KR102044963B1 - 3d printing apparatus and method using electroplating - Google Patents

Abstract

A printing pen having a nozzle at a front end and discharging the metal solution loaded therein to the substrate through the nozzle; And when a meniscus of a metal solution is formed between the printing pen and the substrate, the metal inside the meniscus using a metal electrode having a contact point with a metal solution loaded therein as a first electrode and a substrate as a second electrode. By applying a predetermined voltage to the solution, a 3D printing apparatus according to an embodiment of the present invention includes a power supply for plating a metal solution inside a meniscus onto a substrate.

Description

3D printing apparatus and method using electroplating method {3D PRINTING APPARATUS AND METHOD USING ELECTROPLATING}

The present invention relates to a 3D printing apparatus and method using an electroplating method. More specifically, the present invention relates to a 3D printing apparatus and method using an electroplating method that does not require a high temperature application process for sintering a metal material used in 3D printing.

3D printing technology uses additive manufacturing, which stacks materials such as polymers, plastics, or metallic powders based on three-dimensional design data, thereby mockups, prototypes, tools, and parts. It is a technique to shape the back.

The advantage of 3D printing is that even if only one product is produced, the production cost is relatively low, and any shape product can be freely produced. In the conventional plastic model manufacturing technology, the cost of making a single product is very high because the mold is produced after the mold is produced, but the 3D printing technology produces the product by stacking the raw materials one by one without the mold. It is very suitable for small quantity production of many kinds. In addition, according to the 3D printing technology, even a product having a complicated shape can be easily produced, and thus, the types of products that can be produced using the 3D printing technology are virtually unlimited. As a result, 3D printing technology is expected to change the paradigm of technology in various fields such as manufacturing, healthcare, and IT, and lead industrial innovation.

Although there are many types of 3D printing methods, they can be classified into a liquid based method, a powder based method and a solid based method according to the characteristics of the raw materials used. Each method has its own strengths and weaknesses, and there are differences in molding speed, accuracy and detail of molding, and there are ways to freely color products and only one color.

Liquid-based methods mainly use liquid polymer synthetic resin and other synthetic resins to stack layers one by one according to the shape of an object, and then photocure the stacked structures. A representative method based on liquid is the first commercially introduced as SLA (Stereolithography). Liquid-based methods other than SLA include Jetted Photopolymer and Ink Jet Printing. Liquid-based methods generally have the advantage of being able to form precisely close to their original form, but have the disadvantage that the cured polymer may wear over time and thus have poor durability.

The powder-based method is a process of melting or sintering synthetic resin and metal raw materials made in powder form. Selective Laser Sintering (SLS) is a typical powder-based method. Powder-based method can use a variety of raw materials, such as metals and ceramics, and has the advantage of being more robust than the result of the photocuring process of the liquid raw material, but has the disadvantage that a high temperature process is required for the sintering of the powder.

Finally, solid-based methods are usually made by shaving solid materials, which differ in their processing form. Laminated Object Manufacturing (LOM) method stacks thin sheets of paper material one by one, and then cuts them into the shape of an object.FDM (Fused Deposition Modeling) method melts raw materials in a thread form and stacks them one by one.

Currently, the 3D printer market using polymers or plastics has already fallen in price so that individuals can own and use it under the leadership of advanced countries such as the US, Japan, and Germany. However, in the case of metal raw materials, due to high material price, complicated processing method, high sintering temperature, and explosion risk, it is restricted from development unlike 3D printing using plastic materials. Therefore, even in the case of metal raw materials, there is a demand for the development of a technology capable of producing a product at a low temperature by a simple process.

3D printing apparatus and method using an electroplating method according to an embodiment of the present invention is an object that does not require a high temperature application process for sintering the metal material.

In addition, the 3D printing apparatus and method using an electroplating method according to an embodiment of the present invention aims to efficiently control the shape of the structure on the substrate.

3D printing apparatus according to an embodiment of the present invention,

A printing pen having a nozzle at a front end and discharging a metal solution loaded therein to the substrate through the nozzle; And when a meniscus of the metal solution is formed between the printing pen and the substrate, the metal electrode having a contact with the metal solution loaded therein is a first electrode, and the substrate is a second electrode. By applying a predetermined voltage to the metal solution inside the meniscus, it may include a power supply for plating the metal solution inside the meniscus on the substrate.

The power supply unit adjusts the magnitude of each of the first voltage applied to the metal solution inside the meniscus and the second voltage applied to the metal solution inside the meniscus during the first time interval. The shape of the unit structure of the metal solution plated on the substrate may be controlled.

The power supply unit may include a first voltage for plating the metal solution inside the meniscus on the substrate and a second voltage for etching the metal solution plated on the substrate. The solution may be applied to form a columnar unit structure on the substrate.

The power supply unit has a tubular shape by applying a first voltage for plating a metal solution inside the meniscus onto the substrate, and not applying a voltage to the metal solution during the second time interval. A unit structure of may be formed on the substrate.

The power supply unit may include a first voltage for plating the metal solution inside the meniscus on the substrate, and a second voltage less than the first voltage and for plating the metal solution inside the meniscus on the substrate. The tubular unit structure may be formed on the substrate by applying a metal solution inside the meniscus.

The power supply unit controls the shape of the unit structure of the metal solution plated on the substrate by further adjusting the duty ratio between the first time interval and the second time interval,

The duty ratio is,

[Equation]

(1st time interval-2nd time interval) / 1st time interval

It can be determined by the above equation.

The power supply unit has a duty ratio between 0 and 1 for a first voltage for plating the metal solution inside the meniscus on the substrate and a second voltage for etching the metal solution plated on the substrate. The columnar unit structure may be formed on the substrate by applying to the metal solution inside the meniscus.

The power supply unit may include a first voltage for plating the metal solution inside the meniscus on the substrate, and a second voltage less than the first voltage and for plating the metal solution inside the meniscus on the substrate. A tubular unit structure may be formed on the substrate by applying a duty ratio between 0 and 1 to the metal solution inside the meniscus.

The 3D printing apparatus may further include a position controller which controls a position of at least one of the printing pen and the substrate.

The position controller may control the shape of the meniscus formed between the printing pen and the substrate by controlling the position of at least one of the printing pen and the substrate.

3D printing method according to another embodiment of the present invention,

Discharging the metal solution loaded in the printing pen having the nozzle at the front end to the substrate; And when a meniscus of the metal solution is formed between the printing pen and the substrate, the metal electrode having a contact with the metal solution loaded therein is a first electrode, and the substrate is a second electrode. The method may include plating the metal solution inside the meniscus on the substrate by applying a predetermined voltage to the metal solution inside the meniscus.

3D printing apparatus and method using an electroplating method according to an embodiment of the present invention does not require a high temperature application process for sintering the metal material.

In addition, the 3D printing apparatus and method using an electroplating method according to an embodiment of the present invention can efficiently control the shape of the structure on the substrate.

1 is a view showing the configuration of a 3D printing apparatus according to an embodiment of the present invention.
FIG. 2 is a diagram showing the ion distribution of the metal solution of the A portion shown in FIG. 1.
3A is a diagram illustrating a first voltage during a first time interval and a second voltage during a second time interval applied to a metal solution in the 3D printing apparatus according to an embodiment of the present invention. (b) is a view showing the shape of the unit structure according to the duty ratio between the first time interval and the second time interval of FIG.
4 shows a structure grown on a substrate at a duty ratio of 0.9.
FIG. 5A is a diagram illustrating a first voltage during a first time interval and a second voltage during a second time interval applied to a metal solution in the 3D printing apparatus according to an embodiment of the present invention. (b) is a view showing the shape of the unit structure according to the duty ratio between the first time interval and the second time interval of FIG.
6 shows a structure grown on a substrate with a duty ratio of 0.4.
7 (a), 7 (b) and 7 (c) are diagrams for explaining a method of generating a bridge-shaped structure by controlling a meniscus of a metal solution.
8 is a flowchart illustrating a procedure of a 3D printing method according to another embodiment of the present invention.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

1 is a view showing the configuration of a 3D printing apparatus 100 according to an embodiment of the present invention.

Referring to FIG. 1, the 3D printing apparatus 100 according to an exemplary embodiment may include a printing pen 110, a substrate 120, a power supply 130, and a position controller 140.

The printing pen 110 loads the metal solution 112 therein and discharges the metal solution 112 through the nozzle provided at the front end portion. In addition, a metal electrode 114 for applying a predetermined voltage to the metal solution 112 may be positioned inside the printing pen 110. The cross section of the nozzle of the printing pen 110 may have a variety of shapes, such as circular, sand, hexagonal.

The raw material supply control unit (not shown) may be connected to the printing pen 110. The raw material supply control unit has a metal solution 112 loaded on the printing pen 110 through a nozzle of the printing pen 110 to the substrate 120. Ensure proper discharge. The raw material supply control unit uses a metal solution 112 that is spontaneously formed when the metal solution 112 contacts the substrate 120 or the metal solution 112 loaded on the printing pen 110 by using an air pressure of a pump. 120).

The unit structure is formed on the substrate 120 by the metal solution 112 discharged from the printing pen 110. The substrate 120 may serve as an electrode for applying a predetermined voltage to the metal solution 112.

The power supply unit 130 is positioned inside the printing pen 110 to connect the metal electrode 114 having the contact with the metal solution 112 to the first electrode, for example, the anode electrode and the substrate 120. A predetermined voltage may be applied to the metal solution 112 as a second electrode, for example, a cathode. The application of voltage can use a potentiostat

Specifically, when the meniscus 113 of the metal solution 112 is formed between the printing pen 110 and the substrate 120, the power supply 130 is located inside the printing pen 110. The metal solution in the meniscus 113 is applied by applying a predetermined voltage to the metal solution 112 in the meniscus 113 using the metal electrode 114 as the first electrode and the substrate 120 as the second electrode. 112 may be plated on the substrate 120. Whether or not the meniscus 113 is formed may be determined by measuring a voltage or current change generated when the meniscus 113 is formed and a monitoring method using an optical system.

In addition, the power supply unit 130 is formed on the substrate 120 by adjusting the magnitude of each of the first voltage during the first time interval and the second voltage during the second time interval applied to the metal solution 112. The shape of the unit structure of the solution 112 may be controlled. After the first voltage is applied to the metal solution 112 during the first time interval, the second voltage may be applied to the metal solution 112 during the second time interval. Furthermore, the power supply 130 may further adjust the duty ratio between the first time interval and the second time interval together with the magnitudes of the first voltage and the second voltage, respectively, to form a metal solution formed on the substrate 120 ( The shape of the unit structure of 112 may be controlled, which will be described in detail with reference to FIGS. 2 to 6.

The position controller 140 controls the position of at least one of the printing pen 110 and the substrate 120. The position controller 140 may control the position of at least one of the printing pen 110 and the substrate 120 with reference to the shape of the unit structure obtained through the CCD camera 142. In addition, the position control unit 140 controls the shape of the meniscus 113 formed between the printing pen 110 and the substrate 120 by controlling the position of at least one of the printing pen 110 and the substrate 120. The growth direction of the structure can be adjusted, which will be described with reference to FIG. 7.

FIG. 2 is a diagram showing the ion distribution of the metal solution 112 of the A portion shown in FIG. 1.

The supply of metal ions in electroplating is an important factor in determining the quality of the plating. In general electroplating, diffusion and migration are key factors for the supply of metal ions. In the present invention, unlike the case of general electroplating, the meniscus serves as a deposition bath. Thereby, there is an additional evaporation effect in which metal ions are collected on the surface of the meniscus by evaporation of the solvent occurring at the meniscus surface. This evaporation effect acts as an important factor of the metal ion supply together with the diffusion and migration effects in the present invention.

As shown in FIG. 2, due to the evaporation effect, it can be seen that ions of the metal solution 112 are distributed at high density on the surface of the meniscus, especially the contact region B of the meniscus and the substrate 120. have. In fact, when a predetermined voltage is applied for one second and the appearance of the plated on the substrate 120 is observed, it can be seen that the nucleation density is higher than the inner side of the plating layer. In this case, if the plating proceeds continuously, it becomes impossible to produce a uniform and dense structure.

Accordingly, the 3D printing apparatus 100 according to an exemplary embodiment of the present invention may further include a magnitude of each of the first voltage during the first time interval and the second voltage during the second time interval applied to the metal solution 112. Furthermore, the duty ratio between the first time interval and the second time interval is adjusted to generate a more precise unit structure.

FIG. 3A illustrates a first voltage during a first time interval and a second voltage during a second time interval applied to the metal solution 112 in the 3D printing apparatus 100 according to an exemplary embodiment of the present invention. 3 (b) is a view showing the shape of the unit structure according to the duty ratio between the first time interval and the second time interval of Figure 3 (a).

As described above, the power supply unit 130 may apply a predetermined voltage to the metal solution 112 in the meniscus, specifically, the first voltage during the first time period and the second voltage during the second time period. After adjusting the magnitude of each of the two voltages, the first voltage and the second voltage may be applied to the metal solution 112 at a predetermined duty ratio. The duty ratio between the first time interval and the second time interval may be defined by Equation 1 below.

[Equation 1]

(1st time interval-2nd time interval) / 1st time interval

When the total application time between the first time interval and the second time interval is one cycle, the power supply unit 130 applies the first voltage and the second voltage to the metal solution 112 at a predetermined number of cycles, thereby applying the unit structure to the substrate ( 120).

The power supply 130 applies a first voltage for plating the metal solution 112 inside the meniscus on the substrate 120 to the metal solution 112, and then the metal solution plated on the substrate 120 ( By applying the second voltage for etching the 112 to the metal solution 112, a columnar unit structure may be formed on the substrate 120. The columnar unit structure may have a flat top surface and have a dense shape.

As shown in FIG. 3A, the power supply unit 130 applies the first voltage during the first time interval of 2 V and the second voltage during the second time interval of −0.1 V to the metal solution 112. can do. 2V corresponds to the first voltage for plating the metal solution 112 inside the meniscus on the substrate 120, and -0.1V etches the metal solution 112 plated on the substrate 120. Although it corresponds to the second voltage, the magnitude of the first voltage and the magnitude of the second voltage are not limited to 2V and -0.1V, and may vary depending on the material of the metal solution 112. In addition, the first voltage for plating the metal solution 112 inside the meniscus on the substrate 120 may have a positive polarity and may etch the plated metal solution 112 on the substrate 120. The second voltage to be etched may have a negative polarity, but the first voltage and the substrate for plating the metal solution 112 inside the meniscus on the substrate 120 according to the material of the metal solution 112. All of the second voltages that etch the metal solution plated on 120 may have positive polarity.

FIG. 3B is a diagram showing the shape of the unit structure formed when the first voltage of 2V and the second voltage of −0.1V are applied to the metal solution 112 with a constant duty.

When the duty ratio is 1, only the first voltage of 2V is applied to the metal solution 112. At this time, the unit structure grows rapidly on the outside of the meniscus where the density of the solution ions is high due to the evaporation effect at the beginning of plating. Due to the continuous application of the first voltage, dendrite unit structures are formed that cannot be controlled under the influence of a strong electric field formed at the center.

The power supply unit 130 applies a voltage of 2 V to the metal solution 112 to plate the metal solution 112 inside the meniscus on the substrate 120, and then the metal solution plated on the substrate 120 ( By applying a second voltage of −0.1 V, which etches 112, to the metal solution 112, it is possible to etch an irregularly protruding point.

Referring to FIG. 3 (b), when the duty ratio is 0.9 and 0.67, it can be seen that a flat and dense columnar unit structure is formed, and when the duty ratio is 0.5, the unit structure is not formed due to excessive etching. have.

Accordingly, the power supply unit 130 may form a flat and dense columnar unit structure by adjusting the duty ratio between the first time interval and the second time interval. Referring to FIG. 3B, the duty ratio between the first time interval and the second time interval is preferably set to a value between 0.5 and 1, but may vary depending on the material of the metal solution 112. , Is not limited to values between 0.5 and 1.

FIG. 4 is a view taken by a scanning electron microscope of a structure formed by repeatedly stacking a unit structure formed by applying a first voltage of 2V and a second voltage of −0.1V at a duty ratio of 0.9. Likewise, it can be seen that a uniform and dense structure is formed.

FIG. 5A is a diagram illustrating a first voltage of a first time interval and a second voltage of a second time interval applied to the metal solution 112 in the 3D printing apparatus 100 according to an exemplary embodiment of the present invention. 5 (b) is a diagram illustrating the shape of the unit structure according to the duty ratio between the first time interval and the second time interval of FIG. 5 (a).

The power supply 130 may include a first voltage for plating the metal solution 112 in the meniscus on the substrate 120, and a metal solution 112 in the meniscus less than the first voltage. The second voltage to be plated on) may be applied to the metal solution 112 inside the meniscus to form a tubular unit structure on the substrate 120.

The voltage of 2V shown in FIG. 5 (a) corresponds to the first voltage for plating the metal solution 112 inside the meniscus on the substrate 120, and 0.8V is less than the first voltage and the meniscus. The metal solution 112 therein corresponds to the second voltage for plating the substrate 120. However, the magnitude of the first voltage and the magnitude of the second voltage are not limited to 2V and 0.8V, and may vary depending on the material of the metal solution. The first voltage for plating the metal solution 112 inside the meniscus on the substrate 120 and the second voltage for plating the metal solution 112 inside the meniscus on the substrate 120 have the same polarity. Can have

When the duty ratio shown in FIG. 5 (b) is 1, the duty ratio is the same as that shown in FIG. 3 (b). The lower the duty ratio is, the tubular shape becomes the unit structure because the lower the first voltage is. This is because the application of the second voltage acts strongly on the evaporation effect to increase the density of metal ions on the meniscus surface. In other words, when the first voltage is applied briefly, the plating proceeds quickly only on the surface of the meniscus, and when the second voltage is applied for a relatively long time, the metal ions collect toward the surface of the meniscus and at the same time slow plating. This occurs to form a tubular unit structure having a dense and uniform wall.

The power supply unit 130 may form a tubular unit structure by setting the duty ratio between the first time interval and the second time interval to a value between 0 and 1. FIG. Referring to FIG. 5 (b), the duty ratio between the first time interval and the second time interval is preferably set to a value between 0 and 0.7, but may vary depending on the material of the metal solution 112. , Is not limited to values between 0 and 0.7.

In some embodiments, the power supply 130 may not apply the second voltage to the metal solution 112 during the second time interval. That is, the power supply 130 may generate the tubular unit structure by applying only the first voltage for plating the metal solution 112 on the substrate 120 to the metal solution 112 during the first time interval. Even if the second voltage is not applied to the metal solution 112 during the second time interval, the tubular unit structure may be formed due to the evaporation effect. However, in this case, even when the second voltage is applied to the metal solution 112 during the second time interval, a unit structure having a less dense and not smooth wall may be formed.

FIG. 6 is a view taken by a scanning electron microscope of a structure formed by repeatedly stacking a unit structure formed by applying a first voltage of 2V and a second voltage of 0.8V at a duty ratio of 0.4. Likewise, it can be seen that a tubular structure of uniform and dense form is formed.

7 (a), 7 (b) and 7 (c) are diagrams for explaining a method of generating a bridge-shaped structure by controlling the meniscus 113 of the metal solution 112.

As described above, the position controller 140 of the 3D printing apparatus 100 according to an embodiment of the present invention controls the position of at least one of the printing pen 110 and the substrate 120, thereby printing the pen 110. The growth direction of the structure may be controlled by controlling the shape of the meniscus 113 formed between the substrate 120 and the substrate 120. Accordingly, structures of various shapes may be formed.

First, as shown in FIG. 7A, when the meniscus 113 is formed on the first unit structure 710, the position controller 140 moves the printing pen 110 to the right side in the drawing. The meniscus 113 is controlled to be formed in the right direction. Next, as shown in FIG. 7B, the position controller 140 adjusts the position of the printing pen 110 such that the meniscus 113 formed on the second unit structure 720 is formed in the left direction. The meniscus 113 formed on the first unit structure 710 and the meniscus 113 formed on the second unit structure 710 are coupled to the left side. Thereafter, as shown in FIG. 3 (c), the printing pen 110 is lifted upward, and a first unit structure 710 is applied by applying a voltage to the metal solution inside the coupled meniscus 113. And the second unit structure 720 form a bridge-shaped structure 730 combined.

That is, the 3D printing apparatus 100 according to an embodiment of the present invention controls the shape of the meniscus 113 by controlling the position of at least one of the printing pen 110 and the substrate 120, and then the voltage is increased. By applying it, it is possible to accurately create structures of various shapes desired by the user.

8 is a flowchart illustrating a procedure of a 3D printing method according to another embodiment of the present invention. Referring to FIG. 8, the 3D printing method according to another exemplary embodiment of the present invention includes steps that are processed in time series in the 3D printing apparatus 100 illustrated in FIG. 1. Therefore, even if omitted below, the contents described above with respect to the 3D printing apparatus 100 shown in FIG. 1 may be applied to the 3D printing method of FIG. 8.

In operation S810, the 3D printing apparatus 100 discharges the metal solution 112 loaded in the printing pen 110 having the nozzle at the front end to the substrate 120.

In operation S820, the 3D printing apparatus 100 forms a meniscus of the metal solution 112 between the printing pen 110 and the substrate 120. The 3D printing apparatus 100 may determine whether the meniscus is formed by measuring a voltage or current change generated when the meniscus is formed and using a monitoring method using an optical system.

In operation S830, the 3D printing apparatus 100 is positioned inside the printing pen 110 and has a metal electrode 114 having a contact with the metal solution 112 as the first electrode and the substrate 120 as the second electrode. By applying a predetermined voltage to the metal solution 112 in the meniscus, the metal solution 112 in the meniscus can be plated on the substrate 120. The 3D printing apparatus 100 may control the shape of the unit structure by applying the first voltage and the second voltage having a predetermined duty ratio to the metal solution 112, which has been described above, and thus a detailed description thereof will be omitted.

Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may implement the present invention in other specific forms without changing the technical spirit or essential features thereof. You will understand that. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

100: 3D printing device
110: printing pen
114: metal electrode
120: substrate
130: power supply
140: position control unit
142: CCD camera

Claims (19)

A printing pen having a nozzle at a front end and discharging a metal solution loaded therein to the substrate through the nozzle; And
When a meniscus of the metal solution connecting the printing pen and the substrate is formed by the metal solution discharged from the nozzle, a metal electrode having a contact with the metal solution loaded therein is provided as a first electrode. And a power supply unit for plating the metal solution inside the meniscus on the substrate by applying a voltage to the metal solution inside the meniscus using the substrate as the second electrode.
The power supply unit,
3D printing apparatus, characterized in that for controlling the shape of the unit structure of the metal solution plated on the substrate by changing the magnitude of the voltage applied to the metal solution inside the meniscus.
The method of claim 1,
The power supply unit,
The first voltage applied to the metal solution inside the meniscus during the first time interval and the second voltage applied to the metal solution inside the meniscus during the second time interval is adjusted to the plating on the substrate 3D printing apparatus, characterized in that for controlling the shape of the unit structure of the metal solution.
A printing pen having a nozzle at a front end and discharging a metal solution loaded therein to the substrate through the nozzle; And
When a meniscus of the metal solution is formed between the printing pen and the substrate, the metal electrode having a contact with the metal solution loaded therein is a first electrode and the substrate is a second electrode. Including a power supply for plating a metal solution in the meniscus on the substrate by applying a voltage to the metal solution inside the varnish,
The power supply unit,
By changing the magnitude of the voltage applied to the metal solution inside the meniscus to control the shape of the unit structure of the metal solution plated on the substrate,
A first voltage for plating the metal solution inside the meniscus on the substrate and a second voltage for etching the metal solution plated on the substrate are applied to the metal solution inside the meniscus, 3D printing apparatus, characterized in that to form a columnar unit structure on the substrate.
A printing pen having a nozzle at a front end and discharging a metal solution loaded therein to the substrate through the nozzle; And
When a meniscus of the metal solution is formed between the printing pen and the substrate, the metal electrode having a contact with the metal solution loaded therein is a first electrode and the substrate is a second electrode. Including a power supply for plating a metal solution in the meniscus on the substrate by applying a voltage to the metal solution inside the varnish,
The power supply unit,
By changing the magnitude of the voltage applied to the metal solution inside the meniscus to control the shape of the unit structure of the metal solution plated on the substrate,
By applying a first voltage for plating the metal solution inside the meniscus on the substrate during the first time interval to the metal solution, and not applying a voltage to the metal solution during the second time interval, 3D printing apparatus, characterized in that to form a unit structure on the substrate.
A printing pen having a nozzle at a front end and discharging a metal solution loaded therein to the substrate through the nozzle; And
When a meniscus of the metal solution is formed between the printing pen and the substrate, the metal electrode having a contact with the metal solution loaded therein is a first electrode and the substrate is a second electrode. Including a power supply for plating a metal solution in the meniscus on the substrate by applying a voltage to the metal solution inside the varnish,
The power supply unit,
By changing the magnitude of the voltage applied to the metal solution inside the meniscus to control the shape of the unit structure of the metal solution plated on the substrate,
A first voltage for plating the metal solution inside the meniscus on the substrate, and a second voltage less than the first voltage and for plating the metal solution inside the meniscus on the substrate. 3D printing apparatus, characterized in that to form a tubular unit structure on the substrate by applying a metal solution.
A printing pen having a nozzle at a front end and discharging a metal solution loaded therein to the substrate through the nozzle; And
When a meniscus of the metal solution is formed between the printing pen and the substrate, the metal electrode having a contact with the metal solution loaded therein is a first electrode and the substrate is a second electrode. Including a power supply for plating a metal solution in the meniscus on the substrate by applying a voltage to the metal solution inside the varnish,
The power supply unit,
The first voltage applied to the metal solution inside the meniscus during the first time interval and the second voltage applied to the metal solution inside the meniscus during the second time interval is adjusted to the plating on the substrate By controlling the shape of the unit structure of the metal solution to be
By controlling the duty ratio between the first time interval and the second time interval to control the shape of the unit structure of the metal solution plated on the substrate,
The duty ratio is,

[Equation]
(1st time interval-2nd time interval) / 1st time interval

3D printing apparatus, characterized in that determined by the equation.
The method of claim 6,
The power supply unit,
The first voltage for plating the metal solution inside the meniscus on the substrate and the second voltage for etching the metal solution plated on the substrate with a duty ratio between 0 and 1 inside the meniscus. 3D printing apparatus, characterized in that to form a columnar unit structure on the substrate by applying a metal solution.
The method of claim 6,
The power supply unit,
A first voltage for plating the metal solution inside the meniscus on the substrate and a second voltage less than the first voltage and for plating the metal solution inside the meniscus on the substrate between 0 and 1. 3D printing apparatus, characterized in that to form a tubular unit structure on the substrate by applying a duty ratio to the metal solution inside the meniscus.
The method of claim 1,
The 3D printing device,
3D printing apparatus further comprising a position control unit for controlling the position of at least one of the printing pen and the substrate.
The method of claim 9,
The position control unit,
And controlling the position of at least one of the printing pen and the substrate to control the shape of the meniscus formed between the printing pen and the substrate.
Discharging the metal solution loaded in the printing pen having the nozzle at the front end to the substrate;
When a meniscus of the metal solution connecting the printing pen and the substrate is formed by the metal solution discharged from the nozzle, a metal electrode having a contact with the metal solution loaded therein is provided as a first electrode. Plating the metal solution inside the meniscus on the substrate by applying a voltage to the metal solution inside the meniscus using the substrate as a second electrode; And
And controlling the shape of the unit structure of the metal solution plated on the substrate by changing the magnitude of the voltage applied to the metal solution inside the meniscus.
The method of claim 11,
Controlling the shape of the unit structure of the metal solution,
The first voltage applied to the metal solution inside the meniscus during the first time interval and the second voltage applied to the metal solution inside the meniscus during the second time interval is adjusted to the plating on the substrate 3D printing method, characterized in that for controlling the shape of the unit structure of the metal solution.
Discharging the metal solution loaded in the printing pen having the nozzle at the front end to the substrate;
When a meniscus of the metal solution is formed between the printing pen and the substrate, the metal electrode having a contact with the metal solution loaded therein is a first electrode and the substrate is a second electrode. Plating a metal solution inside the meniscus onto the substrate by applying a voltage to the metal solution inside the varnish; And
And controlling the shape of the unit structure of the metal solution plated on the substrate by changing the magnitude of the voltage applied to the metal solution inside the meniscus.
Controlling the shape of the unit structure of the metal solution,
A first voltage for plating the metal solution inside the meniscus on the substrate and a second voltage for etching the metal solution plated on the substrate are applied to the metal solution inside the meniscus, Forming a columnar unit structure on the substrate 3D printing method comprising the.
Discharging the metal solution loaded in the printing pen having the nozzle at the front end to the substrate;
When a meniscus of the metal solution is formed between the printing pen and the substrate, the metal electrode having a contact with the metal solution loaded therein is a first electrode and the substrate is a second electrode. Plating a metal solution inside the meniscus onto the substrate by applying a voltage to the metal solution inside the varnish; And
And controlling the shape of the unit structure of the metal solution plated on the substrate by changing the magnitude of the voltage applied to the metal solution inside the meniscus.
Controlling the shape of the unit structure of the metal solution,
During the first time interval, a first voltage for plating the metal solution inside the meniscus onto the substrate is applied to the metal solution, and the second voltage is not applied to the metal solution during the second time interval. 3D printing method comprising the step of forming a unit structure on the substrate.
Discharging the metal solution loaded in the printing pen having the nozzle at the front end to the substrate;
When a meniscus of the metal solution is formed between the printing pen and the substrate, the metal electrode having a contact with the metal solution loaded therein is a first electrode and the substrate is a second electrode. Plating a metal solution inside the meniscus onto the substrate by applying a voltage to the metal solution inside the varnish; And
And controlling the shape of the unit structure of the metal solution plated on the substrate by changing the magnitude of the voltage applied to the metal solution inside the meniscus.
Controlling the shape of the unit structure of the metal solution,
A first voltage for plating the metal solution inside the meniscus on the substrate, and a second voltage less than the first voltage and for plating the metal solution inside the meniscus on the substrate. Applying a metal solution to form a tubular unit structure on the substrate.
Discharging the metal solution loaded in the printing pen having the nozzle at the front end to the substrate;
When a meniscus of the metal solution is formed between the printing pen and the substrate, the metal electrode having a contact with the metal solution loaded therein is a first electrode and the substrate is a second electrode. Plating a metal solution inside the meniscus onto the substrate by applying a voltage to the metal solution inside the varnish; And
And controlling the shape of the unit structure of the metal solution plated on the substrate by changing the magnitude of the voltage applied to the metal solution inside the meniscus.
Controlling the shape of the unit structure of the metal solution,
And controlling the shape of the unit structure of the metal solution plated on the substrate by further adjusting the duty ratio between the first time interval and the second time interval.
The duty ratio is,

[Equation]
(1st time interval-2nd time interval) / 1st time interval

3D printing method characterized in that determined by the equation.
The method of claim 16,
Controlling the shape of the unit structure of the metal solution,
The first voltage for plating the metal solution inside the meniscus on the substrate and the second voltage for etching the metal solution plated on the substrate with a duty ratio between 0 and 1 inside the meniscus. Applying a metal solution to form a columnar unit structure on the substrate.
The method of claim 16,
Controlling the shape of the unit structure of the metal solution,
A first voltage for plating the metal solution inside the meniscus on the substrate and a second voltage less than the first voltage and for plating the metal solution inside the meniscus on the substrate between 0 and 1. And applying a duty ratio to the metal solution inside the meniscus, thereby forming a tubular unit structure on the substrate.
The method of claim 11,
The 3D printing method,
And controlling the position of at least one of the printing pen and the substrate to control the shape of the meniscus formed between the printing pen and the substrate.

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