CN1510158A - Lead-free alloy tin-plating copper wire - Google Patents
Lead-free alloy tin-plating copper wire Download PDFInfo
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- CN1510158A CN1510158A CNA021579598A CN02157959A CN1510158A CN 1510158 A CN1510158 A CN 1510158A CN A021579598 A CNA021579598 A CN A021579598A CN 02157959 A CN02157959 A CN 02157959A CN 1510158 A CN1510158 A CN 1510158A
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Abstract
A lead-free alloy-Sn coated copper wire is prepared through proportionally mixing Sn as basic material with In, Bi and Cu, smelting to obtain lead-free alloy solder, and hot dipping of bare copper wire. Its advantages are high strength, weldability, and resistance to high temp and oxidizing, and low cost.
Description
One technical field
The invention belongs to electronic industry base mateiral field, particularly relate to a kind of lead-free alloy tinned wird
Two background technologies
Tinned wird is a kind of base mateiral of electronic industry, is suitable for the lead-in wire of production electronic devices and components and the wire jumper of machine line plate.The production technique of tinned wird has two kinds of traditional technologys, and a kind of is electroplating technology, and a kind of is hot-dip process, adopts scolder terne metal or pure tin, because of the poor performance of pure tin coating, generally seldom uses.The advantage of electroplating technology is that coating is even, good concentricity, but its energy consumption is big, and environmental pollution is serious, and the processing cost height of waste liquid needs the environmental issue of solution more, so use few.See Fig. 1 Technology and principle schematic for details.
The advantage of hot-dip process is energy-conservation free from environmental pollution, and cost is low, but the bad grasp of coating concentricity of common hot-dip process need take special process and technology to solve its drawback.
No matter tinned wird takes any technology at present, the application of coating material is tinsel entirely, this material can satisfy the electronic product manufacture process requirement on performance, but lead is deleterious as a heavy metal species and compound thereof, and HUMAN HEALTH is had very big hazardness.So countries such as European Union, Japan, the U.S. to electronic product unleaded production stipulated to stop using timetable.
China is as the big country of production and exit electronic product, and use is paid much attention to lead-free, and unleaded production has become the task of top priority.
There is following problem in traditional in addition hot-dip process:
1, copper line surface coating because of the influence that is subjected to gravity is easy to generate off-centre, can not satisfy the processing requirement of electronic product under molten state.
2, the composition of coating is that terne metal can not satisfy environmental requirement, thus should adopt hot-dip process also will obtain the tinned wird that ideal does not have lead-coat, purpose of the present invention that Here it is.
Three summary of the invention
The present invention provides a kind of lead-free alloy tinned wird for solving the above technical problem that exists in the known conventional art.
The technical scheme that the present invention takes for the technical problem that exists in the solution known technology is: a kind of lead-free alloy tinned wird, be to be that base-material interpolation weight percent is element indium (In) 0.01～1.98%, bismuth (Bi) 0.01～5.98%, copper (Cu) 0.01～1.98% with tin, lead-free solder alloy is made in melting, adopt the vertical technology of hot dipping to be plated on the surface of bare copper wire, and make the lead-free alloy tinned wird.
The utility model has also adopted following technical measures: the lead-free alloy tinned wird, with tin is the lead-free solder alloy that base-material adds element indium, bismuth, copper one-tenth, its element preferred percent is an indium: 0.1～1.5%, bismuth 0.1～1.5%, copper 0.1～0.5%, and tin is its surplus; The lead-free alloy tinned wird, it is as follows with tin to be that base-material adds the lead-free solder alloy manufacture method that element indium, bismuth, copper make: take by weighing tin 98.5%, copper 0.5%, bismuth 0.8%, 0.2% 4 kind of metallic substance of indium by weight proportion respectively; Earlier tin, copper are put into melting in 650 ℃ the constant temperature oven in 10: 1 ratios, copper is melted in the tin fully, go out to be molded as the gun-metal spindle then; Above remaining tin is gone into smelting furnace to be warming up to 280 ℃ of indium, bismuths of putting into above ratio then and to be stirred to fusing fully, be warming up to 360 ℃ again, put into above gun-metal spindle, stir fusing fully, be warming up to 410 ℃ again, stirred 10 minutes, and reached uniform mixing, go out to be molded as the lead-free solder alloy spindle then; Copper cash behind the vertical technology wicking of lead-free alloy tinned wird hot dipping, during through the mould sizing, mould must vertically be placed on lead-free solder alloy and become on the liquid level of 280 ℃ of temperature, mould studs with the titanium alloy overcoat, mould is swum on its liquid level, last bottom tumbler line also should be perpendicular to liquid level, make the mould can freely adjust and the position of copper cash, keep concentric, make alloy layer be molten state after the copper cash depanning, certain flowable is arranged with copper cash, under the effect of gravity, coating has a uniform process of freedom before solidifying, and keeps not dither state of copper cash smooth running, keeps coating and copper cash concentric and even.
Advantage of the present invention and positively effect are: lead-free alloy coating can not only possess the advantage of traditional tin lead-coat, overcome its shortcoming and also can also be anti-oxidant, high temperature resistant, intensity is high, improve the utilization ratio of scolder, economical with materials, reduce cost, improved weldability, improved concentricity, homogeneity and the surface quality of copper cash coating, compliance with environmental protection requirements makes the production level of tinned wird and quality product bring up to a new height.
Four description of drawings
Fig. 1: conventional process flow principle schematic
Fig. 2: technical process principle schematic of the present invention
Five embodiments
For further understanding content characteristic of the present invention and effect, 2 detailed descriptions are implemented as follows in conjunction with the accompanying drawings:
At first, take by weighing tin 98.5%, copper 0.5%, bismuth 0.8%, 0.2% 4 kind of metallic substance of indium by weight proportion respectively according to the manufacture method of lead-free solder alloy; Earlier tin, copper are put into melting in 650 ℃ the constant temperature oven in 10: 1 ratios, copper is melted in the tin fully, go out to be molded as the gun-metal spindle then; Above remaining tin is gone into smelting furnace to be warming up to 280 ℃ of indium, bismuths of putting into above ratio then and to be stirred to fusing fully, be warming up to 360 ℃ again, put into above gun-metal spindle, stir fusing fully, be warming up to 410 ℃ again, stirred 10 minutes, and reached uniform mixing, go out to be molded as the lead-free solder alloy spindle then.
Carry out lead-free alloy tinned wird process Installation according to the technical process of Fig. 2 then and adjust equipment, tissue is produced, adopt the vertical technology of lead-free alloy tinned wird hot dipping, copper cash behind the wicking, during through the mould sizing, mould must vertically be placed on lead-free solder alloy and become on the liquid level of 280 ℃ of temperature, mould studs with the titanium alloy overcoat, mould is swum on its liquid level, last bottom tumbler line also should be perpendicular to liquid level, and mould can freely be adjusted and the position of copper cash, keeps concentric with copper cash, make alloy layer be molten state after the copper cash depanning, certain flowable is arranged, and under the effect of gravity, coating has a uniform process of freedom before solidifying, and held stationary moves not dither state, keep coating and copper cash concentric reach even.Produce the lead-free alloy tinned wird, make its production level and quality product that new breakthrough be arranged, bring up to a new height.
Claims (4)
1, a kind of lead-free alloy tinned wird.Traditional tinned wird is with a certain proportion of tinsel, be plated on the surface of bare copper wire by plating or hot-dip process, and the lead-free alloy tinned wird is characterized in that being that base-material interpolation weight percent is element indium (In) 0.01～1.98%, bismuth (Bi) 0.01～5.98%, copper (Cu) 0.01～1.98% with tin, lead-free solder alloy is made in melting, adopt the vertical technology of hot dipping to be plated on the surface of bare copper wire, and make the lead-free alloy tinned wird.
2, lead-free alloy tinned wird according to claim 1, with tin is the lead-free solder alloy that base-material adds element indium, bismuth, copper one-tenth, it is characterized in that its element preferred percent is an indium: 0.1～1.5%, bismuth 0.1～1.5%, copper 0.1～0.5%, tin is its surplus.
3, lead-free alloy tinned wird according to claim 1, it is as follows with tin to be that base-material adds its feature manufacture method of lead-free solder alloy that element indium, bismuth, copper make:
Take by weighing tin 98.5%, copper 0.5%, bismuth 0.8%, 0.2% 4 kind of metallic substance of indium by weight proportion respectively; Earlier tin, copper are put into melting in 650 ℃ the constant temperature oven in 10: 1 ratios, copper is melted in the tin fully, go out to be molded as the gun-metal spindle then; Above remaining tin is gone into smelting furnace to be warming up to 280 ℃ of indium, bismuths of putting into above ratio then and to be stirred to fusing fully, be warming up to 360 ℃ again, put into above gun-metal spindle, stir fusing fully, be warming up to 410 ℃ again, stirred 10 minutes, and reached uniform mixing, go out to be molded as the lead-free solder alloy spindle then.
4, lead-free alloy tinned wird according to claim 1, the vertical technology of hot dipping is characterized in that, copper cash behind the wicking, during through the mould sizing, mould must vertically be placed on lead-free solder alloy and become on the liquid level of 280 ℃ of temperature, mould studs with the titanium alloy overcoat, and mould is swum on its liquid level, and last bottom tumbler line also should be perpendicular to liquid level, make the mould can freely adjust and the position of copper cash, keep concentric, make alloy layer be molten state after the copper cash depanning, certain flowable is arranged with copper cash, under the effect of gravity, coating has a uniform process of freedom before solidifying, and keeps not dither state of copper cash smooth running, keeps coating and copper cash concentric and even.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021579598A CN100480416C (en) | 2002-12-23 | 2002-12-23 | Lead-free alloy tin-plating copper wire and fabricating method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021579598A CN100480416C (en) | 2002-12-23 | 2002-12-23 | Lead-free alloy tin-plating copper wire and fabricating method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1510158A true CN1510158A (en) | 2004-07-07 |
| CN100480416C CN100480416C (en) | 2009-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB021579598A Expired - Fee Related CN100480416C (en) | 2002-12-23 | 2002-12-23 | Lead-free alloy tin-plating copper wire and fabricating method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102560311A (en) * | 2012-03-16 | 2012-07-11 | 鹰潭市众鑫成铜业有限公司 | Alloy used in hot plating process of tinned wire |
| CN104878337A (en) * | 2015-05-04 | 2015-09-02 | 神宇通信科技股份公司 | Energy-saving tinning device used on coaxial cable copper wire tinning production line |
| CN105304221A (en) * | 2015-11-22 | 2016-02-03 | 天津市宏远电子有限公司 | Hard and semi-hard tin-coated copper wire manufacturing method |
| CN105390176A (en) * | 2015-12-15 | 2016-03-09 | 北京有色金属与稀土应用研究所 | Tin-lead plating flat copper wire and preparation method thereof |
| CN107587095A (en) * | 2017-10-13 | 2018-01-16 | 凯美龙精密铜板带（河南）有限公司 | A kind of environmentally friendly copper and copper alloy plate strip surface hot-dip tinning method |
| CN108950450A (en) * | 2018-09-03 | 2018-12-07 | 德清县欣琪电子有限公司 | A kind of tin plating solution for copper covered steel wire |
| CN109628870A (en) * | 2019-01-22 | 2019-04-16 | 陶乐敏 | A kind of environment-friendly type lead-free alloy material and its processing technology |
-
2002
- 2002-12-23 CN CNB021579598A patent/CN100480416C/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102560311A (en) * | 2012-03-16 | 2012-07-11 | 鹰潭市众鑫成铜业有限公司 | Alloy used in hot plating process of tinned wire |
| CN104878337A (en) * | 2015-05-04 | 2015-09-02 | 神宇通信科技股份公司 | Energy-saving tinning device used on coaxial cable copper wire tinning production line |
| CN105304221A (en) * | 2015-11-22 | 2016-02-03 | 天津市宏远电子有限公司 | Hard and semi-hard tin-coated copper wire manufacturing method |
| CN105390176A (en) * | 2015-12-15 | 2016-03-09 | 北京有色金属与稀土应用研究所 | Tin-lead plating flat copper wire and preparation method thereof |
| CN107587095A (en) * | 2017-10-13 | 2018-01-16 | 凯美龙精密铜板带（河南）有限公司 | A kind of environmentally friendly copper and copper alloy plate strip surface hot-dip tinning method |
| CN108950450A (en) * | 2018-09-03 | 2018-12-07 | 德清县欣琪电子有限公司 | A kind of tin plating solution for copper covered steel wire |
| CN109628870A (en) * | 2019-01-22 | 2019-04-16 | 陶乐敏 | A kind of environment-friendly type lead-free alloy material and its processing technology |
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| Publication number | Publication date |
|---|---|
| CN100480416C (en) | 2009-04-22 |
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