CN100546439C - Electroplating technique for thickening mask hole cuprum of printed circuit board - Google Patents
Electroplating technique for thickening mask hole cuprum of printed circuit board Download PDFInfo
- Publication number
- CN100546439C CN100546439C CNB2008100669439A CN200810066943A CN100546439C CN 100546439 C CN100546439 C CN 100546439C CN B2008100669439 A CNB2008100669439 A CN B2008100669439A CN 200810066943 A CN200810066943 A CN 200810066943A CN 100546439 C CN100546439 C CN 100546439C
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- Prior art keywords
- hole
- circuit board
- printed circuit
- thickening
- pcb
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
A kind of electroplating technique for thickening mask hole cuprum of printed circuit board, its technology may further comprise the steps: will bore via etc., and make the surface moisture oven dry of the printed circuit board (PCB) that the hole conducted; Printed circuit board surface is coated with insulating layer coating, and makes its drying; To be coated with the printed board circuit plate of insulating layer coating, calculate the aperture surface area in the hole that needs plating, multiply by and to plate plating density and the time that reaches the hole copper thickness, calculate the current density value that electroplating hole copper needs; The hole thickening is carried out in the hole of printed circuit board (PCB) electroplates; The printed circuit board surface of carrying out hole thickening plating is smooth; The hole copper thickness has been met the requirements of printed circuit board (PCB) cleaned, changed graphics art over to and make.Present technique can improve the production efficiency of electroplating assembly line, reduces copper resource, water resources in the printed circuit board (PCB) production, the consumption of power resource and minimizing chemicals use amount; Be easy to the manufacturing of the printed circuit board (PCB) of accurate circuit.
Description
Technical field
The present invention relates to the production method of printed circuit board (PCB), the particularly hole copper coating of the via of printed circuit board (PCB), component hole, blind hole, copper electroplating layer thickening and hole copper are electroplated, some plating composite deposite against corrosion in the via.
Background technology
Former conventional printed circuit board (PCB) is produced in the electroplating technology, and it is big that the hole copper thickness of the cable-through hole of micro hole (0.15-0.35mm), component hole, blind hole is electroplated difficulty, requires the equipment performance height, requires high to covering power and the covering power of electroplating photo etching.Now produce electroplating technology for the hole copper thickness that reaches cable-through hole, micro hole and the hole plating copper thickness 20 μ m-25 μ m hole copper thicknesses of component hole, copper-clad plate is after boring, after electroless copper plating or the processing of charing via, copper-clad plate face copper layer is electroplated onto 18-30 μ m, the thick 12 μ m-25 μ m hole copper thicknesses that just may be plated to of copper in the hole.Or will be in that the circuit board pattern plating copper is thick when reaching 20-25 μ m thickness of coating, hole copper is just near the hole copper thickness of 18-25 μ m; The hole copper thickness to be electroplated onto 20 μ m-25 μ m, just thick being electroplated onto of monoblock circuit board figure copper far must be surpassed above thickness.So, cause accurate wiring board to electroplate difficulty and increase, require high electroplating hole equipment and plating liquid medicine photo etching; And waste a large amount of copper resources, water resources and power resource, do not meet energy-saving and cost-reducing that country proposes, the industry state basic policy of reduction of discharging.
Technology contents
The objective of the invention is to, at above the deficiencies in the prior art, a kind of electroplate technology of the printed circuit board (PCB) of refining is provided, promptly improve the production efficiency of electroplating assembly line, reduce copper resource, water resources in the printed circuit board (PCB) production, the consumption of power resource and minimizing chemicals use amount; Can reach the requirement of printed circuit board (PCB) again, be easy to the manufacturing of the printed circuit board (PCB) of accurate circuit the hole copper thickness.
The object of the invention can be achieved through the following technical solutions; A kind of electroplating technique for thickening mask hole cuprum of printed circuit board may further comprise the steps:
A, will bore via, component hole, blind hole, and electroless copper plating or hole charing are handled, made the surface moisture oven dry of the printed circuit board (PCB) that the hole conducted;
B, handle well the surface of via, component hole, blind hole, printed circuit board surface is coated with insulating layer coating, and makes its drying except that heavy copper or hole charing;
C, will be coated with the printed circuit board (PCB) of insulating layer coating, calculate the aperture surface area that needs the hole of electroplating, and multiply by and to plate plating density and the time that reaches the hole copper thickness, calculate the current density value that electroplating hole copper needs;
D, hole thickening is carried out in the hole of printed circuit board (PCB) electroplated;
E, will to carry out the printed circuit board surface that hole thickening electroplates smooth, removes the part that exceeds printed circuit board surface;
F, the hole copper thickness has been met the requirements of printed circuit board (PCB) cleaned, changed graphics art over to and make.
Described electroplating technique for thickening mask hole cuprum of printed circuit board, insulating layer coating that printed circuit board surface is coated with is insulating resin or printing ink in its described b step.
Described electroplating technique for thickening mask hole cuprum of printed circuit board, the viscosity of its printing ink are 110-140.
Described electroplating technique for thickening mask hole cuprum of printed circuit board, insulating layer coating that its printed circuit board surface is coated with is printing insulating resin or printing ink; The Printing screen mesh is between 100T-180T, and printing is 40-80 with frictioning hardness, printing frictioning and screen angle 25-30 degree.
Described electroplating technique for thickening mask hole cuprum of printed circuit board, after its d step was intact, that the hole inwall has was against corrosion, during the low-resistance value requirement, to hole re-plating tin, nickel, golden arbitrary coating; Connect the e step afterwards again.
Described electroplating technique for thickening mask hole cuprum of printed circuit board, after its d step finishes, for the printed circuit board (PCB) that the paster requirement is arranged, to thickening the hole of plating, for preventing tin liquor consent when the paster, in hole, fill with resin or printing ink to institute's cable-through hole of conducting, and to the exposure of resin printing ink, flushing, striping, oven dry in the hole; Connect the e step afterwards again.
Described electroplating technique for thickening mask hole cuprum of printed circuit board in its e step, is removed the part that exceeds printed circuit board surface, adopts the orifice ring limit that amary tape grinding machine protrudes the face limit to grind.
Described electroplating technique for thickening mask hole cuprum of printed circuit board in its e step, is removed the part that exceeds printed circuit board surface, can adopt orifice ring limit and the resin printing ink behind the consent that amary tape grinding machine protrudes the face limit to grind.
Technological progress of the present invention is, a kind of electroplating technique for thickening mask hole cuprum of printed circuit board is provided, can improve the production efficiency of electroplating assembly line, reduce copper resource, water resources in the printed circuit board (PCB) production, the consumption of power resource and minimizing chemicals use amount.Can reach the requirement of printed circuit board (PCB), be easy to the manufacturing of the printed circuit board (PCB) of accurate circuit the hole copper thickness.
Specific embodiment
For the production technology of printed circuit board (PCB), engage technology of the present invention, its a whole set of technology can may further comprise the steps:
(1) material is opened in copper-clad plate, leaves the copper-clad plate piece of required size, and the designing requirement according to circuit board on the copper-clad plate piece of leaving gets out via with CNC (numerically controlled drill).
(2) surperficial polish-brush, the burr on via limit when removing surface drilling.
(3) after boring, through the double face copper of electroless copper plating, print photosensitive-ink or printed circuit board (PCB) pattern printing ink, make the circuit board pattern ink setting of photosensitive-ink or printing.
(4) copper-clad plate of printing insulating resin or printing ink is electroplated, make via hole thickness of coating reach 25-35 μ m, promptly need thickness.
(5) remove dielectric films such as copper-clad plate surface mask printing ink or resin.
(6) orifice ring and plug socket resin are protruded in grind table face limit.
(7) to changing the making figure over to after the copper facing of copper-clad plate surface electrical.
(8) cover negative film figure acid etching behind the hole with dry film.
Adopt when (9) covering the hole and can inhale the screen printer of vacuum, the printing ink in the copper-plated hole is covered the hole with printing ink.
(10) printed circuit board (PCB) that grinds behind the film is changed over to graphic making, to printed circuit board surface printing sensitization circuit oil.Because of being coated with the alkali resistance resist layer in the via, so replace the etching of photosensitive dry film negative film figure with photosensitive-ink.Save photosensitive dry film and make the cost of figure circuit.
(11) printing welding resistance printing ink.
(12) finished product detection after the moulding is soaked 3 times for 228 ℃ through thermal shock experiment, no aperture fracture in each 10 seconds, finished product shipment.
The printed circuit board (PCB) via metallization mask hole electroplating molding process of this technology, surface and the metallization of via electroless copper plating to circuit board that circuitous pattern is arranged after holing, to via Direct Electroplating copper, the metallized via of electro-coppering no longer passes through etch process, this technology is when electroplating via hole copper, cause is to the no longer electro-coppering of former Copper Foil on the circuit board, circuit pattern or local need reaching that the certain copper of needs is thick when electroplating via, are realized the thick circuit pattern of certain copper simultaneously, this technology has bigger making flexibility, this technology has kept the thick uniformity of the copper of former Copper Foil, be not subjected to the factor affecting of copper electroplating layer became uneven when making accurate fine rule road circuit board, make full use of the consistent Copper Foil of thickness in the former copper-clad plate, it is easier to make accurate fine rule road, and having significant effect, circuit precision height is subjected to the etch effects factor little when making circuitous pattern, reduced to reduce cost because of scrapping that the etching factor causes, save material.
This technology is to the via-hole of circuit board Direct Electroplating time, because the total surface area of via-hole of circuit board is less than circuit board total surface area (aperture surface area of via is the 10%-20% of board surface area approximately), easier hole copper thickness when making thru-hole electroplating reaches the hole copper thickness that needs, and the limit, hole of via is slightly larger than the aperture of via after electroplating, and a little more than the copper face of circuit board, make the connectivity of via more reliable, satisfy and to reach the circuit board line designing requirement.The concrete advantage of this technology:
(1) this technology is to print the via that dielectric film exposes needs plating earlier in printed circuit board (PCB) operation block with conducting after the charing of electroless copper plating formula via, electroplate thickening earlier at hole copper, this technology is to thru-hole electroplating the time, current density concentrates in the via, electric current distribution is more even, very easy the reaching more than the 25-35 μ m of copper coating in the via.
(2) this fabrication hole copper is electroplated and to be reached 25-35 μ m copper bed thickness when above, accounts for plate face area 10-15% calculating, electroplating time 20 minutes with internal surface of hole.Every square metre consumes the about 50-70 gram of electro-coppering.
(3) after grinding to panel plating once about 10 minutes, the thick 5-10 μ of electro-coppering m consumed the about 100-130 of electro-coppering and restrains (two sides copper consumption).
(4) this technology (2)+(3) consume the about 170-200 gram of electro-coppering altogether, save electro-coppering 60%-70%m approximately than common process
2, save and electroplate power consumption 60%m
2, electroplating time shortens 40 minutes than common process, and the Electroplating Production line use ratio improves 50%.
When (5) this technology was used in electroplating printed circuit board production, plate face thickness of coating uniformity was 0.5-1% approximately.
(6) the printed circuit board (PCB) operation block of this technology Electroplating Production, plate face copper layer uniformity is even than common process, can save 30%-50%m when the figure etching work procedure is made
2Chemicals is saved or used less to etching solution.
(7) during this technology Electroplating Production because of only to thru-hole electroplating, not high to water quality requirement, recycle so this technology electroplating washing water is renewable, and the conventional 50-70%m that saves of water for cleaning amount
2
(8) this technology is when making the circuit board on accurate line fine rule road, be easy to make, need not adopt in the common process to plate face Copper Foil corrosion inhibitor technology, can save corrosion inhibitor fresh water (FW) electrochemistry medicine, and there is not the etched quality problem of common process,, folder film clean, lateral erosion etc. as etching.
(9) this technology is in Electroplating Production; at conventional alkaline etching liquid; this technology after to via copper facing more directly to thru-hole electroplating tin coating and nickel dam; as resist layer in the hole of via; make line pattern with the circuit ink printing plate face negative film circuit film when making the figure circuit again; with being characterized in substituting the dry film etching, admittedly so print that copper protective layer can be not etched in the nickel, tin resist layer hole of existing alkali resistant etching in the via, saving figure dry film use cost with printing ink.
As seen this technology manufacture on the source save material, energy consumption, minimizing pollutant sources.
Claims (8)
1, a kind of electroplating technique for thickening mask hole cuprum of printed circuit board is characterized in that, described technology may further comprise the steps:
A, will bore via, component hole, blind hole, and electroless copper plating or hole charing are handled, made the surface moisture oven dry of the printed circuit board (PCB) that the hole conducted;
B, handle well the surface of via, component hole, blind hole, printed circuit board surface is coated with insulating layer coating, and makes its drying except that heavy copper or hole charing;
C, will be coated with the printed circuit board (PCB) of insulating layer coating, calculate the aperture surface area that needs the hole of electroplating, and multiply by and to plate plating density and the time that reaches the hole copper thickness, calculate the current density value that electroplating hole copper needs;
D, hole thickening is carried out in the hole of printed circuit board (PCB) electroplated;
E, will to carry out the printed circuit board surface that hole thickening electroplates smooth, removes the part that exceeds printed circuit board surface;
F, the hole copper thickness has been met the requirements of printed circuit board (PCB) cleaned, changed graphics art over to and make.
2, electroplating technique for thickening mask hole cuprum of printed circuit board according to claim 1 is characterized in that, insulating layer coating that printed circuit board surface is coated with is insulating resin or printing ink in the described b step.
3, electroplating technique for thickening mask hole cuprum of printed circuit board according to claim 2 is characterized in that, the viscosity of described printing ink is 110-140.
4, electroplating technique for thickening mask hole cuprum of printed circuit board according to claim 2 is characterized in that, insulating layer coating that described printed circuit board surface is coated with is printing insulating resin or printing ink; The Printing screen mesh is between 100T-180T, and printing is 40-80 with frictioning hardness, printing frictioning and screen angle 25-30 degree.
5, electroplating technique for thickening mask hole cuprum of printed circuit board according to claim 1 is characterized in that, after described d step was intact, that the hole inwall has was against corrosion, during the low-resistance value requirement, to hole re-plating tin, nickel, golden arbitrary coating; Connect the e step afterwards again.
6, electroplating technique for thickening mask hole cuprum of printed circuit board according to claim 1, it is characterized in that, after described d step finishes, for the printed circuit board (PCB) that the paster requirement is arranged, to thickening the hole of plating, for preventing tin liquor consent when the paster, in hole, fill with resin or printing ink to institute's cable-through hole of conducting, and to the exposure of resin printing ink, flushing, striping, oven dry in the hole; Connect the e step afterwards again.
7, electroplating technique for thickening mask hole cuprum of printed circuit board according to claim 1 is characterized in that, in the described e step, removes the part that exceeds printed circuit board surface, adopts the orifice ring limit that amary tape grinding machine protrudes the face limit to grind.
8, electroplating technique for thickening mask hole cuprum of printed circuit board according to claim 6, it is characterized in that, in the described e step, remove the part that exceeds printed circuit board surface, can adopt orifice ring limit and the resin printing ink behind the consent that amary tape grinding machine protrudes the face limit to grind.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2008100669439A CN100546439C (en) | 2008-04-30 | 2008-04-30 | Electroplating technique for thickening mask hole cuprum of printed circuit board |
| PCT/CN2009/070405 WO2009132528A1 (en) | 2008-04-30 | 2009-02-12 | Hole thickening plating method of pcb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2008100669439A CN100546439C (en) | 2008-04-30 | 2008-04-30 | Electroplating technique for thickening mask hole cuprum of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101304638A CN101304638A (en) | 2008-11-12 |
| CN100546439C true CN100546439C (en) | 2009-09-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2008100669439A Expired - Fee Related CN100546439C (en) | 2008-04-30 | 2008-04-30 | Electroplating technique for thickening mask hole cuprum of printed circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN100546439C (en) |
| WO (1) | WO2009132528A1 (en) |
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| CN101873770B (en) * | 2009-04-21 | 2012-07-18 | 广东兴达鸿业电子有限公司 | Electroplating copper plughole process of circuit board |
| CN101635489B (en) * | 2009-04-23 | 2011-08-10 | 杭州新三联电子有限公司 | Technology for producing commutator plate of rigid double-face vibration motor |
| CN101616549B (en) * | 2009-07-21 | 2011-01-05 | 东莞康源电子有限公司 | Method for manufacturing single-side thick copper stepped plate by electroplating addition method |
| CN101790286B (en) * | 2010-02-04 | 2012-05-09 | 深南电路有限公司 | Process for machining holes |
| CN101841972B (en) * | 2010-04-23 | 2012-11-14 | 汕头超声印制板公司 | Method for manufacturing high-AR and fine-line PCB |
| CN102154668A (en) * | 2011-06-01 | 2011-08-17 | 何忠亮 | Mask electroplating process for printed circuit board |
| CN103068163B (en) * | 2011-10-24 | 2013-11-06 | 悦虎电路(苏州)有限公司 | Electroplating method of circuit board with surface coated with resin |
| CN103533766B (en) * | 2013-10-22 | 2016-07-06 | 东莞生益电子有限公司 | The circuit board that the manufacture method of circuit board and the method prepare |
| CN104411107A (en) * | 2014-11-05 | 2015-03-11 | 深圳恒宝士线路板有限公司 | PCB electrogilding technology |
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| CN106910645A (en) * | 2017-02-15 | 2017-06-30 | 哈尔滨工业大学深圳研究生院 | A kind of printing stencil method electroplates porous metal film and its method and application |
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| CN107645834A (en) * | 2017-08-30 | 2018-01-30 | 景旺电子科技(龙川)有限公司 | A kind of etching method substitutes machining making and destroyed or force to yield method for product |
| CN108650796A (en) * | 2018-04-04 | 2018-10-12 | 广州兴森快捷电路科技有限公司 | Pcb board electro-plating method |
| CN110029375A (en) * | 2019-05-14 | 2019-07-19 | 四川海英电子科技有限公司 | The circulation copper electroplating method of high-order high-density circuit board |
| CN112770546A (en) * | 2020-12-30 | 2021-05-07 | 深圳市合成快捷电子科技有限公司 | Manufacturing method of high-precision rigid-flexible circuit board |
| CN112788853A (en) * | 2021-01-09 | 2021-05-11 | 勤基电路板（深圳）有限公司 | Production process of circuit board for increasing area of through hole pad and circuit board |
| CN113056117B (en) * | 2021-03-15 | 2022-07-29 | 德中（天津）技术发展股份有限公司 | Method for metalizing and electroplating hole wall only |
| CN113194617A (en) * | 2021-03-23 | 2021-07-30 | 江门市奔力达电路有限公司 | PCB negative film production process |
| CN115297618B (en) * | 2022-10-08 | 2023-11-03 | 广州添利电子科技有限公司 | Radar board PCB manufacturing process |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2550081B2 (en) * | 1987-07-08 | 1996-10-30 | 株式会社日立製作所 | Circuit formation method |
| JP2636537B2 (en) * | 1991-04-08 | 1997-07-30 | 日本電気株式会社 | Manufacturing method of printed wiring board |
| JP4113024B2 (en) * | 2003-03-31 | 2008-07-02 | 三菱製紙株式会社 | Substrate manufacturing method |
-
2008
- 2008-04-30 CN CNB2008100669439A patent/CN100546439C/en not_active Expired - Fee Related
-
2009
- 2009-02-12 WO PCT/CN2009/070405 patent/WO2009132528A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN101304638A (en) | 2008-11-12 |
| WO2009132528A1 (en) | 2009-11-05 |
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Owner name: SHENZHEN GUOMINGSHUN ELECTRON TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: LI DONGMING Effective date: 20091211 |
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Effective date of registration: 20091211 Address after: N Industrial Zone, Baoan District, Shenzhen, Guangdong Patentee after: Shenzhen Guomingshun Electronic Technology Co.,Ltd. Address before: Guangdong city of Shenzhen province Baoan District Songgang Yanchuan Road police station 200127 horn Patentee before: Li Dongming |
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Granted publication date: 20090930 Termination date: 20140430 |