CN112317766A - Submicron-scale printing equipment and printing method thereof - Google Patents
Submicron-scale printing equipment and printing method thereof Download PDFInfo
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- CN112317766A CN112317766A CN202011232554.6A CN202011232554A CN112317766A CN 112317766 A CN112317766 A CN 112317766A CN 202011232554 A CN202011232554 A CN 202011232554A CN 112317766 A CN112317766 A CN 112317766A
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- 238000007639 printing Methods 0.000 title claims abstract description 112
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 95
- 239000007788 liquid Substances 0.000 claims description 23
- 238000005507 spraying Methods 0.000 claims description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 17
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 14
- 238000002156 mixing Methods 0.000 claims description 14
- 239000007789 gas Substances 0.000 claims description 13
- 239000011261 inert gas Substances 0.000 claims description 11
- 238000003756 stirring Methods 0.000 claims description 8
- 230000008859 change Effects 0.000 claims description 7
- 150000001450 anions Chemical class 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 6
- 229910021645 metal ion Inorganic materials 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 6
- 238000005485 electric heating Methods 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 230000009471 action Effects 0.000 claims description 2
- 150000001768 cations Chemical class 0.000 claims description 2
- 238000013329 compounding Methods 0.000 claims description 2
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 2
- 210000003437 trachea Anatomy 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 239000000654 additive Substances 0.000 abstract description 6
- 230000000996 additive effect Effects 0.000 abstract description 6
- 238000005498 polishing Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 abstract description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 235000011149 sulphuric acid Nutrition 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- 238000013499 data model Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000008236 heating water Substances 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/34—Laser welding for purposes other than joining
- B23K26/342—Build-up welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Nozzles (AREA)
Abstract
The invention relates to the technical field of laser additive manufacturing, and aims to solve the problems that parts printed by the existing printing equipment have thermal shrinkage, need to be subjected to heat treatment, are low in precision, and meanwhile, a cutter is worn, gas is supplied, polishing processing at the later stage and the like all consume great time and cost in the printing process, and the printing efficiency is low; the electrode is arranged on the workbench, and the conveying pipeline is arranged between the mixer and the cantilever nozzle and used for connecting the mixer and the cantilever nozzle. The invention is especially suitable for the high-efficiency printing of submicron metal and has higher social use value and application prospect.
Description
Technical Field
The invention relates to the technical field of laser additive manufacturing, in particular to submicron-scale printing equipment and a printing method thereof.
Background
Metal additive manufacturing is one of the most important branches of additive manufacturing technology. The traditional metal additive manufacturing is a novel manufacturing technology for manufacturing a high-performance metal component by using metal powder/wire materials as raw materials, using high-energy beams (laser/electron beams/electric arcs/plasma beams and the like) as cutters, using a computer three-dimensional CAD data model as a basis, and melting and stacking the materials layer by layer under the control of software and a numerical control system by using a discrete-stacking principle.
The metal additive manufacturing has obvious advantages in the fields of printing small batches, special-shaped pieces and the like, and is favored by people. The part that current printing apparatus printed has thermal contraction, need carry out heat treatment, and the precision is lower, prints the in-process cutter wearing and tearing simultaneously, gas supply, later stage polishing processing etc. and all consumes very big time and cost, prints inefficiency. To this end, we propose a submicron-sized printing apparatus and a printing method thereof.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides submicron-grade printing equipment and a printing method thereof, overcomes the defects of the prior art, has reasonable design and compact structure, and aims to solve the problems that the parts printed by the prior printing equipment have thermal shrinkage, need to be subjected to heat treatment, have lower precision, consume great time and cost in the printing process, such as cutter abrasion, gas supply, later-stage grinding and the like, and have low printing efficiency.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme:
a submicron-scale printing device comprises a mixer for mixing printing materials, a conveying pipe for conveying the printing materials, a cantilever nozzle for jet printing of the printing materials, a workbench for forming a printing workpiece, and an electrode for obtaining electrons from positive ions of the printing materials;
the electrode is arranged on the workbench, and the material conveying pipe is arranged between the mixer and the cantilever nozzle and used for connecting the mixer and the cantilever nozzle;
the device also comprises a computer system arranged in the device, wherein the computer system is used for controlling the melting, mixing, inputting and outputting of printing material components in the mixer; controlling the temperature change of the printing material in the conveying pipe; controlling the XYZ direction moving speed of the cantilever nozzle and the spraying direction of the printing material; controlling the coordinate position of the printing material printed on the workbench; the voltage and current of the electrodes are monitored.
Preferably, the blender includes the hollow jar of body in inside, and the supporting legs is installed to the lower extreme of the jar body, and jar internal stirring impeller that is used for the compounding and the agitator motor who is used for driving stirring impeller that has put, and a plurality of component pan feeding mouths that are used for each component raw materials input are installed to the lateral wall upper portion of the jar body through-going, and the roof of the jar body is run through to install and is connect the trachea, and the lateral wall lower part of the jar body is run through to install the liquid outlet of connecting the conveying.
Preferably, the conveying pipeline includes the inner tube, and the both ends of inner tube are the material input port I of connecting the blender and the material delivery outlet of connecting the cantilever nozzle respectively, and the outside cover of inner tube is equipped with the outer tube, and is formed with the temperature control chamber between outer tube and the inner tube, and the both sides in temperature control chamber are equipped with the water inlet and the outlet that link up, and the temperature control intracavity is equipped with the electric heating wire that the multiunit is used for the temperature heating, and the temperature control intracavity still is equipped with a plurality of turbofan that are used for with higher speed rivers to flow and heat conduction.
Preferably, the air receiving pipe is a three-way pipe, the first connector is communicated with the top wall of the tank body, the second connector is communicated with the outside air, the third connector is connected with an inert gas source, and the third connector is provided with an opening and closing valve.
Preferably, one side of the temperature control cavity close to the water outlet is provided with a temperature sensor for detecting the temperature of water.
Preferably, the cantilever nozzle comprises a pipe body, one side of the pipe body, which is connected with the output end of the conveying pipe, is a material input port II, the middle of the pipe body expands outwards to form a micro material buffer area, the tail end of the pipe body is connected with the cantilever, a micro flow channel which is communicated with the pipe body is arranged in the cantilever, and the tail end of the cantilever is integrally formed with the material nozzle which is communicated with the micro flow channel.
Preferably, the nozzle opening of the material nozzle is of a quadrangular frustum pyramid structure, and the caliber of the nozzle opening is not more than 200 nm.
Preferably, the workbench comprises an outer cabin circular table, a solution cavity is formed inside the outer cabin circular table, a central circular table made of conductive materials is installed on the inner wall of the solution cavity through a plurality of longitudinal beams, the central circular table is immersed below the liquid level of molten-state solution in the solution cavity, a plurality of positioning bosses are integrally formed on the edge of the outer cabin circular table, and the central circular table is connected with the cathode of the electrode.
The invention also provides a printing method of the submicron-scale printing equipment, which comprises the following steps:
s1, enabling the raw materials of each component to enter a mixer through corresponding component feeding ports for full mixing, and inputting inert gas through a gas receiving pipe at the top of the mixer;
s2, the mixed printing material enters the cantilever nozzle after the temperature of the printing material is adjusted by the material conveying pipe, and is sprayed onto the central circular table of the workbench under the action of the material nozzle according to the movement track and the spraying speed of the cantilever;
s3, starting an electrode, enabling metal ions sprayed into liquid drops by a material nozzle to obtain electrons through an electrode cathode contacted on a workbench to generate metal to be attached to a central circular table, and enabling anions in the liquid drops to lose electrons near an electrode anode to achieve a closed loop of the whole circuit;
and S4, generating a layer of metal after each layer of spraying is finished by the cantilever nozzle, sequentially overlapping, and finally printing the part with the preset size.
Preferably, in step S1, the inert gas is nitrogen gas, which is used to enhance the mixing effect of the liquid and the spraying pressure of the printing material.
(III) advantageous effects
The embodiment of the invention provides submicron-grade printing equipment and a printing method thereof, which have the following beneficial effects:
1. according to the invention, a set of printing equipment is formed by mutually connecting and combining structures such as the mixer, the conveying pipe, the cantilever nozzle, the workbench and the like, so that submicron metal printing is finally realized, the printing efficiency is improved, and a new thought is provided for the fields of laser repair and the like.
2. According to the submicron printing equipment, through the cooperation with the electrode, metal ions in a printing material obtain electrons through the electrode cathode contacted on the workbench to generate metal, the metal is attached to the central circular table, and the anions in the liquid drops lose electrons near the electrode anode, so that the closed loop of the whole circuit is achieved, and the printing of a metal material with higher precision is realized.
Drawings
The above features, technical features, advantages and implementations of a submicron-scale printing apparatus and printing method thereof will be further described in the following description of preferred embodiments in a clearly understandable manner with reference to the accompanying drawings.
FIG. 1 is a schematic view of the construction of a submicron-scale printing device according to the present invention;
FIG. 2 is a schematic diagram of the mixer structure of the submicron-scale printing apparatus of the present invention;
FIG. 3 is a schematic view of a feeding tube of the submicron printing apparatus of the present invention;
FIG. 4 is a schematic diagram of a cantilever nozzle structure of a submicron-scale printing device according to the present invention;
FIG. 5 is a schematic view of a material nozzle structure of the submicron-sized printing apparatus of the present invention;
FIG. 6 is a schematic diagram of a stage of the submicron printing device of the present invention;
FIG. 7 is a diagram of the combined structure of the stage and the electrodes of the submicron-sized printing device according to the present invention.
In the figure: the device comprises a mixer 1, a tank body 101, a component feeding port 102, supporting legs 103, an air receiving pipe 104, an air outlet 105, a stirring impeller 106, a conveying pipe 2, a material inlet I201, a material outlet 202, an inner pipe 203, an outer pipe 204, a water inlet 205, a water outlet 206, a turbine fan 207, an electric heating wire 208, a temperature sensor 209, a cantilever nozzle 3, a material inlet II 301, a micro material buffer zone 302, a cantilever 303, a material nozzle 304, a nozzle port 3041, an electrode 4, a workbench 5, an outer cabin round platform 501, a longitudinal beam 502, a central round platform 503 and a positioning boss 504.
Detailed Description
The invention will be further illustrated with reference to the following figures 1 to 7 and examples:
a submicron-scale printing device is shown in figure 1 and comprises a mixer 1 for mixing printing materials, a conveying pipe 2 for conveying the printing materials, a cantilever nozzle 3 for jet printing of the printing materials, a workbench 5 for forming a printing workpiece, and an electrode 4 for obtaining electrons from positive ions of the printing materials;
the electrode 4 is arranged on the workbench 5, and the material conveying pipe 2 is arranged between the mixer 1 and the cantilever nozzle 3 and used for connecting the mixer 1 and the cantilever nozzle 3;
the device also comprises a computer system arranged in the device, wherein the computer system is used for controlling the melting, mixing, inputting and outputting of printing material components in the mixer 1; controlling the temperature change of the printing material in the material conveying pipe 2; controlling the XYZ direction moving speed of the cantilever nozzle 3 and the printing material spraying direction; controlling the coordinate position of the printing material printed on the workbench 5; the voltage and current of the electrode 4 are monitored.
In this embodiment, as shown in fig. 2, the material mixer 1 includes a hollow tank 101, a supporting leg 103 is installed at a lower end of the tank 101, a stirring impeller 106 for mixing and a stirring motor for driving the stirring impeller 106 are installed in the tank 10, a plurality of component material inlet ports 102 for inputting raw materials of each component are installed on an upper portion of a side wall of the tank 101 in a penetrating manner, a gas receiving pipe 104 is installed on a top wall of the tank 101 in a penetrating manner, a liquid outlet 105 connected with the gas delivery pipe 2 is installed on a lower portion of the side wall of the tank 101 in a penetrating manner, and a control valve is installed on the liquid.
In this embodiment, as shown in fig. 3, the conveying pipeline 2 includes an inner pipe 203, and the two ends of the inner pipe 203 are respectively a material input port i 201 connected to the mixer 1 and a material output port 202 connected to the cantilever nozzle 3, the outer side of the inner pipe 203 is sleeved with an outer pipe 204, and a temperature control cavity is formed between the outer pipe 204 and the inner pipe 203, the two sides of the temperature control cavity are provided with a water inlet 205 and a water outlet 206 which are through, a plurality of groups of electric heating wires 208 used for heating water are arranged in the temperature control cavity, and a plurality of turbine fans 207 used for accelerating the flow of water and the conduction of heat are further arranged in the temperature control cavity, so as to ensure the control of.
In this embodiment, as shown in fig. 2, the gas receiving pipe 104 is a three-way pipe, the first port is connected to the top wall of the tank 101 in a penetrating manner, the second port is communicated with the outside air, the third port is connected to an inert gas source, and an open-close valve is arranged on the third port, the open-close valve is closed, the gas receiving pipe 104 serves as a gas outlet, and gas accumulated or generated in the solution can be discharged; the on-off valve is opened, the gas receiving pipe 104 serves as a gas inlet, and inert gas is input to apply pressure to the solution to promote the reaction.
In this embodiment, as shown in fig. 3, a temperature sensor 209 for detecting water temperature is disposed on a side of the temperature control chamber close to the water outlet 206, and when the temperature sensor 209 of the water outlet 206 senses that the water temperature in the temperature control chamber is too high, the electric heating wires 208 may momentarily reduce the number of operations or power, and the turbine fan 207 may also accelerate the rotation speed to reduce the overall water temperature.
In this embodiment, as shown in fig. 4, the cantilever nozzle 3 includes a pipe body, one side of the pipe body connected to the output end of the feeding pipe 2 is a material input port ii 301, the middle portion of the pipe body expands outward to form a micro material buffer area 302, the end of the pipe body is connected to a cantilever 303, a micro flow channel connected to the pipe body is arranged in the cantilever 303, a material nozzle 304 connected to the micro flow channel is integrally formed at the end of the cantilever 303, and the material nozzle 304 sprays a material onto the substrate or a part to be repaired to form the substrate.
In this embodiment, as shown in fig. 5, the nozzle opening 3041 of the material nozzle 304 is a quadrangular frustum structure, and the aperture of the nozzle opening 3041 is not more than 200nm, which is suitable for processing and repairing miniature and high-precision parts.
In this embodiment, as shown in fig. 6 and 7, the workbench 5 includes an outer chamber circular truncated cone 501, a solution cavity is formed inside the outer chamber circular truncated cone 501, a central circular truncated cone 503 made of a conductive material is installed on an inner wall of the solution cavity through a plurality of longitudinal beams 502, the central circular truncated cone 503 is submerged below a liquid level of a molten solution in the solution cavity, a plurality of positioning bosses 504 are integrally formed at an edge of the outer chamber circular truncated cone 501 and used for fixedly installing the workbench 5, the central circular truncated cone 503 is connected with a cathode of the electrode 4, the central circular truncated cone 503 is a forming and fixing part of a substrate or a part, and during operation, cations of a printing material are ejected from the material nozzle 304 and are used for obtaining electrons at the cathode, the electrons are formed into metal, and then the metal workpiece is formed by.
Example 1
The invention provides a metal copper printing method based on submicron-level printing equipment, which comprises the following steps:
s1, CuSO4, H2SO4 and HCl enter the mixer 1 through the corresponding component feeding ports 102 respectively and are fully mixed, the feeding speeds are respectively 10g/min, 0.5mL/min and 1mL/min, and nitrogen is input into a gas receiving pipe 104 at the top of the mixer;
s2, adjusting the temperature of the mixed printing material to 60-70 ℃ through the material conveying pipe 2, then enabling the printing material to enter the cantilever nozzle 3, and spraying the printing material onto the central circular table 503 of the workbench 5 through the material nozzle 304 according to the motion track and the spraying speed of the cantilever;
s3, starting the electrode 4, enabling metal ions sprayed into liquid drops by the material nozzle 304 to obtain electrons through the cathode of the electrode 4 contacted with the worktable 5 to generate metal to be attached to the central circular truncated cone 503, and enabling anions in the liquid drops to lose electrons near the anode of the electrode 4 to achieve the closed loop of the whole circuit;
and S4, generating a layer of metal after each layer of spraying is finished by the cantilever nozzle, sequentially overlapping, and finally printing the metal copper part with the preset size.
In this embodiment, in the step S1, the input inert gas is nitrogen, which is used to enhance the mixing effect of the liquid and the spraying pressure of the printing material.
Example 2
The invention also provides a metallic nickel printing method based on the submicron-scale printing equipment, which comprises the following steps:
s1, NiSO4, H2SO4 and HCl enter the mixer 1 through the corresponding component feeding ports 102 respectively and are fully mixed, the feeding speeds are respectively 8g/min, 0.8mL/min and 1mL/min, and nitrogen is input through the air receiving pipe 104 at the top of the mixer;
s2, adjusting the temperature of the mixed printing material to 40-60 ℃ through the material conveying pipe 2, then enabling the printing material to enter the cantilever nozzle 3, and spraying the printing material onto the central circular table 503 of the workbench 5 through the material nozzle 304 according to the motion track and the spraying speed of the cantilever;
s3, starting the electrode 4, enabling metal ions sprayed into liquid drops by the material nozzle 304 to obtain electrons through the cathode of the electrode 4 contacted with the worktable 5 to generate metal to be attached to the central circular truncated cone 503, and enabling anions in the liquid drops to lose electrons near the anode of the electrode 4 to achieve the closed loop of the whole circuit;
and S4, generating a layer of metal after each layer of spraying is finished by the cantilever nozzle, sequentially overlapping, and finally printing the metal nickel part with the preset size.
In this embodiment, in the step S1, the input inert gas is nitrogen, which is used to enhance the mixing effect of the liquid and the spraying pressure of the printing material.
Example 3
The invention also provides a metallic silver printing method based on the submicron-scale printing equipment, which comprises the following steps:
s1, AgNO3, HNO3 and HCl enter the mixer 1 through the corresponding component feeding ports 102 respectively and are fully mixed, the feeding speeds are 12g/min, 1.0mL/min and 1mL/min respectively, and nitrogen is input through the air receiving pipe 104 at the top of the mixer;
s2, adjusting the temperature of the mixed printing material to 80-90 ℃ through the material conveying pipe 2, then enabling the printing material to enter the cantilever nozzle 3, and spraying the printing material onto the central circular table 503 of the workbench 5 through the material nozzle 304 according to the motion track and the spraying speed of the cantilever;
s3, starting the electrode 4, enabling metal ions sprayed into liquid drops by the material nozzle 304 to obtain electrons through the cathode of the electrode 4 contacted with the worktable 5 to generate metal to be attached to the central circular truncated cone 503, and enabling anions in the liquid drops to lose electrons near the anode of the electrode 4 to achieve the closed loop of the whole circuit;
and S4, generating a layer of metal after each layer of spraying is finished by the cantilever nozzle, sequentially overlapping, and finally printing the metal silver part with the preset size.
In this embodiment, in the step S1, the input inert gas is nitrogen, which is used to enhance the mixing effect of the liquid and the spraying pressure of the printing material.
The embodiments of the present invention are disclosed as the preferred embodiments, but not limited thereto, and those skilled in the art can easily understand the spirit of the present invention and make various extensions and changes without departing from the spirit of the present invention.
Claims (10)
1. A submicron-scale printing device is characterized by comprising a mixer (1) for mixing printing materials, a conveying pipe (2) for conveying the printing materials, a cantilever nozzle (3) for jet printing of the printing materials, a workbench (5) for forming a printing workpiece, and an electrode (4) for obtaining electrons from cations of the printing materials;
the electrode (4) is arranged on the workbench (5), and the material conveying pipe (2) is arranged between the mixer (1) and the cantilever nozzle (3) and used for connecting the mixer (1) and the cantilever nozzle (3);
the device also comprises a computer system arranged in the device, and the computer system is used for controlling the melting mixing, inputting and outputting of printing material components in the mixer (1); controlling the temperature change of the printing material in the material conveying pipe (2); controlling the XYZ direction moving speed of the cantilever nozzle (3) and the printing material spraying direction; controlling the coordinate position of the printing material printed on the workbench (5); the voltage and current of the electrode (4) are monitored.
2. A submicron-sized printing device according to claim 1, characterized in that: blender mixer (1) is including inside hollow jar body (101), and supporting legs (103) are installed to the lower extreme of jar body (101), jar body (10) embeds there are stirring impeller (106) that are used for the compounding and the agitator motor who is used for driving stirring impeller (106), a plurality of component pan feeding mouths (102) that are used for each component raw materials input are installed to the lateral wall upper portion of jar body (101) through lining up, link up on the roof of jar body (101) and install and connect trachea (104), the lateral wall lower part of jar body (101) is link up and is installed liquid outlet (105) of connecting conveying pipeline (2).
3. A submicron-sized printing device according to claim 1, characterized in that: conveying pipeline (2) include inner tube (203), and the both ends of inner tube (203) are material input port I (201) of connecting blender mixer (1) and material delivery outlet (202) of connecting cantilever nozzle (3) respectively, the outside cover of inner tube (203) is equipped with outer tube (204), and be formed with the control by temperature change chamber between outer tube (204) and inner tube (203), the both sides in control by temperature change chamber are equipped with water inlet (205) and outlet (206) that link up, the control by temperature change intracavity is equipped with multiunit electric heating wire (208) that are used for the temperature heating, and the control by temperature change intracavity still is equipped with a plurality of turbofan (207) that are used for with higher speed water to flow and heat conduction.
4. A submicron-sized printing device according to claim 2, characterized in that: the air receiving pipe (104) is a three-way pipe, the first connector is communicated with the top wall of the tank body (101), the second connector is communicated with the outside air, the third connector is connected with an inert gas source, and an opening and closing valve is arranged on the third connector.
5. A submicron-sized printing device according to claim 3, characterized in that: and a temperature sensor (209) for detecting the water temperature is arranged on one side of the temperature control cavity close to the water outlet (206).
6. A submicron-sized printing device according to claim 1, characterized in that: cantilever nozzle (3) include the body, and one side that conveying pipeline (2) output was connected to the body is material input port II (301), and the middle part of body outwards expands and is formed with miniature material buffer (302), and the end-to-end connection of body has cantilever (303), and is equipped with the miniature runner of through connection body in cantilever (303), and the terminal integrated into one piece of cantilever (303) has material nozzle (304) of through connection miniature runner.
7. A submicron-sized printing device according to claim 1, characterized in that: the nozzle opening (3041) of the material nozzle (304) is of a quadrangular frustum pyramid structure, and the caliber of the nozzle opening (3041) is not more than 200 nm.
8. A submicron-sized printing device according to claim 1, characterized in that: the working table (5) comprises an outer cabin circular table (501), a solution cavity is formed inside the outer cabin circular table (501), a central circular table (503) made of conductive materials is mounted on the inner wall of the solution cavity through a plurality of longitudinal beams (502), the central circular table (503) is immersed below the liquid level of molten state solution in the solution cavity, a plurality of positioning bosses (504) are integrally formed on the edge of the outer cabin circular table (501), and the central circular table (503) is connected with a cathode of the electrode (4).
9. A method of printing with a submicron-scale printing device, comprising the steps of:
s1, enabling the raw materials of each component to enter a mixer (1) through corresponding component feeding ports (102) for fully mixing, and inputting inert gas through a gas receiving pipe (104) at the top of the mixer;
s2, the mixed printing material enters the cantilever nozzle (3) after the temperature of the printing material is adjusted by the material conveying pipe (2), and is sprayed onto the central circular table (503) of the workbench (5) under the action of the material nozzle (304) according to the motion track and the spraying speed of the cantilever;
s3, starting an electrode (4), enabling metal ions sprayed into liquid drops by a material nozzle (304) to obtain electrons through a cathode of the electrode (4) contacted with a workbench (5) to generate metal attached to a central circular truncated cone (503), and enabling anions in the liquid drops to lose electrons near an anode of the electrode (4) to achieve closed loop of the whole circuit;
and S4, generating a layer of metal after each layer of spraying is finished by the cantilever nozzle (3), sequentially overlapping, and finally printing the part with the preset size.
10. A method of printing by a submicron-sized printing device according to claim 9, characterized in that: in the step S1, the input inert gas is nitrogen gas, which is used to enhance the mixing effect of the liquid and the spraying pressure of the printing material.
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