CN105323973A - Reworking method for solving bad backlight caused by rough circuit board hole wall - Google Patents
Reworking method for solving bad backlight caused by rough circuit board hole wall Download PDFInfo
- Publication number
- CN105323973A CN105323973A CN201510732039.7A CN201510732039A CN105323973A CN 105323973 A CN105323973 A CN 105323973A CN 201510732039 A CN201510732039 A CN 201510732039A CN 105323973 A CN105323973 A CN 105323973A
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- CN
- China
- Prior art keywords
- time
- backlight
- electroless copper
- circuit board
- hole wall
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Abstract
The invention belongs to a reworking method for solving bad backlight caused by a rough circuit board hole wall. When a hole wall depression (6) in the wall of a plug-in hole (4) is greater than or equal to 30 microns, and flake-shaped light permeating exists in the depression when the depression is observed by a 40-time microscope, the condition is the bad backlight caused by the rough hole wall; the reworking method for the bad backlight is characterized by comprising the following steps: a, performing a first time of whole-board electroplating on a semifinished circuit board (1) after the circuit board is subjected to a first time of electroless copper deposition, wherein the current density in electroplating is half of 1.6ASD, namely the current density is 0.8ASD and the electroplating process is 30 minutes; b, performing a second time of electroless copper deposition on the whole-board electroplated circuit board (1); c, performing a second time of whole-board electroplating on the circuit board (1) after the circuit board is subjected to the second time of electroless copper deposition; and d, cutting to determine the reworking quality. The reworking method effectively solves the technical problems of the electroless copper deposition bad backlight and electroplating voids caused by the rough hole walls; and the reworking method improves the quality of the rework products and reduces the scrap products.
Description
Technical field
The invention belongs to wiring board reworking method, particularly the bad reworking method of backlight that causes of a kind of printed wiring board Hole Wall Roughness.
Background technology
In printed circuit board manufacturing process, hole metallization is generally first use electroless copper plating bottoming, then electricity consumption copper coating thickeies.Boring → electroless copper plating technique → as take bulk → secondary washing → de-smear → recovery wash → flow process of preneutralization → secondary washing → neutralization → secondary washing → whole hole → secondary washing → microetch → secondary washing → preimpregnation → activation → secondary washing → speedization → secondary washing → electroless copper plating → secondary washing produces, when hole after plug-in holes of circuit board Hole Wall Roughness excessive (more than 30 microns) time, depression will be formed at hole wall place, the depression of electroless copper plating to the excessive formation of Hole Wall Roughness can not cover completely, can find that hole wall recess has local sheet printing opacity with 40 power microscope observations after electroless copper plating, the excessive backlight caused of Hole Wall Roughness that Here it is is bad.The reworking method that current industry is general is: microetch → nog plate → whole hole → secondary washing → microetch → secondary washing → preimpregnation → activation → secondary washing → speedization → secondary washing → electroless copper plating → secondary washing, and then electric plating of whole board thickeies.There is following defect in this reworking method: when Hole Wall Roughness is more than 30 microns, the bad probability of backlight will be multiplied, just can not produce the qualified production plate of backlight with above-mentioned reworking method, number of times of doing over again just likely causes producing blackboard newspaper and gives up more than 2 times.
Summary of the invention
The technical scheme that technical solution problem of the present invention adopts is: the bad reworking method of the excessive backlight caused of a kind of printed wiring board Hole Wall Roughness, comprises and first the wiring board semi-finished product insert hole section after electroless copper plating is confirmed backlight state; When insert hole hole wall there is hole wall depression >=30 microns, and recess is viewed as local sheet printing opacity by 40 power microscopes, this backlight is bad is that the excessive backlight caused of Hole Wall Roughness is bad, and the reworking method that contrast backlight is bad, is characterized in that taking following steps:
A. first time electric plating of whole board is carried out to the half-finished circuit board after first time electroless copper plating, during plating, current density is by the half of current density during normal plating, time is constant, as and when normally electroplating current density be 1.6ASD, time is 30min, here use the current density of 0.8ASD, the time is that 30min electroplates;
B. again second time electroless copper plating is carried out to the wiring board after above-mentioned electric plating of whole board;
C. carry out second time electric plating of whole board to the wiring board of second time electroless copper plating, during plating, current density presses the half of 1.6ASD, namely carries out second time electric plating of whole board with 0.8ASD, and the time is 30min;
D. confirmation of finally cutting into slices is done over again quality, and backlight level is greater than 8 grades for qualified.
The invention has the beneficial effects as follows: this invention effectively solves the technical problem that the electroless copper plating backlight caused greatly because hole wall is coarse is bad and plating is empty, improves product quality and rate of finished products, reduces cost.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, illustrate with embodiment.
Fig. 1 is the front view of the bad reworking method of printed wiring board hole wall manufacture degree backlight;
Fig. 2 is insert hole A-A cutaway view in Fig. 1.
In figure: 1-wiring board; 2-PAD; 3-circuit; 4-insert hole; 5-element is by surfacing; 6-hole wall caves in.
Specific embodiment
Embodiment, with reference to accompanying drawing, the bad reworking method of a kind of printed wiring board hole wall manufacture degree backlight, comprises confirmation backlight state of first insert hole 4 on half-finished for electroless copper plating wiring board 1 being cut into slices; When insert hole 4 wall there is hole wall depression 6 >=30 microns, and recess is viewed as local sheet printing opacity by 40 power microscopes, this backlight is bad is that the excessive backlight caused of Hole Wall Roughness is bad, to the reworking method of this kind, it is characterized in that taking following steps:
A. carry out an electric plating of whole board to the half-finished wiring board 1 of first time electroless copper plating, during plating, current density is by the half of current density during normal plating, and the time is constant, and namely normal current is 1.6ASD, and the time is 30min; Here use the current density of 0.8ASD, the time is 30min plating;
B. second time time electroless copper plating is carried out to the wiring board 1 after above-mentioned first time electric plating of whole board;
C. carry out second time electric plating of whole board to the wiring board 1 of second time electroless copper plating, during plating, current density presses the half of 1.6ASD, and namely carry out second time plating with 0.8ASD, the time is 30min;
D. confirmation of finally cutting into slices is done over again quality, and backlight level is greater than 8 grades for qualified.
Wiring board 1 is provided with PAD2, circuit 3 and element by surfacing 5.Simple to operate, success rate of doing over again is high.
Claims (1)
1. the bad reworking method of the coarse backlight caused of printed wiring board hole wall, comprises and first insert hole (4) section on half-finished for electroless copper plating wiring board (1) is confirmed backlight state; When insert hole (4) wall there are hole wall depression (6) >=30 micron, and recess is local sheet printing opacity by 40 power microscopes observation recess, this backlight is bad is that the excessive backlight caused of Hole Wall Roughness is bad, the reworking method bad to this kind of backlight, is characterized in that taking following steps:
A. first time electric plating of whole board is carried out to the half-finished circuit board (1) after first time electroless copper plating; during plating, current density is by the half of normal current density; time is constant (if current density during normal electric plating of whole board is 1.6ASD; time is 30min; now then electroplate by the current density of 0.8ASD, time or 30min);
B. to above-mentioned first time electric plating of whole board wiring board (1) carry out second time electroless copper plating;
C. carry out second time electric plating of whole board to the wiring board (1) of second time electroless copper plating, during plating, current density presses the half of 1.6ASD, namely carries out second time electroplating with 0.8ASD, time or 30min;
D. confirmation of finally cutting into slices is done over again quality, and backlight level is greater than 8 grades for qualified.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510732039.7A CN105323973B (en) | 2015-11-03 | 2015-11-03 | The bad reworking method of backlight caused by printed wiring board hole wall is coarse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510732039.7A CN105323973B (en) | 2015-11-03 | 2015-11-03 | The bad reworking method of backlight caused by printed wiring board hole wall is coarse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105323973A true CN105323973A (en) | 2016-02-10 |
| CN105323973B CN105323973B (en) | 2018-11-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510732039.7A Active CN105323973B (en) | 2015-11-03 | 2015-11-03 | The bad reworking method of backlight caused by printed wiring board hole wall is coarse |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105323973B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106413273A (en) * | 2016-11-01 | 2017-02-15 | 江门崇达电路技术有限公司 | Board surface copper particle improving process |
| CN107529285A (en) * | 2017-09-05 | 2017-12-29 | 奥士康精密电路（惠州）有限公司 | A kind of bad PCB of backlight does over again technique |
| CN110461105A (en) * | 2019-07-23 | 2019-11-15 | 福州瑞华印制线路板有限公司 | A kind of heavy copper process of printed wiring board automation control |
| CN115066099A (en) * | 2022-07-15 | 2022-09-16 | 科惠白井(佛冈)电路有限公司 | Forming method of PTH hole with high thickness-diameter ratio of PCB |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101841972A (en) * | 2010-04-23 | 2010-09-22 | 汕头超声印制板公司 | Method for manufacturing high-AR and fine-line PCB |
| CN101977486A (en) * | 2010-10-29 | 2011-02-16 | 东莞红板多层线路板有限公司 | Method for manufacturing via stubs of circuit board |
| CN103731992A (en) * | 2013-12-27 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | Method for reducing pits generated in gold-plated area of circuit board |
-
2015
- 2015-11-03 CN CN201510732039.7A patent/CN105323973B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101841972A (en) * | 2010-04-23 | 2010-09-22 | 汕头超声印制板公司 | Method for manufacturing high-AR and fine-line PCB |
| CN101977486A (en) * | 2010-10-29 | 2011-02-16 | 东莞红板多层线路板有限公司 | Method for manufacturing via stubs of circuit board |
| CN103731992A (en) * | 2013-12-27 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | Method for reducing pits generated in gold-plated area of circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106413273A (en) * | 2016-11-01 | 2017-02-15 | 江门崇达电路技术有限公司 | Board surface copper particle improving process |
| CN106413273B (en) * | 2016-11-01 | 2019-11-22 | 江门崇达电路技术有限公司 | The technique for improving plate face copper particle |
| CN107529285A (en) * | 2017-09-05 | 2017-12-29 | 奥士康精密电路（惠州）有限公司 | A kind of bad PCB of backlight does over again technique |
| CN110461105A (en) * | 2019-07-23 | 2019-11-15 | 福州瑞华印制线路板有限公司 | A kind of heavy copper process of printed wiring board automation control |
| CN115066099A (en) * | 2022-07-15 | 2022-09-16 | 科惠白井(佛冈)电路有限公司 | Forming method of PTH hole with high thickness-diameter ratio of PCB |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105323973B (en) | 2018-11-06 |
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Inventor after: Ji Longjiang Inventor after: Zheng Wei Inventor after: Chen Lingling Inventor after: Zhao Jinliang Inventor after: Sun Miao Inventor before: Shang Tinghua |
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