CN112654164A - Blind hole and circuit pattern high-precision alignment mode - Google Patents
Blind hole and circuit pattern high-precision alignment mode Download PDFInfo
- Publication number
- CN112654164A CN112654164A CN202011561519.9A CN202011561519A CN112654164A CN 112654164 A CN112654164 A CN 112654164A CN 202011561519 A CN202011561519 A CN 202011561519A CN 112654164 A CN112654164 A CN 112654164A
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- pattern
- film
- electroplating
- dry film
- blind hole
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
Abstract
A high-precision alignment mode of a blind hole and a circuit pattern comprises the following specific steps of a front process → pressing → laser → chemical copper deposition → dry film pasting → exposure → development → pattern electroplating → a rear process: (1) and a former process: cleaning the substrate; (2) and pressing: laminating the resin copper foil and the substrate; (3) and laser: processing an alignment target on the laminated board by using laser; (4) chemical copper deposition: realizing metallization of the nonmetal blind holes; (5) and sticking a dry film: sticking the dry film on a copper foil; (6) and exposure: generating a pattern of connecting lines; (7) and developing: washing off the unexposed film layer by using a developing solution; (8) and pattern electroplating: manufacturing a circuit pattern by using an electroplating mode; (9) and a post-process: and cleaning and drying the circuit board. This counterpoint mode improves the counterpoint ability of circuit board figure and blind hole, stops to scrap because of secondary counterpoint precision leads to, promotes production efficiency and yield, promotes the reliability of product.
Description
Technical Field
The invention relates to the technical field of improvement of a production process of a printed circuit board, in particular to a high-precision alignment mode of a blind hole and a circuit pattern.
Background
With the trend of multi-functionality and intelligence development of electronic products, higher requirements are also put forward on carrier printed circuit boards carrying electronic parts, and the development of the circuit boards towards lightness, thinness, shortness and smallness is promoted, so that designed circuits are more and more dense and thinner, the line width/space of 3mil/3mil gradually becomes the conventional requirements, and circuit boards with 2.5mil or even 2mil circuits are produced by enterprises and gradually become a trend. For such a fine circuit, the alignment mode of the fine circuit provides a high requirement, the traditional operation mode is that an alignment reference is processed by pressing, in the production of a laser process, alignment is carried out according to the reference processed by pressing, the alignment reference processed by pressing is also used in the production of a later circuit process, in the interlayer alignment process, the influence of accumulated errors of equipment on the fine circuit is large, the alignment errors bring unmatched phenomena, the yield of products is reduced, the reputation and the public praise of terminal customers are influenced, and a better alignment mode is urgently needed to improve the defects.
Disclosure of Invention
The invention mainly aims to provide a high-precision alignment mode of a blind hole and a circuit pattern, which can effectively solve the problems in the background technology.
A high-precision alignment mode of a blind hole and a circuit pattern comprises the following specific steps of a front process → pressing → laser → chemical copper deposition → dry film pasting → exposure → development → pattern electroplating → a rear process:
(1) and a former process: cleaning the substrate;
(2) and pressing: laminating the resin copper foil and the substrate to form a laminated plate, and processing an alignment reference blind hole on the laminated plate;
(3) and laser: carrying out alignment according to the alignment reference of the pressing processing, and processing an alignment target spot on the pressing plate by using laser;
(4) chemical copper deposition: depositing a uniform conductive layer on the wall of the blind hole through oxidation-reduction reaction, and then electroplating, thickening and plating copper to finish the deposition of metal copper and realize the metallization of the nonmetal blind hole;
(5) and sticking a dry film: adhering the dry film to the copper foil under the conditions of heating and pressurizing;
(6) and exposure: generating a pattern of connecting circuits between the blind holes;
(7) and developing: washing off the unexposed film layer by using a developing solution, and leaving the film layer of the exposed part;
(8) and pattern electroplating: manufacturing a circuit pattern by using an electroplating mode to form a required circuit;
(9) and a post-process: and cleaning and drying the manufactured circuit board.
Further, the previous process in the step (1) comprises polishing the substrate, removing burrs on the surface and cleaning the board surface.
Further, in the step (3), a group of laser holes is added on each of the four sides of the laminated plate, each group comprises 8 holes, and the total number of the holes is four, namely 32 holes.
Further, step (4) further comprises:
1) and brushing the board: removing burrs at an orifice before chemical copper deposition, and cleaning the surface of a pressing plate;
2) and desmearing treatment: the residual drilling dirt of the copper foil is removed, the hole wall structure is improved, the binding force is enhanced, and the binding property is ensured.
Further, when the film is pasted in the step (5), the protective film is firstly peeled off from the dry film, then the dry film is pasted on the copper foil plate under the condition of heating and pressurizing, a resist layer in the dry film becomes soft after being heated, the fluidity is increased, the pasting is completed under the pressure of the heat-assisted press roller and the action of a binder in the resist, the pasting is generally continuously pasted, the upper film and the lower film are aligned, and the pattern transfer yield can be improved through proper dry film bonding force.
Further, the pattern electroplating method in the step (8) is to perform pattern electroplating on the copper layer below the film layer washed away by the developing solution, then wash away the exposed part of the film layer by using an etching solution, and etch the copper layer below the film layer, wherein the copper layer after pattern electroplating is left as a required circuit.
Further, the post-processing in the step (9) comprises cleaning the surface of the circuit board after the pattern electroplating and drying treatment.
Compared with the prior art, the high-precision alignment mode of the blind holes and the circuit patterns has the following beneficial effects:
1. a group of 8 laser holes are added at each group of plate edges, each plate edge is a group, and the total number is four, so that accurate alignment can be realized;
2. in line exposure production, a laser procedure is used for processing a target spot alignment mode, so that mechanical precision errors caused by two alignment modes are reduced, alignment precision is effectively improved, error precision caused by two alignment errors is eliminated, the risk of deviation is improved, and alignment precision of laser blind holes and patterns is improved;
3. the pattern uses the blind hole of the current level as the alignment reference, and reduces the precision error (25um) caused by deviation to 0;
4. the alignment precision of the circuit pattern and the blind holes can be improved to be within 2mil from the original maximum 3 mil.
Drawings
FIG. 1 is a flow chart of a high-precision alignment method of blind holes and circuit patterns according to the present invention.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Referring to fig. 1, a method for aligning a blind via and a circuit pattern with high precision includes a front process → pressing → laser → electroless copper plating → pasting a dry film → exposure → development → pattern plating → a rear process, and the specific steps are as follows:
(1) and a former process: cleaning the substrate;
(2) and pressing: laminating the resin copper foil and the substrate to form a laminated plate, and processing an alignment reference blind hole on the laminated plate;
(3) and laser: carrying out alignment according to the alignment reference of the pressing processing, and processing an alignment target spot on the pressing plate by using laser;
(4) chemical copper deposition: depositing a uniform conductive layer on the wall of the blind hole through oxidation-reduction reaction, and then electroplating, thickening and plating copper to finish the deposition of metal copper and realize the metallization of the nonmetal blind hole;
(5) and sticking a dry film: adhering the dry film to the copper foil under the conditions of heating and pressurizing;
(6) and exposure: generating a pattern of connecting circuits between the blind holes;
(7) and developing: washing off the unexposed film layer by using a developing solution, and leaving the film layer of the exposed part;
(8) and pattern electroplating: manufacturing a circuit pattern by using an electroplating mode to form a required circuit;
(9) and a post-process: and cleaning and drying the manufactured circuit board.
The previous procedure in the step (1) comprises the steps of polishing the substrate, removing burrs on the surface and cleaning the board surface.
And (4) adding a group of laser holes on the four sides of the laminated plate in the step (3), wherein each group comprises eight holes, and the total number is thirty-two.
The step (4) further comprises the following steps:
1) and brushing the board: removing burrs at an orifice before chemical copper deposition, and cleaning the surface of a pressing plate;
2) and desmearing treatment: the residual drilling dirt of the copper foil is removed, the hole wall structure is improved, the binding force is enhanced, and the binding property is ensured.
When the film is pasted in the step (5), the protective film is firstly stripped from the dry film, then the dry film is pasted on the copper foil plate under the condition of heating and pressurizing, the corrosion inhibitor layer in the dry film becomes soft after being heated, the fluidity is increased, the pasting is completed under the pressure of the heat-assisted compression roller and the action of the binder in the corrosion inhibitor, the pasting is generally continuously pasted, the upper film and the lower film are aligned, and the pattern transfer yield can be improved through proper dry film bonding force.
And (4) performing pattern electroplating on the copper layer below the film layer washed away by the developing solution, washing away the exposed film layer by using an etching solution, and etching the copper layer below the film layer, wherein the copper layer after pattern electroplating is left is a required circuit.
And (9) cleaning the surface of the circuit board after pattern electroplating and drying.
The invention provides a high-precision alignment mode of blind holes and circuit patterns, which comprises the steps of firstly removing burrs on the surface of a substrate, then cleaning the surface of the substrate to ensure the cleanness of the surface, then laminating a resin copper foil and the substrate to form a laminated plate, processing an alignment reference blind hole on the laminated plate, then performing alignment according to the alignment reference of the lamination processing, processing four groups of 32 alignment target points on the laminated plate by utilizing laser, then performing deburring treatment on the inner part of the blind hole, cleaning the surface of the laminated plate, removing residual drilling dirt of the copper foil after the cleaning is completed, improving the hole wall structure, strengthening the bonding force, depositing a uniform conductive layer on the hole wall of the blind hole by utilizing a redox reaction, electroplating and thickening copper plating to complete the deposition of metal copper, realizing the metallization of non-metal blind holes, and then drying the surface of the laminated plate, and then a dry film is pasted, when the film is pasted, the protective film is firstly peeled off from the dry film, then the dry film is pasted on the copper foil plate under the condition of heating and pressurizing, a resist layer in the dry film is heated to be softened, the fluidity is increased, the film pasting is completed under the action of the pressure of the heat-assisting press roller and the binder in the resist, the laminated plate is exposed after the film pasting is completed, a pattern of a connecting circuit between the blind hole and the blind hole is generated, the unexposed film layer is washed away by developing solution after the exposure, the film layer at the exposed part is left, then the pattern on the copper layer below the film layer washed away by the developing solution is electroplated, the film layer at the exposed part is washed away by etching solution, the copper layer below the film layer is etched, the copper layer after the pattern electroplating is the required circuit, the accurate alignment of the blind hole and the circuit pattern is completed, and finally.
In conclusion, the invention can reduce the mechanical precision error caused by two-time alignment, effectively improve the alignment precision, eliminate the error precision caused by two-time alignment error, improve the risk of deviation, improve the alignment precision of the laser blind holes and the patterns, and improve the alignment precision of the circuit patterns and the blind holes from the original maximum 3mil to within 2 mil.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. The utility model provides a mode that blind hole and high accuracy of circuit figure counterpoint which characterized in that: the method comprises the following specific steps of:
(1) and a former process: cleaning the substrate;
(2) and pressing: laminating the resin copper foil and the substrate to form a laminated plate, and processing an alignment reference blind hole on the laminated plate;
(3) and laser: carrying out alignment according to the alignment reference of the pressing processing, and processing an alignment target spot on the pressing plate by using laser;
(4) chemical copper deposition: depositing a uniform conductive layer on the wall of the blind hole through oxidation-reduction reaction, and then electroplating, thickening and plating copper to finish the deposition of metal copper and realize the metallization of the nonmetal blind hole;
(5) and sticking a dry film: adhering the dry film to the copper foil under the conditions of heating and pressurizing;
(6) and exposure: generating a pattern of connecting circuits between the blind holes;
(7) and developing: washing off the unexposed film layer by using a developing solution, and leaving the film layer of the exposed part;
(8) and pattern electroplating: manufacturing a circuit pattern by using an electroplating mode to form a required circuit;
(9) and a post-process: and cleaning and drying the manufactured circuit board.
2. The method of claim 1, further comprising: the previous procedure in the step (1) comprises the steps of polishing the substrate, removing burrs on the surface and cleaning the board surface.
3. The method of claim 1, further comprising: and (4) adding a group of laser holes on the four sides of the laminated plate in the step (3), wherein each group comprises 8 laser holes, and the total number of the laser holes is four groups.
4. The method of claim 1, further comprising: the step (4) further comprises the following steps:
1) and brushing the board: removing burrs at an orifice before chemical copper deposition, and cleaning the surface of a pressing plate;
2) and desmearing treatment: the residual drilling dirt of the copper foil is removed, the hole wall structure is improved, the binding force is enhanced, and the binding property is ensured.
5. The method of claim 1, further comprising: when the film is pasted in the step (5), the protective film is firstly stripped from the dry film, then the dry film is pasted on the copper foil plate under the condition of heating and pressurizing, the corrosion inhibitor layer in the dry film becomes soft after being heated, the fluidity is increased, the pasting is completed under the pressure of the heat-assisted compression roller and the action of the binder in the corrosion inhibitor, the pasting is generally continuously pasted, the upper film and the lower film are aligned, and the pattern transfer yield can be improved through proper dry film bonding force.
6. The method of claim 1, further comprising: and (4) performing pattern electroplating on the copper layer below the film layer washed away by the developing solution, washing away the exposed film layer by using an etching solution, and etching the copper layer below the film layer, wherein the copper layer after pattern electroplating is left is a required circuit.
7. The method of claim 1, further comprising: and (9) cleaning the surface of the circuit board after pattern electroplating and drying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011561519.9A CN112654164A (en) | 2020-12-25 | 2020-12-25 | Blind hole and circuit pattern high-precision alignment mode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011561519.9A CN112654164A (en) | 2020-12-25 | 2020-12-25 | Blind hole and circuit pattern high-precision alignment mode |
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| Publication Number | Publication Date |
|---|---|
| CN112654164A true CN112654164A (en) | 2021-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011561519.9A Pending CN112654164A (en) | 2020-12-25 | 2020-12-25 | Blind hole and circuit pattern high-precision alignment mode |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114364167A (en) * | 2021-12-23 | 2022-04-15 | 江苏普诺威电子股份有限公司 | Double-layer packaging substrate alignment method suitable for laser through hole |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997046349A1 (en) * | 1996-06-05 | 1997-12-11 | Burgess Larry W | Blind via laser drilling system |
| CN103179812A (en) * | 2013-04-18 | 2013-06-26 | 梅州市志浩电子科技有限公司 | Manufacturing method of high-order multistage HDI (High Density Interconnection) printed circuit board |
| CN105764261A (en) * | 2016-03-25 | 2016-07-13 | 柏承科技(昆山)股份有限公司 | Circuit LDI exposure positioning method and application thereof |
| CN106341961A (en) * | 2016-09-12 | 2017-01-18 | 深圳市景旺电子股份有限公司 | High-density interconnection printed circuit board and method of increasing aligning degree of blind hole and graph |
-
2020
- 2020-12-25 CN CN202011561519.9A patent/CN112654164A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997046349A1 (en) * | 1996-06-05 | 1997-12-11 | Burgess Larry W | Blind via laser drilling system |
| CN103179812A (en) * | 2013-04-18 | 2013-06-26 | 梅州市志浩电子科技有限公司 | Manufacturing method of high-order multistage HDI (High Density Interconnection) printed circuit board |
| CN105764261A (en) * | 2016-03-25 | 2016-07-13 | 柏承科技(昆山)股份有限公司 | Circuit LDI exposure positioning method and application thereof |
| CN106341961A (en) * | 2016-09-12 | 2017-01-18 | 深圳市景旺电子股份有限公司 | High-density interconnection printed circuit board and method of increasing aligning degree of blind hole and graph |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114364167A (en) * | 2021-12-23 | 2022-04-15 | 江苏普诺威电子股份有限公司 | Double-layer packaging substrate alignment method suitable for laser through hole |
| CN114364167B (en) * | 2021-12-23 | 2023-11-07 | 江苏普诺威电子股份有限公司 | Double-layer packaging substrate alignment method suitable for laser through holes |
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Application publication date: 20210413 |