CN101302636A - Metal piece electroplating method - Google Patents
Metal piece electroplating method Download PDFInfo
- Publication number
- CN101302636A CN101302636A CNA2008100650926A CN200810065092A CN101302636A CN 101302636 A CN101302636 A CN 101302636A CN A2008100650926 A CNA2008100650926 A CN A2008100650926A CN 200810065092 A CN200810065092 A CN 200810065092A CN 101302636 A CN101302636 A CN 101302636A
- Authority
- CN
- China
- Prior art keywords
- metalwork
- electroplating
- membrane
- metal part
- metal piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses a metal part electroplating method, which comprises the following: a step of membrane sticking, which is to cover an anti-electroplating membrane coincided with the non-electroplating part of a metal part on the surface of the metal part to be electroplated; a step of electroplating, which is to carry out the electroplating of the metal part covered with the anti-electroplating membrane on the surface; a step of stripping, which is to remove the anti-electroplating membrane on the metal part after electroplating. The metal part electroplating method can avoid unnecessary waste and reduces electroplating cost; moreover, the method greatly increases bonding force when a metal part is glued to other parts or a PCB, and the metal part does not delaminate or fall off even when the metal part is exposed in a high-temperature environment for a long time.
Description
Technical field
The present invention relates to machining technique, relate in particular to and a kind of mach metalwork is carried out electric plating method.
Background technology
In the prior art, for being used between communication field structural part and the structural part, between structural part and the current-carrying, the bonding of signal zero parts or machine riveting etc. need be carried out the electroplated metal part, all adopt whole the plating (to comprise gold-plated, silver-plated, copper facing etc.) mode, and in actual applications, most of metalwork all has only part to need to electroplate, this whole plating mode does not need galvanized part to electroplate to metalwork yet, thereby caused unnecessary waste, and when metalwork surface electrical coating will bond with other parts or PCB, bonding force poor (particularly gold coated article) at high temperature produces layering easily.
Summary of the invention
Technical problem to be solved by this invention is: a kind of Metal plating method is provided, this method can be avoided unnecessary waste, reduce galvanized cost, and in the time of can improving metalwork after the plating and miscellaneous part or PCB bonding, bonding force poor (particularly gold coated article) at high temperature produces stratified problem easily.
For solving the problems of the technologies described above, the present invention adopts following technical scheme:
A kind of metal piece electroplating method may further comprise the steps:
Step of membrane sticking need not to electroplate the anti-plate film that partially overlaps at metalwork surface coverage one deck of electroplated with it;
Plating step, the metalwork that the surface is coated with described anti-plate film is electroplated;
The striping step after plating finishes, is removed the anti-plate film on the metalwork.
The invention has the beneficial effects as follows:
Embodiments of the invention pass through at metalwork surface coverage selectivity anti-plate film, thereby only need galvanized part to electroplate to metalwork, avoid unnecessary waste, reduced galvanized cost, and can increase metalwork and miscellaneous part or the PCB bonding force in when bonding greatly, can layering or come off even also be in for a long time in the high temperature not.
Embodiment
The present invention relates to a kind of to metalwork, in particular between structural part in the communication field and the structural part, between structural part and the current-carrying, the bonding of signal zero parts or machine riveting etc. need carry out the method that selective electroplating is carried out on electroplated metal part surface, describe the idiographic flow that in one embodiment of the present of invention the metalwork surface is carried out a selective electroplating below in detail:
In step of membrane sticking, need not to electroplate the anti-plate film that partially overlaps with it at metalwork surface coverage one deck of electroplated;
For the metalwork that can on exposure machine, process, as metal matrix etc., its anti-plate film can adopt photosensory membrane, and the benefit that adopts photosensory membrane is only to compare complicated anti-plate figure, uses photosensory membrane as follows at the method flow of metallic surface making anti-plate figure:
At first, photosensory membrane is covered on the metalwork of electroplated;
Secondly, using exposure machine that described metalwork be need not galvanized part exposes;
Secondly, the unexposed part of photosensory membrane is developed again, form the anti-plate zone on the metalwork surface.
During specific implementation, general PCB makes the photosensitive dry film of figure, and its optimum thickness is about the 30-50 micron.
In addition, described anti-plate film can also adopt acid and alkali-resistance, high temperature resistant, the adhesive tape of cull not, this adhesive tape can be used for the anti-plate film processing of all metalworks, but its shortcoming is to do the anti-plate figure that complexity has precision, use the process of adhesive tape making anti-plate film comparatively simple, only need adhesive tape to be covered the metalwork surface and compress, get final product,, then can use blade adhesive tape to be carried out processing such as deburring, shaping if need to repair the anti-plate figure to prevent that adhesive tape comes off in electroplating process.
Consider for the electroplating effect of the best, before step of membrane sticking, preferably the surface of metalwork handled that guarantee impurity such as its surface clean, no greasy dirt, the anti-plate film for photosensory membrane is made will prevent that especially it is subjected to the injury of basic solution.
In plating step, the metalwork that the surface is coated with described anti-plate film is electroplated.
In the striping step, after plating finishes, remove the anti-plate film on the metalwork, during specific implementation,, can adopt the highly basic sodium hydroxide solution to remove photosensory membrane for the anti-plate film that photosensory membrane is made; For the anti-plate film that cull adhesive tape is not made, directly remove and get final product.
Use the metalwork after this selective electroplating mode is electroplated, if it does not plate the zone and will bond with other parts or PCB, it is not plated after the zone carries out other mode surface treatments, by bonding or compacting, can increase its bonding force greatly, can layering or come off even also be in for a long time in the high temperature not.
The above is a preferred implementation of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also are considered as protection scope of the present invention.
Claims (6)
1, a kind of metal piece electroplating method is characterized in that, may further comprise the steps:
Step of membrane sticking need not to electroplate the anti-plate film that partially overlaps at metalwork surface coverage one deck of electroplated with it;
Plating step, the metalwork that the surface is coated with described anti-plate film is electroplated;
The striping step after plating finishes, is removed the anti-plate film on the metalwork.
2, metal piece electroplating method as claimed in claim 1 is characterized in that, described anti-plate film is a photosensory membrane.
3, metal piece electroplating method as claimed in claim 2 is characterized in that, described step of membrane sticking specifically comprises:
Photosensory membrane is covered on the metalwork of electroplated;
Using exposure machine that described metalwork be need not galvanized part exposes;
The unexposed part of photosensory membrane is developed, form the anti-plate zone on the metalwork surface.
4, metal piece electroplating method as claimed in claim 3 is characterized in that, in described striping step, uses the photosensory membrane on the strong base solution removal metalwork.
As each described metal piece electroplating method among the claim 2-4, it is characterized in that 5, the thickness of described photosensory membrane is the 30-50 micron.
6, metal piece electroplating method as claimed in claim 1 is characterized in that, described anti-plate film is an adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100650926A CN101302636A (en) | 2008-01-18 | 2008-01-18 | Metal piece electroplating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008100650926A CN101302636A (en) | 2008-01-18 | 2008-01-18 | Metal piece electroplating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101302636A true CN101302636A (en) | 2008-11-12 |
Family
ID=40112727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008100650926A Pending CN101302636A (en) | 2008-01-18 | 2008-01-18 | Metal piece electroplating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101302636A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102014586A (en) * | 2010-11-24 | 2011-04-13 | 深南电路有限公司 | Method for gold-plating long and short gold fingers |
| CN102168293A (en) * | 2011-01-20 | 2011-08-31 | 宁波华龙电子股份有限公司 | Membrane sticking electroplating process for lead frame and special device thereof |
| CN102505132A (en) * | 2011-10-25 | 2012-06-20 | 深南电路有限公司 | Encapsulation base plate surface electroplating method |
| WO2012130929A2 (en) | 2011-03-29 | 2012-10-04 | Rovalma, S.A. | Cathodic protection by coating for cooling circuits or other holes or channels |
| CN103441625A (en) * | 2013-09-05 | 2013-12-11 | 宁波韵升股份有限公司 | Local electroplating method of magnetic tile for rare earth permanent magnet motor rotor |
| CN105063694A (en) * | 2015-08-21 | 2015-11-18 | 无锡桥阳机械制造有限公司 | Metal part electroplating method |
| CN105200473A (en) * | 2015-10-30 | 2015-12-30 | 无锡市嘉邦电力管道厂 | Electroplating method of metal piece |
| CN105603474A (en) * | 2016-03-04 | 2016-05-25 | 广德英菲特电子有限公司 | Local thick copper plating process |
| CN107460509A (en) * | 2017-07-21 | 2017-12-12 | 广东欧珀移动通信有限公司 | Terminal enclosure and terminal enclosure processing technology |
| CN111889988A (en) * | 2020-08-24 | 2020-11-06 | 东莞市阳耀电子技术有限公司 | Preparation method of hardware plate |
| US11786930B2 (en) | 2016-12-13 | 2023-10-17 | Hzo, Inc. | Protective coating |
-
2008
- 2008-01-18 CN CNA2008100650926A patent/CN101302636A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102014586A (en) * | 2010-11-24 | 2011-04-13 | 深南电路有限公司 | Method for gold-plating long and short gold fingers |
| CN102168293A (en) * | 2011-01-20 | 2011-08-31 | 宁波华龙电子股份有限公司 | Membrane sticking electroplating process for lead frame and special device thereof |
| CN102168293B (en) * | 2011-01-20 | 2012-05-30 | 宁波华龙电子股份有限公司 | Membrane sticking electroplating process for lead frame and special device thereof |
| WO2012130929A2 (en) | 2011-03-29 | 2012-10-04 | Rovalma, S.A. | Cathodic protection by coating for cooling circuits or other holes or channels |
| CN102505132A (en) * | 2011-10-25 | 2012-06-20 | 深南电路有限公司 | Encapsulation base plate surface electroplating method |
| CN103441625A (en) * | 2013-09-05 | 2013-12-11 | 宁波韵升股份有限公司 | Local electroplating method of magnetic tile for rare earth permanent magnet motor rotor |
| CN105063694A (en) * | 2015-08-21 | 2015-11-18 | 无锡桥阳机械制造有限公司 | Metal part electroplating method |
| CN105200473A (en) * | 2015-10-30 | 2015-12-30 | 无锡市嘉邦电力管道厂 | Electroplating method of metal piece |
| CN105603474A (en) * | 2016-03-04 | 2016-05-25 | 广德英菲特电子有限公司 | Local thick copper plating process |
| US11786930B2 (en) | 2016-12-13 | 2023-10-17 | Hzo, Inc. | Protective coating |
| CN107460509A (en) * | 2017-07-21 | 2017-12-12 | 广东欧珀移动通信有限公司 | Terminal enclosure and terminal enclosure processing technology |
| CN107460509B (en) * | 2017-07-21 | 2019-07-30 | Oppo广东移动通信有限公司 | Terminal enclosure and terminal enclosure processing technology |
| CN111889988A (en) * | 2020-08-24 | 2020-11-06 | 东莞市阳耀电子技术有限公司 | Preparation method of hardware plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101302636A (en) | Metal piece electroplating method | |
| CN101892499B (en) | Peel-able ultra-thin copper foil using copper foil as carrier and preparation method thereof | |
| EP0960725B1 (en) | Resin-coated composite foil, production and use thereof | |
| WO2006095851A1 (en) | Copper surface treatment method and copper | |
| CN101835346A (en) | Nickel-gold electroplating process of PCB | |
| CN101275257A (en) | Method for electroplating gold on surface of circuit board | |
| CN105463524A (en) | Electroplating method of cyanide-free silver electroplating liquid | |
| US20140001051A1 (en) | Method of Electroplating and Depositing Metal | |
| JP2010201804A (en) | Composite metal foil, method for producing the same, and printed wiring board | |
| CN111424294A (en) | Production process of reverse copper foil | |
| CN102014586A (en) | Method for gold-plating long and short gold fingers | |
| CN101815405A (en) | Nickel-less immersion gold electric gold thickening process for printed circuit board | |
| US8158269B2 (en) | Composite material for electrical/electronic part and electrical/electronic part using the same | |
| CN100363175C (en) | Bonding layer forming solution, method of producing copper-to-resin bonding layer using the solution, and layered product obtained thereby | |
| CN109016196A (en) | A kind of electroplating diamond wire saw | |
| JPH0119000B2 (en) | ||
| CN113355672A (en) | Electroplating process of aluminum alloy pier pressing part | |
| JP4820989B2 (en) | Electroforming mold manufacturing method | |
| CN107475713A (en) | A kind of aluminum alloy mobile phone shell and its processing technology | |
| CN101960055B (en) | Method for plating RF equipment and RF equipment manufactured therefrom | |
| CN104152879A (en) | A method of manufacturing barrier material-plated copper foil | |
| US20140308538A1 (en) | Surface treated aluminum foil for electronic circuits | |
| KR100332515B1 (en) | Lamination process in PCB | |
| WO2018166047A1 (en) | Method for electroplating contact strip | |
| US20210002780A1 (en) | Ultra-thin copper foil structure, electromagnetic interference shield, copper clad laminate and printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20081112 |