CN111286688B - Production process of tinned copper wire - Google Patents
Production process of tinned copper wire Download PDFInfo
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- CN111286688B CN111286688B CN202010255916.7A CN202010255916A CN111286688B CN 111286688 B CN111286688 B CN 111286688B CN 202010255916 A CN202010255916 A CN 202010255916A CN 111286688 B CN111286688 B CN 111286688B
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- copper wire
- tin
- hot tinning
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 267
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 50
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 166
- 238000001816 cooling Methods 0.000 claims abstract description 71
- 238000000034 method Methods 0.000 claims abstract description 44
- 230000008569 process Effects 0.000 claims abstract description 24
- 230000004913 activation Effects 0.000 claims abstract description 20
- 238000002844 melting Methods 0.000 claims abstract description 12
- 230000008018 melting Effects 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims description 55
- 239000010949 copper Substances 0.000 claims description 55
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 150000002739 metals Chemical class 0.000 claims description 15
- 230000004907 flux Effects 0.000 claims description 11
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 10
- 229910052797 bismuth Inorganic materials 0.000 claims description 10
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 10
- 229910052698 phosphorus Inorganic materials 0.000 claims description 10
- 239000011574 phosphorus Substances 0.000 claims description 10
- 229910052738 indium Inorganic materials 0.000 claims description 9
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000007747 plating Methods 0.000 abstract description 29
- 150000003839 salts Chemical class 0.000 abstract description 6
- 239000007921 spray Substances 0.000 abstract description 6
- 238000002360 preparation method Methods 0.000 abstract description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- 239000011224 oxide ceramic Substances 0.000 description 13
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 13
- 239000000243 solution Substances 0.000 description 13
- 229910001928 zirconium oxide Inorganic materials 0.000 description 13
- 238000005476 soldering Methods 0.000 description 9
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 7
- 239000011592 zinc chloride Substances 0.000 description 7
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 238000000137 annealing Methods 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000001053 micromoulding Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/06—Metallic material
- C23C4/08—Metallic material containing only metal elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/02—Pretreatment of the material to be coated, e.g. for coating on selected surface areas
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/26—After-treatment
- C23C2/28—Thermal after-treatment, e.g. treatment in oil bath
- C23C2/29—Cooling or quenching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/38—Wires; Tubes
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/123—Spraying molten metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/14—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying for coating elongate material
- C23C4/16—Wires; Tubes
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/18—After-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/32—Wires
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
Abstract
The invention belongs to the technical field of tinning preparation, and particularly relates to a production process of a tinned copper wire. The production process comprises the steps of sequentially carrying out activation treatment, primary hot tinning treatment, primary cooling, secondary hot tinning treatment and secondary cooling on a copper wire to obtain a tinned copper wire; the temperature of the primary hot tinning treatment is higher than that of the secondary hot tinning treatment; wherein the temperature of the primary hot tinning treatment is at least 38 ℃ higher than the melting point of tin; the temperature of the secondary hot tinning treatment is at least 8 ℃ higher than the melting point of tin. The twice tin plating process adopted in the production process of the tin-plated copper wire is that a layer of tin is hot-plated on the surface of one layer of tin plating layer again, the twice tin plating layers are tightly combined, the requirement of smooth and flat surface of the super-thick tin layer can be realized, the tin layer on the copper wire is fully ensured to have better uniformity, the problems of tin leakage and thin tin can not be caused, and the copper wire has better heat resistance and salt spray resistance.
Description
Technical Field
The invention belongs to the technical field of tinning preparation, and particularly relates to a production process of a tinned copper wire.
Background
The tinning on the surface of the copper wire can greatly improve the corrosion resistance and oxidation resistance of the copper wire, and the copper conductor has brazing performance, is a basic material in the electronic industry, and is suitable for producing leads of electronic components and jumper wires of circuit boards of the whole machine. With the continuous development of electronic component equipment towards miniaturization, micro-molding and high integration, the electronic packaging technology is developed towards automation and high efficiency, and the performance requirements on products such as tinned copper wires are higher and higher.
The tinned round copper wire is generally produced by a hot-dip method, namely a bare copper wire continuously and quickly passes through a molten tin bath, liquid tin is attached to the surface of the copper wire and then is cooled and solidified in the air, so that continuous plating is completed, the process of carrying out hot-dip tinning on the copper wire is essentially a wetting and diffusing process, and meanwhile, the process of flowing and crystallizing tin liquor to be solidified on the surface when the copper wire leaves the tin bath is also carried out, so that the performance of a product is greatly influenced by a copper wire matrix, a tin melt and a hot-dip method production process. On the one hand, the surface of the copper wire often has the phenomena of oil stain, water stain, oxidation and the like, so that the local part of the surface of the copper wire is not plated with tin or the plated thickness and density are insufficient, although the surface of the copper wire can be subjected to surface activation treatment before hot dipping, the quality defect existing on the surface of the copper wire can be not completely eliminated, the problems of 'thin plating' and 'missing plating' of the copper wire occur, and the tin layer does not protect a bare copper matrix. On the other hand, copper wires are subjected to hot-dip in tin liquor, copper atoms diffuse into the tin liquor, and along with the extension of production time, the concentration of the copper atoms in a tin bath is remarkably improved after a period of time, so that the melting point of the tin liquor is improved, the viscosity is increased, the wettability between the tin liquor and the copper wires is reduced, and the problems of 'thin plating' and 'missing plating' of the copper wires can also occur. However, the problems of "thin plating" and "skip plating" of the copper wire can reduce the heat resistance and salt spray resistance of the tin-plated copper wire, so that the copper wire cannot meet the use requirements of electronic components.
In addition, the specification of the tin-plated round lead used for the electronic component is often large, the plating layer is required to have a certain thickness, and the uniformity of the copper wire with a thick tin layer is difficult to ensure by the existing hot-dip plating process. In order to solve the above problems, attempts have been made to improve the tin plating layer of a tin-plated round copper wire by changing the tin layer composition, changing the flux composition, raising the hot-dip tin plating temperature, etc., but the above-mentioned fundamental reasons cannot be sufficiently solved, and thus the effects are still small.
Disclosure of Invention
Therefore, the invention aims to overcome the defects of the prior art that the heat resistance and the salt spray resistance of the copper wire are reduced and the thickness of a tin layer is not uniform due to 'thin plating' and 'tin leakage' on the surface of the tinned copper wire, and the like, thereby providing a production process of the tinned copper wire.
Therefore, the invention provides the following technical scheme.
The invention provides a production process of a tinned copper wire, which comprises the following steps,
the copper wire is subjected to activation treatment, primary hot tinning treatment, primary cooling, secondary hot tinning treatment and secondary cooling in sequence to obtain a tinned copper wire;
the temperature of the primary hot tinning treatment is higher than that of the secondary hot tinning treatment; wherein the temperature of the primary hot tinning treatment is at least 38 ℃ higher than the melting point of tin; the temperature of the secondary hot tinning treatment is at least 8 ℃ higher than the melting point of tin.
The temperature of the primary hot tinning treatment is 270-320 ℃; the temperature of the secondary hot tinning treatment is 240-245 ℃.
The content of rare metals in the tin melt of the secondary hot tin plating treatment is not more than 0.1wt%, and for example, may be 0.05 wt% to 0.1wt%, and preferably may be 0.05 wt% to 0.08 wt%;
preferably, the rare metal is at least one of indium, bismuth, and nickel.
The copper content in the tin solution in the primary hot tinning treatment is not more than 0.7 wt%;
the copper content in the tin solution in the secondary hot tinning treatment is not more than 2.0 wt%.
The second cooling method is an air cooling method;
preferably, the wind speed in the air cooling method is 10-15m/s, and the wind direction is vertical to the copper wire.
Further, in the production process, the conveying speed of the copper wire is 150-.
When the diameter of the copper wire is larger than 0.8mm, the transmission speed of the copper wire is 150-200 m/min;
when the diameter of the copper wire is less than 0.1mm, the transmission speed of the copper wire is 300-400 m/min;
when the diameter of the copper wire is 0.1-0.8mm, the transmission speed of the copper wire is 200-300 m/min.
Furthermore, the copper wire is activated by using the soldering flux in the production process.
The length of the copper wire in the first cooling step is 1-1.5 m.
The phosphorus content in the tin melt of the primary hot tinning treatment is 0.01-0.1 wt%.
The first cooling is an air cooling method, namely, the copper wire is exposed between the primary hot tinning furnace and the secondary hot tinning furnace, and the copper wire is cooled at room temperature. The method can ensure that the copper wire has certain temperature when entering the secondary hot tin plating furnace and cannot be cooled to too low temperature.
The primary hot tinning furnace is not provided with an eye die; the secondary hot tinning furnace is provided with an eye die at the position where the copper wire leaves the molten tin; when the copper wire leaves the secondary hot tin plating furnace, fresh tin on the surface of the copper wire covers the rarely existing partial plating leakage points, so that the tin layer forms a compact layer.
The soldering flux is weak acid or neutral soldering flux.
The technical scheme of the invention has the following advantages:
1. the production process of the tinned copper wire comprises the steps of sequentially carrying out activation treatment, primary hot tinning treatment, primary cooling, secondary hot tinning treatment and secondary cooling on a copper wire to obtain the tinned copper wire; the temperature of the primary hot tinning treatment is higher than that of the secondary hot tinning treatment; wherein the temperature of the primary hot tinning treatment is at least 38 ℃ higher than the melting point of tin; the temperature of the secondary hot tinning treatment is at least 8 ℃ higher than the melting point of tin. The temperature of the primary hot tinning treatment in the production process is higher than that of the secondary hot tinning treatment and is at least 38 ℃ higher than the melting point of tin, the liquidity of tin melt in the primary hot tinning treatment is good, the wettability between the tin melt and a copper wire matrix is good, the phenomenon of tin leakage is reduced, the secondary hot tinning treatment is carried out on the basis of the primary hot tinning treatment, the temperature of the secondary hot tinning treatment is lower than that of the primary hot tinning treatment and is at least 8 ℃ higher than the melting point of tin, so that the secondary tin melt is more easily coated on a copper wire, the tin leakage generated in the primary hot tinning treatment completes filling in the secondary hot tinning treatment, the phenomenon of tin leakage of the copper wire is avoided, the temperature of the secondary hot tinning treatment is lower than that of the primary hot tinning treatment, the tinned copper wire is not easily oxidized, and the surface of the copper wire is brighter; the tin plating process is adopted twice in the production process of the tin-plated copper wire, namely, a layer of tin is hot-plated on the surface of a layer of tin plating layer again, the two tin plating layers are tightly combined, the requirement of smooth and flat surface of the surface of an ultra-thick tin layer can be realized, the tin layer on the copper wire is fully ensured to have better uniformity, the problems of tin leakage and thin tin are avoided, and the copper wire has better heat resistance and salt spray resistance; meanwhile, the temperature of the secondary hot tinning treatment is controlled to be lower than that of the primary hot tinning treatment, so that the problem of excessive remelting of the existing tin layer of the copper wire in the secondary hot tinning treatment can be solved.
2. According to the production process of the tinned copper wire, the temperature of the tin melt subjected to one-time hot tinning treatment in the production process is 270-320 ℃ and is higher than the melting point of tin of 231.89 ℃, so that the tin melt can be fully ensured to have better fluidity, the problem of overhigh viscosity of the tin melt is avoided, the copper wire can be better wetted after being immersed into the tin melt, and the integrity and uniformity of a coating are ensured. The temperature of the tin melt after the secondary hot tinning treatment is 240-245 ℃, the problem that the tin plated on the copper wire is excessive and is melted again can be avoided, the fluidity of the tin melt after the secondary tinning is met, the energy consumption is reduced, the temperature of the copper wire after the secondary tinning is not too high, and the problem that the surface of the copper wire is yellow due to oxidation is avoided.
In the copper wire tinning process, along with the increase of the temperature of a tin melt, copper atoms are diffused into the tin melt in the tinning process, the viscosity of the tin melt is increased, the wettability of the tin melt and a copper wire is reduced, if the wettability of the tin melt and a copper wire matrix is further improved, the problem can be solved only by further increasing the temperature of the tin melt, but when the temperature of the tin melt exceeds 320 ℃, a tin layer on the copper wire is crystallized, the quality of the tinned copper wire cannot be ensured, and another solution is to replace the tin melt, but the method cannot effectively utilize tin resources; the temperature of the tin melt subjected to one-time hot tinning treatment in the production process is 270-320 ℃, so that the tin melt can still be used after the concentration of copper in the tin melt reaches 2 wt%, which is far higher than the highest concentration of copper in the tin melt in the prior art by 1wt%, and the problem that the tin melt needs to be replaced after the concentration of copper in the tin melt exceeds 1wt% in the prior art is solved; the tin melt solution of the secondary hot tinning treatment is 240-245 ℃, so that the tin melt solution can still be used after the concentration of copper in the tin melt solution reaches 0.7wt%, and when the concentration of copper in the tin melt solution is further increased, the tin melt solution of the secondary hot tinning process can be used in the primary hot tinning process, so that the service life and the utilization rate of the tin melt solution are improved. Moreover, through the process of twice tin plating, when the second tin plating is carried out, because the surface of the copper wire is plated with the tin layer and the temperature of the second tin plating treatment is lower than that of the first tin plating treatment, the phenomenon that copper atoms are diffused to tin melt is greatly weakened, and the service life of the tin melt in the second tin plating treatment is prolonged.
3. According to the production process of the tinned copper wire, rare metal is added into the tin melt after the secondary hot tinning treatment, so that the fluidity of the tin melt, the wettability with a copper wire base material and the oxidation resistance of a tin layer on the copper wire can be improved; the indium and bismuth in rare metals can improve the fluidity and wettability of tin melt, and the nickel can improve the oxidation resistance of tin layer
4. According to the production process of the tinned copper wire, the tinning method is adopted twice, so that the conveying speed of the copper wire and the production speed of the whole process can be increased, and compared with the prior art, the production speed of the production process is increased by 30-50%; meanwhile, after the production speed is increased, the contact time of the copper wire and the tin melt can be shortened, the diffusion of copper atoms to the tin melt is reduced, and the service life of the tin melt is prolonged.
The control fan is arranged in parallel to the direction of the copper wires, the wind direction is perpendicular to the copper wires, the uniform cooling of each section of copper wires in the second cooling process can be ensured, and the method is easy to control.
By controlling the distance between the fan and the eye mold, when the copper wire comes out of the eye mold, the copper wire can be cooled in the distance to solidify the tin layer, so that the problem that the tin layer is not uniform due to the influence of wind is avoided; if the distance between the fan and the eye model is too long, the time that the tin layer is at high temperature is prolonged, and the risk that the tin layer is oxidized is increased.
0.01-0.1wt% of phosphorus element is added into the tin melt in the primary hot tinning treatment, so that the oxidation of the tin melt can be reduced, the wettability of a copper wire and the tin melt is further improved, and the copper wire between two hot tinning processes is prevented from being oxidized.
5. According to the production process of the tinned copper wire, the tin layer on the copper wire with an excessively long distance can be prevented from being oxidized by controlling the length of the copper wire in the first cooling process, because the temperature of the primary hot tinning process is 240-245 ℃, the temperature of the copper wire cannot be reduced too low after the excessive distance is exceeded, and the temperature of the tin melt in the secondary hot tinning process cannot be reduced too fast when the secondary hot tinning process is carried out, so that the temperature balance of a secondary tinning furnace is maintained.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a flow chart of a process for producing a tinned copper wire in example 1 of the present invention;
reference numerals:
1-a copper wire; 2-one-time hot tinning furnace; 3-secondary hot tinning furnace; 4-eye mold; 5-a fan; 6-a surface activation device; 7-a zirconia ceramic guide wheel;
2-1-hot tinning molten liquid for one time; 3-1-hot tinning melt twice.
Detailed Description
The following examples are provided to further understand the present invention, not to limit the scope of the present invention, but to provide the best mode, not to limit the content and the protection scope of the present invention, and any product similar or similar to the present invention, which is obtained by combining the present invention with other prior art features, falls within the protection scope of the present invention.
The examples do not show the specific experimental steps or conditions, and can be performed according to the conventional experimental steps described in the literature in the field. The reagents or instruments used are not indicated by manufacturers, and are all conventional reagent products which can be obtained commercially.
Example 1
The embodiment provides a production process of a tinned copper wire, the process is shown in figure 1, and comprises the following steps,
selecting a bare copper wire 1 with a diameter of 1.18mm in an annealed state, conveying the bare copper wire in a direction indicated in FIG. 1 at a speed of 180m/min, starting tinning, and making the copper wire enter a surface activation device 6 to be ZnCl2The water solution is used as a soldering flux (purchased from Shenzhen Mingxin scientific and technological Limited) to carry out activation treatment on the surface of a copper wire, then the copper wire enters a primary hot tinning furnace 2 to carry out primary hot tinning treatment, a zirconium oxide ceramic guide wheel 7 is used for conveying the copper wire in the primary hot tinning furnace, an eye mould is not arranged in the primary hot tinning furnace, the temperature of a tin melt 2-1 is 320 ℃, the content of phosphorus is 0.1wt%, then the copper wire penetrates out of the tin melt of the primary hot tinning furnace to carry out primary cooling, the primary cooling is taken out of the furnace for air cooling, the length of the copper wire in the primary cooling step is 1.5m (calculated by the length of the copper wire), then the copper wire enters a tin melt 3-1 of a secondary hot tinning furnace 3 to carry out secondary hot tinning treatment, the temperature of the tin melt in the secondary hot tinning furnace is 245 ℃, the copper wire contains 0.08 wt% of rare metals (the rare metals are indium, bismuth and nickel in a mass ratio of 1:1: 1: 1), the zirconium oxide ceramic guide wheel 7 is used for conveying the copper wire in the secondary hot tinning furnace, the copper line leaves tin melt department and still is provided with eye mould 4, the eye mould still is equipped with the round hole that the diameter is 1.2mm in it, the copper line is worn out from the round hole, leave the hot tin stove of secondary, carry out the second cooling, the method of second cooling is air-cooled method, walk the fan 5 of line direction through setting up a plurality of being on a parallel with copper line, make the air outlet perpendicular to copper line of fan, and then the direction perpendicular to copper line of wind, the wind speed is 15 ms, the length of the copper line that is blown to is 1.2m (the length of copper line in the second cooling), and the fan and the eye mould of air-out at firstIs 0.5m (based on the length of the copper wire), and finally, a wire is taken up to obtain the tinned copper wire with the diameter of 1.2 mm.
In this embodiment, 12 zirconia ceramic guide wheels, 12 eye molds and 12 wire collecting devices are arranged in the secondary hot tinning furnace in the primary hot tinning furnace, so that 12 production lines can be simultaneously carried out.
Example 2
The embodiment provides a production process of a tinned copper wire, which comprises the following steps,
selecting bare copper wire with diameter of 0.49mm in annealing state, conveying at 260m/min in the direction indicated in FIG. 1, starting tinning, and allowing the copper wire to enter surface activation device to form ZnCl2The method comprises the steps of using an aqueous solution as a soldering flux to carry out activation treatment on the surface of a copper wire, then enabling the copper wire to enter a primary hot tinning furnace to carry out primary hot tinning treatment, enabling the copper wire to be a zirconium oxide ceramic guide wheel in the primary hot tinning furnace, enabling the copper wire not to be provided with an eye die in the primary hot tinning furnace, enabling the molten tin to be at 280 ℃ and 0.08 wt% of phosphorus to pass through the molten tin in the primary hot tinning furnace, carrying out primary cooling, enabling the first cooling to be furnace-out air cooling, enabling the copper wire in the primary cooling step to be 1.5m in length (based on the length of the copper wire), enabling the copper wire to enter the molten tin in a secondary hot tinning furnace to carry out secondary hot tinning treatment, enabling the molten tin in the secondary hot tinning furnace to be at 242 ℃ and containing 0.08 wt% of rare metals (the rare metals are indium, bismuth and nickel in a mass ratio of 1:1: 2), enabling the copper wire to be a zirconium oxide ceramic guide wheel in the secondary hot tinning furnace, and enabling the copper wire to be further provided with an eye die at a position away from the molten tin, still be equipped with the diameter in the eye mould and be 0.5 mm's round hole, the copper line is worn out from the round hole, leave the hot tinning furnace of secondary, carry out the second cooling, the method of second cooling is air-cooled, through setting up a plurality of fans that are on a parallel with the copper line and walk the line direction, make the air outlet perpendicular to copper line of fan, and then the direction perpendicular to copper line of wind, the wind speed is 15 ms, the length of the copper line that is blown by wind is 1m (the length of copper line in the second cooling), and the fan of the first air-out is 0.5m (with the length of copper line) with the distance of eye mould, receive the line at last, obtain the diameter and be 0.5 mm's tinned wire.
The present embodiment can realize 16 production lines at the same time.
Example 3
The embodiment provides a production process of a tinned copper wire, which comprises the following steps,
selecting bare copper wire with diameter of 0.074mm in annealing state, conveying at 350m/min in the direction indicated in FIG. 1, starting tinning, and allowing the copper wire to enter surface activation device to form ZnCl2The method comprises the steps of using an aqueous solution as a soldering flux to carry out activation treatment on the surface of a copper wire, then enabling the copper wire to enter a primary hot tinning furnace to carry out primary hot tinning treatment, enabling a zirconium oxide ceramic guide wheel to convey the copper wire in the primary hot tinning furnace, enabling a tin melt in the primary hot tinning furnace to be free from an eye die, enabling the tin melt to be at 270 ℃ and the phosphorus content to be 0.1wt%, enabling the copper wire to penetrate out of the tin melt in the primary hot tinning furnace to carry out primary cooling, enabling the primary cooling to be discharged from the furnace for air cooling, enabling the copper wire in the primary cooling step to be 1.2m in length (based on the length of the copper wire), enabling the copper wire to enter a tin melt in a secondary hot tinning furnace to carry out secondary hot tinning treatment, enabling the tin melt in the secondary hot tinning furnace to be at 240 ℃ and contain 0.05 wt% of rare metals (the rare metals are indium, bismuth and nickel in a mass ratio of 1:1: 2), enabling the copper wire to be the zirconium oxide ceramic guide wheel, and enabling the copper wire to leave the tin melt to be provided with the eye die, the round hole that the diameter was 0.08mm is still equipped with in the eye mould, the copper line is worn out from the round hole, leave the hot tinning stove of secondary, carry out the second cooling, the method of second cooling is air-cooled, through setting up a plurality of fans that are on a parallel with the copper line and walk the line direction, make the air outlet perpendicular to copper line of fan, and then the direction perpendicular to copper line of wind, the wind speed is 15m/s, the length of the copper line that is blown by wind is 0.85m (the length of copper line in the second cooling), and the fan of the first air-out is 0.5m (with the length of copper line) with the distance of eye mould, receive the line at last, obtain the tinned wire that the diameter is 0.08 mm.
The present embodiment can realize 24 production lines at the same time.
Example 4
The embodiment provides a production process of a tinned copper wire, which comprises the following steps,
the bare copper wire 1 having a diameter of 1.18mm in an annealed state was selected, transported at a speed of 180m/min in the direction indicated in FIG. 1, and tin plating was started, and the copper wire was tinnedFirstly enters a surface activation device 6 to be activated by ZnCl2The method comprises the steps of using an aqueous solution as a soldering flux to carry out activation treatment on the surface of a copper wire, then entering a primary hot tinning furnace 2 to carry out primary hot tinning treatment, enabling a zirconium oxide ceramic guide wheel 7 to convey the copper wire in the primary hot tinning furnace, not arranging an eye mould in the primary hot tinning furnace, enabling a tin melt 2-1 to be at 300 ℃, enabling the phosphorus content to be 0.1wt%, then enabling the copper wire to penetrate out of the tin melt in the primary hot tinning furnace to carry out primary cooling, taking out the copper wire from the furnace for air cooling, enabling the copper wire in the primary cooling step to be 1.5m in length (based on the length of the copper wire), then entering a tin melt 3-1 of a secondary hot tinning furnace 3 to carry out secondary hot tinning treatment, enabling the temperature of the tin melt in the secondary hot tinning furnace to be 270 ℃, containing 0.08 wt% of rare metals (the rare metals are indium, bismuth and nickel in a mass ratio of 1:1: 1), enabling the copper wire in the secondary hot tinning furnace to be the zirconium oxide ceramic guide wheel 7, the copper line leaves tin melt department and still is provided with eye mould 4, the eye mould still is equipped with the round hole that the diameter is 1.2mm in it, the copper line is worn out from the round hole, leave the hot tinning stove of secondary, carry out the second cooling, the method of second cooling is air-cooled method, walk the fan 5 of line direction through setting up a plurality of being on a parallel with copper line, make the air outlet perpendicular to copper line of fan, and then the direction perpendicular to copper line of wind, the wind speed is 15m/s, the length of the copper line that is blown by wind is 1.2m (the length of copper line in the second cooling), and the fan of the first air-out is 0.5m (with the length of copper line) with the distance of eye mould, receive the line at last, obtain the diameter and be 1.2 mm's tinned wire.
In this embodiment, 12 zirconia ceramic guide wheels, 12 eye molds and 12 wire collecting devices are arranged in the secondary hot tinning furnace in the primary hot tinning furnace, so that 12 production lines can be simultaneously carried out.
Example 5
The embodiment provides a production process of a tinned copper wire, which comprises the following steps,
selecting bare copper wire with diameter of 0.49mm in annealing state, conveying at 260m/min in the direction indicated in FIG. 1, starting tinning, and allowing the copper wire to enter surface activation device to form ZnCl2The water solution is used as the scaling powder to carry out the activation treatment on the surface of the copper wire, and then the copper wire enters a primary hot tinning furnace to carry out primary hot tinning treatmentThe copper wire is conveyed in the tinning furnace to be a zirconium oxide ceramic guide wheel, an eye die is not arranged in the primary hot tinning furnace, the temperature of a tin melt is 280 ℃, the content of phosphorus is 0.08 wt%, then the copper wire penetrates out of the tin melt of the primary hot tinning furnace to be subjected to primary cooling, the primary cooling is discharged from the furnace for air cooling, the length of the copper wire in the primary cooling step is 1.5m (calculated by the length of the copper wire), then the copper wire enters the tin melt of the secondary hot tinning furnace to be subjected to secondary hot tinning treatment, the temperature of the tin melt in the secondary hot tinning furnace is 242 ℃, the copper wire contains 0.08 wt% of rare metals (the rare metals are indium and bismuth with the mass ratio of 1: 1), the copper wire is conveyed in the secondary hot tinning furnace to be the zirconium oxide ceramic guide wheel, the eye die is also arranged at the position of the copper wire away from the tin melt, a round hole with the diameter of 0.5mm is further arranged in the eye die, the copper wire penetrates out of the round hole, the copper wire, leaves the secondary hot tinning furnace to be subjected to secondary cooling, the second cooling method is an air cooling method, and is characterized in that a plurality of fans parallel to the copper wire routing direction are arranged, so that the air outlet of each fan is perpendicular to the copper wire, the wind direction is perpendicular to the copper wire, the wind speed is 15m/s, the length of the copper wire blown by wind is 1m (the length of the copper wire in the second cooling), the distance between the fan which firstly blows out air and the eye mould is 0.5m (the length of the copper wire), and finally the wire is taken up, so that the tinned copper wire with the diameter of 0.5mm is obtained.
The present embodiment can realize 16 production lines at the same time.
Example 6
The embodiment provides a production process of a tinned copper wire, which comprises the following steps,
selecting bare copper wire with diameter of 0.49mm in annealing state, conveying at 260m/min in the direction indicated in FIG. 1, starting tinning, and allowing the copper wire to enter surface activation device to form ZnCl2The method comprises the following steps of using a water solution as a soldering flux to carry out activation treatment on the surface of a copper wire, then enabling the copper wire to enter a primary hot tinning furnace to carry out primary hot tinning treatment, enabling a copper wire to be conveyed in the primary hot tinning furnace to be a zirconia ceramic guide wheel, not arranging an eye die in the primary hot tinning furnace, enabling the temperature of a tin melt to be 280 ℃ and the content of phosphorus to be 0.08 wt%, enabling the copper wire to penetrate out of the tin melt of the primary hot tinning furnace to be subjected to primary cooling, enabling the primary cooling to be discharged from the furnace for air cooling, enabling the length of the copper wire in the primary cooling step to be 1.5m (calculated by the length of the copper wire), and then enabling the copper wire to pass through the furnace for primary coolingThe secondary hot tinning treatment is carried out in the tin melt entering the secondary hot tinning furnace, the temperature of the tin melt in the secondary hot tinning furnace is 242 ℃, the tin melt contains 0.05 wt% of rare metal (the rare metal is bismuth), a zirconium oxide ceramic guide wheel is used for conveying a copper wire in the secondary hot tinning furnace, an eye die is further arranged at the position of the copper wire, which is away from the tin melt, the eye die is also provided with a round hole with the diameter of 0.5mm, the copper wire penetrates out of the round hole and leaves the secondary hot tinning furnace for secondary cooling, the secondary cooling method is an air cooling method, a plurality of fans parallel to the routing direction of the copper wire are arranged, the air outlet of each fan is perpendicular to the copper wire, the direction of the air is perpendicular to the copper wire, the air speed is 12m/s, the length of the copper wire blown by the air is 1m (the length of the copper wire in the secondary cooling), and the distance between the fan which blows out air firstly and the eye die is 0.5m (based on the length of the copper wire), and finally, taking up the wire to obtain the tinned copper wire with the diameter of 0.5 mm.
The present embodiment can realize 16 production lines at the same time.
Comparative example 1
The comparative example provides a production process of a tinned copper wire, comprising the following steps,
selecting bare copper wire with diameter of 0.49mm in annealing state, conveying at 260m/min in the direction indicated in FIG. 1, starting tinning, and allowing the copper wire to enter surface activation device to form ZnCl2The method comprises the steps of using an aqueous solution as a soldering flux to carry out activation treatment on the surface of a copper wire, then entering a primary hot tinning furnace to carry out primary hot tinning treatment, wherein a zirconium oxide ceramic guide wheel is arranged in the primary hot tinning furnace for conveying the copper wire, an eye die is not arranged in the primary hot tinning furnace, the temperature of a tin melt is 280 ℃, the content of phosphorus is 0.08 wt%, then the copper wire penetrates out of the tin melt in the primary hot tinning furnace to carry out primary cooling, the primary cooling is discharged from the furnace for air cooling, the length of the copper wire in the primary cooling step is 1.5m (based on the length of the copper wire), then entering the tin melt in a secondary hot tinning furnace to carry out secondary hot tinning treatment, the temperature of the tin melt in the secondary hot tinning furnace is 280 ℃, the rare metals (the rare metals are indium, bismuth and nickel) are 0.08 wt%, the zirconium oxide ceramic guide wheel is arranged in the secondary hot tinning furnace for conveying the copper wire, the eye die is arranged at the position away from the tin melt, and the eye die is also provided with a round hole with the diameter of 0.5mm, copper wire slaveWear out in the round hole, leave the hot tinning stove of secondary, carry out the second cooling, the method of second cooling is the air-cooled method, through setting up a plurality of fans that are on a parallel with the copper line and walk the line direction, make the air outlet perpendicular to copper line of fan, and then the direction perpendicular to copper line of wind, the wind speed is 15m/s, the length of the copper line that is blown by wind is 1m (the length of copper line in the second cooling), and the fan of the first air-out is 0.5m (with the length of copper line) with the distance of eye mould, receive the line finally, obtain the diameter and be 0.5 mm's tinned wire.
Test examples
The test example provides the performance test method and results of the tinned copper wires prepared in examples 1-6 and comparative example 1;
the diameter, surface quality, heat resistance, salt spray resistance and tin layer thickness of the tinned copper wire are tested according to GBT 4910-; the test results are shown in table 1;
TABLE 1 results of performance test of tinned copper wires produced in examples 1 to 6 and comparative example 1
The tinned copper wire prepared by the production process provided by the invention has better heat resistance and salt spray resistance, the thickness of a tin layer on the copper wire is uniform, and the tin layer has the advantages of high surface and high precision; meanwhile, the copper wire production process is high in transmission speed, can be used for simultaneously carrying out a plurality of production lines, and is high in production efficiency which is far higher than that of other existing production methods with the same specification. In addition, the service life of the molten tin in the hot tinning treatment is long, the tin consumption is greatly reduced, and the utilization rate of tin is improved.
In addition, the thickness of the tin layer on the tin-plated copper wire prepared by the production process can reach 9 μm, and the defect that the tin layer with the thickness of more than 6 μm cannot be prepared in the existing hot-dip plating process is overcome.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the invention may be made without departing from the spirit or scope of the invention.
Claims (7)
1. A production process of a tinned copper wire is characterized by comprising the following steps of,
the copper wire is subjected to activation treatment, primary hot tinning treatment, primary cooling, secondary hot tinning treatment and secondary cooling in sequence to obtain a tinned copper wire;
the temperature of the primary hot tinning treatment is higher than that of the secondary hot tinning treatment; wherein the temperature of the primary hot tinning treatment is at least 38 ℃ higher than the melting point of tin; the temperature of the secondary hot tinning treatment is at least 8 ℃ higher than the melting point of tin;
the temperature of the primary hot tinning treatment is 270-320 ℃; the temperature of the secondary hot tinning treatment is 240-245 ℃;
the content of rare metals in the tin melt of the secondary hot tinning treatment is not more than 0.1 wt%;
the rare metal is at least one of indium and bismuth;
the phosphorus content in the tin melt of the primary hot tinning treatment is 0.01-0.1 wt%.
2. The production process according to claim 1, wherein the copper content in the tin melt in the primary hot tinning treatment is not more than 0.7 wt%;
the copper content in the tin solution in the secondary hot tinning treatment is not more than 2.0 wt%.
3. The production process according to claim 1 or 2, wherein the second cooling method is an air cooling method;
the wind speed in the wind cooling method is 10-15m/s, and the wind direction is vertical to the copper wire.
4. The production process as claimed in claim 1 or 2, wherein the conveying speed of the copper wire in the production process is 150-400 m/min.
5. The process according to claim 4, wherein when the diameter of the copper wire is greater than 0.8mm, the conveying speed of the copper wire is 150-200 m/min;
when the diameter of the copper wire is less than 0.1mm, the transmission speed of the copper wire is 300-400 m/min;
when the diameter of the copper wire is 0.1-0.8mm, the transmission speed of the copper wire is 200-300 m/min.
6. The process according to claim 1 or 2, wherein the copper wire is activated by a flux in the process.
7. The production process according to claim 1 or 2, wherein the length of the copper wire in the first cooling step is 1 to 1.5 m.
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