CN103068163B - Electroplating method of circuit board with surface coated with resin - Google Patents
Electroplating method of circuit board with surface coated with resin Download PDFInfo
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- CN103068163B CN103068163B CN 201110324397 CN201110324397A CN103068163B CN 103068163 B CN103068163 B CN 103068163B CN 201110324397 CN201110324397 CN 201110324397 CN 201110324397 A CN201110324397 A CN 201110324397A CN 103068163 B CN103068163 B CN 103068163B
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Abstract
The invention discloses an electroplating method of a circuit board with the surface coated with resin. The method comprises the following steps: (1) coating resin, namely coating a layer of a solidifiable combination of an insulation polymer layer and curing agents on a base material copper of the circuit board after being laminated, providing a resin layer which is not solidified or is partially solidified, the resin having acid proof property and alkali-corrosion, and the thickness between 8-10mum; (2) drying; (3) boring; (4) removing the resin layer on the board; (5) sinking copper; (6) grinding the board; (7) copper electroplating; (8) removing a film: namely removing the resin layer on the surface by using NaOH solution, keeping the film removing time for at least 5min, exposing the base copper on the board; and (9) outputting the product: performing the next procedure preparation after electroplating is completed. The electroplating method of the circuit board is low in cost and high in quality, electroplating cost is saved by 85%, scratching on the surface of the circuit board because of electroplating operation is completely lowered, and meanwhile an open circuit notch caused by the abnormal situation that the copper on the surface of electroplated copper is not even in thickness is avoided.
Description
Technical field
The present invention relates to a kind of electro-plating method of wiring board, particularly the electro-plating method of the wiring board of a kind of low cost, high-quality surface-coated resin, belong to the wiring board processing technique field.
Background technology
there are three large problems in wiring board in the process of electro-coppering: 1, the purpose of electro-coppering is conducted the enclose pattern of wiring board and outer graphics for plate one deck conductive copper layer in the hole, only need on this part principle can realize plating conductive copper in the hole, and all copper plating technology is and electroplates simultaneously in PCB surface and hole at present, resource is seriously in short supply now, the price of copper also constantly raises, consume in the circuit board electroplating process in the copper of plate face accounts for whole electroplating process more than 80%, simultaneously these copper being electroplated onto needs in addition corresponding electric charge to realize on the plate face, so cause the waste of great copper and electric power resource, 2, now electric plating of whole board technology when carrying out panel plating due to CURRENT DISTRIBUTION can't homogeneity, cause the copper electroplating thickness of plate face diverse location to differ larger, have the phenomenon of line short and residual copper when the etching of carrying out the surface lines figure is made, 3, need repeatedly artificial carrying and upper and lower plates action in the panel plating process, as easy as rolling off a logly cause scratch that plate face copper is subject to external force to form open circuit etc. extremely when follow-up making circuit.
Summary of the invention
Technical problem for above-mentioned existence the objective of the invention is: the electro-plating method that has proposed the wiring board of a kind of low cost, high-quality surface-coated resin.
Technical solution of the present invention is achieved in that a kind of electro-plating method of wiring board of surface-coated resin, comprises following steps:
1., coating resin: the curable compositions that will complete coating one deck insulating polymer and curing agent on the base material copper surface of wiring board after lamination, uncured or partly solidified resin bed is provided, resin bed has characteristic acidproof but the fearness caustic corrosion, and its thickness is at 8-10um;
2., oven dry operation: resin bed need carry out corresponding oven dry operation, to guarantee intact being attached on base material copper surface of resin bed, default five sections 80 ℃-90 ℃-100 ℃-90 ℃-80 ℃ of bake out temperature, every section all guarantees drying time 5min at least, complete above after, need to guarantee that resin bed intensity is more than 6H;
3., bore operation: wiring board is carried out bore operation according to the item number borehole data;
4., wiring board removes resin bed: sulfuric acid process is removed residual resin bed operation in the hole;
5., heavy copper: need equally to use acid heavy copper system, in the circuit plate hole and PCB surface all deposit the last layer conductive layer, make the function that possesses conduction in the hole, be beneficial to the operation of follow-up electro-coppering;
6., nog plate: use the abrasive belt grinding machine that PCB surface is once polished, purpose is that the heavy copper of PCB surface is removed, and makes PCB surface expose resin bed, does not possess conducting function, only carries out the electro-coppering operation in the hole during plating;
7., electro-coppering: wiring board is hung electroplated the electro-coppering metallization operation of carrying out in cylinder in the hole, make the conducting of PCB surface and inner figure;
8., move back film: use the resin bed on NaOH solution removal surface, move back the film time need guarantee at least 5min, expose the base material copper of PCB surface;
9., shipment: plating completes, and carries out next step operation and makes.
Due to the utilization of technique scheme, the present invention compared with prior art has following advantages:
The electro-plating method of the wiring board of surface-coated resin of the present invention, electroplate cost of manufacture and save 85%, PCB surface improves fully because of the scratch that electroplating operations causes, and is stopped because of the even open circuit breach that extremely causes of electro-coppering surface copper thickness ununiformity simultaneously.
Embodiment
The circuit board electroplating method of surface-coated resin of the present invention comprises following steps:
1., coating resin: the curable compositions that will complete coating one deck insulating polymer and curing agent on the base material copper surface of wiring board after lamination, uncured or partly solidified resin bed is provided, resin bed has characteristic acidproof but the fearness caustic corrosion, and its thickness is at 8-10um;
2., oven dry operation: resin bed need carry out corresponding oven dry operation, to guarantee intact being attached on base material copper surface of resin bed, default five sections 80 ℃-90 ℃-100 ℃-90 ℃-80 ℃ of bake out temperature, every section all guarantees drying time 5min at least, complete above after, need to guarantee that resin bed intensity is more than 6H;
3., bore operation: wiring board is carried out bore operation according to the item number borehole data;
4., wiring board removes resin bed: sulfuric acid process is removed residual resin bed operation in the hole;
5., heavy copper: need equally to use acid heavy copper system, in the circuit plate hole and PCB surface all deposit the last layer conductive layer, make the function that possesses conduction in the hole, be beneficial to the operation of follow-up electro-coppering;
6., nog plate: use the abrasive belt grinding machine that PCB surface is once polished, purpose is that the heavy copper of PCB surface is removed, and makes PCB surface expose resin bed, does not possess conducting function, only carries out the electro-coppering operation in the hole during plating;
7., electro-coppering: wiring board is hung electroplated the electro-coppering metallization operation of carrying out in cylinder in the hole, make the conducting of PCB surface and inner figure;
8., move back film: use the resin bed on NaOH solution removal surface, move back the film time need guarantee at least 5min, expose the base material copper of PCB surface;
9., shipment: plating completes, and carries out next step operation and makes.
Due to the utilization of technique scheme, the present invention compared with prior art has following advantages:
The electro-plating method of the wiring board of surface-coated resin of the present invention, electroplate cost of manufacture and save 85%, PCB surface improves fully because of the scratch that electroplating operations causes, and is stopped because of the even open circuit breach that extremely causes of electro-coppering surface copper thickness ununiformity simultaneously.
Above-described embodiment only is explanation technical conceive of the present invention and characteristics; its purpose is to allow person skilled in the art scholar can understand content of the present invention and be implemented; can not limit protection scope of the present invention with this; all equivalences that Spirit Essence is done according to the present invention change or modify, and all should be encompassed in protection scope of the present invention.
Claims (1)
1. the electro-plating method of the wiring board of a surface-coated resin comprises following steps:
1., coating resin: the curable compositions that will complete coating one deck insulating polymer and curing agent on the base material copper surface of wiring board after lamination, uncured or partly solidified resin bed is provided, resin bed has characteristic acidproof but the fearness caustic corrosion, and its thickness is at 8-10um;
2., oven dry operation: resin bed need carry out corresponding oven dry operation, to guarantee intact being attached on base material copper surface of resin bed, default five sections 80 ℃-90 ℃-100 ℃-90 ℃-80 ℃ of bake out temperature, every section all guarantees drying time 5min at least, complete above after, need to guarantee that resin bed intensity is more than 6H;
3., bore operation: wiring board is carried out bore operation according to the item number borehole data;
4., wiring board removes resin bed: sulfuric acid process is removed residual resin bed operation in the hole;
5., heavy copper: need equally to use acid heavy copper system, in the circuit plate hole and PCB surface all deposit the last layer conductive layer, make the function that possesses conduction in the hole, be beneficial to the operation of follow-up electro-coppering;
6., nog plate: use the abrasive belt grinding machine that PCB surface is once polished, purpose is that the heavy copper of PCB surface is removed, and makes PCB surface expose resin bed, does not possess conducting function, only carries out the electro-coppering operation in the hole during plating;
7., electro-coppering: wiring board is hung electroplated the electro-coppering metallization operation of carrying out in cylinder in the hole, make the conducting of PCB surface and inner figure;
8., move back film: use the resin bed on NaOH solution removal surface, move back the film time need guarantee at least 5min, expose the base material copper of PCB surface;
9., shipment: plating completes, and carries out next step operation and makes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110324397 CN103068163B (en) | 2011-10-24 | 2011-10-24 | Electroplating method of circuit board with surface coated with resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110324397 CN103068163B (en) | 2011-10-24 | 2011-10-24 | Electroplating method of circuit board with surface coated with resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103068163A CN103068163A (en) | 2013-04-24 |
| CN103068163B true CN103068163B (en) | 2013-11-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201110324397 Active CN103068163B (en) | 2011-10-24 | 2011-10-24 | Electroplating method of circuit board with surface coated with resin |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030011434A (en) * | 2001-08-02 | 2003-02-11 | 주식회사 디에이피 | Manufacturing method for hidden laser via hole of multi-layered printed circuit board |
| CN101286454A (en) * | 2007-04-10 | 2008-10-15 | 上海美维科技有限公司 | Printed circuit board and producing method of encapsulation base of integrated circuit |
| CN101304638A (en) * | 2008-04-30 | 2008-11-12 | 李东明 | Electroplating technique for thickening mask hole cuprum of printed circuit board |
| CN101662893A (en) * | 2009-09-04 | 2010-03-03 | 东莞美维电路有限公司 | Manufacturing method for printed wiring board with dense disk holes |
-
2011
- 2011-10-24 CN CN 201110324397 patent/CN103068163B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030011434A (en) * | 2001-08-02 | 2003-02-11 | 주식회사 디에이피 | Manufacturing method for hidden laser via hole of multi-layered printed circuit board |
| CN101286454A (en) * | 2007-04-10 | 2008-10-15 | 上海美维科技有限公司 | Printed circuit board and producing method of encapsulation base of integrated circuit |
| CN101304638A (en) * | 2008-04-30 | 2008-11-12 | 李东明 | Electroplating technique for thickening mask hole cuprum of printed circuit board |
| CN101662893A (en) * | 2009-09-04 | 2010-03-03 | 东莞美维电路有限公司 | Manufacturing method for printed wiring board with dense disk holes |
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| Publication number | Publication date |
|---|---|
| CN103068163A (en) | 2013-04-24 |
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Effective date of registration: 20200320 Address after: No. 999, Yinzhong South Road, Wuzhong Economic Development Zone, Suzhou City, Jiangsu Province Patentee after: Yuehu Crystal Core Circuit (Suzhou) Co., Ltd. Address before: Road Wuzhong Economic Development Zone Suzhou city Jiangsu province 215122 Yin No. 999 Patentee before: TIGERBUILDER CIRCUIT (SUZHOU) Co.,Ltd. |
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