JP2006252862A - Memory card, mobile information terminal unit and charger - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a memory card, a mobile information terminal unit and a charger, with a metal electric contact with an excellent property of abrasion and corrosion resistance. <P>SOLUTION: The memory card used by being inserted into a unit with a spring contact is composed of an electric contact 6 with a lamination, on an electrode base material 1, of a nickel plated layer 2 of 1 to 3 μm thick, a Pd-Ni alloy-plated layer 3 of a thickness of 0.2 to 1 μm, and a Co-containing Au-plated layer 4 of a thickness of 0.03 to 0.05 μm in that order, and a flash memory element. When the memory card is inserted into the unit, the contact 6 will contact the spring contact. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a memory card, a mobile information terminal device, and a charger having an electrical contact excellent in durability.

  Conventionally, memory cards (memory sticks, SD cards, multimedia cards, smart media, etc.) and mobile information terminal devices (cell phones, portable electronic devices, etc.) formed by sealing a memory chip in a card-type outer shell In general, a metal contact obtained by applying Ni plating and Au plating on a copper (Cu) -based material is used for electrical contact portions such as a charging part and a connector (see, for example, Patent Document 1).

The electrical contact having such a material configuration has a corrosion problem due to the following two mechanisms, which causes a contact failure of the contact.
1) Ni of the lower layer plating or Cu of the base material corrodes through the pinholes existing in the Au plating.
2) When the insertion / extraction and sliding are repeated, the Au plating is scraped, and the exposed Ni of the lower layer plating and Cu of the base material are corroded.

  The conventional solution to the problem has been to thicken the Au plating. Since the number of pinholes is inversely proportional to the plating thickness, the number of pinholes can be reduced to a problem-free level by applying a certain amount of Au plating. In addition, it can withstand a certain amount of insertion and removal and sliding. For example, in the case of a commercially available memory card, the film thickness of the Au plating layer is about 1 to 2.5 μm.

JP 2004-218031 A

  However, the insertion / extraction of the memory card and the attachment / detachment of the mobile information terminal device to / from the charger are performed almost every day, and the number of insertions / removals and the number of attachments / detachments have increased dramatically. Therefore, the wear and damage of the Au plating layer proceeded in electrical contacts, and simply increasing the film thickness of the Au plating layer did not prevent the relative increase in the number of pinholes and corrosion due to the exposure of the underlying metal. .

Moreover, in the situation where memory cards, mobile information terminal devices, and chargers associated therewith are widely spread as recently, increasing the thickness of the Au plating layer as described above is a significant economic loss. It was not preferable.
Therefore, the above-mentioned memory card, mobile information terminal device and charger require a metal electrical contact excellent in wear resistance / corrosion resistance without increasing the cost.

  The present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide a memory card, a mobile information terminal device, and a charger having metal electrical contacts that are excellent in wear resistance and corrosion resistance. .

  The present invention provided to solve the above problems is a memory card used by being inserted into a device having a spring contact. On the electrode substrate, a Ni plating layer having a thickness of 1 to 3 μm, a thickness of 0.2 to 1 μm Pd—Ni alloy plating layer, 0.03 to 0.05 μm thick Co-containing Au plating layer, and a flash memory device. The memory card is characterized in that the electrical contact is in contact with the spring contact (claim 1).

  The present invention provided in order to solve the above problems is a rechargeable battery serving as a power source, and an Ni plating layer having a film thickness of 1 to 3 μm, a film thickness of 0.2 to A mobile information terminal device comprising: a 1 μm Pd—Ni alloy plating layer; and a charging electrical contact formed by sequentially laminating a Co-containing Au plating layer having a thickness of 0.03 to 0.05 μm. Item 2).

  The present invention provided to solve the above-mentioned problems is a charger for charging a mobile information terminal device, which is in contact with an electric contact for charging of the mobile information terminal device of an electrode base connected to an external power source Electricity in which a Ni plating layer with a thickness of 1 to 3 μm, a Pd—Ni alloy plating layer with a thickness of 0.2 to 1 μm, and a Co-containing Au plating layer with a thickness of 0.03 to 0.05 μm are sequentially laminated on the portion. A charger comprising a contact (claim 3).

According to the memory card of the present invention, when the contact portion is an electrical contact having excellent wear resistance and corrosion resistance, the card is repeatedly inserted into and removed from a device such as a memory card mounting device several times a day. Even so, the contact portion is kept in a good state and can be used for a long time.
According to the mobile information terminal device of the present invention, the charging electrical contact is an electrical contact having excellent wear resistance and corrosion resistance, so that charging can be performed even when charging is repeated several times a day. The electrical contacts for the use are kept in good condition and can be used for a long time.
According to the charger of the present invention, the electrical contact constituting the charging terminal is an electrical contact having excellent corrosion resistance, so that the electrical contact of the charging terminal can be performed even when charging is repeated several times a day. Is kept in good condition and can be used for a long time.

Below, the electrical contact used as the basis of this invention is demonstrated.
FIG. 1 is a cross-sectional view showing a configuration of an electrical contact used in the present invention.
As shown in FIG. 1, the electrical contact 6 is formed on the electrode base 1 with a Ni plating layer 2 having a thickness of 1 to 3 μm, a Pd—Ni alloy plating layer 3 with a thickness of 0.2 to 1 μm, and a thickness of 0.03. A Co-containing Au plating layer 4 having a thickness of ˜0.05 μm is sequentially laminated.

  The electrode substrate 1 may be any material as long as it is a material generally used as a conductive material for electrical contacts. For example, copper-type materials, such as brass (Cu-Zn type) and phosphor bronze (Cu-Sn-P type), are mentioned. Moreover, the electrode base material 1 should just be a shape according to uses, such as a thin plate and foil. In addition, it is preferable that the surface roughness of the electrode base material 1 is so smooth that the surface unevenness | corrugation of the electrode base material 1 is not reflected in the surface after each plating layer is formed.

  The Ni plating layer 2 may be a conventionally known Ni plating method as long as adhesion to the electrode substrate 1 is ensured and the film thickness can be controlled to 1 to 3 μm. For example, an electroplating method may be used.

  The Pd—Ni alloy plating layer 3 may be a conventionally known Pd—Ni alloy plating method as long as adhesion with the Ni plating layer 2 is ensured and the film thickness can be controlled to 0.2 to 1 μm. That's fine. The Pd: Ni ratio (weight ratio) of the Pd—Ni alloy plating layer 3 is preferably 70:30 to 90:10, and most preferably around 80:20.

The Co-containing Au plating layer 4 may be a conventionally known Co-containing Au plating method as long as adhesion with the Pd—Ni alloy plating layer 3 is secured and the film thickness can be controlled to 0.03 to 0.05 μm. According to the method (flash plating). A film thickness of 0.1 μm or more is not preferable because a lubricating effect on sliding cannot be obtained and wear resistance is lowered. Moreover, it is preferable that Co content rate in a plating layer is 0.3-0.5 wt%.
The Co-containing Au plating layer 4 may be sealed.

  With the configuration of the electrical contact 6 as described above, the thickness of the Co-containing Au plating layer 4 is significantly reduced (less than 95% in terms of the film thickness ratio), and more resistant to conventional electrical contacts. Abrasion and corrosion resistance can be improved. These improvements are due to the following mechanism.

(1) Abrasion resistance When a relatively soft layer (Co-containing Au plating layer 4) is thinly deposited on the hard layer of the Pd—Ni alloy plating layer 3, the metal of the softer one (Co-containing Au plating layer 4) Acts like a solid lubricant and is less likely to wear against sliding.

(2) Corrosion resistance Both Pd-Ni alloy plating layer 3 and Co-containing Au plating layer 4 have pinholes in the plating layer (the porosity of Pd-Ni alloy plating layer 3 is less than that of Co-containing Au plating layer 4) However, since the number of pinholes penetrating to the Ni plating layer 2 of the lower layer plating is drastically reduced by overlapping two layers, the corrosion resistance is improved. Further, the metal in contact with the Ni plating layer 2 is changed from the conventional Au to the Pd—Ni alloy, so that the local battery effect is reduced and the corrosion resistance is improved (potential difference between Au and Ni: 1.73 V, Pd and Ni Potential difference: 1.15 V).

  Furthermore, since a part of the Ni plating layer having a low plating rate is replaced with a Pd—Ni alloy plating layer having a high plating rate, the production efficiency of the entire plating layer of the electrical contact 6 is improved.

Next, the memory card according to the present invention will be described.
2 and 3 are schematic views showing a configuration example of the memory card of the present invention.
2 and 3, reference numeral 10 denotes a memory card, which shows an external configuration viewed from one surface 13a of the memory card 10 and the other surface 13b on the opposite side, and has a thin, substantially card shape. ing.

  In FIG. 3, a contact portion 16 including a 10-row terminal array of two stages is provided along the edge of one end 14 a of one surface 13 a of the memory card 10. The first-stage contact portion 16a and the second-stage contact portion 16b of the contact portion 16 having the two-stage configuration are formed by the electrical contact configuration shown in FIG. Of these, the leftmost two rows of contacts in the insertion direction are connected to each other and short-circuited, and the other eight rows of contacts are the first-stage contact portion 16a and the second-stage contacts at an interval of 18, respectively. It is divided into two contact portions of the portion 16b. The 10 rows of contacts in each stage of the two-stage configuration are configured such that adjacent contacts are partitioned by a partition 17.

  Also, whether or not the insertion direction of the memory card 10 is correct when the memory card 10 is inserted into the slot portion 21 of the memory card mounting device 20 at the corner between the one end portion 14a and the one side surface 15a of the memory card 1. And a concave portion 19 for positioning is provided. A fixing recess 1a for fixing the memory card 10 at a position determined by the positioning recess 19 is provided on the edge of the side surface 15a.

In FIG. 2, the height H ₁ for storing the flash memory element (memory) in the vicinity of the end portion 14b opposite to the end portion 14a of the other surface 13b opposite to the one surface 13a of the memory card 10 is shown. A first convex portion 12 is provided. As a result, it is possible to easily increase the memory capacity of the memory card without greatly changing the external dimensions.

Next, a case where the memory card 10 is used by being inserted into a device having a spring contact (memory card mounting device) will be described.
4A, 4B, and 5 show cross-sectional views of the memory card mounting device 20 with the memory card 10 inserted and mounted as viewed from the side surface 15b.

  Here, the memory card mounting device 20 is provided with an opening 22 by cutting into a portion corresponding to the first convex portion 12 of the memory card 10 described above. Further, the memory card is mounted on the surface of the metal plate 25 serving as a countermeasure against static electricity constituting the substantially box-shaped slot portion 21 of the memory card mounting device 20 in contact with the one surface 13a on which the contact portion 16 of the memory card 10 is provided. Two long protrusions 25a are provided in parallel with the insertion direction to make the memory card easy to slide and to be inserted and removed.

  FIG. 4B is a cross-sectional view of the memory card mounting device 20 of this example as viewed from the side surface 25b. In the memory card mounting device 20, the spring contact terminals 36a and 36b are formed by bending a part of the two-stage spring contact terminals 36a and 36b, and the spring contact terminals 36a and 36b are molded with a resin. 26 is connected to a flexible substrate 27 having a movable wiring portion attached to the edge 26c edge of one surface 26b.

  FIG. 4A is a cross-sectional view of the memory card 10 as viewed from the side surface 15b. Reference numeral 30 denotes a conventionally built-in memory, and reference numeral 30a denotes a newly added memory. The memory card 10 is inserted into the memory card mounting device 20 from the end portion 14a with the surface 13b opposite to the one surface 13a on which the contact portion 16 is provided facing upward.

  FIG. 5 shows a state in which the memory card 10 is mounted on the memory card mounting apparatus 20. The memory card 10 inserted from the slot 21 of the slot portion 21 of the memory card mounting device 20 is inserted to a predetermined position and mounted on the memory card mounting device 20. At this time, the surfaces of the contact portions 16a and 16b of the two-stage configuration of the memory card 10 are slid in a state where the spring contacts 37 and 37 of the memory card mounting device 20 are pressed by the spring action of the spring contact terminals 36a and 36b, respectively. Thereafter, the pressure contact state is maintained and an electrical connection is obtained. An electronic device (not shown) is connected to the flexible substrate 27 from the spring contacts 37, 37 through the contact terminals 36a and 36b through the mold resin portion 26 and connected to the tip of the movable wiring portion of the flexible substrate 27. It is possible to send and receive signals to and from the control means built in the.

  Further, when the memory card 10 is pulled out from the insertion slot of the slot portion 21, the spring contacts 37 and 37 of the memory card mounting device 20 are respectively spring contact points on the surfaces of the contact portions 16a and 16b of the two-stage configuration of the memory card 10. After being slid in a pressed state by the spring action of the terminals 36a and 36b, the contact with the spring contacts 37, 37 is released.

  Thus, each time the memory card 10 is used, the memory card 10 is inserted into and removed from the memory card mounting device 20, and the surfaces of the contact portions 16 a and 16 b of the memory card 10 are slid by the spring contacts 37 and 37. In the memory card 10 of the present invention, the contact portions 16a and 16b are electrical contacts having excellent wear resistance and corrosion resistance having the configuration shown in FIG. 1, so that the memory card 10 can be inserted into and removed from the memory card mounting device 20 several times a day. Even when this is repeated, the contact portions 16a and 16b are kept in a good state and can be used for a long time.

Next, a mobile information terminal device and a charger according to the present invention will be described.
FIG. 6 is a schematic diagram showing a configuration of a mobile phone which is an aspect of the mobile information terminal device of the present invention. In the following, the U direction, D direction, L direction, R direction, F direction, and B direction indicated by arrows in the drawings mean upward, downward, leftward, rightward, forward, and backward, respectively. To do. Further, the directionality shown in the present specification is for the convenience of describing the mobile phone 40 and the charger 60 in the present specification.

  As shown in FIG. 6, the mobile phone 40 includes an operation unit main body 41 and a display unit main body 42 that are substantially in the shape of a thin box, and the operation unit main body 41 and the display unit main body 42 are opposed to each other. It consists of a hinge part 43 that is rotatably combined at the side part. This basic configuration is the same as that of a conventional mobile phone.

  In addition, when not in use, the mobile phone 40 is carried in a state where the operation unit main body 41 and the display unit main body 42 are folded so as to overlap each other via the hinge unit 43. The cellular phone 40 is used in a state where the operation unit main body 41 and the display unit main body 42 are unfolded via the hinge portion 43 as shown in FIG.

  In the folded state, the operation unit main body 41 has one main surface facing the display unit main body 42 as an operation surface 41a. On the operation surface 41a, a numeric key 44, a jog dial 45, and various function buttons 46 are provided as shown in FIG. It has been. The operation section main body 41 is provided with a transmitter section 47 that is located on the free end side opposite to the hinge section 43 of the operation surface 41a and incorporates a microphone (not shown).

  The mobile phone 40 stores a rechargeable battery pack or the like in the operation unit main body 41, and power is supplied to each unit.

  In addition, the operation portion main body 41 is provided with a charging terminal portion 48 for charging the secondary battery pack on the side surface on the free end side opposite to the hinge portion 43 of the operation surface 41a.

  The charging terminal portion 48 is configured such that charging electrical contacts 48 a and 48 a are exposed at the bottom surface of a flat recess 49 formed on the free end side surface of the operation portion main body 41. The electrical contacts 48a and 48a are formed by the configuration of the electrical contacts shown in FIG.

  The operation portion main body 41 is provided with an antenna portion 50 which is a side surface on the hinge portion 43 side and accommodates a telescopic rod antenna at the left end thereof, and a locking claw 67 of the charger 60 is provided at substantially the center thereof. A locking hole (not shown) for locking is formed.

FIG. 7 is a schematic diagram showing a configuration of a mobile phone charger which is an embodiment of the charger of the mobile information terminal device of the present invention.
The battery charger 60 includes a main body portion 62 that is long and slightly thick in the front-rear direction, and two support pillars 63, 63 that protrude upward from left and right corners on the rear end side of the main body portion 62. The main body part 62 includes a locking convex part 64 projecting upward from the left and right central part on the front end side of the main body part 62, and a charging circuit (not shown) is provided inside the main body part 62.

  The distance between the two support pillars 63, 63 and the locking projection 64 in the front-rear direction is formed to be approximately the same as the length in the front-rear direction of the battery charger (cell phone 40) charged by the charger 60. The two support pillars 63 and 63 and the locking projection 64 constitute a mounting portion 65 of the mobile phone 40 in the charger 60.

  On the surface of the charger 60 facing the front of the two support pillars 63, 63, charging terminals 66, 66 connected to an external power supply project. The charging terminals 66, 66 are formed with the configuration of the electrical contacts shown in FIG.

  A locking claw 67 is provided in the substantially central portion of the locking projection 64 toward the rear, and the locking claw 67 is a locking provided on a device (cell phone 40) charged by the charger 60. The mobile phone 40 is positioned by being locked in the hole.

The mobile phone 40 is attached to the charger 60 and charged as follows.
First, in a state in which the cellular phone 40 is folded, the mobile phone 40 is tilted so that the electrical contacts 48a and 48a of the charging terminal portion 48 are brought into contact with the charging terminals 66 and 66 of the charger 60 (FIG. 8). Next, the mobile phone 40 is rotated so that the hinge 43 side goes downward with the charging terminal 48 side as a fulcrum. Accordingly, the electrical contacts 48a, 48a and the charging terminals 66, 66 slide on the surfaces of each other under a certain pressure.

  Then, the locking hole 31 formed on the hinge portion 23 side of the mobile phone 20 is locked to the locking claw 7 of the charger 1.

  As a result, the cellular phone 20 is mounted in the charger 1 in a folded and horizontal state, and the electrical contacts 48a, 48a and the charging terminals 66, 66 are held in an electrically connected state ( FIG. 9).

  Further, when the cellular phone 40 is detached from the charger 60, an operation reverse to that in the case of wearing is performed. Also at this time, the electrical contacts 48a and 48a and the charging terminals 66 and 66 slide on the surfaces of each other under a certain pressure, and then the contact is released.

  As described above, the mobile phone 40 is attached to and detached from the charger 60 each time it is charged, and the electrical contacts 48a and 48a of the mobile phone 40 and the charging terminals 66 and 66 of the charger 60 are on the surface of each other. Slide. The electrical contacts 48a and 48a of the mobile phone 40 of the present invention and the charging terminals 66 and 66 of the charger 60 are the electrical contacts having excellent wear resistance and corrosion resistance having the configuration shown in FIG. Even when charging is repeated many times, the electrical contacts 48a and 48a and the charging terminals 66 and 66 are kept in a good state and can be used for a long time.

Examples of carrying out the present invention are shown below.
Example 1
A memory card sample having the configuration shown in FIGS. 2 and 3 was produced. The configuration of the electrical contacts of the contact portions 16a and 16b was as follows.
Electrode base material 1: Copper plate Ni plating layer 2: A film thickness of 3 μm was formed by electroplating.
Pd—Ni alloy plating layer 3: A film thickness of 1 μm and a Pd: Ni weight ratio of 80:20 were formed by electroplating.
Co-containing Au plating layer 4: A film thickness of 0.03 μm and a Co content of 0.3% were formed by electroplating.

(Comparative Example 1)
In Example 1, the Pd—Ni alloy plating layer 3 is omitted, the Au plating layer having a film thickness of 0.5 μm is used instead of the Co-containing Au plating layer 4, and the memory card sample is prepared under the same conditions as in Example 1. Produced.

(Comparative Example 2)
In Example 1, the Ni plating layer 2 is 4 μm thick, and instead of the Co-containing Au plating layer 4, a 0.03 μm thick Au plating layer is used. Otherwise, a memory card sample is manufactured under the same conditions as in Example 1. did.

(Comparative Example 3)
In Example 1, the thickness of the Ni plating layer 2 is 1.5 μm, the Pd: Ni weight ratio of the Pd—Ni alloy plating layer 3 is 50:50, and the thickness of the Co-containing Au plating layer 4 is 0.5 μm. Otherwise, a memory card sample was produced under the same conditions as in Example 1.

Using the obtained sample, the deterioration test by the following insertion / extraction test and mixed gas corrosion test was performed.
(1) Insertion / extraction test The test which repeats the insertion / extraction to the memory card mounting apparatus 20 shown in FIG. 4, FIG. 5 12000 times was done. The contact pressure at this time was 0.5N.
(2) Mixed gas corrosion test Next, the sample after the insertion / extraction test is exposed to a mixed gas corrosion test for 48 hours in an environment of sulfur dioxide gas: 10 ppm, nitrogen dioxide gas: 10 ppm, temperature: 40 ° C., humidity: 75% RH. Went.

  The surface of contact part 16a, 16b of Example 1 after performing the said deterioration test and Comparative Examples 1-3 was observed with the scanning electron microscope (SEM). Each result is shown in FIGS.

In Example 1, in the insertion / extraction test, a clear sliding mark was not seen in a portion (sliding portion) rubbed with the spring contact, and the wear was hardly received (FIG. 10). Further, no corrosion occurred.
On the other hand, in Comparative Example 1, the plating layer was greatly scraped at the sliding portion, and a state of severe corrosion (black portion in the figure) was confirmed (FIG. 11). Further, in Comparative Example 2, the plating layer was scraped at the sliding portion, and it was confirmed that the plate was considerably corroded (FIG. 12). This is probably because the wear resistance was lowered because Co was not contained in the Au plating layer. Further, in Comparative Example 3, although the Co-containing Au plating layer 4 had a thickness of 0.5 μm, corrosion at the sliding portion was observed (FIG. 13).

Next, the relationship between the applied current and voltage was investigated for the contact portions 16a and 16b of Example 1 and Comparative Example 1 before and after the deterioration test. The respective results are shown in FIGS.
In Example 1, there is almost no difference in the relationship between current and voltage before and after the deterioration test, and it can be seen that this is a good metal contact (FIG. 14). On the other hand, in Comparative Example 1, a voltage increase, that is, an increase in contact resistance value was observed after the deterioration test (FIG. 15).

(Comparative Examples 4 to 8)
The deterioration test was conducted using various commercially available memory cards (5 types) as samples of Comparative Examples 4 to 8, and the relationship between applied current and voltage was investigated. In the insertion / extraction test, the contact pressure was set to 0.5 N for each sample.

Moreover, when the plating layer structure was analyzed about the contact part of the sample of Comparative Examples 4-8, all were 2 layer structures of Au / Ni, and each film thickness was as follows.
Comparative Example 4: Ni plating layer = 6.92 μm, Au plating layer = 0.58 μm
Comparative Example 5: Ni plating layer = 9.50 μm, Au plating layer = 1.08 μm
Comparative Example 6: Ni plating layer = 3.33 μm, Au plating layer = 1.67 μm
Comparative Example 7: Ni plating layer = 13.00 μm, Au plating layer = 2.50 μm
Comparative Example 8: Ni plating layer = 11.70 μm, Au plating layer = 1.83 μm

The result is shown in FIG. Here, the relationship between the average value of the voltage y obtained when the current M is supplied to the contact and the variation between the actual data is obtained as an SN ratio, and 65 dB is added to that value.
Example 1 was found to be superior to Comparative Examples 4 to 8 in at least 5 db (more than 4 times in reliability) corrosion resistance and wear resistance.

It is sectional drawing which shows the structure of the electrical contact used by this invention. It is the schematic (1) which shows the structural example of the memory card of this invention. It is the schematic (2) which shows the structural example of the memory card of this invention. It is sectional drawing which shows the state which inserts a memory card in a memory card mounting apparatus. It is sectional drawing which shows the state which mounted | wore the memory card mounting apparatus with the memory card. It is the schematic which shows the structure of the mobile information terminal device (cellular phone) of this invention. It is the schematic which shows the structure of the charger of this invention. It is sectional drawing which shows the state in the middle of mounting | wearing a charger with a mobile information terminal device (mobile telephone). It is sectional drawing which shows the state which mounted | wore the charger with the mobile information terminal device (cellular phone). 2 is a diagram showing a surface state after a deterioration test of Example 1. FIG. 6 is a diagram showing a surface state after a deterioration test of Comparative Example 1. FIG. 6 is a diagram showing a surface state after a deterioration test of Comparative Example 2. FIG. 6 is a view showing a surface state after a deterioration test of Comparative Example 3. FIG. It is a figure which shows the relationship of the electric current-voltage before and behind the deterioration test of Example 1. FIG. It is a figure which shows the relationship of the electric current-voltage before and behind the deterioration test of the comparative example 1. FIG. It is a figure which shows the evaluation result of Example 1 and Comparative Examples 4-8.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Electrode base material, 2 ... Ni plating layer, 3 ... Pd-Ni alloy plating layer, 4 ... Co containing Au plating layer, 6 ... Electrical contact, 10 ... Memory card , 12 ... Memory storing convex part, 12a ... Label attaching surface, 12b ... Hooking convex part, 12c ... Label, 13a, 13b ... Surface, 14a, 14b ... End Part, 15a, 15b ... side face, 16, 16a, 16b ... contact part, 17 ... partition, 18 ... interval, 19 ... recessed part, 19a ... curved surface part, 1a ... Fixing recess, 20 ... Memory card mounting device, 21 ... Slot part, 22 ... Opening part, 25 ... Metal plate, 26 ... Mold resin part, 30, 30a ... Memory, 36a, 36b ... spring contact terminal, 37 ... spring contact, 40 ... mobile Information terminal equipment (mobile phone), 41 ... operation unit main body, 42 ... display unit main body, 43 ... hinge part, 44 ... numeric keypad, 45 ... jog dial, 46 ... various function buttons , 47... Transmitter section, 48... Charging terminal section, 48 a and 48 b... Electrical contacts for charging, 49... Recessed section, 50... Antenna section, 60. Main body part, 63 ... support pillar, 64 ... locking projection, 65 ... mounting part, 66 ... charging terminal, 67 ... locking claw

Claims (3)

  In a memory card that is used by being inserted into a device having a spring contact, a Ni plating layer having a thickness of 1 to 3 μm, a Pd—Ni alloy plating layer having a thickness of 0.2 to 1 μm, a thickness of 0. It comprises an electrical contact formed by sequentially laminating a Co-containing Au plating layer of 03 to 0.05 μm and a flash memory element, and the electrical contact comes into contact with a spring contact when inserted into the device. Memory card.   On a rechargeable battery serving as a power source and an electrode base material connected to the battery, a Ni plating layer having a thickness of 1 to 3 μm, a Pd—Ni alloy plating layer having a thickness of 0.2 to 1 μm, a thickness of 0. A mobile information terminal device comprising a charging electrical contact formed by sequentially laminating a Co-containing Au plating layer of 03 to 0.05 μm. A charger for charging a mobile information terminal device,
A portion of the electrode base material connected to an external power source that comes into contact with the charging electrical contact of the mobile information terminal device has a Ni plating layer with a thickness of 1 to 3 μm and a Pd—Ni alloy plating layer with a thickness of 0.2 to 1 μm. A battery charger comprising an electrical contact formed by sequentially laminating a Co-containing Au plating layer having a thickness of 0.03 to 0.05 μm.

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