CN108950450A - A kind of tin plating solution for copper covered steel wire - Google Patents
A kind of tin plating solution for copper covered steel wire Download PDFInfo
- Publication number
- CN108950450A CN108950450A CN201811018530.3A CN201811018530A CN108950450A CN 108950450 A CN108950450 A CN 108950450A CN 201811018530 A CN201811018530 A CN 201811018530A CN 108950450 A CN108950450 A CN 108950450A
- Authority
- CN
- China
- Prior art keywords
- plating solution
- steel wire
- tin plating
- tin
- covered steel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/38—Wires; Tubes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of tin plating solution for copper covered steel wire, which includes tin, indium, bismuth and antioxidant, and the weight ratio between the tin, indium, bismuth and antioxidant is 100:1:1:1.Formula of the invention is reasonable, and indium can be improved solderability, and bismuth can be improved brightness, has good solderability, bright property using copper covered steel wire prepared by the tin plating solution, after storing longer time in air, solderability and bright property are still preferable.
Description
Technical field
The present invention relates to a kind of tin plating solutions for copper covered steel wire.
Background technique
In recent years, with the rapid development of electronics industry, in order to improve the solderability of electronic component and material and reduce at
This, using the tin coating for plating good weldability on the lead of electronic component.Using current tin plating solution in wire surface
It can get bright coating, but after the solderability of coating is poor, and lead stores 2~6 months in air, coating just becomes ash
Black, welding performance are worse.In addition, plating solution itself is also very unstable, place 1~2 month in air, plating solution just becomes muddy, sternly
Ghost image rings the bright property and solderability of coating.
Summary of the invention
In view of the above-mentioned problems, there is good solderability the present invention provides a kind of tin plating solution for copper covered steel wire,
In air after a long time placement will not be dimmed, bright property is good.
The technical solution adopted by the present invention is that:
A kind of tin plating solution for copper covered steel wire, the tin plating solution include tin, indium, bismuth and antioxidant, the tin,
Weight ratio between indium, bismuth and antioxidant is 100:1:1:1.
Preferably, the antioxidant is resorcinol, the weight concentration of the resorcinol is 0.5~5%.
Formula of the invention is reasonable, and indium can be improved solderability, and bismuth can be improved brightness, is prepared using the tin plating solution
Copper covered steel wire have good solderability, bright property, in air store longer time after, solderability and bright property are still
Preferably.
Specific embodiment
The present invention is described in further detail below by specific embodiment.
A kind of tin plating solution for copper covered steel wire, the tin plating solution include tin, indium, bismuth and antioxidant, the tin,
Weight ratio between indium, bismuth and antioxidant is 100:1:1:1, and the antioxidant is resorcinol, the resorcinol
Weight concentration be 0.5~5%.
There is good solderability, bright property using copper covered steel wire prepared by the tin plating solution, store in air longer
Time after, solderability and bright property are still preferable.
Claims (2)
1. a kind of tin plating solution for copper covered steel wire, which is characterized in that the tin plating solution includes tin, indium, bismuth and antioxidant,
Weight ratio between the tin, indium, bismuth and antioxidant is 100:1:1:1.
2. a kind of tin plating solution for copper covered steel wire according to claim 1, which is characterized in that the antioxidant
Weight concentration for resorcinol, the resorcinol is
0.5~5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811018530.3A CN108950450A (en) | 2018-09-03 | 2018-09-03 | A kind of tin plating solution for copper covered steel wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811018530.3A CN108950450A (en) | 2018-09-03 | 2018-09-03 | A kind of tin plating solution for copper covered steel wire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108950450A true CN108950450A (en) | 2018-12-07 |
Family
ID=64475555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811018530.3A Pending CN108950450A (en) | 2018-09-03 | 2018-09-03 | A kind of tin plating solution for copper covered steel wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108950450A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1510158A (en) * | 2002-12-23 | 2004-07-07 | 天津市宏远电子有限公司 | Lead-free alloy tin-plating copper wire |
| CN102660723A (en) * | 2012-05-17 | 2012-09-12 | 合肥工业大学 | Rare-earth modified tin alloy for continuous hot-dip coating of copper wire and copper-coated metal composite wire, and manufacturing method thereof |
| KR20150088646A (en) * | 2014-01-24 | 2015-08-03 | 덕산하이메탈(주) | Conductive paste for heat generation and the manufacturing method thereof and the electric device comprising thereof |
| CN105047247A (en) * | 2015-07-13 | 2015-11-11 | 东莞市同亚电子科技有限公司 | Tin composition for wire tinning and preparation method and application thereof |
-
2018
- 2018-09-03 CN CN201811018530.3A patent/CN108950450A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1510158A (en) * | 2002-12-23 | 2004-07-07 | 天津市宏远电子有限公司 | Lead-free alloy tin-plating copper wire |
| CN102660723A (en) * | 2012-05-17 | 2012-09-12 | 合肥工业大学 | Rare-earth modified tin alloy for continuous hot-dip coating of copper wire and copper-coated metal composite wire, and manufacturing method thereof |
| KR20150088646A (en) * | 2014-01-24 | 2015-08-03 | 덕산하이메탈(주) | Conductive paste for heat generation and the manufacturing method thereof and the electric device comprising thereof |
| CN105047247A (en) * | 2015-07-13 | 2015-11-11 | 东莞市同亚电子科技有限公司 | Tin composition for wire tinning and preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| HK1053278A1 (en) | A lead-free solder, method for preparing the same and method of soldering by using the same | |
| CN101716702B (en) | Multi-component alloy cadmium-free low-silver solder | |
| CN103124614B (en) | Solder paste and solder flux | |
| WO2008148088A8 (en) | Brazing material | |
| JP2011156558A (en) | Lead-free solder alloy | |
| MX2010012877A (en) | Brazing material. | |
| CN104439751A (en) | Novel low-melting-point lead-free solder | |
| CN101049655A (en) | Silver solder of containing gallium, indium, and rare earth neodymium and cerium without cadmium | |
| CN105965172A (en) | Low temperature welding material | |
| MY128285A (en) | Lead-free zinc-containing solder paste | |
| CN108950450A (en) | A kind of tin plating solution for copper covered steel wire | |
| CN103071941B (en) | High tenacity, resistant to hydrogen cause, the metal powder type flux-cored wire of sulphide stress corrosion crackle and method for making | |
| CN109182943A (en) | A kind of tin plating technique of copper covered steel wire | |
| CN104668810B (en) | A kind of novel lead-free welding material and the preparation method of scaling powder thereof | |
| CN103084749B (en) | The lead-free brazing in a kind of high service life | |
| CN104526180A (en) | Lead-free solder containing cerium, rubidium and zinc and preparation method thereof | |
| CN103643264A (en) | Rare earth-containing tinning liquid | |
| CN103476540A (en) | Solder alloy | |
| CN102825396B (en) | Sn-Zn leadless brazing filler metal containing Pr, Ga and Te | |
| CN103214716A (en) | Smokeless plastic welding rod | |
| CN109751332A (en) | Automobile bearing anti-attrition protective layer | |
| CN104588908A (en) | Lead-free solder with lanthanum, rubidium and zinc and preparation method thereof | |
| CN105880862A (en) | Photovoltaic welding strip welding flux easy to weld | |
| CN205582524U (en) | Copper clad aluminium composite wire | |
| CN104561658A (en) | High-strength lead-free corrosion-resisting brass alloy |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181207 |