating film 22 after, can be immersed in continuously in the electroplate liquid of the 2nd electric bath groove 3, apply the 2nd electroplating film 23.And embodiment is same as the above-mentioned method.
For example, Sn-Bi liquid is arranged in the present invention.At this, in the electroplate liquid of the 1st electric bath groove 2, contain the Bi of percentum.Thus, the whisker (needle crystal) that suppresses the 1st electroplating film 22 surfaces significantly.In addition, as the concentration management process of this electroplate liquid, carry out the management of Bi same as the above-mentioned methodly.
That is, in the electroplate liquid of the 1st electric bath groove 2, the metallic substance except the Sn that uses in the electroplate liquid of the 2nd electric bath groove 3 contains at least a metallic substance among Bi, Ag and the Cu of being selected from of percentum.The whisker (needle crystal) that can suppress thus, the 1st electroplating film 22 surfaces significantly.
As indicated in the above description, electro-plating method of the present invention can reach following effect.
The formation of the first, the 1 electroplate liquid and the 2nd electroplate liquid except the 1st and the 2nd metallic substance that constitutes electroplate liquid separately and dissolve the acid solvent of these metallic substance, comes down to identical liquid and constitutes.Therefore, even the 1st electroplate liquid is blended in the 2nd electroplate liquid, confusion does not take place in the liquid formation yet, can apply different metallic substance or same metallic substance continuously but 2 layers of different electroplating film of the ratio of components of metallic substance on conductive component.As a result, can be omitted in carry out between the 1st electroplating film and the 2nd electroplating film, utilize washing with the cleaning of liquid bath, reach the shortening of operation process and activity duration.
Second, in the management of the 1st and the 2nd metallic substance that the 1st electroplate liquid and the 2nd electroplate liquid contain, at first, the formation of the 1st electroplate liquid and the 2nd electroplate liquid, except the 1st and the 2nd metallic substance that constitutes electroplate liquid separately and dissolve the acid solvent of these metallic substance, be that identical liquid constitutes.The 1st metallic substance Sn of electroplate liquid can mainly dissolve by anodic and adjust concentration separately.Therefore, can use the concentration management of the 2nd metallic substance among Bi, Ag and the Cu termly in the 2nd electroplate liquid, the concentration management of electroplate liquid becomes easy.
The 3rd, certainization of the operating speed that uses automatic plating machine and produce, certainization of current density and making except the 1st of the 1st electroplate liquid and the 2nd electroplate liquid forms identical liquid with the 2nd metallic substance and the solution that dissolves the acid solvent of these metallic substance constitutes.Therefore, the thickness of the 2nd electroplating film is thinner significantly than the 1st electroplating film, thereby the time that conductive component is immersed in the 2nd electroplate liquid shortens.Its result can reduce the liquid measure of the 2nd electric bath groove significantly.Thus, the 2nd metallic substance Bi, Ag that uses in the 2nd electroplate liquid and the usage quantity of Cu also can reduce significantly, and its result can realize that cost reduces.
The 4th, in the electroplate liquid of the 1st electric bath groove, except the 1st metallic substance Sn that in the electroplate liquid of the 2nd electric bath groove, uses, contain at least a the 2nd metallic substance among Bi, Ag and the Cu of being selected from of percentum.The whisker (needle crystal) that can suppress thus, the 1st electroplating film surface significantly.
The 5th, in the lead-in wire and semiconducter device of the electro-plating method more than using, because employed electroplate liquid is not leaded, so human body or environment are not made a very bad impression.In addition, make except the metallic substance of the 1st electroplate liquid and the 2nd electroplate liquid and dissolve solution the acid solvent of these metallic substance and form identical liquid and constitute, the metallic substance ratio of components that perhaps makes the 1st electroplate liquid and the 2nd electroplate liquid is different but metallic substance is identical, thereby realizes the raising of electroplating quality.
Claims (4)
1. electro-plating method, conductive component is immersed in the 1st electroplate liquid, the 2nd electroplate liquid successively, the 2nd electroplating film that on the surface of above-mentioned conductive component, overlaps to form the 1st electroplating film that constitutes by the Sn metal and constitute by the alloy of the alloy of the alloy of above-mentioned Sn metal and Bi metal, above-mentioned Sn metal and Ag metal or above-mentioned Sn metal and Cu metal, it is characterized in that
Above-mentioned the 1st electroplate liquid is by the Sn material, dissolve the solvent of this Sn material, organic acid, additive and pure water constitute, above-mentioned the 2nd electroplate liquid by with the Sn material of the same kind of above-mentioned the 1st electroplate liquid, dissolve this Sn material and the solvent same kind of above-mentioned the 1st electroplate liquid, from the Bi material, a kind of metallic substance of selecting in Ag material or the Cu material, dissolve the solvent of this metallic substance, organic acid with the same kind of above-mentioned the 1st electroplate liquid, constitute with the additive and the pure water of the same kind of above-mentioned the 1st electroplate liquid
Above-mentioned conductive component is immersed in above-mentioned the 1st electroplate liquid, form above-mentioned the 1st electroplating film, then, above-mentioned conductive component need not be washed, and with above-mentioned the 1st electroplate liquid attached to the state on the above-mentioned conductive component, above-mentioned conductive component is immersed in above-mentioned the 2nd electroplate liquid, forms above-mentioned the 2nd electroplating film;
In above-mentioned the 2nd electroplate liquid, carry out the concentration management of a kind of metallic substance of from above-mentioned Bi material, Ag material or Cu material, selecting.
2. the described electro-plating method of claim 1 is characterized in that, in above-mentioned the 2nd electroplate liquid, by being arranged on the dissolving of Sn solvability electrode and the bringing into of above-mentioned the 1st electroplate liquid in above-mentioned the 2nd electroplate liquid, carries out replenishing of above-mentioned Sn material.
3. the described electro-plating method of claim 1 is characterized in that, in above-mentioned the 1st electroplate liquid, by being arranged on the dissolving of the Sn solvability electrode in above-mentioned the 1st electroplate liquid, carries out replenishing of above-mentioned Sn material.
4. the described electro-plating method of claim 1 is characterized in that, in the above-mentioned organic acid, comprises methylsulfonic acid or propyl alcohol sulfonic acid, in above-mentioned solvent, comprises Virahol.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000052533A JP3523556B2 (en) | 2000-02-28 | 2000-02-28 | Plating method |
| JP52533/00 | 2000-02-28 | ||
| JP52533/2000 | 2000-02-28 |
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| Publication Number | Publication Date |
|---|---|
| CN1318655A CN1318655A (en) | 2001-10-24 |
| CN1307327C true CN1307327C (en) | 2007-03-28 |
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| CNB011123761A Expired - Lifetime CN1307327C (en) | 2000-02-28 | 2001-02-28 | Electroplating method |
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|---|---|
| JP (1) | JP3523556B2 (en) |
| KR (1) | KR100695372B1 (en) |
| CN (1) | CN1307327C (en) |
| TW (1) | TW506100B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3568486B2 (en) * | 2000-03-29 | 2004-09-22 | 三洋電機株式会社 | Method for manufacturing semiconductor device |
| US7772043B2 (en) | 2001-12-12 | 2010-08-10 | Sanyo Electric Co., Ltd. | Plating apparatus, plating method and manufacturing method for semiconductor device |
| EP2273622A4 (en) * | 2008-03-19 | 2011-07-06 | Furukawa Electric Co Ltd | Metallic material for connector and process for producing the metallic material for connector |
| CN105525332B (en) * | 2014-10-24 | 2018-11-09 | 中国科学院苏州纳米技术与纳米仿生研究所 | A kind of method and encapsulation chip reducing solder bonding thermal stress |
| KR102170830B1 (en) * | 2020-07-01 | 2020-10-27 | 팽명호 | Surface treatment method using lead-free or lead solder |
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2000
- 2000-02-28 JP JP2000052533A patent/JP3523556B2/en not_active Expired - Fee Related
-
2001
- 2001-02-27 KR KR1020010009848A patent/KR100695372B1/en not_active IP Right Cessation
- 2001-02-27 TW TW090104478A patent/TW506100B/en not_active IP Right Cessation
- 2001-02-28 CN CNB011123761A patent/CN1307327C/en not_active Expired - Lifetime
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4519878A (en) * | 1982-04-14 | 1985-05-28 | Nippon Kokan Kabushiki Kaisha | Method of Fe-Zn alloy electroplating |
| JPS62202094A (en) * | 1986-02-28 | 1987-09-05 | Sumitomo Metal Ind Ltd | Production of gradient plating |
| JPH07305193A (en) * | 1994-05-06 | 1995-11-21 | Nippon Steel Corp | Production of multilayer plated steel sheet and production of thermal-diffusion alloy plated steel sheet using the multilayer plated steel sheet |
| CN1185036A (en) * | 1996-12-10 | 1998-06-17 | 古河电气工业株式会社 | Connecting material for electronic elements, and the connection and semiconductor device using same |
| CN1224083A (en) * | 1998-12-25 | 1999-07-28 | 清华大学 | Brightening and leveling agent for lead and tin methylsulfonate electroplating bath |
Also Published As
| Publication number | Publication date |
|---|---|
| TW506100B (en) | 2002-10-11 |
| CN1318655A (en) | 2001-10-24 |
| JP2001234390A (en) | 2001-08-31 |
| KR20010085639A (en) | 2001-09-07 |
| JP3523556B2 (en) | 2004-04-26 |
| KR100695372B1 (en) | 2007-03-15 |
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