CN103774194A - Electroplating equipment for LED lead wire framework - Google Patents
Electroplating equipment for LED lead wire framework Download PDFInfo
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- CN103774194A CN103774194A CN201310507891.5A CN201310507891A CN103774194A CN 103774194 A CN103774194 A CN 103774194A CN 201310507891 A CN201310507891 A CN 201310507891A CN 103774194 A CN103774194 A CN 103774194A
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- lead frame
- electroplating
- silver
- led lead
- electroplate liquid
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Abstract
The invention discloses electroplating equipment for LED lead wire framework. The electroplating equipment comprises a pressure plate, an upper electrode, an upper baseplate, an upper bottom plate, an upper mold, a lower mold, a lower bottom plate, a lower baseplate, a spray plate and a lower electrode, wherein the upper electrode, the upper baseplate, the upper bottom plate and the upper mold are fixed under the pressure plate in sequence; the lower mold and the lower bottom plate are fixed on the lower baseplate in sequence; the lower electrode and the spray plate are mounted under the lower baseplate; hollowed out holes are formed in both the upper mold and the lower mold in positions corresponding to parts to be electroplated; through holes, through which an electroplating solution flows, are formed in the upper baseplate, the upper bottom plate, the lower bottom plate, the lower baseplate and the spray plate. The electroplating equipment is used for selective electroplating of disposable functional areas on both sides of the LED lead wire framework.
Description
Present patent application is divisional application.The application number of original bill is: 201010177157.3, and the applying date is: 2010-05-07, denomination of invention is: a kind of LED lead frame and electro-plating method and electroplating device.
Technical field
The present invention relates to a kind of LED lead frame, and relevant with the electroplating device of this LED lead frame.
Background technology
In prior art, the structure of LED lead frame as shown in Figure 1, Figure 2 and Figure 3, whole lead frame 100 all silver-plated 200.
Coordinate shown in Fig. 4, when its plating, technical process is as follows: electrochemical deoiling → electrolytic degreasing → washing → pickling → washing → copper facing → washing → all electrosilverings (or whole electrosilvering → functional zone parcel plating silver) → silver recovery → washing → strip → washing → neutralization → washing → hot water wash → oven dry, wherein all electroplating is that whole lead frame is all silver-plated.
In technical process, the effect of each step is as follows:
Electrochemical deoiling and electrolytic degreasing are all in order to remove the grease on LED lead frame.
Washing has two effects, and first, clean LED lead frame, second, clean and remain in LED lead frame Qian road liquid medicine, after guaranteeing, road liquid medicine is not contaminated.The number of times of washing can be for once or repeatedly.
Pickling remains in the degreasing fluid above LED framework with electrolytic degreasing in being, activation LED lead frame surface, makes to electroplate silver layer and framework bonding force is more firm.The number of times of pickling can be for once or secondary.
Copper facing is raising silver layer and copper layer bonding force, and improves the planeness on copper layer surface.
All silver-plated is all to electroplate silver on framework surface.As Fig. 3, the two-sided above silver of all electroplating of LED lead frame.
Functional zone (containing chip rest area) local silver-plating is at framework positive function district part parcel plating silver, and thickening silver layer, meets the requirements of the customers function area part silver thickness.
Silver recovery is the silver-plated liquid medicine that remains in LED lead frame in order to reclaim, and can clean lead frame.
Strip is that silver layer surface is carried out to polishing, makes the luminance brightness of silver layer surface meet client's requirement.
Neutralization is the strip liquid medicine that neutralization remains in LED lead frame.
Hot water wash is thoroughly to clean LED lead frame surface, guarantees that framework is clean.
Adopt existing method to electroplate, whole lead frame is all electroplated silver, silver is also electroplated in nonfunctional area (frame), only adopts whole electrosilverings if there is no functional zone parcel plating silver operation, and the silver-plated thickness of frame can be equally thick with functional zone, and, in order to guarantee the silver-plated thickness of chip rest area, the silver-plated thickness in whole functional zone is the same with chip rest area again, thus, cause silver-colored utilization ratio very low, production cost is high.Bonding force between silver layer and plastics is little simultaneously, in the time that client encapsulates, may cause layering between silver layer and plastics, affects the quality of LED product.
In view of this, the inventor improves for the electroplating technology of existing LED lead frame, then has this case to produce.
Prior art
The present invention
12 chip rest areas 13, functional zone
No. 14 silvered films 15 of anti-displacement protective membrane
Secondary silvered film 16 organic protective films 17
Patrix 22 counterdies 23
Jet tray 26 electrodes 27
Upper plate 34 patrixes 35
Counterdie 36 lower shoes 37
Hypocoxa 38 jet trays 39
Hollow hole 42 through holes 43
Summary of the invention
The object of the present invention is to provide a kind of LED lead frame electroplating device, the electroplating technology that utilizes the LED lead frame of this LED lead frame electroplating device realization, can effectively utilize argent, reduces costs, the bonding force that improves plastics and lead frame, reaches anti-layering object.
To achieve these goals, technical scheme of the present invention is as follows:
A kind of electroplating device of LED lead frame, formed by pressing plate, top electrode, upper substrate, upper plate, upper die and lower die, lower shoe, hypocoxa, jet tray and lower electrode, the below of pressing plate is fixed top electrode, upper substrate, upper plate and patrix successively, counterdie and lower shoe are fixed on the top of hypocoxa successively, lower electrode and jet tray are installed in the below of hypocoxa, upper die and lower die all form hollow hole to the position in requisition for electroplating, and have the through hole flowing through for electroplate liquid on upper substrate, upper plate, lower shoe, hypocoxa and jet tray.This equipment is applicable to the two-sided disposable functional zone of front and back and selects parcel plating operation.
Adopt after such scheme, the present invention compared with prior art:
One, positive function of the present invention district, functional zone, the back side and chip rest area all adopt selection parcel plating mode to realize and only electroplate effective district part, frame is not electroplated, the silvered film of chip rest area is thicker than functional zone, whole lead frame electrosilvering aspect is long-pending only for existing methodical 37.09%, reduces production costs; And the whole lead frame of prior art is all electroplated upper silver, production cost is high;
Two, the present invention is in the time that client encapsulates, and lead frame part copper layer contacts with plastics with silver layer, and copper layer is larger than the bonding force of silver layer and plastics with the bonding force of plastics, thereby improves the bonding force of framework and plastics, prevents framework and plastics layering; And bonding force between the whole silver layers of prior art lead frame and plastics is relative little, may cause lead frame and plastics layering in client's encapsulation process.
In a word, it is long-pending that the present invention has greatly reduced electrosilvering aspect, and argent is effectively used, and has reduced electroplating cost, and improves the bonding force of plastics and lead frame, reaches anti-layering object, has improved the quality of LED product.
Below in conjunction with the drawings and the specific embodiments, the present invention is described in further details.。
Accompanying drawing explanation
Fig. 1 is the front view of LED lead frame in prior art;
Fig. 2 is the rear view of LED lead frame in prior art;
Fig. 3 is the cross section enlarged view of LED lead frame in prior art;
Fig. 4 is the plating schema of LED lead frame in prior art;
Fig. 5 is the front view of LED lead frame of the present invention;
Fig. 6 is the rear view of LED lead frame of the present invention;
Fig. 7 is the cross section enlarged view of LED lead frame of the present invention;
Fig. 8 is the plating schema of LED lead frame of the present invention;
Fig. 9 is electroplating device one structural representation of LED lead frame of the present invention;
Figure 10 is the electroplating device one of the LED lead frame of the present invention schematic diagram of working;
Figure 11 is electroplating device two structural representations of LED lead frame of the present invention;
Figure 12 is the electroplating device two of the LED lead frame of the present invention schematic diagram of working.
Label declaration
Embodiment
Now the present invention is further described with embodiment by reference to the accompanying drawings.
Referring to shown in Fig. 5 to Fig. 7, is a kind of LED lead frame 10 that the present invention discloses, and is divided into frame 11, functional zone 12 and 13 3 of chip rest areas part.On whole lead frame 10, form anti-displacement protective membrane 14.On whole functional zone 12, form a silvered film 15 through selection electrosilvering.On chip rest area 13, form secondary silvered film 16 again through parcel plating silver, the silvered film (comprise a silvered film 15 and secondary silvered film 16) that makes chip rest area 13 is thicker than the silvered film of functional zone 12 around (only once silvered film 15).On frame 11, form anti-copper oxidation organic protective film 17.
As shown in Figure 8, be the electro-plating method of the present invention's LED lead frame of pointing out, technical process is as follows:
First, electroplate front surface processing.Electrochemical deoiling → electrolytic degreasing → washing → pickling → washing → copper facing → washing → anti-displacement processing → washing.
Electrochemical deoiling and electrolytic degreasing are all in order to remove the grease on LED lead frame.
Washing has two effects, and first, clean LED lead frame, second, clean and remain in LED lead frame Qian road liquid medicine, after guaranteeing, road liquid medicine is not contaminated.The number of times of washing can be for once or repeatedly.
Pickling remains in the degreasing fluid above LED framework with electrolytic degreasing in being, activation LED lead frame surface, makes to electroplate silver layer and framework bonding force is more firm.The number of times of pickling can be for once or secondary.
Copper facing is raising silver layer and copper layer bonding force, and improves the planeness on copper layer surface.
The present invention has also increased anti-displacement processing in plating front surface is processed; copper substrate surface at LED lead frame forms the anti-displacement protective membrane of one deck, makes lead frame in silver-plated or silver recovery process, when not charged; not with electroplate liquid generation replacement(metathesis)reaction, improve silver layer bonding force.The concrete anti-displacement liquid medicine (solution being formed by silver potassium cyanide, Mei Taile liquid medicine supplier's conducting salt Adjusting Salts and Mei Taile liquid medicine supplier's anti-displacement liquid Supre DIPA-5T) that adopts, processing parameter: at room temperature, in corresponding electroplate liquid, silver (Ag) concentration is 1.0～10.0g/l, when conducting salt concentration is 5～25g/l, anti-displacement chemical concentration is 10～50ml/l.
Then, carry out electroplating processes.The present invention adopts selection parcel plating mode to realize and only electroplates effective district part, and frame is not electroplated, and the silvered film of chip rest area is thicker than functional zone.
Concrete operation has three kinds of forms:
The first, electrosilvering is selected in functional zone, the first back side, then electrosilvering is selected, last chip rest area parcel plating silver by positive function district;
The second, electrosilvering is selected in first positive function district, then electrosilvering is selected, last chip rest area parcel plating silver in functional zone, the back side;
The third, electrosilvering is selected in the two-sided disposable functional zone of front and back, then chip rest area parcel plating silver.
As shown in Figure 9 and Figure 10, be a kind of electroplating device 20 that the present invention discloses, this equipment is applicable to functional zone, the back side and selects electrosilvering, positive function district to select the one side of electrosilvering or chip rest area parcel plating silver to select parcel plating operation.This equipment is made up of pressing plate 21, patrix 22, counterdie 23, base plate 24, substrate 25, jet tray 26 and electrode 27.Patrix 22 is atresia flat board, can adopt silica gel to make, and patrix 22 is fixed on the below of pressing plate 21.Counterdie 23 forms hollow hole 28 to the position in requisition for electroplating, and can adopt silica gel to make, and counterdie 23 is fixed on base plate 24, and base plate 24 is fixed on substrate 25, the below installing electrodes 27 of substrate 25 and jet tray 26.On base plate 24, substrate 25 and jet tray 26, have the through hole 29 that flows through (seeing shown in Figure 10 arrow) for electroplate liquid.
When use, as selected electrosilvering in functional zone, the back side, lead frame 10 is faced up to the back side towards being placed down on counterdie 23, by pressing plate 21, patrix 22 to the front that presses to patrix 22 and be fitted in lead frame 10, compress by pressing plate 21, make patrix 22 and counterdie 23 be close to the front and back of lead frame 10; Before plating, electroplate liquid does not spray upward, and electroplate liquid does not contact with lead frame 10, as shown in Figure 9; When plating, electroplate liquid sprays upward through the through hole 29 of jet tray 26, substrate 25 and base plate 24, be subject to the obstruction of patrix 22, counterdie 23, electroplate liquid contacts the back side through hollow hole 28 needs silver-plated region, and electroplate liquid sprays less than front, by electrolysis silver in the parcel plating of the back side of lead frame 10 electroplate liquid contact, all the other are not electroplated by counterdie 23 cover parts, as Figure 10.
This equipment selects electrosilvering the same with the operation of chip rest area parcel plating silver for positive function district, does not repeat at this.
As shown in Figure 11 and Figure 12, be the another kind of electroplating device 30 that the present invention discloses, this equipment is applicable to the disposable two-sided functional of front and back district and selects parcel plating operation.This equipment is made up of pressing plate 31, top electrode 32, upper substrate 33, upper plate 34, patrix 35, counterdie 36, lower shoe 37, hypocoxa 38, jet tray 39 and lower electrode 40.The below of pressing plate 31 is fixed top electrode 32, upper substrate 33, upper plate 34 and patrix 35 successively.Counterdie 36 and lower shoe 37 are fixed on the top of hypocoxa 38 successively, and lower electrode 40 and jet tray 39 are installed in the below of hypocoxa 38.Patrix 35 and counterdie 36 all form hollow hole 41,42 to the position in requisition for electroplating.On upper substrate 33, upper plate 34, lower shoe 37, hypocoxa 38 and jet tray 39, have the through hole 43 that flows through (seeing shown in Figure 12 arrow) for electroplate liquid.
When use, lead frame 10 is faced up to the back side towards being placed down on counterdie 36, pressing plate 31, to the front that presses to patrix 35 and be fitted in lead frame 10, is compressed by pressing plate 31, make patrix 35 and counterdie 36 be close to the front and back of lead frame 10; Before plating, electroplate liquid does not spray upward, and electroplate liquid does not contact with lead frame 10, as shown in figure 11; When plating, electroplate liquid sprays upward through the through hole 43 of jet tray 39, hypocoxa 38, lower shoe 37, upper plate 34 and upper substrate 33, be subject to the obstruction of patrix 35, counterdie 36, electroplate liquid process hollow hole 41 contacts the back side with 42, front needs silver-plated region, and sprayed less than just not electroplating by patrix 35, counterdie 36 cover part electroplate liquids, as Figure 12.
Finally, electroplate aftertreatment, silver recovery → washing → strip → washing → neutralization → washing → anti-copper oxide treatment → washing → hot water wash → oven dry.
Silver recovery is the silver-plated liquid medicine that remains in LED lead frame in order to reclaim, and can clean lead frame.
Strip is that silver layer surface is carried out to polishing, makes the luminance brightness of silver layer surface meet client's requirement.
Neutralization is the strip liquid medicine that neutralization remains in LED lead frame.
Hot water wash is thoroughly to clean LED lead frame surface, guarantees that framework is clean.
The present invention has also increased anti-copper oxide treatment in hot water wash with in before drying, and is to form one deck organic protective film on copper layer surface, copper layer is exposed in air not oxidized.Concrete technology is, at room temperature, adopts copper protection liquid medicine (copper protection is the copper protection liquid medicine CuPRoTEC that ROHM AND HAAS liquid medicine company provides), and concentration is 10-50ml/l, forms one deck organic protective film on copper layer surface.
Emphasis of the present invention is to utilize to select parcel plating to replace all plating.Above embodiment is the further explanation to this case, but not restriction to interest field, and all modifications of doing according to this case spirit and variation all should fall into the protection category of this case.
Claims (2)
1. the electroplating device of a LED lead frame, it is characterized in that: formed by pressing plate, top electrode, upper substrate, upper plate, upper die and lower die, lower shoe, hypocoxa, jet tray and lower electrode, the below of pressing plate is fixed top electrode, upper substrate, upper plate and patrix successively, counterdie and lower shoe are fixed on the top of hypocoxa successively, lower electrode and jet tray are installed in the below of hypocoxa, upper die and lower die all form hollow hole to the position in requisition for electroplating, and have the through hole flowing through for electroplate liquid on upper substrate, upper plate, lower shoe, hypocoxa and jet tray.
2. the electroplating device of LED lead frame as claimed in claim 1, it is characterized in that: when this electroplating device is selected electrosilvering and local electrosilvering, lead frame is faced up to the back side towards being placed down on counterdie, by pressing plate to the front that presses to patrix and be fitted in lead frame, compress by pressing plate, make upper die and lower die be close to the front and back of lead frame; Before plating, electroplate liquid does not spray upward, and electroplate liquid does not contact with lead frame; When plating, electroplate liquid sprays upward through the through hole of jet tray, hypocoxa, lower shoe, upper plate and upper substrate, be subject to the obstruction of upper die and lower die, electroplate liquid is through hollow hole and contact the back side, positive need silver-plated region, and is sprayed less than just not electroplating by upper die and lower die cover part electroplate liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310507891.5A CN103774194B (en) | 2010-05-07 | 2010-05-07 | A kind of electroplating device of LED lead frame |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310507891.5A CN103774194B (en) | 2010-05-07 | 2010-05-07 | A kind of electroplating device of LED lead frame |
| CN201010177157.3A CN101867009B (en) | 2010-05-07 | 2010-05-07 | LED lead frame and electroplating method and electroplating equipment thereof |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010177157.3A Division CN101867009B (en) | 2010-05-07 | 2010-05-07 | LED lead frame and electroplating method and electroplating equipment thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103774194A true CN103774194A (en) | 2014-05-07 |
| CN103774194B CN103774194B (en) | 2016-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310507891.5A Expired - Fee Related CN103774194B (en) | 2010-05-07 | 2010-05-07 | A kind of electroplating device of LED lead frame |
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| CN (1) | CN103774194B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105271807A (en) * | 2015-04-02 | 2016-01-27 | 常州雅谱智能变色光学器件有限公司 | Film plating template and method used for producing ITO glass plated with EC film |
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2010
- 2010-05-07 CN CN201310507891.5A patent/CN103774194B/en not_active Expired - Fee Related
Patent Citations (6)
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| JPS62263992A (en) * | 1986-05-08 | 1987-11-16 | Hitachi Cable Ltd | Partial plating method |
| JPH1081992A (en) * | 1996-09-02 | 1998-03-31 | Dainippon Printing Co Ltd | Partial plating device of lead frame and partial plating method |
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Non-Patent Citations (1)
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| 冯小龙: ""连续高速电镀技术在集成电路引线框架生产中的应用"", 《电镀与涂饰》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105271807A (en) * | 2015-04-02 | 2016-01-27 | 常州雅谱智能变色光学器件有限公司 | Film plating template and method used for producing ITO glass plated with EC film |
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| CN103774194B (en) | 2016-08-24 |
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