CN110461105A - A kind of heavy copper process of printed wiring board automation control - Google Patents
A kind of heavy copper process of printed wiring board automation control Download PDFInfo
- Publication number
- CN110461105A CN110461105A CN201910666695.XA CN201910666695A CN110461105A CN 110461105 A CN110461105 A CN 110461105A CN 201910666695 A CN201910666695 A CN 201910666695A CN 110461105 A CN110461105 A CN 110461105A
- Authority
- CN
- China
- Prior art keywords
- copper
- heavy copper
- control system
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention provides a kind of heavy copper process of printed wiring board automation control, need to provide and one surpass depth-of-field microscope and control system, which connect with control system, is controlled by control system, which includes: to drill to pcb board；Go pore burr removing；The heavy copper of level；Pcb board after heavy copper is sampled, sample plane scan in hole using super depth-of-field microscope, the hole medial surface image being unfolded, the area for not covering copper in automatic measurement image accounts for the percent value of entire area, exports to control system；If percent value stops the heavy copper operation of above-mentioned level, adjust heavy copper parameter according to comparison result more than preset value, then restarts the heavy copper of above-mentioned level and operate；If being less than preset value, the subsequent handling of wiring board is executed.The present invention realizes the detection of diaphanous spot quantification, improves accuracy and detection speed that backlight determines, realize industrial automation, improve production efficiency and quality by being introduced into 3D imaging technique into wiring board production.
Description
Technical field
The present invention relates to wiring board production field more particularly to a kind of heavy copper process of printed wiring board automation control.
Background technique
The heavy copper process of tradition mainly includes heavy copper ejecting plate -> backlight judgement -> production control.Wherein, heavy copper ejecting plate, refers to
Heavy copper is being carried out after drilling to pcb board, which refers to electroless copper plating (Plated Through Hole) i.e. that plating is logical
Hole, abbreviation PTH are one of technique particularly important in printed wiring board production, and the purpose is to pass through on idioelectric hole wall
The mode of chemical deposition covers one layer of closely knit firm metal copper layer as conductor, connects the route between wiring board two or more layers
Admittance electricity；Backlight determines and production control, refers to after heavy copper ejecting plate, the inner hole deposition in such a way that sampling and backlight determine
Copper effect is evaluated, while suspending subsequent handling, until waiting evaluation result to start subsequent handling after qualification, if unqualified
It then returns to previous process and re-starts heavy copper, repeat above-mentioned heavy copper process.Due to traditional backlight judgement has the following deficiencies: 1,
Hole need to be ground to pore radius with grinder by destructive testing, using gold as light irradiation under microscope, see its hole iuuminting journey
Degree, the place that layers of copper of sinking covers is opaque, goes to determine according to backlight series table, this process is all artificially to qualitatively judge, accuracy
It is not high；2, the adjustment for carrying out heavy copper parameter again is determined according to backlight, because backlight decision process needs the operation such as grinding, is spent
Time is longer, and there are the hysteresis qualitys of control；3, during backlight determines, if liquid medicine fails, the plate of production cannot and
When adjust, there are quality risks for the product of outflow.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of heavy copper process of printed wiring board automation control, can oneself
Dynamicization detects heavy copper effect, and Real-time Feedback mechanism, improves inner hole deposition copper efficiency and quality.
The present invention is implemented as follows: a kind of printed wiring board automation control sinks copper process, it need to provide that one to surpass the depth of field aobvious
Micro mirror and control system, the super depth-of-field microscope connect with control system, are controlled by control system, and the process includes as follows
Step:
Step 1 drills to pcb board；
Step 2 goes pore burr removing；
Step 3 carries out horizontal heavy copper；
Step 4 is sampled the pcb board after heavy copper, scan in hole to sample plane using super depth-of-field microscope, obtain
To the hole medial surface image of expansion, the area for not covering copper in automatic measurement image accounts for the percent value of entire area, export to
Control system；
Percent value is compared with a preset value for step 5, control system, if percent value is more than the preset value,
6 are then entered step, otherwise, enters step 7；
Step 6 stops the heavy copper operation of above-mentioned level, adjusts heavy copper parameter according to comparison result, then restart above-mentioned water
Flat heavy copper operation；
Step 7, the subsequent handling for executing wiring board.
Further, the concrete mode of the step 2 " going pore burr removing " are as follows: by control hydraulic pressure device to hole inner burr into
Row rinses, while being cleaned using vibration of ultrasonic wave.
Further, the control system is also connected with a warning device, and the step 6 further includes, by warning device into
Row alarm.
Further, the subsequent handling of the step 7 includes whole plate copper facing, production route, graphic plating, etching, ink
Printing, print character and molding.
The present invention has the advantage that
1, it by introducing 3D imaging technique in assist side manufacturing process, is calculated automatically by system, realizes that diaphanous spot is fixed
Quantization improves the accuracy that backlight determines；
2, backlight decision procedure of the invention is docked with the integration of heavy copper cash control system, realizes networking docking, Neng Gougen
Determine that result realizes the adjustment of technological parameter according to backlight, reaches automatic stabilisation and control heavy copper backlight quality；
3, when backlight testing result is close to critical value, liquid medicine can be adjusted in first time, does not allow backlight to be worse off,
Stablize backlight quality；
4, it realizes industrial automation, saves material cost, cost of labor, improve production efficiency and quality.
Detailed description of the invention
The present invention is further illustrated in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is a kind of heavy copper process execution flow chart of printed wiring board automation control of the present invention.
Fig. 2 is not conform to table images schematic diagram under super depth-of-field microscope in one embodiment of the invention.
Fig. 3 is qualified images schematic diagram under super depth-of-field microscope in another embodiment of the present invention.
Specific embodiment
As shown in Figure 1 to Figure 3, the heavy copper process of a kind of printed wiring board automation control of the invention, need to provide and one surpass scape
Deep microscope and control system, the super depth-of-field microscope connect with control system, are controlled by control system, and the process includes
Following steps:
Step 1 drills to pcb board；
Step 2 goes pore burr removing；
Step 3 carries out horizontal heavy copper；More heavy copper can be more advantageous to automation production flow line to the heavy copper of selection level
Realization because when horizontal heavy copper, pcb board is to be circulated one by one by scroll bar, and the non-perpendicular such bulk transfer of heavy copper,
It is grabbed at random convenient for subsequent mechanical hand and is sampled detection.
Step 4 is sampled the pcb board after heavy copper, scan in hole to sample plane using super depth-of-field microscope, obtain
To the hole medial surface image of expansion, the area for not covering copper in automatic measurement image accounts for the percent value of entire area, export to
When covering is preferable in hole, image and data as shown in Figure 3 is presented if sinking copper on a large scale in control system, if the heavy copper of small range,
When covering insufficient in hole, image and data as described in Figure 2 is presented；
Percent value is compared with a preset value for step 5, control system, if percent value is more than the preset value
(specifically can be using the series assessed value in traditional backlight series table of comparisons), then enter step 6, otherwise, enter step 7；
Step 6 stops the heavy copper operation of above-mentioned level, adjusts heavy copper parameter according to comparison result, then restart above-mentioned water
Flat heavy copper operation；
Step 7, the subsequent handling for executing wiring board.
In order to preferably clean to the pcb board after drilling, remove flash removed, the step 2 " going pore burr removing " it is specific
Mode can be with are as follows: is rinsed by controlling hydraulic pressure device to hole inner burr, while being cleaned using vibration of ultrasonic wave.
Preferably, the control system is also connected with a warning device, the warning device can be combined aural and visual alarm, described
Step 6 further includes being alarmed by warning device.
Wherein, the subsequent handling of the step 7 include whole plate copper facing, production route, graphic plating, etching, ink printing,
Print character and molding.
The present invention is calculated automatically by system by introducing 3D imaging technique in assist side manufacturing process, realizes light transmission
Point quantification improves the accuracy that backlight determines；Backlight decision procedure of the invention is docked with the integration of heavy copper cash control system,
It realizes networking docking, can determine that result realizes the adjustment of technological parameter according to backlight, reach automatic stabilisation and control heavy copper backlight
Quality；When backlight testing result is close to critical value, liquid medicine can be adjusted in first time, not allow backlight to be worse off, stablize
Backlight quality is realized that quickly detection quickly returns to production line, is lost to prevent anti-avulsion from the liquid curing on the pcb board of production line
Effect, influences the original effect of liquid and influences finally to sink copper quality；It realizes industrial automation, saves material cost, cost of labor,
It improves production efficiency and quality.
Although specific embodiments of the present invention have been described above, those familiar with the art should be managed
Solution, we are merely exemplary described specific embodiment, rather than for the restriction to the scope of the present invention, it is familiar with this
The technical staff in field should be covered of the invention according to modification and variation equivalent made by spirit of the invention
In scope of the claimed protection.
Claims (4)
1. a kind of printed wiring board automation control sinks copper process, it is characterised in that: need to provide and one surpass depth-of-field microscope and control
System, the super depth-of-field microscope connect with control system, are controlled by control system, and the process includes the following steps:
Step 1 drills to pcb board；
Step 2 goes pore burr removing；
Step 3 carries out horizontal heavy copper；
Step 4 is sampled the pcb board after heavy copper, scan in hole to sample plane using super depth-of-field microscope, be opened up
The hole medial surface image opened, the area for not covering copper in automatic measurement image account for the percent value of entire area, and output is to control
System；
Percent value is compared with a preset value for step 5, control system, if percent value is more than the preset value, into
Enter step 6, otherwise, enters step 7；
The heavy copper operation of the above-mentioned level of step 6, stopping, adjusting heavy copper parameter according to comparison result, then restart above-mentioned level and sink
Copper operation；
Step 7, the subsequent handling for executing wiring board.
2. a kind of printed wiring board automation control according to claim 1 sinks copper process, it is characterised in that: the step
The concrete mode of 2 " going pore burr removing " are as follows: be rinsed by controlling hydraulic pressure device to hole inner burr, while using vibration of ultrasonic wave
Cleaning.
3. a kind of printed wiring board automation control according to claim 1 sinks copper process, it is characterised in that: the control
System is also connected with a warning device, and the step 6 further includes being alarmed by warning device.
4. a kind of printed wiring board automation control according to claim 1 sinks copper process, it is characterised in that: the step
7 subsequent handling includes whole plate copper facing, production route, graphic plating, etching, ink printing, print character and molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910666695.XA CN110461105B (en) | 2019-07-23 | 2019-07-23 | Automatic control copper deposition process for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910666695.XA CN110461105B (en) | 2019-07-23 | 2019-07-23 | Automatic control copper deposition process for printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110461105A true CN110461105A (en) | 2019-11-15 |
| CN110461105B CN110461105B (en) | 2022-03-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910666695.XA Active CN110461105B (en) | 2019-07-23 | 2019-07-23 | Automatic control copper deposition process for printed circuit board |
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| Country | Link |
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| CN (1) | CN110461105B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111575752A (en) * | 2020-05-14 | 2020-08-25 | 深圳崇达多层线路板有限公司 | Electroplating manufacturing method for deep micro-hole in PCB |
| CN112326667A (en) * | 2020-10-27 | 2021-02-05 | 惠州市特创电子科技有限公司 | Copper-clad detection method and device for conductive connecting hole |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2492041Y (en) * | 2001-07-06 | 2002-05-15 | 凯崴电子股份有限公司 | Non-destruction detector for microhole wall of circuit board |
| TW200630607A (en) * | 2004-09-21 | 2006-09-01 | Ngk Spark Plug Co | Inspecting method for wiring board, manufacturing method for wiring board and inspecting device for wiring board |
| CN105323973A (en) * | 2015-11-03 | 2016-02-10 | 大连崇达电路有限公司 | Reworking method for solving bad backlight caused by rough circuit board hole wall |
| TW201713922A (en) * | 2015-09-10 | 2017-04-16 | 肯提克有限公司 | Automated optical inspection of IBUMP and VUT process defects including dislocation |
-
2019
- 2019-07-23 CN CN201910666695.XA patent/CN110461105B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2492041Y (en) * | 2001-07-06 | 2002-05-15 | 凯崴电子股份有限公司 | Non-destruction detector for microhole wall of circuit board |
| TW200630607A (en) * | 2004-09-21 | 2006-09-01 | Ngk Spark Plug Co | Inspecting method for wiring board, manufacturing method for wiring board and inspecting device for wiring board |
| TW201713922A (en) * | 2015-09-10 | 2017-04-16 | 肯提克有限公司 | Automated optical inspection of IBUMP and VUT process defects including dislocation |
| CN105323973A (en) * | 2015-11-03 | 2016-02-10 | 大连崇达电路有限公司 | Reworking method for solving bad backlight caused by rough circuit board hole wall |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111575752A (en) * | 2020-05-14 | 2020-08-25 | 深圳崇达多层线路板有限公司 | Electroplating manufacturing method for deep micro-hole in PCB |
| CN111575752B (en) * | 2020-05-14 | 2021-10-12 | 深圳崇达多层线路板有限公司 | Electroplating manufacturing method for deep micro-hole in PCB |
| CN112326667A (en) * | 2020-10-27 | 2021-02-05 | 惠州市特创电子科技有限公司 | Copper-clad detection method and device for conductive connecting hole |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110461105B (en) | 2022-03-18 |
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