CN106211634A - Circuit boring dry method method for metallising - Google Patents
Circuit boring dry method method for metallising Download PDFInfo
- Publication number
- CN106211634A CN106211634A CN201610614943.2A CN201610614943A CN106211634A CN 106211634 A CN106211634 A CN 106211634A CN 201610614943 A CN201610614943 A CN 201610614943A CN 106211634 A CN106211634 A CN 106211634A
- Authority
- CN
- China
- Prior art keywords
- copper
- circuit board
- circuit
- metallising
- dry method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0709—Catalytic ink or adhesive for electroless plating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of circuit boring dry method method for metallising, use vacuum sputtering technique, deposit metal film at circuit board surface and borehole wall and reach to turn on purpose.The present invention dry method depositing process by vacuum equipment, can replace or part replaces chemical plating process existing during wiring board produces, its production process will not use such as EDTA(edetate) such strong chelating agent, make the waste water that wiring board produces process become simple, and then wiring board is greatly reduced produces the pollution to environment and reduce sewage disposal expense.By improving Line-width precision and the reliability of hole metallization of circuit board, and then improve the crudy of circuit board, the particularly hole line mass of micro-strip substrate.
Description
Technical field
The present invention relates to circuit board manufacturing process field, specifically a kind of circuit boring dry method method for metallising.
Background technology
Circuit board can form industrialization, large-scale production, and topmost contribution is owing to releasing in the sixties in 20th century
About patent formulation and the colloid palladium patent formulation of electroless copper, circuit board through-hole is used electroless copper be its industrialization,
Large-scale production and automated production are laid a good foundation.It also becomes the circuit board making accepted by each manufacturing enterprise
One of fundamental technology.Board production fundamental technology is as follows:
Copper coated foil plate blanking one hole deburring one surface level process one weak corrosion one activate one the full plate of electroless copper one plate
Copper one etches the tin plating lead of plating patterns imaging one pattern plating copper one or nickel gold one stripping resist one etches a hot melt one and is coated with resistance
Layer
Must have chemical-copper-plating process during circuit board making, electroless copper be fundamental technology during circuit board making and
Important step.Electroless copper typically uses formaldehyde to be reducing agent, by Cu2+It is reduced into metallic copper and is deposited on circuit board surface and boring
Inwall, forms continuous print copper film, reaches the purpose of conducting.
Cu2++2HCHO+4OH-→Cu+2HCOO- +2H2O+H2↑
In order to the metallic copper tissue making deposition is fine and smooth and chemical plating solution is stable, it is necessary to control the Cu in solution2+Concentration, therefore
Needing in chemical plating fluid to add strong chelating agent, generally EDTA, this material such as chelating agent and formaldehyde can bring harm to environment,
Waste water has the biggest difficulty when processing, and the waste water especially with EDTA chelating agent processes, and current process all can not be done
To thoroughly.It addition, the maintenance and management of electroless copper tank liquor also has certain difficulty.But currently without replacing technique reliably, change
Learn copper facing and remain the critical process in circuit board making.
Summary of the invention it is an object of the invention to provide a kind of circuit boring dry method method for metallising, to solve existing electricity
Plate surface, road and boring use the pollution problem that chemical method copper facing exists.
In order to achieve the above object, the technical solution adopted in the present invention is:
Circuit boring dry method method for metallising, it is characterised in that: include following one or more steps:
Utilize optical detection, location, digital-controlled cleaning, remove circuit boring inwall and bore dirt；Utilize brush filament to clear up, remove circuit board
Drilled edge burr；Utilize ultrasonic waves for cleaning, remove circuit board surface dust；Utilize vacuum radio frequency plasma cleaning, remove electricity
Road plate oxide on surface and pollutant；Utilize vacuum sputtering technique, sink on circuit board copper-clad plate surface and circuit boring hole wall
Long-pending copper film；Before circuit board non-metal bare board surface and borehole wall deposit copper film, first with aluminum or chromium bottoming more terraced with aluminum bronze
Copper facing after degree alloy or chromium-copper graded alloy transition；Aluminize after vacuum sputtering copper film, as technical process overcoat.
Described circuit boring dry method method for metallising, it is characterised in that: utilize vacuum sputtering technique, it is achieved circuit board
Borehole wall metallizes.
Described circuit boring dry method method for metallising, it is characterised in that: copper-clad plate drilled metal can be realized, also
Can realize without covering copper bare board surface and drilled metal.
Described circuit boring dry method method for metallising, it is characterised in that: aluminize after copper plating film, as technical process
Overcoat is possible to prevent copper film oxidation and pollutes.
The present invention dry method depositing process by vacuum equipment, is a kind of clean process technique not having sewage.Can take
Generation or part replace chemical plating process existing during wiring board produces, and its production process will not use such as EDTA(ethylenediamine tetrem
Hydrochlorate) such strong chelating agent, the waste water making wiring board produce processes the simple of change, and then it is right that wiring board production is greatly reduced
The pollution of environment and reduction sewage disposal expense.By improving Line-width precision and the reliability of hole metallization of wiring board, and then
Improve the crudy of wiring board, the particularly hole line mass of micro-strip substrate.
Advantage of the present invention is:
1. utilize vacuum coating technology to realize the metallization of circuit boring, water discharge that technical process is pollution-free.
2. the chemical plating process during replacement available circuit plate produces, it is to avoid use strong chelating agent, make in board production
Waste water processes the simple of change, and processing cost is greatly lowered.
3. by vacuum sputtering aluminum (chromium) bottoming, use aluminum (chromium) copper gradient alloy transition again, can be at nonmetal bare board table
Face obtains the copper facing thin film having good adhesion.
4. on copper film surface, sputtering is aluminized as technical process protecting film, prevents layers of copper oxidation and pollutes.
Accompanying drawing explanation
Fig. 1 is circuit board (copper-clad plate) surface coating structural representation.
Fig. 2 is circuit board (nonmetal bare board) surface coating structural representation.
Detailed description of the invention
Circuit boring dry method method for metallising, it is characterised in that: include following one or more steps:
1, utilize optical detection, location, digital-controlled cleaning, remove circuit boring inwall and bore dirt；
2, utilize brush filament to clear up, remove circuit boring burrs on edges；
3, utilize ultrasonic waves for cleaning, remove circuit board surface dust；
4, utilize vacuum radio frequency plasma to clear up, remove circuit board surface oxide and pollutant；
5, utilize vacuum sputtering technique, deposit copper film (such as Fig. 1 institute on circuit board (copper-clad plate) surface and circuit boring hole wall
Show)；Before circuit board (nonmetal bare board) surface and borehole wall deposit copper film, first with aluminum (chromium) bottoming, then with aluminum (chromium)
Copper gradient alloy transition, improves the adhesion (as shown in Figure 2) of metal coating；
6, aluminize on vacuum sputtering copper film surface, prevent copper film oxidation as technical process overcoat and pollute.
The present invention compares with existing wet processing (chemical plating) and is shown in Table 1.
Table 1 circuit boring metallization dry process compares with wet processing
| Dry process (vacuum sputtering) | Wet processing (chemical plating) | |
| Principle | Utilize plasma, principle of magnetron-sputtering, generate in a vacuum | Utilizing EDTA for chelating agent, formaldehyde is reducing agent, generates in aqueous |
| Impact on environment | Pollution-free waste water | The a large amount of pollutant effluents Han EDTA of generation, difficult treatment, costly |
| Production stability | Stable production process | The maintenance and management of electroless copper tank liquor is more difficult |
| Multiformity | Many metal composite claddings can be prepared, such as: aluminum, chromium, copper etc., it is achieved the metallic film of difference in functionality | Can only copper facing can not aluminize |
| Production capacity is expanded | Mass production can be realized by continuous prodution design | Easily |
| Equipment investment | Account for producing the 20% of gross investment | Accounting for producing the 5% of gross investment, sewage treatment equipment accounts for and produces the 20% of gross investment |
| Produce and consume | Power consumption is main | Chemical cost and waste are bigger |
Claims (4)
1. circuit boring dry method method for metallising, it is characterised in that: include following one or more steps:
Utilize optical detection, location, digital-controlled cleaning, remove circuit boring inwall and bore dirt；Utilize brush filament to clear up, remove circuit board
Drilled edge burr；Utilize ultrasonic waves for cleaning, remove circuit board surface dust；Utilize vacuum radio frequency plasma cleaning, remove electricity
Road plate oxide on surface and pollutant；Utilize vacuum sputtering technique, sink on circuit board copper-clad plate surface and circuit boring hole wall
Long-pending copper film；Before circuit board non-metal bare board surface and borehole wall deposit copper film, first with aluminum or chromium bottoming more terraced with aluminum bronze
Copper facing after degree alloy or chromium-copper graded alloy transition；Aluminize after vacuum sputtering copper film, as technical process overcoat.
Circuit boring dry method method for metallising the most according to claim 1, it is characterised in that: utilize vacuum sputtering skill
Art, it is achieved circuit boring the via hole.
Circuit boring dry method method for metallising the most according to claim 1, it is characterised in that: copper-clad plate can be realized and bore
Hole metallization, it is also possible to realize without covering copper bare board surface and drilled metal.
Circuit boring dry method method for metallising the most according to claim 1, it is characterised in that: aluminize after copper plating film,
It is possible to prevent copper film oxidation as technical process overcoat and pollutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610614943.2A CN106211634A (en) | 2016-07-29 | 2016-07-29 | Circuit boring dry method method for metallising |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610614943.2A CN106211634A (en) | 2016-07-29 | 2016-07-29 | Circuit boring dry method method for metallising |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106211634A true CN106211634A (en) | 2016-12-07 |
Family
ID=57497456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610614943.2A Pending CN106211634A (en) | 2016-07-29 | 2016-07-29 | Circuit boring dry method method for metallising |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106211634A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108456858A (en) * | 2018-03-08 | 2018-08-28 | 合肥开泰机电科技有限公司 | Circuit board drilling dry method method for metallising |
| CN115261778A (en) * | 2022-06-23 | 2022-11-01 | 胜宏科技（惠州）股份有限公司 | Magnetron sputtering assisted copper deposition method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4217182A (en) * | 1978-06-07 | 1980-08-12 | Litton Systems, Inc. | Semi-additive process of manufacturing a printed circuit |
| US6227943B1 (en) * | 1998-05-01 | 2001-05-08 | International Business Machines Corporation | Method and system for pre-cleaning and post-cleaning deposited metal |
| WO2013059985A1 (en) * | 2011-10-25 | 2013-05-02 | 建业（惠州）电路版有限公司 | Process for metallisation of holes in printed circuit board |
| CN104103526A (en) * | 2014-07-22 | 2014-10-15 | 华进半导体封装先导技术研发中心有限公司 | Improved fanout panel level three-dimensional semiconductor chip package process |
| WO2016074360A1 (en) * | 2014-11-12 | 2016-05-19 | 惠州建邦精密塑胶有限公司 | Metal layer structure formed on plastic surface and surface treatment process therefor |
-
2016
- 2016-07-29 CN CN201610614943.2A patent/CN106211634A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4217182A (en) * | 1978-06-07 | 1980-08-12 | Litton Systems, Inc. | Semi-additive process of manufacturing a printed circuit |
| US6227943B1 (en) * | 1998-05-01 | 2001-05-08 | International Business Machines Corporation | Method and system for pre-cleaning and post-cleaning deposited metal |
| WO2013059985A1 (en) * | 2011-10-25 | 2013-05-02 | 建业（惠州）电路版有限公司 | Process for metallisation of holes in printed circuit board |
| CN104103526A (en) * | 2014-07-22 | 2014-10-15 | 华进半导体封装先导技术研发中心有限公司 | Improved fanout panel level three-dimensional semiconductor chip package process |
| WO2016074360A1 (en) * | 2014-11-12 | 2016-05-19 | 惠州建邦精密塑胶有限公司 | Metal layer structure formed on plastic surface and surface treatment process therefor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108456858A (en) * | 2018-03-08 | 2018-08-28 | 合肥开泰机电科技有限公司 | Circuit board drilling dry method method for metallising |
| CN115261778A (en) * | 2022-06-23 | 2022-11-01 | 胜宏科技（惠州）股份有限公司 | Magnetron sputtering assisted copper deposition method |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20161207 |