A kind of tin lead welding band and manufacture method thereof that is used for solar photovoltaic assembly
Technical field
The present invention relates to a kind of electric material, relate in particular to a kind of tin lead welding band and manufacture method thereof that is used for solar photovoltaic assembly.
Background technology
Since 21st century, for the love to environment, the utilization of solar energy becomes one of human focus of creating new forms of energy.Solar photovoltaic assembly has used the Si sheet of a large amount of polycrystalline and monocrystalline, and these Si sheets need be communicated with by welding (band is with/is confluxed in interconnection) welding, are transferred to designated field, by this pattern generating, transmits electric power.Along with the fast development of solar photovoltaic assembly, just need be used for the welding of solar photovoltaic assembly in a large number.
Up to now, people are in order to obtain high conductivity, and the welding that connects solar photovoltaic assembly all adopts higher oxygen-free copper of purity or high-purity copper (99.9999%) as conductor material, and manufacturing cost will be very high like this.
Publication number is the utility model patent of CN201430144; disclose a kind of solar cell and be coated with the tin band; comprise the copper strips base material; the copper strips base material simultaneously is coated with the ashbury metal layer; another side is coated with the protective layer homochromy with solar battery sheet, and protective layer is pigment coated or is the ashbury metal coating of mixing additives of pigments.
Publication number be CN101488536 patent disclosure the conflux method of the band and the band assembling solar plate that confluxes of a kind of solar photovoltaic assembly, its conflux with on the tin layer cover and adopt tinning technology.
Prior art generally all is to adopt tinning technology that tin solder is covered to copper strips.The tin thickness of this method manufacturing is inhomogeneous, phenomenons such as list edge, scruff, copper scale and variable color are arranged, and often produces pin hole and stream tin during welding, and solderability is bad.
The large-scale popularization of solar photovoltaic assembly is used the problem that needs to solve two aspects, the production cost that aspect is the Si sheet will descend, and another aspect is that the production cost of each parts such as welding is cheap, and production technology is controlled, production process is wanted high-speeding, the adhesive force of welding and Si sheet will be got well, and solderability will be got well, and fusing point is low, the plate surface of what is more important welding is smooth, solderability will be got well, and it is high that conductivity is wanted, and electric conductivity will be got well.And prior art adopts tinning technology that tin solder is covered the method for producing welding to the copper strips not satisfy last requirement.
Summary of the invention
Purpose of the present invention in order to solve the problem that above-mentioned prior art exists, provides a kind of tin lead welding band and manufacture method thereof that is used for solar photovoltaic assembly exactly.
In order to achieve the above object, the present invention has adopted following technical scheme: a kind of tin lead welding band that is used for solar photovoltaic assembly, comprise the copper strips base material, and described copper strips substrate surface is coated with the leypewter layer of one deck densification, and thickness is 3~20 microns.
Tin with the percentage by weight of lead is in the described ashbury metal layer: tin 60~90%, plumbous 10~40%.General tin and lead proportion are: the composition ratio is for having 60/40,65/35,63/37,70/30,80/20,90/20.
Described copper strips base material is oxygen-free copper stripe or copper belt.
The above-mentioned manufacture method that is used for the tin lead welding band of solar photovoltaic assembly is to adopt electro-plating method to cover the leypewter layer of one deck densification on the copper strips base material, and the thickness of leypewter layer is 3~20 microns.
The key step of described electro-plating method is, the copper strips base material is after heat treatment electroplated by the electroplate liquid that contains Sn, Pb, and copper strips base material translational speed is controlled at 3-20m/min, and electroplate liquid pH value is controlled at 1~2, temperature of electroplating solution is controlled at 10~30 ℃, and current density is controlled at 10~50A/dm
2, electroplating time was controlled at 60~120 seconds, and thickness of coating is controlled at 3~20 microns.
In the described electroplate liquid, the adding form of Sn is stannous sulfate or tin methane sulfonate, and the adding form of Pb is lead sulfate or pyrovinic acid lead, and the molar concentration rate of Sn and Pb is controlled at 30: 8~20.
The present invention has following advantage and characteristics owing to adopted above technical scheme:
1, owing to adopt the plumbous electro-plating method of tin, coating has patterned features, can strengthen the adhesive force of welding, effectively improves the conductance 2-4% of photovoltaic welding belt.
2, adopt electro-plating method to make tin lead welding band, produce fast, the SnPb alloy layer thickness is controlled 3~20 microns on the copper strips.Welding processing controllable width reaches 1.1~20 millimeters.
3, adopting the welding specific insulation of galvanoplastic manufacturing is 0.0185~0.021 Ω mm
2/ m, the specific insulation of the welding of making than tinning is low.
4, the welding fusing point that adopts the plumbous electro-plating method of tin to make is low, and controlled, and melting range is the 183-190 degree.
Description of drawings
Fig. 1 is the section structure schematic diagram of product electrotinning lead welding band of the present invention;
Fig. 2 is the section structure schematic diagram of prior art tinning welding.
Specific embodiments
The present invention is used for the tin lead welding band of solar photovoltaic assembly, comprises the copper strips base material, is coated with the leypewter layer of one deck densification at the copper strips substrate surface, and thickness is 3~20 microns.Tin with the percentage by weight of lead is in the leypewter layer: tin 60~90%, plumbous 10~40%.The copper strips base material is oxygen-free copper stripe or copper belt.
The present invention is used for the manufacture method of the tin lead welding band of solar photovoltaic assembly, is to adopt electro-plating method to cover the leypewter layer of one deck densification on the copper strips base material.Concrete steps are as follows:
A, electrolytic degreasing: plating piece is placed the alkaline solution electrolysis, remove the grease and the flash on plating piece surface;
B, activation: place acid solution to activate plating piece, remove the oxide on plating piece surface;
C, preimpregnation: plating piece is placed acid sulfonate solution preimpregnation, plating piece is formed etching;
D, the plumbous plating of tin: adopt delivery wheel transmission plating piece, allow plating piece electroplate through electroplate liquid, transmission speed is controlled at 6~18 meters/minute, and current density is controlled at 10~30 amperes/square decimeter, temperature of electroplating solution is controlled at 15~35 ℃, and electroplating time was controlled at 30~90 seconds; Pyrovinic acid system, sulfuric acid system or the mixed acid system of consisting of of electroplate liquid: Sn and Pb, wherein the molar concentration rate of Sn and Pb is controlled at 30: 8~20.
E, neutralization: the plating piece after will electroplating places sodium radio-phosphate,P-32 solution to handle, and the organic acid on surface is cleaned up;
F, tin protection: place tin protection solution to handle plating piece, form one deck organic membrane on the plating piece surface;
G, ultrasonic wave pure water are washed: plating piece is placed the pure water ultrasonic Treatment, to remove the impurity in the coating space.
Below be the embodiment that the manufacture method that adopts the present invention to be used for the tin lead welding band of solar photovoltaic assembly is produced welding.
Embodiment 1
The copper strips base material adopts commercially available copper belt, the copper strips base material is implemented heat treatment, 400 ℃ of following heat treatments 90 minutes.
To electroplate by the electroplate liquid that contains Sn, Pb through heat treated copper belt, the molar concentration rate of Sn and Pb was controlled at 30: 10; Copper strips base material translational speed is controlled at 10m/min, and electroplate liquid pH value is controlled to be 1, and temperature of electroplating solution is controlled to be 20 ℃, and current density is controlled at 30A/dm
2, electroplating time was controlled at 2 minutes, and thickness of coating is controlled at 10 microns.Obtain tin in the coating and plumbous percentage by weight and be 63: 37 welding.
Embodiment 2
The copper strips base material adopts commercially available copper belt, the copper strips base material is implemented heat treatment, 750 ℃ of following heat treatments 30 minutes.
To electroplate by the electroplate liquid that contains Sn, Pb through heat treated oxygen-free copper stripe, the molar concentration rate of Sn and Pb was controlled at 30: 20; Copper strips base material translational speed is controlled at 15m/min, and electroplate liquid pH value is controlled to be 2, and temperature of electroplating solution is controlled to be 25 ℃, and current density is controlled at 40A/dm
2, electroplating time was controlled at 1 minute, and thickness of coating is controlled at 15 microns.Obtain tin in the coating and plumbous percentage by weight and be 60: 40 welding.
Embodiment 3
The copper strips base material adopts commercially available oxygen-free copper stripe, and the copper strips base material is implemented heat treatment, is 60 minutes 550 ℃ of following heat treatments.
To electroplate by the electroplate liquid that contains Sn, Pb through heat treated oxygen-free copper stripe, the molar concentration rate of Sn and Pb was controlled at 30: 8; Copper strips base material translational speed is controlled at 20m/min, and electroplate liquid pH value is controlled to be 1.5, and temperature of electroplating solution is controlled to be 15 ℃, and current density is controlled at 30A/dm
2, electroplating time was controlled at 2 minutes, and thickness of coating is controlled at 8 microns.Obtain tin in the coating and plumbous percentage by weight and be 70: 30 welding.
According to actual test result, the solar components that the present invention produced is compared with the product of common process production with the welding product, and comparatively significantly lifting, specific insulation (Ω mm are being arranged aspect the conductance index
2/ m) be reduced to 0.018-0.021 from 0.022-0.023.Because the reduction of welding resistivity with the power output of solar module is got a promotion, according to measuring and calculating, can improve power output 1.5-13.0% approximately.
The present invention has overcome the deficiencies in the prior art, and it is inhomogeneous to have solved the welding thickness of coating, and anomalies such as list edge, scruff, copper scale, variable color effectively improve index (CPK) value of processing procedure ability, and lower than unleaded plating welding fusing point.Have advantage and characteristics mainly contain: technology is simple, reaction fast, the production efficiency height; Product has good solderability; Product has the favorable conductive rate.
The present invention is owing to adopted Terne Electroplating technology, and tin thickness is even, and the surface is very smooth, as shown in Figure 1.And the welding surface of tinning explained hereafter presents tangible arc convex, as shown in Figure 2.