CN104105361A - Method for selective plating of conductive hole of circuit board - Google Patents
Method for selective plating of conductive hole of circuit board Download PDFInfo
- Publication number
- CN104105361A CN104105361A CN201410190917.2A CN201410190917A CN104105361A CN 104105361 A CN104105361 A CN 104105361A CN 201410190917 A CN201410190917 A CN 201410190917A CN 104105361 A CN104105361 A CN 104105361A
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- Prior art keywords
- hole
- copper
- conductive
- circuit board
- plate
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- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 53
- 238000007747 plating Methods 0.000 title abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 120
- 239000010949 copper Substances 0.000 claims abstract description 98
- 229910052802 copper Inorganic materials 0.000 claims abstract description 98
- 239000010410 layer Substances 0.000 claims abstract description 63
- 238000005260 corrosion Methods 0.000 claims abstract description 25
- 239000011241 protective layer Substances 0.000 claims abstract description 20
- 238000009713 electroplating Methods 0.000 claims description 52
- 239000007788 liquid Substances 0.000 claims description 50
- 239000003814 drug Substances 0.000 claims description 46
- 239000000463 material Substances 0.000 claims description 39
- 238000005530 etching Methods 0.000 claims description 29
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 25
- 239000003292 glue Substances 0.000 claims description 25
- 229920006267 polyester film Polymers 0.000 claims description 17
- 239000011888 foil Substances 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000003618 dip coating Methods 0.000 claims description 4
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 239000002893 slag Substances 0.000 claims description 2
- 230000007797 corrosion Effects 0.000 abstract description 9
- 238000005553 drilling Methods 0.000 abstract description 6
- 239000000126 substance Substances 0.000 abstract description 5
- 238000003912 environmental pollution Methods 0.000 abstract description 2
- 238000005253 cladding Methods 0.000 abstract 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 23
- 238000004519 manufacturing process Methods 0.000 description 22
- 239000011889 copper foil Substances 0.000 description 21
- 238000005516 engineering process Methods 0.000 description 13
- 239000000243 solution Substances 0.000 description 12
- 238000007639 printing Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 239000002253 acid Substances 0.000 description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 235000011121 sodium hydroxide Nutrition 0.000 description 8
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 6
- 230000035939 shock Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000003112 inhibitor Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000010970 precious metal Substances 0.000 description 3
- 238000011536 re-plating Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 241001074085 Scophthalmus aquosus Species 0.000 description 2
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- 206010070834 Sensitisation Diseases 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical class C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000001055 chewing effect Effects 0.000 description 1
- BQJTUDIVKSVBDU-UHFFFAOYSA-L copper;sulfuric acid;sulfate Chemical compound [Cu+2].OS(O)(=O)=O.[O-]S([O-])(=O)=O BQJTUDIVKSVBDU-UHFFFAOYSA-L 0.000 description 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000008313 sensitization Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a method for selective plating of a conductive hole of a circuit board. The method comprises the following steps of: 1) covering the two surfaces of a copper-cladding plate with corrosion-resistant protective layers; 2) drilling a base hole of the conductive hole; 3) forming a conductive layer on the inner surface of the base hole; 4) plating copper on the inner surface of the base hole through the conductive layer; and 5) removing the corrosion-resistant protective layers. With the adoption of the method disclosed by the invention, copper and chemicals can be saved greatly, environmental pollution is light, moreover, projecting annular copper edge is prevented from being formed in the conductive hole of the circuit board, the edge of a via hole is not required to grind, and the finished product rate of the circuit board is high.
Description
[technical field]
The present invention relates to process for manufacturing circuit board, relate in particular to a kind of method of circuit board selective electroplating conductive hole.
[background technology]
The technique of traditional printing via-hole of circuit board metallization and circuit pattern moulding process, double-sided multi-layer and flexible circuit board is: copper-clad plate sawing sheet → CNC boring → surperficial nog plate (surperficial Copper Foil corrosion inhibitor) → circuit board chemical plating hole metallization → circuit board face electro-coppering or the thick copper of electroplating surface → surperficial nog plate → printing photosensitive-ink or paste and in light-sensitive surface → circuit pattern film exposure → figure development → plate face oil removing → pattern plating copper → graphic plating tin → circuit pattern striping → circuit board etching → circuit board plate face and hole, move back tin or the cleaning of the protection photosensitive dry film of the plate upper thread Lu Yukong face of decorporating → nog plate proceeds to and prints welding resistance ink.
The existing following shortcoming of traditional circuit-board production Technology:
(1) in traditional circuit-board production process: for the copper thickening in via, through thick in order to make the copper coat of metal in the hole of the via on circuit board reach certain thickness 18 μ m～25 μ m copper on the circuit board of electroless copper plating, Gu when electroplating on the thick Copper Foil of former Copper Foil 12 μ m～36 μ m copper on copper-clad plate operation block or circuit board pattern surface with via simultaneously together with re-plating hole copper part and exceed the copper layer of the part of hole copper, the surface area of via-hole of circuit board is approximately the 10%-20% of board surface area, because solving in traditional handicraft, only electroplate the not technical barrier of electroplating circuit board face of via, so that hole copper reaches certain hole copper thickness to copper facing again on copper foil of copper-clad plate, cause circuit board lateral erosion etching when circuitous pattern etching unclean, via hole copper is eclipsed disconnected, the problems such as Kong Wutong, affect the quality of circuit board, cause the waste of copper resource.
(2) in traditional circuit board production technology, when making precision thin circuit, for the hole copper thickness of via, to reach certain copper thick, will pass through corrosion inhibitor line, first that the Copper Foil corrosion inhibitor on copper-clad plate surface is thin, after corrosion inhibitor, circuit board is the required thickness that reaches hole copper, via after electroless copper plating is electroplated together with circuit board surface, so the wasting of resources of re-plating layer of copper copper is higher on the copper foil circuit board of again corrosion inhibitor being crossed, while making precision thin circuit, difficulty is high, and operation is loaded down with trivial details.
(3) traditional circuit board production technology production link is many.When with sensitization circuit oil circuitous pattern processed, also need to add plating pure tin protective layer; and also the protective layer used nitric acid type of the pure tin of plating tin stripping liquid will be returned tin layer after etching circuitous pattern; wasted precious metal again because using strong erosion nitric acid type tin stripping liquid; increase wastewater discharge, and caused environmental pollution.
(4) when traditional circuit board production technology particularly needs the layer of precious metal such as gold-plated, nickel tin on to circuit board; traditional handicraft is to plate layer of precious metal on full circuit board circuit pattern and via surface; particularly after zinc-plated etching protection layer, also to erode again or board circuit pattern surface and via surface gold-plating, nickel are done etch protection layer; cause the significant wastage of noble metal and chemicals, contaminated environment.In order to overcome the shortcoming of traditional circuit board production technology, patent of invention 200710073024.X discloses a kind of printed circuit board mask hole electroplating molding process, comprises the following steps: (1) selects the metallized copper-clad plate piece of via or circuit board; (2) printing photosensitive-ink or subsides photosensitive dry film, and make photosensitive-ink dry; (3) with light is painted position, via hole or welding position or the local film that will thicken of circuit part, contraposition exposure; (4) develop and expose position, via hole or welding position or local required room or the welding position that will thicken of circuit part after exposure light is solid; (5) carry out mask plating hole, to required thickness; (6) ink or the photosensitive dry film except surface, covered, obtain position, via hole or welding position or local copper-clad plate piece or the circuit board that will thicken of circuit part.This patent of invention adopts selective electroplating conductive hole, and saving copper, other metals and chemicals, low in the pollution of the environment greatly.
The shortcoming of the disclosed method of this patent of invention is: when via mask hole electroplating hole, the limit, hole of via is higher than the circuit copper face of circuit board, need to grind the annular copper bound that protrude on via limit with grinder, because the thickness of copper-clad plate is also inhomogeneous, thickness deviation is in 10% left and right, when grinding conductive hole limit, be easy to circuit board to grind off compared with the circuit of thickness portion, reduced circuit board rate of finished products.
[summary of the invention]
The conductive hole that the technical problem to be solved in the present invention is to provide a kind of circuit board can not form the annular copper bound of protrusion, does not need to grind limit, via hole, the plating hole method of the circuit board selective electroplating conductive hole that circuit board rate of finished products is high.
In order to solve the problems of the technologies described above, the technical solution used in the present invention is that a kind of method of circuit board selective electroplating conductive hole, comprises the following steps:
101) two plate faces at copper coated foil plate cover anti-corrosion protective layer;
102) bore conductive hole datum hole;
103) at datum hole inner surface, form conductive layer;
104) by described conductive layer in the copper facing of datum hole inner surface, at the electroplating surfaces with tin of hole copper;
105) remove anti-corrosion protective layer.
The method of above-described circuit board selective electroplating conductive hole, described anti-corrosion protective layer comprises resist ink layer and the polyester film of pasting on resist ink layer, described conductive layer is Organic Conductive Films; Polyester film is in step 103) remove later, resist ink layer is in step 104) remove, resist ink layer carries out etching, removal tin coating after etching completes after removing. later
The method of above-described circuit board selective electroplating conductive hole, described anti-corrosion protective layer is the ink layer of anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine, described conductive layer is Organic Conductive Films; The ink layer of anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine is in step 104) with sodium hydrate aqueous solution, remove later; Anti-corrosion protective layer carries out etching after removing, and removes unnecessary copper on plate, removal tin coating after etching completes.
The method of above-described circuit board selective electroplating conductive hole, comprises de-smear step, and de-smear step is removed the glue slag in multilayer copper-clad paper tinsel plate datum hole; De-smear step is in step 102) and step 103) between complete.
The method of above-described circuit board selective electroplating conductive hole, in step 101) be included in before on plate face and print photosensitive material, exposure, the rear step that forms required conductive pattern of developing; After completing, etching comprises the step that strips photosensitive material.
The method of above-described circuit board selective electroplating conductive hole, in step 101) comprise before the step of boring location hole and direction hole.
The method of above-described circuit board selective electroplating conductive hole, in step 102) in bore conductive hole datum hole and bore location hole, carry out simultaneously in direction hole.
The method of above-described circuit board selective electroplating conductive hole, described anti-corrosion protective layer is the peelable glue of anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine, described conductive layer is Organic Conductive Films; The peelable glue of anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine is in step 104) remove later; After anti-corrosion protective layer removal, again to plate face dip-coating photosensitive material, after photosensitive material exposure, development, form required conductive pattern; Then, unnecessary copper on etched plate, removes tin coating and photosensitive material after etching completes again.
The method of above-described circuit board selective electroplating conductive hole, described anti-corrosion protective layer is the polyester film of pasting on plate face, and the adhesive of polyester film is silicone rubber adhesive, and described conductive layer is Organic Conductive Films; Polyester film is in step 103) remove later, resist ink layer is in step 104) remove later.
The method of circuit board selective electroplating conductive hole of the present invention, not only greatly saving copper and chemicals, low in the pollution of the environment, and the conductive hole of circuit board can not form the annular copper bound of protrusion, do not need to grind limit, via hole, and circuit board rate of finished products is high.
[accompanying drawing explanation]
Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.
Fig. 1 is the schematic diagram that the embodiment of the method 1 of circuit board selective electroplating conductive hole of the present invention is bored direction hole and location hole.
Fig. 2 is the schematic diagram that the embodiment of the method 1 of circuit board selective electroplating conductive hole of the present invention forms conductive pattern.
Fig. 3 is the schematic diagram of the embodiment of the method 1 printing quick-drying resist ink of circuit board selective electroplating conductive hole of the present invention.
Fig. 4 is the schematic diagram that the embodiment of the method 1 of circuit board selective electroplating conductive hole of the present invention is pasted polyester film.
Fig. 5 is the schematic diagram that the embodiment of the method 1 of circuit board selective electroplating conductive hole of the present invention is bored conductive hole datum hole.
Fig. 6 is the schematic diagram that the embodiment of the method 1 datum hole inner surface of circuit board selective electroplating conductive hole of the present invention forms Organic Conductive Films.
Fig. 7 is the embodiment of the method 1 of circuit board selective electroplating conductive hole of the present invention, datum hole copper facing, zinc-plated schematic diagram.
Fig. 8 is the schematic diagram that the embodiment of the method 1 of circuit board selective electroplating conductive hole of the present invention is removed polyester film.
Fig. 9 is the schematic diagram of the embodiment of the method 1 stripping resist ink layer of circuit board selective electroplating conductive hole of the present invention.
Figure 10 is that embodiment of the method 1 etching of circuit board selective electroplating conductive hole of the present invention retreats the schematic diagram except photosensitive material.
[embodiment]
Embodiment 1:
Two-sided copper foil covered board production technology, adopts plate face to form after conducting channel figure, applies anti-plate layer, Organic Conductive Films overcoat, and step is as follows:
1) choose the two-sided copper foil covered board of the thick H/H of 1.6MM copper, be cut into 210 * 120mm;
2) choose borehole data, bore location hole and direction hole (the once boring) of 3.175mm; Location hole is for being fixed on drilling machine table top by copper coated foil plate, when guaranteeing to hole copper coated foil plate can not move, positioning; Direction hole is that product is identified direction use in successive process, sees Fig. 1;
3) the clean rear printing photosensitive material of plate face, 75 ℃ of baking 40min in baking oven;
4) exposure, the rear needed conductive pattern of circuit design the 120 ℃ of roasting 0.5H of forming that develop, be shown in Fig. 2;
5) forming on the two-sided copper foil covered board of conductive pattern, the thick quick-drying resist ink of printing one deck approximately 15 μ m, is shown in Fig. 3;
6) on quick-drying resist ink layer, paste one deck polyester film (PET film+acrylic acid series glue is not corroded by Organic Conductive Films liquid medicine to protect resist ink), protection Organic Conductive Films liquid medicine corrosion resist ink layer, is shown in Fig. 4;
7) by circuit design the position boring that need to make the set conductive layer in component side and the back side conduct (secondary drilling gets out the datum hole of conductive hole), see Fig. 5;
8) in datum hole, form organic conductive layers.Cross Organic Conductive Films horizontal production line, at datum hole inner surface, form conductive layer, see Fig. 6;
Organic Conductive Films handling process is: whole hole → oxidation → catalysis; Operating condition and parameter are controlled by table 1, obtain Organic Conductive Films, the about 140nm of organic conductive thicknesses of layers.
Table 1 Organic Conductive Films operating condition
What Organic Conductive Films liquid medicine was used is the Organic Conductive Films film forming agent of Zhuhai Si Meite Electron Material Co., Ltd.
9) throw off polyester film, copper facing in acid copper plating cylinder, and hole copper is electroplated onto to 20-25 μ m and at the electroplating surfaces with tin (resist layer) of hole copper, sees Fig. 7 and Fig. 8;
10) copper facing operating condition is in Table 2
Table 2 electro-coppering formula and operating condition
| Copper sulphate | Sulfuric acid | Current density | Time |
| 70G/L | 190G/L | 1.8-2ASD | 60min |
11) in the 1-3% sodium hydroxide solution under normal temperature state, soak 10-15 and strip resist ink layer second, running water is rinsed well, sees Fig. 9;
12) the unnecessary copper of etching in alkaline copper chloride etching solution, moves back in tin liquid medicine and moves back tin after acidity, sees Fig. 9;
13), in the sodium hydroxide solution of 3-5%, stripping photosensitive material, obtains required double-sided PCB, sees Figure 10;
14) do conduction on off test, without the non-conductive phenomenon of via hole, 100% coincident circuit designing requirement;
15) do thermal shock test and high low-temperature test.
Embodiment 2
Two-sided copper foil covered board production technology, adopts plate face to form after conducting channel figure, applies anti-Organic Conductive Films, anti-plate peelable glue, and step is as follows:
1) choose the two-sided copper foil covered board of the thick H/H of 1.6mm copper, be cut into 210 * 120mm;
2) choose borehole data, bore location hole and direction hole (the once boring) of 3.175mm;
3) the clean rear printing photosensitive material of plate face, 75 ℃ of baking 40min in baking oven;
4) after exposure, development, form the needed conductive pattern of circuit design and roasting 0.5H under 120 ℃ of conditions;
5) forming on the two-sided copper foil covered board of conductive pattern, the anti-Organic Conductive Films liquid medicine that printing one deck approximately 15 μ m are thick, the peelable glue of anti-plate liquid medicine, with 120 ℃ of roasting 0.5H; The corrosion of the performance need ability Organic Conductive Films liquid medicine (85 ℃) of anti-Organic Conductive Films anti-plate liquid medicine, anti-plate peelable glue, can keep out acid electroplating liquid medicine and corrode, and as Shenzhen, Ke Shida company provides, the peelable glue that the trade mark is COS-KB010.Shenzhen Ke Shida CompanyAddress is, 9th floors A districts, 2 of the tenth industrial areas, Gongming Tian Liao community, bright new district, Shenzhen.
6) by the position boring (secondary drilling) that need to make the set conductive layer in component side and the back side conduct in circuit design;
7) in datum hole, form organic conductive layers.Cross Organic Conductive Films horizontal production line, at datum hole inner surface, form conductive layer, process is as the step 8 of embodiment 1);
8) hole copper is thickeied to 20-25 μ m in acid copper plating cylinder, and at the electroplating surfaces with tin (resist layer) of hole copper;
9) remove the peelable glue of anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine;
10) the unnecessary copper of etching in alkaline copper chloride etching solution, moves back in tin liquid medicine and moves back tin after acidity;
11), in the sodium hydroxide solution of 3-5%, stripping photosensitive material, obtains required double-sided PCB;
12) do conduction on off test, without the non-conductive phenomenon of via hole, 100% coincident circuit designing requirement;
13) do thermal shock test and high low-temperature test.
Embodiment 3
Multilayer copper-clad paper tinsel board production technology, adopts plate face to form after conducting channel figure, applies anti-Organic Conductive Films anti-plate peelable glue, and step is as follows:
1) choose the two-sided copper foil covered board of the thick H/H of 1.6MM copper, be cut into 210 * 120mm;
2) choose borehole data, bore location hole and direction hole (the once boring) 1 of 3.175mm;
3) the clean rear printing photosensitive material of plate face, 75 ℃ of baking 40min in baking oven;
4) after exposure, development, form the needed internal layer conductive pattern of circuit design and roasting 0.5H under 120 ℃ of conditions;
5) etching, obtain required internal layer conductive pattern after moving back film;
6) according to design, be pressed into multilayer copper-clad paper tinsel plate;
7) after coating photosensitive material, exposure, development, form the needed conductive pattern of circuit design and under 120 ℃ of conditions, bake 0.5H;
8) forming on the two-sided copper foil covered board of conductive pattern, the anti-Organic Conductive Films liquid medicine that printing one deck approximately 15 μ m are thick, the peelable glue of anti-plate liquid medicine, with 120 ℃ of roasting 0.5H; By the position boring (secondary drilling) that need to make the set conductive layer in component side and the back side conduct in circuit design;
9) walk de-smear flow process, remove brill dirty (bore the heat producing while chewing High Rotation Speed during boring resin or glass fibre are melted to the spot producing) in the hole forming while holing;
De-smear parameter is in Table 3:
(sweller, adhesive remover, nertralizer are provided by Zhuhai Si Meite Electron Material Co., Ltd)
10) cross Organic Conductive Films horizontal production line, make the through hole that need conduct form conductive layer, process is as the step 8 of embodiment 1);
11) hole copper is thickeied to 20-25 μ m in acid copper plating cylinder, and at the electroplating surfaces with tin (resist layer) of hole copper;
12) remove the peelable glue of anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine;
13) the unnecessary copper of etching in alkaline copper chloride etching solution, moves back in tin liquid medicine and moves back tin after acidity;
14), in the sodium hydroxide solution of 3-5%, stripping photosensitive material, obtains required double-sided PCB;
15) do conduction on off test, without the non-conductive phenomenon of via hole, 100% coincident circuit designing requirement;
16) do thermal shock test and high low-temperature test.
Embodiment 4
Two-sided copper foil covered board production technology, is directly coated with anti-plate material, then adopts relief method to complete successive process, and step is as follows:
1) choose the two-sided copper foil covered board of 5 thick H/H of 1.6MM copper, be cut into 210 * 120mm;
A) plate face is coated with anti-Organic Conductive Films liquid medicine after cleaning, (Shenzhen Ke Shida company provides anti-plate liquid medicine peelable glue, the trade mark is the peelable glue of COS-KB010, anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine peelable glue THICKNESS CONTROL are in 20 μ m, and in baking oven, 120 ℃ are toasted 40min;
2) choose borehole data, the disposable through hole that has bored location hole, direction hole and needed conduction;
3) cross Organic Conductive Films horizontal production line, make the through hole that need conduct form conductive layer;
4) hole copper is electroplated onto to 20-25 μ m in acid copper plating cylinder;
5) remove the peelable glue of anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine, expose base material copper face;
6) through 3-5% dilute sulfuric acid clean and mechanical nog plate (dilute sulfuric acid is the oxide of removal base material copper face; Machinery nog plate first effect is the deep layer oxidation of removing base material copper face, impression of the hand etc., second effect is alligatoring base material copper face, increase base material copper surface area, improve the adhesive force of photosensitive material, mechanical nog plate polish-brush wheel material is the soft brush of nylon of the abrasive materials such as silicon carbide-containing); Dip-coating photosensitive material (as the UV-6602 of Shenzhen Shen Lejian Chemical Co., Ltd.), THICKNESS CONTROL is in 15 μ m left and right; 120 ℃ of baking 40min in baking oven;
7) after exposure, development, form the needed conductive pattern of circuit design and roasting 0.5H under 120 ℃ of conditions;
8) the unnecessary copper of etching in acid copper chloride etching liquid;
9) in the 1-3% sodium hydroxide solution under 50 ℃ of states, soak 30 seconds stripping photosensitive material layers, running water is rinsed well; Obtain required double-sided PCB;
10) do conduction on off test, without the non-conductive phenomenon of via hole, 100% coincident circuit designing requirement;
11) do thermal shock test and high low-temperature test.
Embodiment 5
Flexible copper clad foil board production technology, is directly coated with anti-plate material, then adopts relief method to complete successive process, and step is as follows:
1) choose the flexible copper clad foil plate of 5 thick H/H of 0.05mm copper, be cut into 250 * 120mm;
2) plate face is coated with anti-Organic Conductive Films liquid medicine after cleaning, (Shenzhen Ke Shida company provides anti-plate liquid medicine peelable glue, product trade mark COS-KB010), anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine peelable glue THICKNESS CONTROL have in 15 μ m, 120 ℃ of baking 40min in baking oven;
3) choose borehole data, the disposable through hole that has bored location hole, direction hole and needed conduction;
4) cross Organic Conductive Films horizontal production line, make the through hole that need conduct form conductive layer;
5) hole copper is electroplated onto to 20-25 μ m in acid copper plating cylinder;
6) remove the peelable glue of anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine, expose base material copper face;
7) through 3-5% dilute sulfuric acid clean and mechanical nog plate (dilute sulfuric acid is the oxide of removal base material copper face; Machinery nog plate first effect is the deep layer oxidation of removing base material copper face, impression of the hand etc., second effect is alligatoring base material copper face, increase base material copper surface area, improve the adhesive force of photosensitive material, mechanical nog plate polish-brush wheel material is the soft brush of nylon of the abrasive materials such as silicon carbide-containing); Dip-coating photosensitive material (as the UV-6602 of Shenzhen Shen Lejian Chemical Co., Ltd.), THICKNESS CONTROL is in 15 μ m left and right; 120 ℃ of baking 40min in baking oven;
8) after exposure, development, form the needed conductive pattern of circuit design and roasting 0.5H under 120 ℃ of conditions;
9) the unnecessary copper of etching in acid copper chloride etching liquid;
10) in the 1-3% sodium hydroxide solution under 50 ℃ of states, soak 30 seconds stripping photosensitive material layers, running water is rinsed well; Obtain required double-sided PCB;
11) do conduction on off test, without the non-conductive phenomenon of via hole, 100% coincident circuit designing requirement;
12) do thermal shock test and high low-temperature test.
Embodiment 6
Two-sided copper foil covered board production technology, adopts plate face to form after conducting channel figure,, paste polyester film, step is as follows:
1) choose the two-sided copper foil covered board of the thick H/H of 1.6mm copper, be cut into 210 * 120mm;
2) choose borehole data, bore location hole and direction hole (the once boring) of 3.175mm;
3) the clean rear printing photosensitive-ink of plate face, 75 ℃ of baking 40min in baking oven;
4) after exposure, development, form the needed conductive pattern of circuit design and roasting 0.5H under 120 ℃ of conditions;
5) forming on the two-sided copper foil covered board of conductive pattern, paste polyester film (PET film+silicone rubber adhesive, to protect conductive pattern ink not corroded by Organic Conductive Films liquid medicine);
6) by the position boring (secondary drilling) that need to make the set conductive layer in component side and the back side conduct in circuit design;
7) in datum hole, form organic conductive layers.Cross Organic Conductive Films horizontal production line, at datum hole inner surface, form conductive layer, process is as the step 8 of embodiment 1);
8) hole copper is thickeied to 20-25 μ m in acid copper plating cylinder, and at the electroplating surfaces with tin (resist layer) of hole copper;
9) remove polyester film;
10) the unnecessary copper of etching in alkaline copper chloride etching solution, moves back in tin liquid medicine and moves back tin after acidity;
11), in the sodium hydroxide solution of 3-5%, stripping photosensitive-ink, obtains required double-sided PCB;
12) do conduction on off test, without the non-conductive phenomenon of via hole, 100% coincident circuit designing requirement;
13) do thermal shock test and high low-temperature test.
The method of the printed circuit board (PCB) selective electroplating conductive hole of the above embodiment of the present invention, first by figure, to shift not boring on the copper coated foil plate of via, produce board circuit figure, bore again via and hole in piece part, then crossing Organic Conductive Films makes non-conduction hole form the re-plating shaping of energising hole, or to the anti-Organic Conductive Films of copper coated foil plate surface coverage one deck of not holing, anti-plate liquid medicine peelable glue, rear brill via, after Organic Conductive Films, make non-conduction hole form energising hole electro-coppering, then doing figure shifts, the above embodiment of the present invention is when electroplating via hole copper, cause is to the no longer electro-coppering of former Copper Foil on plate, to the thick thru-hole electroplating thickening of the certain copper of needs, the above embodiment of the present invention has kept the thick uniformity of copper of former Copper Foil, while making precision thin circuit board, not affected by the factor of copper electroplating layer became uneven, make precision thin circuit easier, circuit precision is higher, while making circuitous pattern, be subject to etch effects factor little, reduced because of scrapping that etching factor causes, reduce costs and save material.The above embodiment of the present invention is when to copper coated foil plate thru-hole electroplating, the total surface area of copper coated foil plate via is approximately the 10%--20% of board surface area, hole copper thickness while more easily making thru-hole electroplating reaches the hole copper thickness needing, the 15%--20% when phosphor-copper consuming when the above embodiment via of the present invention hole copper is electroplated also only has existing technique copper coated foil plate plate face or electroplates circuit pattern and via, the above embodiment of the present invention can save a large amount of electric energy, can save phosphor-copper and the power consumption for plating of nearly 85% left and right, reduce production costs, be beneficial to environmental protection and meet recycling economy production feature.
What is more important, the above embodiment of the present invention aperture copper when to copper coated foil plate via Direct Electroplating is equally smooth with plate face copper, can not form the annular copper bound protruding at the two ends of conductive hole, not need to grind limit, conductive hole hole, the rate of finished products of circuit board greatly improves.
Claims (9)
1. a method for circuit board selective electroplating conductive hole, is characterized in that, comprises the following steps:
101) two plate faces at copper coated foil plate cover anti-corrosion protective layer;
102) bore conductive hole datum hole;
103) at datum hole inner surface, form conductive layer;
104) by described conductive layer in the copper facing of datum hole inner surface;
105) remove anti-corrosion protective layer.
2. the method for circuit board selective electroplating conductive hole according to claim 1, is characterized in that, described anti-corrosion protective layer comprises resist ink layer and the polyester film of pasting on resist ink layer, and described conductive layer is Organic Conductive Films; Polyester film is in step 103) remove later, resist ink layer is in step 104) remove later.
3. the method for circuit board selective electroplating conductive hole according to claim 1, is characterized in that, described anti-corrosion protective layer is the peelable glue of anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine, and described conductive layer is Organic Conductive Films; The peelable glue of anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine is in step 104) remove later.
4. the method for circuit board selective electroplating conductive hole according to claim 1, is characterized in that, comprises de-smear step, and de-smear step is removed the glue slag in multilayer copper-clad paper tinsel plate datum hole; De-smear step is in step 102) and step 103) between complete.
5. according to the method for the circuit board selective electroplating conductive hole described in claim 2 or 3, it is characterized in that, in step 101) be included in before on plate face and print photosensitive material, exposure, the rear step that forms required conductive pattern of developing; In step 104) the later step that is included in hole copper electroplating surfaces with tin, anti-corrosion protective layer carries out etching after removing, and removes unnecessary copper on plate, removal tin coating and photosensitive material after etching completes.
6. the method for circuit board selective electroplating conductive hole according to claim 1, is characterized in that, in step 101) comprise before the step of boring location hole and direction hole.
7. the method for circuit board selective electroplating conductive hole according to claim 1, is characterized in that, in step 102) in bore conductive hole datum hole and bore location hole, carry out simultaneously in direction hole.
8. the method for circuit board selective electroplating conductive hole according to claim 1, is characterized in that, described anti-corrosion protective layer is the peelable glue of anti-Organic Conductive Films liquid medicine, anti-plate liquid medicine, and described conductive layer is Organic Conductive Films; Peelable glue is in step 104) remove later; After anti-corrosion protective layer removal, again to plate face dip-coating photosensitive material, after photosensitive material exposure, development, form required conductive pattern; Then, unnecessary copper on etched plate, removes photosensitive material after etching completes again.
9. the method for circuit board selective electroplating conductive hole according to claim 1, is characterized in that, described anti-corrosion protective layer is the polyester film of pasting on plate face, and the adhesive of polyester film is silicone rubber adhesive, and described conductive layer is Organic Conductive Films; Polyester film is in step 103) remove later, resist ink layer is in step 104) remove later.
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| CN106211631A (en) * | 2016-09-13 | 2016-12-07 | 电子科技大学 | A kind of manufacture method of laminating surface adhesion enhancement mode printed circuit board inner figure |
| CN107170679A (en) * | 2017-05-19 | 2017-09-15 | 京东方科技集团股份有限公司 | A kind of preparation method of conductive pattern, conductive pattern and display base plate |
| CN107708335A (en) * | 2017-11-07 | 2018-02-16 | 竞华电子(深圳)有限公司 | A kind of circuit manufacturing method of multi-layer PCB board |
| CN108541139A (en) * | 2018-03-31 | 2018-09-14 | 深圳市实锐泰科技有限公司 | A kind of PCB via holes production method and PCB |
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| CN110545634A (en) * | 2019-08-29 | 2019-12-06 | 江苏上达电子有限公司 | Manufacturing method of multilayer fine circuit board with circuit being firstly made and then plated with hole copper |
| CN112739020A (en) * | 2020-12-15 | 2021-04-30 | 广德宝达精密电路有限公司 | Method for manufacturing gold-plated circuit board |
| CN112788853A (en) * | 2021-01-09 | 2021-05-11 | 勤基电路板（深圳）有限公司 | Production process of circuit board for increasing area of through hole pad and circuit board |
| CN113056117A (en) * | 2021-03-15 | 2021-06-29 | 德中（天津）技术发展股份有限公司 | Method for metalizing and electroplating hole wall only |
| CN113133224A (en) * | 2021-04-07 | 2021-07-16 | 威海世一电子有限公司 | FPCB plate via hole selective plating process |
| TWI752834B (en) * | 2021-02-20 | 2022-01-11 | 嘉聯益科技股份有限公司 | Manufacturing method of circuit board circuit structure with through hole |
| CN114980497A (en) * | 2021-02-20 | 2022-08-30 | 嘉联益电子(昆山)有限公司 | Method for manufacturing circuit board circuit structure with through hole and manufactured circuit board circuit structure with through hole |
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