JPS62202094A - Production of gradient plating - Google Patents
Production of gradient platingInfo
- Publication number
- JPS62202094A JPS62202094A JP4286686A JP4286686A JPS62202094A JP S62202094 A JPS62202094 A JP S62202094A JP 4286686 A JP4286686 A JP 4286686A JP 4286686 A JP4286686 A JP 4286686A JP S62202094 A JPS62202094 A JP S62202094A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- tank
- film
- circulated
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims abstract description 57
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000000203 mixture Substances 0.000 claims description 12
- 239000002994 raw material Substances 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 229910000831 Steel Inorganic materials 0.000 abstract description 5
- 239000010959 steel Substances 0.000 abstract description 5
- 238000004090 dissolution Methods 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 230000008021 deposition Effects 0.000 abstract description 3
- 150000002739 metals Chemical class 0.000 abstract description 2
- 229910007567 Zn-Ni Inorganic materials 0.000 abstract 1
- 229910007614 Zn—Ni Inorganic materials 0.000 abstract 1
- 238000009434 installation Methods 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 10
- 239000011701 zinc Substances 0.000 description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910018605 Ni—Zn Inorganic materials 0.000 description 4
- 229910001297 Zn alloy Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- KFZAUHNPPZCSCR-UHFFFAOYSA-N iron zinc Chemical compound [Fe].[Zn] KFZAUHNPPZCSCR-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000010960 cold rolled steel Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、メッキ皮膜の厚み方向に連続的に濃度が変化
する皮膜組成を有する傾斜メッキの製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for producing gradient plating having a film composition in which the concentration changes continuously in the thickness direction of the plating film.
(従来の技術)
従来、2層以上の多層メッキ皮膜を製造するためには、
2個以上の独立した、循環タンクおよび原料供給設備等
の原料供給系を用いなければならず、浴管理上問題があ
った。(Conventional technology) Conventionally, in order to manufacture a multilayer plating film with two or more layers,
Two or more independent raw material supply systems such as circulation tanks and raw material supply equipment must be used, which poses problems in bath management.
このため、同一メッキ液を用いながら鉄含有率の異なる
鉄−亜鉛合金メッキ層を形成する方法が、特開昭58−
77589号公報によシ提案されている。これは、単−
系のメッキ液を導入した各メッキ槽において、メッキ液
の液流速および/または電流密度を変えることにより、
鉄含有率の大きく異なるメッキ層を形成するものである
。For this reason, a method of forming iron-zinc alloy plating layers with different iron contents using the same plating solution was proposed in JP-A-58-
This is proposed in Japanese Patent No. 77589. This is simply
By changing the flow rate and/or current density of the plating solution in each plating bath into which the plating solution of the system is introduced,
This is to form plated layers with significantly different iron contents.
また、各メッキ槽間で電流密度を順次変化させて、亜鉛
含有量を順次減少または増加させた鉄−亜鉛合金多層メ
ッキを製造する方法が、特開昭58−67886号公報
によフ開示されている。Furthermore, a method for manufacturing an iron-zinc alloy multilayer plating in which the zinc content is sequentially decreased or increased by sequentially changing the current density between each plating bath is disclosed in Japanese Patent Laid-Open No. 58-67886. ing.
(発明が解決しようとする問題点)
上記方法は、単−系のメッキ液を使用しながら、所望の
多層メッキ皮膜を得られるものではあるが、各メッキ槽
間で、電流密度を変えると、最適メッキ条件(たとえば
通板速度と電流密度)より外れることになり、この分メ
ッキ付着量は減るので、同一メッキ厚を確保するために
は通板速度を下げざるを得なくなり、生産量の低減をき
たす問題がある。またこれらの各種での電流制御、通板
速度制御等の制御装置も複雑にならざるを得なかった。(Problems to be Solved by the Invention) The above method can obtain a desired multilayer plating film while using a single plating solution, but if the current density is changed between each plating tank, The optimum plating conditions (for example, threading speed and current density) will be deviated from, and the amount of plating deposited will decrease accordingly, so in order to maintain the same plating thickness, the threading speed will have to be lowered, resulting in a reduction in production volume. There is a problem that causes In addition, the control devices for controlling current, threading speed, etc. for these various types have also become complicated.
(問題点を解決するための手段)
上記問題点を解決するために、本発明は、メッキ液中の
金属によシ析出速度に差のあることに着目して、この金
属の析出速度の差を利用して各種間の浴組成を変え、こ
れによって連続的に皮膜組成の異なる傾斜メッキを行な
うことを提案するものである。(Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention focuses on the fact that there is a difference in the deposition rate of different metals in the plating solution. This paper proposes that the bath composition of each type be changed using the method, and thereby gradient plating with different film compositions can be performed continuously.
さらに詳細に説明すると、Ni−Zn 、 Fe−Zn
等のメッキを行なう際に、Ni + FeよりもZnの
析出速度が速い。このため、原料を補給しなければ、Z
nの比率の低い浴組成に変わり、形成される皮膜の組成
もZn含有率の低いものとなっていく。これを利用すれ
ば、連続的に皮膜組成を変えることが可能である。To explain in more detail, Ni-Zn, Fe-Zn
When plating, etc., the precipitation rate of Zn is faster than that of Ni + Fe. For this reason, if raw materials are not replenished, Z
The bath composition changes to a lower ratio of n, and the composition of the formed film also becomes lower in Zn content. By utilizing this, it is possible to continuously change the film composition.
そこで、本発明によれば、電気メツキラインにおいて、
多段槽の一部からのみ原料を補給することにより、各槽
間の浴組成を連続的に変え、その結果、連続的に皮膜組
成の異なる傾斜メッキを製造する方法が提供される。Therefore, according to the present invention, in the electroplating line,
By replenishing raw materials from only a portion of the multistage baths, the bath composition between each bath is continuously changed, thereby providing a method for producing graded plating with successively different coating compositions.
本発明を実施するためのメッキ設備の一例を第1図に示
す。第1図に示す設備は、下層がznリッチなNt−Z
nメッキ鋼板を製造するだめのものである。An example of plating equipment for carrying out the present invention is shown in FIG. The equipment shown in Figure 1 has a lower layer containing Zn-rich Nt-Z.
This is a product that cannot be used to manufacture n-plated steel sheets.
溶解槽1には、たとえば、Zn:N1=88 : 12
の比率で原料が投入され、攪拌羽2により溶解され
て調製されたメッキ原液は、ボンf3により、メッキ入
側の第1循環タンク4aに導入される。第1循環タンク
4aに導入されたメッキ液は、ポンプ5aによシ第1メ
スキセル6aと循環タンク48間を循環する。第1循環
タンク4a中のメッキ液は同w第2循環タンク4bにオ
ーバフローし、第2循環タンク4bにオーバフローして
導入されたメッキ液はボンf5bによシ第2メツキセル
68間を循環する。同様に、第2循環タンク4bのメッ
キ液は順次第3〜第5循環タンク50〜5eへとオーバ
フローし、それぞれ対応するメツキセル60〜60間を
各ボン7’ 5 c〜5eにより循環するようになって
いる。In the dissolution tank 1, for example, Zn:N1=88:12
The raw materials are added at a ratio of 1, and the plating stock solution prepared by being dissolved by the stirring blade 2 is introduced into the first circulation tank 4a on the plating input side by the bomb f3. The plating solution introduced into the first circulation tank 4a is circulated between the first mesquicell 6a and the circulation tank 48 by the pump 5a. The plating solution in the first circulation tank 4a overflows into the second circulation tank 4b, and the plating solution overflowed and introduced into the second circulation tank 4b is circulated between the second mesh cells 68 by the bomb f5b. Similarly, the plating solution in the second circulation tank 4b sequentially overflows to the third to fifth circulation tanks 50 to 5e, and is circulated between the corresponding mesh cells 60 to 60 by the respective bombs 7' 5c to 5e. It has become.
いま、上記のような設備において、鋼板Pにメッキを施
すとすると、第1循環タンク4aには、溶解槽1によシ
調製されたZ11含有率の大きいメッキ液が導入されて
いるが、Znはメッキ皮膜に多く取シ込まれるため、第
2循環タンク4b(第2メツキセル6b)〜第5循環タ
ンク4e(第5メツキセル6e)と進むにつれて、Ni
含有量の多い浴組成となる。このようにして、メッキ皮
膜下層からメッキ皮膜上層にかけて、Zn含有率が連続
的に低くなシ、逆に、Ni含有率が順次高くなるメッキ
皮膜が形成される。Now, in the above-mentioned equipment, if a steel plate P is to be plated, a plating solution with a high Z11 content prepared in the dissolution tank 1 is introduced into the first circulation tank 4a. Since a large amount of Ni is incorporated into the plating film, the Ni
The bath composition has a high content. In this way, a plating film is formed in which the Zn content is continuously low and the Ni content is successively high from the lower plating film layer to the upper plating film layer.
したがって、たとえば、耐食性、加工性、耐ピツチング
性等に優れた下層ZnリッチなNi−Znメッキ鋼板(
たとえば、上層のNi含有量:16%、下層のNi含有
量:to%)を製造することができる。Therefore, for example, a lower layer Zn-rich Ni-Zn plated steel sheet (
For example, it is possible to manufacture an upper layer with a Ni content of 16% and a lower layer with a Ni content of to%.
メッキ操業条件としては、電流密度、流速等は不変とす
ることができる。したがって、電流密度を変えることに
よるコスト高の不利を克服することができる。As the plating operation conditions, current density, flow rate, etc. can be kept unchanged. Therefore, the disadvantage of high cost due to changing the current density can be overcome.
上記例では、本発明方法をNi−Znメッキに適用する
場合を示したが、本発明は、Ni−Znメッキのほか、
Fe−Zn 、 5u−Pbメッキ等にも利用すること
ができる。In the above example, the case where the method of the present invention is applied to Ni-Zn plating is shown, but the present invention can be applied to Ni-Zn plating as well as
It can also be used for Fe-Zn, 5u-Pb plating, etc.
各種の濃度コントロールは液の循環量により可能である
。また投入量は、クローズドシステムであれば、メッキ
される量だけ投入すればよい。投入量は電気量に比例さ
せるようにすることができる。Various concentrations can be controlled by changing the amount of liquid circulated. In addition, if it is a closed system, only the amount to be plated needs to be input. The amount of input can be made proportional to the amount of electricity.
上記の例の場合には、たとえば、Zn : 88kli
’/H。In the case of the above example, for example, Zn: 88kli
'/H.
Nt:12に9/Hのメッキを行なうとすれば、同量の
金属を投入すればよい。If 9/H plating is to be performed on Nt:12, the same amount of metal may be added.
また、循環速度を遅くすれば、各種間に大きな濃度差を
生じしめることも可能である。Furthermore, by slowing down the circulation speed, it is possible to create large differences in concentration between each species.
(作用)
上記したように、本発明では、金属による析出速度の差
を利用しているので、単一の原料供給系により、連続的
にメッキ皮膜組成の異なる傾斜メッキを製造することが
できる。(Function) As described above, since the present invention utilizes the difference in deposition rate depending on the metal, it is possible to continuously produce graded plating with different plating film compositions using a single raw material supply system.
(実施例)
操業条件
メッキ対束材:厚み0.8調、幅1200m+nの冷延
鋼板通板速度ニア0m/min
試験装置:第2図に示すものを使用
電流密度: 60 A/ dm2
メッキo、:硫酸塩の形で2n++とNi++を含有P
H:2.温度:50℃
浴組成:
メッキ皮膜:
メッキ厚(付着量):1o、p/1xz(両面)成品評
価:耐食性良好(Ni:15%含有メッキと同等)加工
性良好、耐ピツチング性良好
(発明の効果)
上記したように、本発明によれば、設備を簡素化して、
所望の傾斜メッキを達成することができる。(Example) Operating conditions Plated bundle material: Thickness 0.8, width 1200m+n cold rolled steel plate Passing speed near 0m/min Test equipment: Use the one shown in Figure 2 Current density: 60 A/dm2 Plating o ,: P containing 2n++ and Ni++ in the form of sulfate
H:2. Temperature: 50°C Bath composition: Plating film: Plating thickness (coating amount): 1o, p/1xz (both sides) Product evaluation: Good corrosion resistance (equivalent to plating containing 15% Ni), good workability, good pitting resistance (invention) Effects) As described above, according to the present invention, the equipment can be simplified,
A desired graded plating can be achieved.
第1図は、本発明を実施するだめの装置の概要図、第2
図は本発明の試験装置の概要説明図である。
1・・・溶解槽、2・・・攪拌羽根、3・・・ポンプ、
4a〜4e・・・循環タンク、5a〜5e・・・ボンデ
、6a〜6e・・・メツキセル、P・・・鋼板。FIG. 1 is a schematic diagram of an apparatus for carrying out the present invention, and FIG.
The figure is a schematic explanatory diagram of the test device of the present invention. 1... Dissolution tank, 2... Stirring blade, 3... Pump,
4a-4e...Circulation tank, 5a-5e...Bonde, 6a-6e...Metsukicel, P...Steel plate.
Claims (1)
み原料を補給することにより、各槽間の浴組成を連続的
に変え、その結果、成膜組成を連続的に変えることを特
徴とする傾斜メッキ製造方法。(1) In an electroplating line, the bath composition between each tank is continuously changed by replenishing raw materials from only a part of the multi-stage tank, and as a result, the film formation composition is continuously changed. Inclined plating manufacturing method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4286686A JPS62202094A (en) | 1986-02-28 | 1986-02-28 | Production of gradient plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4286686A JPS62202094A (en) | 1986-02-28 | 1986-02-28 | Production of gradient plating |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62202094A true JPS62202094A (en) | 1987-09-05 |
Family
ID=12647954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4286686A Pending JPS62202094A (en) | 1986-02-28 | 1986-02-28 | Production of gradient plating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62202094A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1307327C (en) * | 2000-02-28 | 2007-03-28 | 古河电气工业株式会社 | Electroplating method |
CN104862748A (en) * | 2015-05-29 | 2015-08-26 | 中国科学院金属研究所 | Crystalline grain scale gradient metallic nickel and controllable preparation method thereof |
CN107059104A (en) * | 2016-02-10 | 2017-08-18 | 株式会社荏原制作所 | Apparatus and method from electroplate liquid to electroplating bath, electroplating system, powder container and electro-plating method for supplying |
-
1986
- 1986-02-28 JP JP4286686A patent/JPS62202094A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1307327C (en) * | 2000-02-28 | 2007-03-28 | 古河电气工业株式会社 | Electroplating method |
CN104862748A (en) * | 2015-05-29 | 2015-08-26 | 中国科学院金属研究所 | Crystalline grain scale gradient metallic nickel and controllable preparation method thereof |
CN107059104A (en) * | 2016-02-10 | 2017-08-18 | 株式会社荏原制作所 | Apparatus and method from electroplate liquid to electroplating bath, electroplating system, powder container and electro-plating method for supplying |
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