CN105390176A - Tin-lead plating flat copper wire and preparation method thereof - Google Patents
Tin-lead plating flat copper wire and preparation method thereof Download PDFInfo
- Publication number
- CN105390176A CN105390176A CN201510932230.6A CN201510932230A CN105390176A CN 105390176 A CN105390176 A CN 105390176A CN 201510932230 A CN201510932230 A CN 201510932230A CN 105390176 A CN105390176 A CN 105390176A
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- Prior art keywords
- copper wire
- wire
- zinc
- plated
- plumbous
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/38—Wires; Tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Coating With Molten Metal (AREA)
Abstract
The invention discloses a tin-lead plating flat copper wire and preparation method thereof. The tin-lead plating flat copper wire is mainly used for electronic industrial fields such as electron components, hybrid integrated circuits and solar photovoltaic modules. An inner core of the tin-lead plating flat copper wire is oxygen-free copper, and the purity is higher than 99.99%, and the outer diameter is 0.1mm-4mm; the plating layer is Sn-Pb alloy, the specific components are 36wt.%-38wt.% of Pb and the rest of Sn, and the thickness of the plating layer is 30microns-50 microns. The flat copper wire is prepared through the adoption of a hot-dipping method; the preparation method is simple in process and convenient for batch production. The tin-lead plating flat copper wire prepared through the above method has the characteristics of being good in conductivity, strong in weldability, good in corrosion resistance, good in oxidation resistance, and firm in plating layer, and has extensive market prospect.
Description
Technical field
A kind of zinc-plated plumbous flat type copper wire and preparation method thereof, is mainly used in the electronics industry such as electronic devices and components, hybrid integrated circuit, solar photovoltaic assembly, belongs to non-ferrous metal calendering manufacture field.
Background technology
Along with machinery, electronic equipment are constantly to miniaturized, microminiaturized future development, there is premium properties and current carrying capacity, transmission speed is fast, thermal diffusivity good, cheap copper lead-in wire is widely used gradually.
Solely zinc-platedly on copper cash prepare tinned wird, add and easily form signal bronze man-hour, uniformity is difficult to control, and thickness of coating and solderability are difficult to ensure, easily there is tin palpus defect during long service, the instructions for use of highly reliable hybrid integrated circuit or electronic devices and components cannot be met.
Prepare in method of coating in conventional chemical plating, plating and hot-dip three kinds, hot-dip has the advantages such as technique is simple, coating is firm, its R&D-based growth maturing.The preparation key technology of hot-dip copper cash is to control thickness of coating, and coating excessive on copper cash, can reduce solder can weld, and affects the characteristic of copper cash itself, causes the wasting of resources simultaneously.
Summary of the invention
The object of the present invention is to provide a kind of zinc-plated plumbous flat type copper wire, this lead-in wire Composition Design science, reasonable mixture ratio, have larger current load amount, higher reliability, better non-oxidizability and corrosion resistance, solderability improves greatly.The electronics industry such as electronic devices and components, hybrid integrated circuit, solar photovoltaic assembly can be applied to.
Another object of the present invention is to the preparation method providing a kind of zinc-plated plumbous flat type copper wire, adopt circular copper wire hot dipped tinning plumbous, the method technique is simple, is beneficial to batch production.
For achieving the above object, the present invention includes following technical scheme:
A kind of zinc-plated plumbous flat type copper wire, its inner core is oxygen-free copper, and purity is higher than 99.99%; Coating is Sn-Pb alloy, and wherein, Pb content is 36wt.% ~ 38wt.%, Sn surplus.
Zinc-plated lead bronze line as above, preferably, described thickness of coating is 30 μm ~ 50 μm.
Zinc-plated plumbous flat type copper wire as above, preferably, the section thickness of described flat type copper wire is 0.1mm ~ 2mm, and width is 1mm ~ 4mm.
The preparation method of zinc-plated lead bronze line as above, the method comprises the following steps:
I. get the raw materials ready: the anaerobic circular copper wire selecting surface cleaning, purity is higher than 99.99%; Sn-Pb alloy pig, wherein, Pb content is 36wt.% ~ 38wt.%, Sn surplus; Cleaning agent for copper; Activation rosin flux; Rubber mold, its endoporus and circular copper wire outside dimension match;
II. hot-dip: place cleaning agent for copper, activation rosin flux, Sn-Pb alloy pig in three technology grooves respectively; First by Sn-Pb alloy heat fused, temperature controls at 230 DEG C ~ 300 DEG C; Then oxygen-free copper-wire is successively passed through cleaning agent for copper, activation rosin flux, Sn-Pb alloy molten solution and rubber mold, wire travelling speed controls at 5 ~ 8m/min;
III. lenticular wire rolling: zinc-plated plumbous circular copper wire Step II obtained is through cold-rolling mill, and adjustment drafts, detect thickness, to meeting dimensional requirement according to claim 3, can prepare zinc-plated plumbous flat type copper wire.
Preparation method as above, preferably, the diameter of described circular copper wire is 0.1mm ~ 4mm.
Preparation method as above, preferably, described activation rosin flux is liquid reactive rosin flux.
Preparation method as above, preferably, the time of described oxygen-free copper-wire hot-dip in Sn-Pb alloy molten solution is 0.5 ~ 2S.
A kind of zinc-plated plumbous flat type copper wire, it adopts method as above to prepare.
Flat type copper wire of the present invention has tin lead-coat, and adopting hot dip coating method to prepare, its beneficial effect is: tin lead-coat, particularly weight ratio are the alloy of tin 63%, lead 37%, because it has minimum eutectic melting point (only 183 DEG C), be applicable to the low temperature such as printed circuit board (PCB) and connect.Zinc-plated lead on copper cash, can suppress copper in tin, dissolve the utilance improving tin effectively.Compare tinned wird, zinc-plated lead bronze line has larger current load amount, higher reliability, better non-oxidizability and corrosion resistance, and solderability improves greatly, also reduces processing cost simultaneously.Be suitable for the multiple electronic product such as electronic devices and components, hybrid integrated circuit, solar photovoltaic assembly to connect.Zinc-plated plumbous flat type copper wire preparation method of the present invention is simple, is beneficial to batch production.
Accompanying drawing explanation
Fig. 1 is the cross-sectional structure schematic diagram of the zinc-plated plumbous flat type copper wire of a kind of preferred implementation of the present invention.
Embodiment
Embodiment below in conjunction with concrete processing preparation is further described zinc-plated plumbous flat type copper wire of the present invention and preparation method thereof.
In following examples, zinc-plated plumbous flat type copper wire prepares by the following method, specifically comprises the following steps:
Step 1: raw material selection
Select the anaerobic circular copper wire of surface cleaning, purity is higher than 99.99%, and wire rod sectional area should be equal with the flat type copper wire for preparing; Enough Sn-Pb alloy pigs; Cleaning agent for copper alcohol and the liquid rosin of activation rosin flux; Rubber mold, the shape of mould is cylindrical hole, and through hole internal diameter is identical with zinc-plated plumbous circular copper wire overall dimension.
Step 2: hot-dip
Three technology grooves and a mould bases are set, place cleaning agent for copper, activation rosin flux, Sn-Pb alloy pig and rubber mold respectively.First by Sn-Pb alloy heat fused, temperature controls at 230 DEG C ~ 300 DEG C; Then oxygen-free copper-wire is successively passed cleaning agent for copper groove, activation rosin flux and Sn-Pb alloy solution groove, rubber mold, wire travelling speed controls at 5 ~ 8m/min, the time of oxygen-free copper-wire hot-dip in Sn-Pb alloy molten solution is 0.5 ~ 2S, obtains zinc-plated plumbous circular copper wire by the zinc-plated lead bronze line of rubber mold through air cooling.
Step 3: lenticular wire rolling
By zinc-plated plumbous circular copper wire through cold-rolling mill, adjustment drafts, detect thickness, to meeting dimensional requirement, can prepare zinc-plated plumbous flat type copper wire.
Step 4: pack around axle
Adopt the tight winding package of single line single-deck, packaging tray can select polymethyl methacrylate dish or hard plastic charging tray.
Obtained zinc-plated plumbous flat type copper wire cross-sectional structure schematic diagram can refer to Fig. 1.Inner core 1 is flat type copper wire, and thickness is 0.1mm ~ 2mm, and width is 1mm ~ 4mm; Outer 2 is tin lead-coat, and thickness is 30 μm ~ 50 μm.
Embodiment 1 prepares zinc-plated plumbous flat type copper wire
Select oxygen-free copper-wire to be of a size of Φ 0.18mm, coating Sn-Pb alloy Pb content is 36.0wt%, and alloy heating-up temperature is 300 DEG C, and hot-dip wire travelling speed is 8m/min, and the hot-dip time is 0.5S.Obtain flat flat type copper wire after rolling and be of a size of 0.1mm × 1mm.
Embodiment 2 prepares zinc-plated plumbous flat type copper wire
Select oxygen-free copper-wire to be of a size of Φ 0.6mm, coating Sn-Pb alloy Pb content is 37.0wt%, and alloy heating-up temperature is 230 DEG C, and hot-dip wire travelling speed is 7m/min, and the hot-dip time is 0.5S.Obtain flat type copper wire after rolling and be of a size of 0.5mm × 2.0mm.
Embodiment 3 prepares zinc-plated plumbous flat type copper wire
Select oxygen-free copper-wire to be of a size of Φ 1.0mm, coating Sn-Pb alloy Pb content is 37.5wt%, and alloy heating-up temperature is 260 DEG C, and hot-dip wire travelling speed is 6m/min, and the hot-dip time is 1S.Obtain flat type copper wire after rolling and be of a size of 1.0mm × 3.0mm.
Embodiment 4 prepares zinc-plated plumbous flat type copper wire
Select oxygen-free copper-wire to be of a size of Φ 1.6mm, coating Sn-Pb alloy Pb content is 38.0wt%, and alloy heating-up temperature is 280 DEG C, and hot-dip wire travelling speed is 5m/min, and the hot-dip time is 2S.Obtain flat type copper wire after rolling and be of a size of 2.0mm × 4.0mm.
Embodiment 5
Carry out performance test to the flat type copper wire that embodiment 1-4 obtains, result is as shown in table 1.
Table 1
| Coating composition | Thickness of coating | Coating coverage rate | Solderability | Tensile strength | |
| Embodiment 1 | 36.0wt％ | 35μm | 99.8％ | 207℃ | 426MPa |
| Embodiment 2 | 37.0wt％ | 30μm | 99.9％ | 198℃ | 453MPa |
| Embodiment 3 | 37.5wt％ | 49μm | 99.5％ | 201℃ | 412MPa |
| Embodiment 4 | 38.0wt％ | 40μm | 99.6％ | 203℃ | 431MPa |
Note: 1, Coating composition detects numerical value is Pb content in Sn-Pb alloy;
2, coating coverage rate is for detecting coating area coverage on the zinc-plated plumbous flat type copper wire of every km;
The embodiment of zinc-plated plumbous flat type copper wire of the present invention and preparation method thereof part is only enumerated in above-described embodiment; in the technical scheme of the invention described above: described coating Pb content can unrestricted choice in prescribed limit; will not enumerate herein; therefore the technical scheme that above explanation comprises should be considered as exemplary, and be not used to the protection range limiting the present patent application patent.
Claims (8)
1. a zinc-plated plumbous flat type copper wire, is characterized in that, its inner core is oxygen-free copper, and purity is higher than 99.99%; Coating is Sn-Pb alloy, and wherein, Pb content is 36wt.% ~ 38wt.%, Sn surplus.
2. zinc-plated lead bronze line as claimed in claim 1, is characterized in that, described thickness of coating is 30 μm ~ 50 μm.
3. zinc-plated plumbous flat type copper wire as claimed in claim 1 or 2, is characterized in that, the section thickness of described flat type copper wire is 0.1mm ~ 2mm, and width is 1mm ~ 4mm.
4. the preparation method of the zinc-plated lead bronze line according to any one of claim 1-3, it is characterized in that, the method comprises the following steps:
I. get the raw materials ready: the anaerobic circular copper wire selecting surface cleaning, purity is higher than 99.99%; Sn-Pb alloy pig, wherein, Pb content is 36wt.% ~ 38wt.%, Sn surplus; Cleaning agent for copper; Activation rosin flux; Rubber mold, its endoporus and circular copper wire outside dimension match;
II. hot-dip: place cleaning agent for copper, activation rosin flux, Sn-Pb alloy pig in three technology grooves respectively; First by Sn-Pb alloy heat fused, temperature controls at 230 DEG C ~ 300 DEG C; Then oxygen-free copper-wire is successively passed through cleaning agent for copper, activation rosin flux, Sn-Pb alloy molten solution and rubber mold, wire travelling speed controls at 5 ~ 8m/min;
III. lenticular wire rolling: zinc-plated plumbous circular copper wire Step II obtained is through cold-rolling mill, and adjustment drafts, detect thickness, to meeting dimensional requirement according to claim 3, can prepare zinc-plated plumbous flat type copper wire.
5. preparation method as claimed in claim 4, it is characterized in that, the diameter of described circular copper wire is 0.1mm ~ 4mm.
6. preparation method as claimed in claim 4, it is characterized in that, described activation rosin flux is liquid reactive rosin flux.
7. the preparation method according to any one of claim 4-6, is characterized in that, the time of described oxygen-free copper-wire hot-dip in Sn-Pb alloy molten solution is 0.5 ~ 2S.
8. a zinc-plated plumbous flat type copper wire, is characterized in that, it adopts the method according to any one of claim 4-7 to prepare.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510932230.6A CN105390176A (en) | 2015-12-15 | 2015-12-15 | Tin-lead plating flat copper wire and preparation method thereof |
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| CN201510932230.6A CN105390176A (en) | 2015-12-15 | 2015-12-15 | Tin-lead plating flat copper wire and preparation method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107579008A (en) * | 2017-09-15 | 2018-01-12 | 佛山慧创正元新材料科技有限公司 | A kind of preparation method of tin plating copper wire |
| CN108004495A (en) * | 2016-11-01 | 2018-05-08 | 江阴市新艺铜业有限公司 | A kind of flat type copper wire preparation for processing |
| CN108526647A (en) * | 2017-03-06 | 2018-09-14 | 联合汽车电子有限公司 | Receive tin piece and preparation method thereof |
| CN109509571A (en) * | 2018-11-19 | 2019-03-22 | 北京有色金属与稀土应用研究所 | A kind of kamash alloy and copper strips composite material and preparation method |
| CN110838571A (en) * | 2019-11-25 | 2020-02-25 | 北京居安瑞韩电子有限公司 | Lead-coated aluminum electrode manufacturing method and storage battery |
| CN110983225A (en) * | 2019-12-23 | 2020-04-10 | 南京工程学院 | Plating assistant agent for hot dip galvanizing of steel member and hot dip galvanizing process adopting plating assistant agent |
| CN114871634A (en) * | 2022-06-15 | 2022-08-09 | 郑州机械研究所有限公司 | Copper phosphorus tin solder wire and preparation method thereof |
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| JP2010015692A (en) * | 2008-06-30 | 2010-01-21 | Sumitomo Electric Ind Ltd | Flat cable and its manufacturing method |
| CN102254978A (en) * | 2011-08-16 | 2011-11-23 | 上海华友金镀微电子有限公司 | Tin-lead welding strip for solar photovoltaic assembly and manufacturing method thereof |
| CN102337422A (en) * | 2010-07-21 | 2012-02-01 | 中国科学院金属研究所 | Low-ablation lead-free tin plating alloy under high temperature |
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| CN1510158A (en) * | 2002-12-23 | 2004-07-07 | 天津市宏远电子有限公司 | Lead-free alloy tin-plating copper wire |
| JP2010015692A (en) * | 2008-06-30 | 2010-01-21 | Sumitomo Electric Ind Ltd | Flat cable and its manufacturing method |
| CN102337422A (en) * | 2010-07-21 | 2012-02-01 | 中国科学院金属研究所 | Low-ablation lead-free tin plating alloy under high temperature |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108004495A (en) * | 2016-11-01 | 2018-05-08 | 江阴市新艺铜业有限公司 | A kind of flat type copper wire preparation for processing |
| CN108526647A (en) * | 2017-03-06 | 2018-09-14 | 联合汽车电子有限公司 | Receive tin piece and preparation method thereof |
| CN107579008A (en) * | 2017-09-15 | 2018-01-12 | 佛山慧创正元新材料科技有限公司 | A kind of preparation method of tin plating copper wire |
| CN109509571A (en) * | 2018-11-19 | 2019-03-22 | 北京有色金属与稀土应用研究所 | A kind of kamash alloy and copper strips composite material and preparation method |
| CN110838571A (en) * | 2019-11-25 | 2020-02-25 | 北京居安瑞韩电子有限公司 | Lead-coated aluminum electrode manufacturing method and storage battery |
| CN110838571B (en) * | 2019-11-25 | 2021-04-02 | 北京居安瑞韩电子有限公司 | Lead-coated aluminum electrode manufacturing method and storage battery |
| CN110983225A (en) * | 2019-12-23 | 2020-04-10 | 南京工程学院 | Plating assistant agent for hot dip galvanizing of steel member and hot dip galvanizing process adopting plating assistant agent |
| CN114871634A (en) * | 2022-06-15 | 2022-08-09 | 郑州机械研究所有限公司 | Copper phosphorus tin solder wire and preparation method thereof |
| US11931828B2 (en) | 2022-06-15 | 2024-03-19 | Zhengzhou Research Institute Of Mechanical Engineering Co., Ltd. | Copper-phosphorus-tin brazing wire and preparation method thereof |
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Application publication date: 20160309 |
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