CN103068163A - Electroplating method of circuit board with surface coated with resin - Google Patents
Electroplating method of circuit board with surface coated with resin Download PDFInfo
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- CN103068163A CN103068163A CN2011103243976A CN201110324397A CN103068163A CN 103068163 A CN103068163 A CN 103068163A CN 2011103243976 A CN2011103243976 A CN 2011103243976A CN 201110324397 A CN201110324397 A CN 201110324397A CN 103068163 A CN103068163 A CN 103068163A
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Abstract
The invention discloses an electroplating method of a circuit board with the surface coated with resin. The method comprises the following steps: (1) coating resin, namely base material copper on the surface of the circuit board after being laminated is coated with a solidifiable combination of an insulation polymer layer and curing agents, a resin layer which is not solidified or is partially solidified is provided, the resin has acid proof property and is not alkali-corrosion resistant, and the proper width of the resin is about 8-10 micrometers; (2) drying operation; (4) board glue removing; (5) copper sinking; (6) board grinding; (7) copper electroplating; (8) resin material removing, namely NaOH solution of 3-5 is used for removing resin materials on the surface, film removing time is at least 5 min, and original copper of the surface of the board is exposed; (9) product output, namely electroplating is completed, and a follow-up procedure is carried out. The electroplating method of the circuit board is low in cost and high in quality, electroplating cost is saved by 85%, scratching on the surface of the circuit board because of electroplating operation is completely lowered, and meanwhile an open circuit notch caused by the abnormal situation that the copper on the surface of electroplated copper is not even in thickness is avoided.
Description
Technical field
The present invention relates to a kind of electro-plating method of wiring board, particularly the electro-plating method of the wiring board of a kind of low cost, high-quality surface-coated resin belongs to the wiring board processing technique field.
Background technology
There are three large problems in wiring board in the process of electro-coppering: 1, the purpose of electro-coppering is conducted the enclose pattern of wiring board and outer graphics for plate one deck conductive copper layer in the hole, only need on this part principle then can realize plating conductive copper in the hole, and all copper plating technology is and electroplates simultaneously in PCB surface and the hole at present, resource is seriously in short supply now, the price of copper also constantly raises, consume in the circuit board electroplating process copper at the plate face account in the whole electroplating process more than 80%, simultaneously these copper being electroplated onto needs in addition corresponding electric charge to realize on the plate face, so then cause the waste of great copper and electric power resource; 2, now electric plating of whole board technology when carrying out panel plating since CURRENT DISTRIBUTION can't homogeneity, cause the copper electroplating thickness of plate face diverse location to differ larger, when the etching of carrying out the surface lines figure is made, have the phenomenon of line short and residual copper; 3, need repeatedly artificial carrying and upper and lower plates action in the panel plating process, the as easy as rolling off a log scratch that causes plate face copper to be subject to external force forms open circuit etc. unusually when follow-up making circuit.
Summary of the invention
Technical problem for above-mentioned existence the objective of the invention is: the electro-plating method that has proposed the wiring board of a kind of low cost, high-quality surface-coated resin.
Technical solution of the present invention is achieved in that a kind of electro-plating method of wiring board of surface-coated resin, comprises following steps:
1., coating resin: will finish that the curable compositions of coating one deck insulating polymer and curing agent provides uncured or partly solidified resin bed on the PCB surface base material copper behind the lamination, resin has characteristic acidproof but the fearness caustic corrosion, its thickness is advisable about 8-10um.
2., oven dry operation: resin need carry out corresponding oven dry operation, to guarantee its intact being attached on the plate surface, default five sections 80 ℃-90 ℃-100 ℃-90 ℃-80 ℃ of bake out temperature is advisable, and every section all guarantees at least 5min of drying time, and finishing needs to guarantee that mechanical strength of resin is more than 6H after above;
3., bore operation: plate is carried out bore operation according to the item number borehole data;
4., plate removes glue: traditional removes gluing method for using potassium permanganate to remove the glue operation, because PCB surface has been used not alkali-proof resin material, removes cull operation in the hole so need use sulfuric acid process instead;
5., heavy copper: need equally to use acid heavy copper system, in the plank hole and the surface all deposit the conductive layer of last layer book book, make the function that possesses conduction in the hole, be beneficial to the operation of follow-up electro-coppering;
6., nog plate: use the abrasive belt grinding machine that the plate face is carried out once slight polishing, purpose is that the change copper of surperficial book book is removed, so that resin bed is exposed on the plate surface, does not possess conducting function, only carries out the electro-coppering operation in the hole during plating;
7., electro-coppering: plate is hung the electro-coppering metallization operation of carrying out in the plating cylinder in the hole, reach the conducting of hole PCB surface and inner figure;
8., move back resin material: use the resin material on the NaOH solution removal surface of 3-5, move back the film time need guarantee at least 5min, expose the original copper of plate face;
9., shipment: plating completes, and carries out next step operation and makes.
Because the utilization of technique scheme, the present invention compared with prior art has following advantages:
The electro-plating method of the wiring board of surface-coated resin of the present invention, electroplate cost of manufacture and save 85%, PCB surface improves fully because of the scratch that electroplating operations causes, and is stopped because of the even open circuit breach that unusually causes of electro-coppering surface copper thickness ununiformity simultaneously.
Embodiment
The circuit board electroplating method of surface-coated resin of the present invention comprises following steps:
1., coating resin: will finish that the curable compositions of coating one deck insulating polymer and curing agent provides uncured or partly solidified resin bed on the PCB surface base material copper behind the lamination, resin has characteristic acidproof but the fearness caustic corrosion, its thickness is advisable about 8-10um.
2., oven dry operation: resin need carry out corresponding oven dry operation, to guarantee its intact being attached on the plate surface, default five sections 80 ℃-90 ℃-100 ℃-90 ℃-80 ℃ of bake out temperature is advisable, and every section all guarantees at least 5min of drying time, and finishing needs to guarantee that mechanical strength of resin is more than 6H after above;
3., bore operation: plate is carried out bore operation according to the item number borehole data;
4., plate removes glue: traditional removes gluing method for using potassium permanganate to remove the glue operation, because PCB surface has been used not alkali-proof resin material, removes cull operation in the hole so need use sulfuric acid process instead;
5., heavy copper: need equally to use acid heavy copper system, in the plank hole and the surface all deposit the conductive layer of last layer book book, make the function that possesses conduction in the hole, be beneficial to the operation of follow-up electro-coppering;
6., nog plate: use the abrasive belt grinding machine that the plate face is carried out once slight polishing, purpose is that the change copper of surperficial book book is removed, so that resin bed is exposed on the plate surface, does not possess conducting function, only carries out the electro-coppering operation in the hole during plating;
7., electro-coppering: plate is hung the electro-coppering metallization operation of carrying out in the plating cylinder in the hole, reach the conducting of hole PCB surface and inner figure;
8., move back resin material: use the resin material on the NaOH solution removal surface of 3-5, move back the film time need guarantee at least 5min, expose the original copper of plate face;
9., shipment: plating completes, and carries out next step operation and makes.
Because the utilization of technique scheme, the present invention compared with prior art has following advantages:
The electro-plating method of the wiring board of surface-coated resin of the present invention, electroplate cost of manufacture and save 85%, PCB surface improves fully because of the scratch that electroplating operations causes, and is stopped because of the even open circuit breach that unusually causes of electro-coppering surface copper thickness ununiformity simultaneously.
Above-described embodiment only is explanation technical conceive of the present invention and characteristics; its purpose is to allow the personage that is familiar with technique can understand content of the present invention and is implemented; can not limit protection scope of the present invention with this; all equivalences that Spirit Essence is done according to the present invention change or modify, and all should be encompassed in protection scope of the present invention.
Claims (1)
1. the electro-plating method of the wiring board of a surface-coated resin comprises following steps:
1., coating resin: will finish that the curable compositions of coating one deck insulating polymer and curing agent provides uncured or partly solidified resin bed on the PCB surface base material copper behind the lamination, resin has characteristic acidproof but the fearness caustic corrosion, and its thickness is advisable about 8-10um;
2., oven dry operation: resin need carry out corresponding oven dry operation, to guarantee its intact being attached on the plate surface, default five sections 80 ℃-90 ℃-100 ℃-90 ℃-80 ℃ of bake out temperature is advisable, and every section all guarantees at least 5min of drying time, and finishing needs to guarantee that mechanical strength of resin is more than 6H after above;
3., bore operation: plate is carried out bore operation according to the item number borehole data;
4., plate removes glue: traditional removes gluing method for using potassium permanganate to remove the glue operation, because PCB surface has been used not alkali-proof resin material, removes cull operation in the hole so need use sulfuric acid process instead;
5., heavy copper: need equally to use acid heavy copper system, in the plank hole and the surface all deposit the conductive layer of last layer book book, make the function that possesses conduction in the hole, be beneficial to the operation of follow-up electro-coppering;
6., nog plate: use the abrasive belt grinding machine that the plate face is carried out once slight polishing, purpose is that the change copper of surperficial book book is removed, so that resin bed is exposed on the plate surface, does not possess conducting function, only carries out the electro-coppering operation in the hole during plating;
7., electro-coppering: plate is hung the electro-coppering metallization operation of carrying out in the plating cylinder in the hole, reach the conducting of hole PCB surface and inner figure;
8., move back resin material: use the resin material on the NaOH solution removal surface of 3-5, move back the film time need guarantee at least 5min, expose the original copper of plate face;
9., shipment: plating completes, and carries out next step operation and makes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110324397 CN103068163B (en) | 2011-10-24 | 2011-10-24 | Electroplating method of circuit board with surface coated with resin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110324397 CN103068163B (en) | 2011-10-24 | 2011-10-24 | Electroplating method of circuit board with surface coated with resin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103068163A true CN103068163A (en) | 2013-04-24 |
| CN103068163B CN103068163B (en) | 2013-11-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201110324397 Active CN103068163B (en) | 2011-10-24 | 2011-10-24 | Electroplating method of circuit board with surface coated with resin |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115692313A (en) * | 2022-10-21 | 2023-02-03 | 湖北金禄科技有限公司 | TFT photoelectric plate and manufacturing method thereof |
| CN116056340A (en) * | 2023-01-30 | 2023-05-02 | 昆山沪利微电有限公司 | PCB production method capable of preventing electrochemical migration |
| CN115692313B (en) * | 2022-10-21 | 2024-10-29 | 湖北金禄科技有限公司 | TFT photoelectric plate and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030011434A (en) * | 2001-08-02 | 2003-02-11 | 주식회사 디에이피 | Manufacturing method for hidden laser via hole of multi-layered printed circuit board |
| CN101286454A (en) * | 2007-04-10 | 2008-10-15 | 上海美维科技有限公司 | Printed circuit board and producing method of encapsulation base of integrated circuit |
| CN101304638A (en) * | 2008-04-30 | 2008-11-12 | 李东明 | Electroplating technique for thickening mask hole cuprum of printed circuit board |
| CN101662893A (en) * | 2009-09-04 | 2010-03-03 | 东莞美维电路有限公司 | Manufacturing method for printed wiring board with dense disk holes |
-
2011
- 2011-10-24 CN CN 201110324397 patent/CN103068163B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030011434A (en) * | 2001-08-02 | 2003-02-11 | 주식회사 디에이피 | Manufacturing method for hidden laser via hole of multi-layered printed circuit board |
| CN101286454A (en) * | 2007-04-10 | 2008-10-15 | 上海美维科技有限公司 | Printed circuit board and producing method of encapsulation base of integrated circuit |
| CN101304638A (en) * | 2008-04-30 | 2008-11-12 | 李东明 | Electroplating technique for thickening mask hole cuprum of printed circuit board |
| CN101662893A (en) * | 2009-09-04 | 2010-03-03 | 东莞美维电路有限公司 | Manufacturing method for printed wiring board with dense disk holes |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115692313A (en) * | 2022-10-21 | 2023-02-03 | 湖北金禄科技有限公司 | TFT photoelectric plate and manufacturing method thereof |
| CN115692313B (en) * | 2022-10-21 | 2024-10-29 | 湖北金禄科技有限公司 | TFT photoelectric plate and manufacturing method thereof |
| CN116056340A (en) * | 2023-01-30 | 2023-05-02 | 昆山沪利微电有限公司 | PCB production method capable of preventing electrochemical migration |
Also Published As
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| CN103068163B (en) | 2013-11-06 |
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Effective date of registration: 20200320 Address after: No. 999, Yinzhong South Road, Wuzhong Economic Development Zone, Suzhou City, Jiangsu Province Patentee after: Yuehu Crystal Core Circuit (Suzhou) Co., Ltd. Address before: Road Wuzhong Economic Development Zone Suzhou city Jiangsu province 215122 Yin No. 999 Patentee before: TIGERBUILDER CIRCUIT (SUZHOU) Co.,Ltd. |