CN108004495A - A kind of flat type copper wire preparation for processing - Google Patents

A kind of flat type copper wire preparation for processing Download PDF

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Publication number
CN108004495A
CN108004495A CN201610937341.0A CN201610937341A CN108004495A CN 108004495 A CN108004495 A CN 108004495A CN 201610937341 A CN201610937341 A CN 201610937341A CN 108004495 A CN108004495 A CN 108004495A
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CN
China
Prior art keywords
copper wire
heating
flat type
wire
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610937341.0A
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Chinese (zh)
Inventor
戴国新
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangyin Xinyi Copper Co Ltd
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Jiangyin Xinyi Copper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Jiangyin Xinyi Copper Co Ltd filed Critical Jiangyin Xinyi Copper Co Ltd
Priority to CN201610937341.0A priority Critical patent/CN108004495A/en
Publication of CN108004495A publication Critical patent/CN108004495A/en
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
    • C23C2/36—Elongated material
    • C23C2/38—Wires; Tubes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Coating With Molten Metal (AREA)

Abstract

The invention discloses a kind of flat type copper wire preparation for processing, comprise the following steps：Step 1：The anaerobic circular copper wire of surface cleaning is selected, the quality of copper is the 99.9% of anaerobic circular copper wire gross mass in copper wire；Step 2：Anaerobic circular copper wire is carried out a drawing and operated by heating wire-drawing equipment and wire-drawing die；Step 3：Cleaning agent for copper and scaling powder are added in rinse bath, rinse bath temperature after heating is maintained at 120 200 degrees Celsius, the molding copper wire of step 2 is put into rinse bath and carries out hot dip operation；Step 4：Leypewter ingot is selected, wherein, lead content is 10.5wt.%~13.8wt.%, tin surplus；Step 5：Selection leypewter ingot is put into heating tank, heating tank is heated, heating-up temperature is 350 450 degrees Celsius, and keeps temperature after the heating.Method disclosed by the invention, by the immersion plating of leypewter and the cleaning process separate operation on copper surface.

Description

A kind of flat type copper wire preparation for processing
Technical field
The present invention relates to a kind of flat type copper wire preparation for processing, belong to metal processing sectors.
Background technology
As machinery, electronic equipment constantly develop to miniaturization, micromation direction, there is excellent performance and electric current to hold Loading capability, the flat type copper wire that transmission speed is fast, thermal diffusivity is good, cheap are gradually widely used.It is solely tin plating on copper wire Preparing tinned wird, when processing, easily forms signal bronze, and uniformity is difficult to control, and thickness of coating and solderability are difficult to ensure that, Tin palpus defect easily occurs during long service, can not meet the requirement of highly reliable hydrid integrated circuit or electronic component. Application Number (patent) is that the Chinese invention patent of CN201510932230.6 discloses a kind of plating tin-lead flat type copper wire and its preparation side Method, can prevent the defects of copper wire easily forms signal bronze during processing.But this method in process closes tin-lead The immersion processes and the surface clean of copper, the addition of scaling powder of gold are carried out at the same time, and such mode is difficult to control on process time System, then copper surface is cleaned agent oxidation seriously to immersion processes overlong time, have impact on the effect of the immersion plating of leypewter, immersion plating The journey time is too short, and the surface clean of copper wire is ineffective, can also influence the effect of the immersion plating of leypewter.
Utility model content
For in the prior art in process by the surface clean of the immersion processes of leypewter and copper, scaling powder Addition is carried out at the same time, and such mode is difficult to control on process time, and immersion processes overlong time is then cleaned agent in copper surface Oxidation is serious, have impact on the effect of the immersion plating of leypewter, and the immersion processes time is too short, and the surface clean of copper wire is ineffective, Also the deficiency of the effect of the immersion plating of leypewter can be influenced, there is provided a kind of flat type copper wire preparation for processing.
The present invention adopts the technical scheme that a kind of flat type copper wire preparation for processing, comprises the following steps：
Step 1：The anaerobic circular copper wire of surface cleaning is selected, the quality of copper is the 99.9% of anaerobic circular copper wire gross mass in copper wire；
Step 2：Anaerobic circular copper wire is carried out a drawing and operated by heating wire-drawing equipment and wire-drawing die；
Step 3：Cleaning agent for copper and scaling powder are added in rinse bath, it is Celsius that rinse bath temperature after heating is maintained at 120-200 Degree, the molding copper wire of step 2 is put into rinse bath and carries out hot dip operation；
Step 4：Leypewter ingot is selected, wherein, lead content is 10.5wt.%~13.8wt.%, tin surplus；
Step 5：Selection leypewter ingot is put into heating tank, heating tank is heated, heating-up temperature is Celsius for 350-450 Degree, and temperature is kept after the heating；
Step 6：Copper wire of the step 3 after processed is passed through into heating tank with constant speed；
In the above process, by the cleaning process separate operation on the immersion plating of leypewter and copper surface, for different copper contents Copper wire can determine surface clean time and the immersion plating time of leypewter respectively, and can distinguish control surface cleaning The temperature of the immersion plating of temperature and leypewter, can so ensure the cleaning performance of copper line surface and the immersion plating effect of leypewter Fruit, and then improve the quality of copper wire finished product.
Step 7：After copper wire cooling after step 6 is processed, secondary drawing is carried out by heating wire-drawing equipment and wire-drawing die Pull out operation；
Step 8：Copper line surface after succeeding stretch carries out wrapped operation using fiber band；
Step 9：Copper wire after the completion of step 8 is carried out using rubber to extrude operation.
Optimization, above-mentioned flat type copper wire preparation for processing, in the step 6, copper wire by the speed of heating tank for 15 meters/ Minute.
Because by the cleaning process separate operation on the immersion plating of leypewter and copper surface, therefore it is not required in step 6 to copper wire table Face is cleaned, and copper wire can be increased by the speed of heating tank relative to the prior art by speed.
Optimization, above-mentioned flat type copper wire preparation for processing, the scaling powder is liquid reactive rosin flux.
Optimize, above-mentioned flat type copper wire preparation for processing, the hot dipping time in the step 3 is 20-35 minutes.
Optimization, above-mentioned flat type copper wire preparation for processing, the lead content of the leypewter ingot is 12.3wt.%, more than tin Amount.
Optimize, above-mentioned flat type copper wire preparation for processing, heating-up temperature is 380 degrees Celsius of in the step 5
Optimize, above-mentioned flat type copper wire preparation for processing, the appearance and size of the copper wire in the step 2 after drawing operation is 1.15 times of the appearance and size of copper wire in step 8 after redraing operation.
Optimize, above-mentioned flat type copper wire preparation for processing, the fiber band in the step 9 is alkali-free glass fibre band.
Optimization, above-mentioned flat type copper wire preparation for processing, the described molding copper wire of step 2 is put into rinse bath carries out heat Before leaching operation, the copper line surface after being processed using wire brush to step 2 carries out feather plucking operation.
Copper line surface smoothness through over cleaning is high, scaling powder attachment it is difficult and be easy to cause copper line surface scaling powder without Method is adhered to, and have impact on the uniformity of follow-up leypewter immersion plating.Copper line surface roughness after feather plucking operation is high, is easier to adhere to Scaling powder, prevents the situation of copper line surface immersion plating inequality caused by scaling powder can not adhere to or adhere to inequality from occurring.
The advantage of the invention is that it can overcome the drawbacks of prior art, novelty reasonable in design.By leypewter The cleaning process separate operation on immersion plating and copper surface, when can determine surface clean respectively for the copper wire of different copper contents Between and leypewter the immersion plating time, and can distinguish control surface cleaning temperature and leypewter immersion plating temperature, It can so ensure the cleaning performance of copper line surface and the immersion plating effect of leypewter, and then improve the quality of copper wire finished product.
Embodiment
Embodiment 1
The present invention is a kind of flat type copper wire preparation for processing, is comprised the following steps：
Step 1：The anaerobic circular copper wire of surface cleaning is selected, the quality of copper is the 99.9% of anaerobic circular copper wire gross mass in copper wire；
Step 2：Anaerobic circular copper wire is carried out a drawing and operated by heating wire-drawing equipment and wire-drawing die；
Step 3：Cleaning agent for copper and scaling powder are added in rinse bath, rinse bath temperature after heating is maintained at 120 degrees Celsius, will The molding copper wire of step 2, which is put into rinse bath, carries out hot dip operation, and the hot dipping time is 28 minutes；
Step 4：Leypewter ingot is selected, wherein, lead content 10.5wt.%, tin surplus；
Step 5：Selection leypewter ingot is put into heating tank, heating tank is heated, heating-up temperature is 350 degrees Celsius, And temperature is kept after the heating；
Step 6：Copper wire of the step 3 after processed is passed through into heating tank with constant speed, copper wire is 15 by the speed of heating tank M/min；
Step 7：After copper wire cooling after step 6 is processed, redraing behaviour is carried out by heating wire-drawing equipment and wire-drawing die Make；
Step 8：Copper line surface after succeeding stretch carries out wrapped operation using fiber band；
Step 9：Copper wire after the completion of step 8 is carried out using rubber to extrude operation.
The scaling powder is liquid reactive rosin flux.The shape of copper wire in the step 2 after drawing operation Size is 1.15 times of the appearance and size of the copper wire after redraing operation in step 8.Fiber band in the step 9 is alkali-free Glass fiber tape.It is described that the molding copper wire of step 2 is put into rinse bath before progress hot dip operation, using wire brush to step Copper line surface after 2 processing carries out feather plucking operation.
Embodiment 2
This embodiment and embodiment 1 difference lies in：
Cleaning agent for copper and scaling powder are added in step 3 in rinse bath, rinse bath temperature after heating is maintained at 200 degrees Celsius, The molding copper wire of step 2 is put into rinse bath and carries out hot dip operation；Leypewter ingot is selected in step 4, wherein, lead content is 13.8wt.%, tin surplus；Selection leypewter ingot is put into heating tank in step 5, heating tank is heated, heating temperature Spend for 450 degrees Celsius, and keep temperature after the heating；The hot dipping time in step 3 is 20 minutes.The lead content of leypewter ingot For 12.3wt.%, tin surplus.
Embodiment 3
This embodiment and embodiment 1 and embodiment 2 difference lies in：
Cleaning agent for copper and scaling powder are added in step 3 in rinse bath, rinse bath temperature after heating is maintained at 180 degrees Celsius, The molding copper wire of step 2 is put into rinse bath and carries out hot dip operation；Leypewter ingot is selected in step 4, wherein, lead content is 12.3wt.%, tin surplus；Selection leypewter ingot is put into heating tank in step 5, heating tank is heated, heating temperature Spend for 380 degrees Celsius, and keep temperature after the heating；The hot dipping time in the step 3 is 35 minutes.
Certainly, it is limitation of the present invention that described above, which is not, and the present invention is also not limited to the example above, the art Those of ordinary skill, in the essential scope of the present invention, the variations, modifications, additions or substitutions made, should all belong to the present invention Protection domain.

Claims (9)

  1. A kind of 1. flat type copper wire preparation for processing, it is characterised in that：Comprise the following steps：
    Step 1：The anaerobic circular copper wire of surface cleaning is selected, the quality of copper is the 99.9% of anaerobic circular copper wire gross mass in copper wire；
    Step 2：Anaerobic circular copper wire is carried out a drawing and operated by heating wire-drawing equipment and wire-drawing die；
    Step 3：Cleaning agent for copper and scaling powder are added in rinse bath, it is Celsius that rinse bath temperature after heating is maintained at 120-200 Degree, the molding copper wire of step 2 is put into rinse bath and carries out hot dip operation；
    Step 4：Leypewter ingot is selected, wherein, lead content is 10.5wt.%~13.8wt.%, tin surplus；
    Step 5：Selection leypewter ingot is put into heating tank, heating tank is heated, heating-up temperature is Celsius for 350-450 Degree, and temperature is kept after the heating；
    Step 6：Copper wire of the step 3 after processed is passed through into heating tank with constant speed；
    Step 7：After copper wire cooling after step 6 is processed, redraing behaviour is carried out by heating wire-drawing equipment and wire-drawing die Make；
    Step 8：Copper line surface after succeeding stretch carries out wrapped operation using fiber band；
    Step 9：Copper wire after the completion of step 8 is carried out using rubber to extrude operation.
  2. 2. flat type copper wire preparation for processing according to claim 1, it is characterised in that：In the step 6, copper wire is by adding The speed of heat channel is 15 ms/min.
  3. 3. flat type copper wire preparation for processing according to claim 1, it is characterised in that：The scaling powder is liquid reactive pine Fragrant scaling powder.
  4. 4. flat type copper wire preparation for processing according to claim 1, it is characterised in that：The hot dipping time in the step 3 For 20-35 minutes.
  5. 5. flat type copper wire preparation for processing according to claim 1, it is characterised in that：The lead content of the leypewter ingot For 12.3wt.%, tin surplus.
  6. 6. flat type copper wire preparation for processing according to claim 1, it is characterised in that：Heating-up temperature is in the step 5 380 degrees Celsius of
    Flat type copper wire preparation for processing according to claim 1, it is characterised in that：A drawing operates in the step 2 The appearance and size of copper wire afterwards is 1.15 times of the appearance and size of the copper wire after redraing operation in step 8.
  7. 7. flat type copper wire preparation for processing according to claim 1, it is characterised in that：Fiber band in the step 9 is Alkali-free glass fibre band.
  8. 8. flat type copper wire preparation for processing according to claim 1, it is characterised in that：It is described by the molding copper wire of step 2 It is put into before carrying out hot dip operation in rinse bath, the copper line surface after being processed using wire brush to step 2 carries out feather plucking operation.
  9. 9. flat type copper wire preparation for processing according to claim 1, it is characterised in that：It is described by the molding copper wire of step 2 It is put into before carrying out hot dip operation in rinse bath, the copper line surface after being processed using wire brush to step 2 carries out feather plucking operation.
CN201610937341.0A 2016-11-01 2016-11-01 A kind of flat type copper wire preparation for processing Pending CN108004495A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110983225A (en) * 2019-12-23 2020-04-10 南京工程学院 Plating assistant agent for hot dip galvanizing of steel member and hot dip galvanizing process adopting plating assistant agent

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103950244A (en) * 2014-05-21 2014-07-30 安徽天正电子有限公司 Tin-indium alloy coated copper wire and production method thereof
CN105390176A (en) * 2015-12-15 2016-03-09 北京有色金属与稀土应用研究所 Tin-lead plating flat copper wire and preparation method thereof
CN105448426A (en) * 2015-11-18 2016-03-30 芜湖楚江合金铜材有限公司 Tinned copper wire production technology process

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103950244A (en) * 2014-05-21 2014-07-30 安徽天正电子有限公司 Tin-indium alloy coated copper wire and production method thereof
CN105448426A (en) * 2015-11-18 2016-03-30 芜湖楚江合金铜材有限公司 Tinned copper wire production technology process
CN105390176A (en) * 2015-12-15 2016-03-09 北京有色金属与稀土应用研究所 Tin-lead plating flat copper wire and preparation method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110983225A (en) * 2019-12-23 2020-04-10 南京工程学院 Plating assistant agent for hot dip galvanizing of steel member and hot dip galvanizing process adopting plating assistant agent

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Application publication date: 20180508

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