CN112326667A - Copper-clad detection method and device for conductive connecting hole - Google Patents
Copper-clad detection method and device for conductive connecting hole Download PDFInfo
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 90
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- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
Abstract
The application provides a copper-clad detection method and device for a conductive connecting hole. The copper-clad detection method of the conductive connecting hole comprises the steps of obtaining a copper-clad distribution image of the inner wall of the conductive connecting hole; comparing the copper-clad distribution image with a preset copper-clad image to obtain copper-clad deficiency feedback quantity; and adjusting the type of the black spot detection signal sent to the monitoring system according to the copper-cladding missing feedback quantity. After comparing with the preset copper-clad image, the copper-clad condition of the inner wall of the current conductive connecting hole and the standard copper-clad condition in the hole are convenient to distinguish, so that the copper-clad missing feedback quantity of the current conductive connecting hole is convenient to obtain, the copper-clad missing feedback quantity is used for determining the copper-clad damage quantity in the current conductive connecting hole, the finally sent black spot detection signal is adjusted according to the copper-clad missing feedback quantity, the judgment of the in-hole blackening phenomenon through a visual mode is not needed, and the misjudgment probability of the in-hole copper-clad blackening abnormity caused by manual work is reduced.
Description
Technical Field
The invention relates to the technical field of copper-clad plate detection, in particular to a copper-clad detection method and device for a conductive connecting hole.
Background
With the rapid development of printed circuit boards, printed circuit boards are used for circuit integration in various electronic technical fields, so that the volume of various electronic devices is greatly reduced, and the printed circuit boards become mainstream circuit boards. The conventional production process of the printed circuit board has the defect that holes of PTH (plated Through Hole) are blackened abnormally, and the main reason is that (1) the Hole walls of the PTH are broken due to incomplete Hole copper covering, and the PTH looks blackened due to no copper reflected light during visual observation or section microscope observation; (2) when the oxidation in the PTH hole is serious, the oxidation of the plate cannot be removed through the pretreatment of solder mask and tin spraying, so that the blackening phenomenon exists in the hole after solder mask development; (3) improper solder mask silk-screen printing (blocking ink after silk-screen printing of PTH holes), too long time before development, the ink in the PTH holes cannot be washed out completely, and the ink remained in the PTH holes naturally seems to be a blackening phenomenon.
However, the conventional black phenomenon of the PTH hole is detected manually, that is, under the irradiation of an external light source, the detection personnel can see the specific situation in the hole clearly by adjusting the visual angle of the human eyes and the position of the light source, and this method increases the probability of misjudgment due to the visual fatigue or negligence of the personnel, thereby resulting in an extremely high visual inspection batch rate in the factory and the return of goods at the client, and reducing the production efficiency.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a copper-clad detection method and device for a conductive connecting hole, which can reduce the misjudgment probability of abnormal blackening of copper-clad in the hole.
The purpose of the invention is realized by the following technical scheme:
a copper-clad detection method of a conductive connecting hole comprises the following steps: acquiring a copper-clad distribution image of the inner wall of the conductive connecting hole; comparing the copper-clad distribution image with a preset copper-clad image to obtain copper-clad deficiency feedback quantity; and adjusting the type of the black spot detection signal sent to a monitoring system according to the copper-cladding deficiency feedback quantity.
In one embodiment, the adjusting the type of the black spot detection signal sent to the monitoring system according to the copper-cladding deficiency feedback quantity includes: obtaining the copper-cladding ratio according to the copper-cladding deficiency feedback quantity; and adjusting the type of the black spot detection signal sent to a monitoring system according to the copper-clad ratio.
In one embodiment, the adjusting the type of the black spot detection signal sent to the monitoring system according to the copper-clad ratio includes: detecting whether the copper-clad ratio is smaller than a preset ratio or not; and when the copper-clad area is smaller than the preset occupation ratio, sending a black spot abnormal signal to a monitoring system.
In one embodiment, the detecting whether the copper-clad ratio is smaller than a preset ratio further includes: and when the copper-clad area is larger than or equal to the preset occupation ratio, sending a normal black spot signal to a monitoring system.
In one embodiment, the adjusting the type of the black spot detection signal sent to the monitoring system according to the copper-cladding deficiency feedback quantity includes: acquiring a copper-clad brightness mean value according to the copper-clad deficiency feedback quantity; and adjusting the type of a black spot detection signal sent to a monitoring system according to the copper-clad brightness mean value.
In one embodiment, the adjusting the type of the black spot detection signal sent to the monitoring system according to the copper-clad brightness mean value includes: detecting whether the average value of the copper-clad brightness is smaller than the preset copper-clad brightness; and when the copper-clad brightness mean value is smaller than the preset copper-clad brightness, sending a black spot abnormal signal to a monitoring system.
In one embodiment, the detecting whether the average value of the copper-clad brightness is smaller than a preset copper-clad brightness further includes: and when the average copper-clad brightness value is greater than or equal to the preset copper-clad brightness, sending a normal black spot signal to a monitoring system.
In one embodiment, the adjusting the type of the black spot detection signal sent to the monitoring system according to the copper-cladding deficiency feedback quantity includes: acquiring a copper-free reflection area according to the copper-cladding deficiency feedback quantity; and adjusting the type of the black spot detection signal sent to a monitoring system according to the copper-free reflection area.
In one embodiment, the adjusting the type of the black spot detection signal sent to the monitoring system according to the copper-free reflection area includes: detecting whether the copper-free reflection area is larger than a preset area or not; and when the copper-free reflection area is larger than the preset area, sending a black spot abnormal signal to a monitoring system.
A copper-clad detection device of a conductive connection hole comprises: the device comprises a light source board, an electronic lens and an image processing main board; the light source board is used for emitting light rays into the conductive connecting hole of the circuit board; the electronic lens is used for extending into the conductive connecting hole so as to obtain a copper-clad distribution image of the inner wall of the conductive connecting hole; the image processing main board is connected with the electronic lens and used for comparing the copper-clad distribution image with a preset copper-clad image to obtain copper-clad deficiency feedback quantity; the image processing main board is also used for adjusting the type of a black spot detection signal sent to a monitoring system according to the copper-clad missing feedback quantity.
Compared with the prior art, the invention has at least the following advantages:
the copper-clad distribution image of the inner wall of the conductive connecting hole is obtained, the copper-clad condition in the conductive connecting hole is accurately displayed, after the copper-clad distribution image is compared with a preset copper-clad image, the copper-clad condition of the inner wall of the current conductive connecting hole and the standard copper-clad condition in the hole are conveniently distinguished, the copper-clad missing feedback quantity of the current conductive connecting hole is conveniently obtained, the copper-clad missing feedback quantity is used for determining the copper-clad damage quantity in the current leading connecting hole, whether the copper-clad in the current leading connecting hole has a blackening phenomenon or not is conveniently determined, the finally sent black spot detection signal is adjusted according to the copper-clad missing feedback quantity, the judgment of the blackening phenomenon in the hole is not needed to be manually carried out in a visual mode, and the misjudgment probability of the.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a flow chart of a copper-clad inspection method for a conductive via in an embodiment;
FIG. 2 is a schematic structural diagram of a hole exposing apparatus for a circuit board according to an embodiment;
FIG. 3 is a cross-sectional view of the wiring board hole exposing device shown in FIG. 2 taken along the direction A-A;
fig. 4 is an enlarged schematic view of the wiring board hole illuminating device shown in fig. 3 at a 1.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The invention relates to a copper-clad detection method of a conductive connecting hole. In one embodiment, the copper-clad detection method of the conductive connecting hole comprises the steps of obtaining a copper-clad distribution image of the inner wall of the conductive connecting hole; comparing the copper-clad distribution image with a preset copper-clad image to obtain copper-clad deficiency feedback quantity; and adjusting the type of the black spot detection signal sent to a monitoring system according to the copper-cladding deficiency feedback quantity. The copper-clad distribution image of the inner wall of the conductive connecting hole is obtained, the copper-clad condition in the conductive connecting hole is accurately displayed, after the copper-clad distribution image is compared with a preset copper-clad image, the copper-clad condition of the inner wall of the current conductive connecting hole and the standard copper-clad condition in the hole are conveniently distinguished, the copper-clad missing feedback quantity of the current conductive connecting hole is conveniently obtained, the copper-clad missing feedback quantity is used for determining the copper-clad damage quantity in the current leading connecting hole, whether the copper-clad in the current leading connecting hole has a blackening phenomenon or not is conveniently determined, the finally sent black spot detection signal is adjusted according to the copper-clad missing feedback quantity, the judgment of the blackening phenomenon in the hole is not needed to be manually carried out in a visual mode, and the misjudgment probability of the.
Please refer to fig. 1, which is a flowchart illustrating a method for detecting copper-clad in a via hole according to an embodiment of the present invention. The copper-clad detection method of the conductive connecting hole comprises part or all of the following steps.
S100: and acquiring a copper-coated distribution image of the inner wall of the conductive connecting hole.
In this embodiment, the copper-clad distribution image is a copper foil distribution situation on the inside of the conductive connection hole, and the copper-clad distribution image is used for showing the position situation of the copper foil attached to the inner wall of the conductive connection hole, so that the covering situation of the copper-clad plate in the conductive connection hole is conveniently shown, and therefore the damaged image of the copper foil attached to the inside of the conductive connection hole to be detected at present is conveniently and accurately obtained, and the coverage distribution area of the copper foil in the conductive connection hole is accurately displayed. The copper-clad distribution image is acquired by using an image acquisition device with the diameter smaller than that of the conductive connecting hole, and when the copper-clad distribution image is acquired, stronger light passes through the conductive connecting hole so as to acquire the copper-clad condition in the conductive connecting hole through the reflection of the copper foil.
S200: and comparing the copper-clad distribution image with a preset copper-clad image to obtain the copper-clad deficiency feedback quantity.
In this embodiment, the preset copper-clad image is a standard copper-clad distribution image, that is, the preset copper-clad image is a copper-clad distribution image corresponding to the conductive connection hole when no blackening phenomenon exists in the conductive connection hole, that is, the preset copper-clad image is a copper-clad distribution image corresponding to the conductive connection hole when copper foil is completely attached to the inner wall of the conductive connection hole. And comparing the copper-clad distribution image with a preset copper-clad image, so that the copper foil adhesion condition in the current lead electric connection hole is compared with the standard copper foil adhesion condition, and whether the current electric connection hole is blackened or not is conveniently judged subsequently, and the copper-clad missing condition in the current lead electric connection hole is conveniently determined. Therefore, when the copper foil on the inner wall of the conductive connecting hole is damaged, the copper-clad missing feedback quantity is directly reflected, and the size of the copper-clad missing feedback quantity corresponds to the damage severity of the copper foil on the inner wall of the conductive connecting hole, namely the copper-clad missing feedback quantity is positively correlated with the damage severity of the copper foil on the inner wall of the conductive connecting hole, namely the larger the copper-clad missing feedback quantity is, the more serious the conductive connecting hole is blackened.
S300: and adjusting the type of the black spot detection signal sent to a monitoring system according to the copper-cladding deficiency feedback quantity.
In this embodiment, the copper-clad missing feedback amount is used as a basis for judging the blackening condition in the current conductive connecting hole, that is, whether a blackening phenomenon exists in the current conductive connecting hole is determined according to the copper-clad missing feedback amount, that is, the type of the black spot detection signal is directly determined by the size of the copper-clad missing feedback amount. The black spot detection signal comprises a black spot-free signal and a black spot signal, the black spot-free signal is used for prompting that no blackening phenomenon exists in the front conductive connecting hole to monitoring personnel, namely, a copper foil on the inner wall of the current conductive connecting hole is complete, and the black spot signal is used for prompting that the blackening phenomenon exists in the front conductive connecting hole to the monitoring personnel, namely, the copper foil on the inner wall of the current conductive connecting hole is damaged. Therefore, according to the copper-clad missing feedback quantity, a corresponding black spot detection signal is sent out, when the current conductive connecting hole is detected to have a blackening phenomenon, namely the copper foil on the inner wall of the current conductive connecting hole is missing, namely the copper foil on the inner wall of the current conductive connecting hole is damaged, the black spot signal is sent to a monitoring system in time, monitoring personnel can find whether the conductive connecting hole on the circuit board is normal or not in time, the judgment of the blackening phenomenon in the hole is not needed to be manually carried out in a visual mode, and the misjudgment probability of the abnormal blackening of the copper-clad in the hole by manual work is reduced.
In one embodiment, the adjusting the type of the black spot detection signal sent to the monitoring system according to the copper-cladding deficiency feedback quantity includes: obtaining the copper-cladding ratio according to the copper-cladding deficiency feedback quantity; and adjusting the type of the black spot detection signal sent to a monitoring system according to the copper-clad ratio. In this embodiment, the copper-clad missing feedback quantity includes a plurality of feedback parameters, and the copper-clad ratio is one of the feedback parameters. The copper-clad ratio is used for showing the coverage ratio of the copper foil on the inner wall of the current conductive connecting hole, namely the ratio of the area of the copper foil on the inner wall of the current conductive connecting hole to the total area of the inner wall, and for the standard conductive connecting hole, the copper-clad ratio is a fixed value. Therefore, according to the copper-clad ratio, the coverage rate of the copper foil on the inner wall of the current conductive connecting hole is convenient to determine, whether the copper foil on the inner wall of the current conductive connecting hole is damaged or not is convenient to determine, and whether the current conductive connecting hole is blackened or not is convenient to determine.
Further, the adjusting the type of the black spot detection signal sent to the monitoring system according to the copper-clad ratio includes: detecting whether the copper-clad ratio is smaller than a preset ratio or not; and when the copper-clad area is smaller than the preset occupation ratio, sending a black spot abnormal signal to a monitoring system. In this embodiment, the preset ratio is a ratio of copper foil on the inside of the standard conductive connection hole, that is, a coverage rate of the copper foil on the inside of the standard conductive connection hole, and according to a comparison result between the copper-clad area ratio and the preset ratio, it is convenient to determine whether the copper foil on the inner wall of the current conductive connection hole is damaged. The copper-clad area is smaller than the preset ratio, the coverage rate of the copper foil on the inner wall of the current conductive connecting hole is smaller than that of the copper foil on the inner wall of the standard conductive connecting hole, namely, the copper foil on the inner wall of the current conductive connecting hole is damaged, the blackening phenomenon in the current conductive connecting hole is also shown, the judgment of the blackening phenomenon in the hole is not needed to be manually carried out in a visual mode, and the misjudgment probability of the abnormal blackening of the copper-clad in hole in a manual mode is reduced.
Further, the detecting whether the copper-clad ratio is smaller than a preset ratio further includes: and when the copper-clad area is larger than or equal to the preset occupation ratio, sending a normal black spot signal to a monitoring system. In this embodiment, the copper-clad area is greater than or equal to the preset ratio, which indicates that the coverage rate of the copper foil on the inner wall of the current conductive connecting hole exceeds the coverage rate of the copper foil on the inner wall of the standard conductive connecting hole, i.e., indicates that the copper foil on the inner wall of the current leading conductive connecting hole is complete, i.e., indicates that no blackening phenomenon exists in the current leading conductive connecting hole, and the judgment of the blackening phenomenon in the hole is not needed to be manually performed in a visual manner, so that the false judgment probability of the abnormal blackening of the copper-clad in the hole is.
In one embodiment, the adjusting the type of the black spot detection signal sent to the monitoring system according to the copper-cladding deficiency feedback quantity includes: acquiring a copper-clad brightness mean value according to the copper-clad deficiency feedback quantity; and adjusting the type of a black spot detection signal sent to a monitoring system according to the copper-clad brightness mean value. In this embodiment, the copper-clad missing feedback quantity includes a plurality of feedback parameters, and the copper-clad luminance mean value is one of the feedback parameters. The copper-clad brightness mean value is used for representing the brightness mean value of the copper foil on the inner wall of the current conductive connecting hole, namely the brightness mean value of each light reflecting point of the copper foil on the inner wall of the current conductive connecting hole, and for a standard conductive connecting hole, the copper-clad brightness mean value is a fixed value. Therefore, the brightness condition of the copper foil on the inner wall of the current conductive connecting hole is convenient to determine according to the copper-clad brightness mean value, so that whether the copper foil on the inner wall of the current conductive connecting hole is damaged or not is convenient to determine, and whether the current conductive connecting hole is blackened or not is convenient to determine.
Further, the adjusting the type of the black spot detection signal sent to the monitoring system according to the copper-clad brightness mean value includes: detecting whether the average value of the copper-clad brightness is smaller than the preset copper-clad brightness; and when the copper-clad brightness mean value is smaller than the preset copper-clad brightness, sending a black spot abnormal signal to a monitoring system. In this embodiment, the preset copper-clad brightness is a brightness average value of the copper foil on the inside of the standard conductive connection hole, that is, a brightness average value of each bright point on the inside of the standard conductive connection hole, and according to a comparison result between the preset copper-clad brightness and the copper-clad brightness, it is convenient to determine whether the copper foil on the inner wall of the current conductive connection hole is damaged. The copper-clad brightness mean value is smaller than the preset copper-clad brightness, the copper foil brightness on the inner wall of the current conductive connecting hole is smaller than the copper foil brightness on the inner wall of the standard conductive connecting hole, namely the copper foil on the inner wall of the current conductive connecting hole is damaged, namely the blackening phenomenon exists in the current conductive connecting hole, the judgment of the blackening phenomenon in the hole is not needed to be manually carried out in a visual mode, and the misjudgment probability of the abnormal blackening of the copper-clad in the hole is reduced.
Further, the detecting whether the average value of the copper-clad brightness is smaller than a preset copper-clad brightness further comprises: and when the average copper-clad brightness value is greater than or equal to the preset copper-clad brightness, sending a normal black spot signal to a monitoring system. In this embodiment, the copper-clad brightness mean value is greater than or equal to the preset copper-clad brightness, which indicates that when the brightness of the copper foil on the inner wall of the front conductive connecting hole exceeds the brightness of the copper foil on the inner wall of the standard conductive connecting hole, the copper foil on the inner wall of the front conductive connecting hole is complete, that is, the blackening phenomenon does not occur in the front conductive connecting hole, the judgment of the blackening phenomenon in the hole does not need to be manually performed in a visual manner, and the false judgment probability of the abnormal blackening of the copper-clad in the hole is reduced.
In one embodiment, the adjusting the type of the black spot detection signal sent to the monitoring system according to the copper-cladding deficiency feedback quantity includes: acquiring a copper-free reflection area according to the copper-cladding deficiency feedback quantity; and adjusting the type of the black spot detection signal sent to a monitoring system according to the copper-free reflection area. In this embodiment, the copper-free reflection area is an area of an area without a copper foil on an inner wall of the current conductive connection hole, and since there is no copper foil in this area, there is little or no reflected light at this position, that is, the reflection area at the damaged position of the copper foil on the inner wall of the conductive connection hole has a low intensity of the reflected light at this position, so that a copper-free reflection phenomenon is formed, and a blackening phenomenon is formed on an image. After having confirmed no copper reflection area, be convenient for know no copper region on the inner wall of current conductive connection hole to be convenient for acquire the area of no copper region on the inner wall of current conductive connection hole, and then be convenient for confirm the damaged condition of copper foil on the inner wall of current conductive connection hole, need not the manual work and carry out the judgement of downthehole blackening through visual mode, reduced the artifical erroneous judgement probability to downthehole copper-clad blackening.
Further, the adjusting the type of the black spot detection signal sent to the monitoring system according to the copper-free reflection area includes: detecting whether the copper-free reflection area is larger than a preset area or not; and when the copper-free reflection area is larger than the preset area, sending a black spot abnormal signal to a monitoring system. The predetermined area is a copper-free reflective area of the copper foil on the inner wall of the standard conductive connection hole, for example, the copper-free reflective area of the copper foil on the inner wall of the standard conductive connection hole is 0. Therefore, after the fact that the copper-free reflection area on the inner wall of the current conductive connecting hole exceeds the preset area is determined, the fact that the copper foil on the inner wall of the current conductive connecting hole is damaged is indicated, namely, the fact that the current conductive connecting hole is blackened is indicated, manual judgment of the blackening phenomenon in the hole is not needed in a visual mode, and the false judgment probability of the abnormal blackening of the copper clad in the hole is reduced.
It can be understood that the conductive connection hole comprises a blind hole besides a PTH hole on the circuit board, the blind hole is a hole between the outermost circuit and the inner circuit of the circuit board, a copper deposition process is also required in the blind hole to form copper foils on the inner wall and the bottom of the blind hole, and the blind hole on the circuit board is a hole which does not penetrate through the circuit board to avoid short circuit of the outer circuits on two sides of the circuit board.
Therefore, the PTH hole and the blind hole need to be distinguished before the copper-clad detection of the conductive connecting hole, so that the preset copper-clad image can be adjusted, and the situation that the accuracy of the final detection result is reduced due to the fact that different holes use the same preset copper-clad image is avoided.
In order to improve the accuracy of the copper-clad detection of the conductive connection hole, before step S100, the method further comprises the following steps:
obtaining the illumination feedback time of each conductive connecting hole;
comparing the illumination feedback time with preset feedback time to obtain feedback delay time;
detecting whether the feedback delay time is greater than 0;
and when the feedback delay time is larger than 0, sending a PTH hole signal to a monitoring system.
In this embodiment, the illuminance feedback time is obtained by the laser transceiver, that is, the output end of the laser transceiver aligns to the conductive connection hole, laser is emitted to the bottom of the conductive connection hole, and whether the conductive connection hole penetrates through the circuit board is determined according to the time of receiving the reflected laser. When the conductive connecting hole does not penetrate through the circuit board, the conductive connecting hole is provided with a bottom on the circuit board, laser emitted by the output end of the laser transceiver returns along the original path after meeting the bottom of the conductive connecting hole, namely the laser transceiver receives reflected laser, and the hole is a blind hole; when the conductive connecting hole penetrates through the circuit board, the laser transceiver cannot receive reflected laser, namely, the illumination feedback time is infinite, and the hole is a PTH hole. And when the preset feedback time is the time when the laser transceiver is arranged on one side of the circuit board and the other side of the circuit board is used as the bottom of the conductive connecting hole, the laser transceiver receives the reflection time of the reflected laser. In this way, the feedback delay time is obtained by comparing the illuminance feedback time with the preset feedback time, and the feedback delay time is the reflection time difference of the laser, so that whether the conductive connecting hole is penetrated or not is convenient to determine. When the feedback delay time is greater than 0, the fact that the reflection time of the laser is greater than the preset feedback time is indicated, that is, the fact that the bottom of the conductive connecting hole is located outside the circuit board is indicated, that is, the fact that the conductive connecting hole penetrates through the circuit board is indicated. At the moment, the conductive connecting hole is a PTH, and the used preset copper-clad image is a standard copper-clad image of the PTH.
Furthermore, the copper-clad detection method of the conductive connection hole is not only suitable for being used after a copper deposition process, but also suitable for being used after solder mask silk-screen printing, namely the solder mask covers the copper-clad plate, and in the process, the solder mask is oily and is easy to enter a PTH hole and cause plugging, so that the hole is blackened. In order to reduce the phenomenon of blackening in the hole caused by solder mask silk-screen printing and facilitate timely finding and cleaning the ink in the hole, before the step S100, the method further comprises the following steps:
acquiring an imaging image of the conductive connecting hole;
acquiring a gray value of each conductive connecting hole according to the imaging image;
comparing the gray value with a preset gray value to obtain a gray feedback quantity;
and adjusting the cleaning time and times of the plasma cleaner for the substrate according to the gray feedback quantity.
In this embodiment, the imaging image of the conductive connection hole is an image of a side surface of the circuit board on which the conductive connection hole is formed, and the image acquisition device acquires the gray level of the circuit board to form the imaging image of the conductive connection hole, wherein the imaging image of the conductive connection hole includes a gray level corresponding to each conductive connection hole, that is, gray levels of the side wall and the bottom of the conductive connection hole. The gray value is a numerical value corresponding to the gray level in the conductive connecting hole and is used for reflecting the light reflecting performance of the side wall and the bottom of the conductive connecting hole, when waste materials are left in the conductive connecting hole, namely, printing ink of a solder mask layer is arranged in the conductive connecting hole, light is not reflected in the conductive connecting hole in a parallel angle mode, namely, the light is reflected in the conductive connecting hole in a multi-angle mode, the number of light finally reflected back to the image acquisition device is reduced, and therefore the reflection gray level obtained by the image acquisition device is reduced. In this way, the gray feedback quantity is obtained by comparing the gray value with a preset gray value, wherein the preset gray value is the gray value corresponding to the situation that no residue exists in the conductive connecting hole, and the gray feedback quantity represents the difference between the current gray value of the conductive connecting hole and the gray value corresponding to the situation that no residue exists in the conductive connecting hole, so that whether the residue exists in the conductive connecting hole or not can be conveniently determined. The gray feedback quantity determines cleaning parameters of the plasma cleaning machine, namely the gray feedback quantity is in direct proportion to the cleaning time and times of the plasma cleaning machine on the circuit board, namely the gray feedback quantity is increased, the cleaning time and times of the plasma cleaning machine on the circuit board are increased, residues in the conductive connecting hole are convenient to remove, the cleanliness of the conductive connecting hole is improved, and the phenomenon of in-hole blackening caused by solder mask silk-screen printing is reduced.
In addition, the preset gray scale can be determined according to the shape of the conductive connecting hole on the circuit board, different shape structures and different gray scale values of the conductive connecting hole without residues exist, namely before the gray scale value is compared with the preset gray scale value, the shape of the conductive connecting hole corresponding to the used preset gray scale is the same as the shape of the conductive connecting hole which is detected currently, and the comparison standard is correspondingly adjusted when the gray scale comparison is carried out on the conductive connecting holes with different shapes, so that the cleanliness of the residues in the conductive connecting hole is improved.
Furthermore, after the copper-clad plate is filled in the conductive connecting holes, namely after the copper deposition process is finished, the conductive connecting holes can be blocked by the copper-clad plate, so that the welding of electronic components is not facilitated, and the defective rate of the circuit board is increased.
In order to improve the yield of the circuit board, before step S100, the method further includes the following steps:
acquiring a copper foil protruding image of the conductive connecting hole;
acquiring a maximum protruding value of the copper foil according to the copper foil protruding image;
comparing the maximum value of the protrusion with a preset protrusion value to obtain protrusion difference;
and adjusting the removal displacement of the surface foreign matter remover according to the protruding extension difference.
In this embodiment, the protruding image of the copper foil is obtained by the image acquisition device from the side surface of the circuit board, that is, the acquisition direction of the image acquisition device is the same as the opening direction of the conductive connection hole, so that the protruding height of the copper clad on the inner wall of the conductive connection hole can be conveniently obtained. After the copper-clad plate is embedded in the conductive connecting hole, the depth of the conductive connecting hole is different due to different shapes of the conductive connecting hole, so that the length of the copper-clad plate protruding out of the conductive connecting hole is different from that of the inner wall of the conductive connecting hole. In order to remove the excessive part protruding from the copper-clad plate, even if pins of electronic components are welded in the conductive connecting holes, the height of the highest part protruding from the copper-clad plate on the circuit board, namely the maximum protruding value, is obtained. And comparing the maximum protruding value with a preset protruding value, so as to determine the height difference between the highest protruding height of the copper clad laminate and the corresponding protrusion of the preset protruding value. Therefore, according to the protruding extension difference, the surface foreign matter remover can determine the distance of the final required radial movement along the conductive connecting hole, namely the removal displacement, so that excessive protruding parts of the copper-clad plate on the inner wall of the conductive connecting hole are removed, the flatness of the copper-clad plate in the conductive connecting hole in a plane is improved, and the probability of plugging the conductive connecting hole by the copper-clad plate in the copper deposition process is reduced.
The application also provides a circuit board hole illuminating device which is realized by adopting the copper-clad detection method of the conductive connecting hole in any embodiment. In one embodiment, the circuit board hole illuminating device is provided with functional modules corresponding to the steps of the copper-clad detection method for realizing the conductive connecting holes.
Please refer to fig. 2, which is a schematic structural diagram of a circuit board hole exposing device according to an embodiment of the present invention. The circuit board hole illuminating device 10 comprises a light source board 100, an electronic lens 200 and a display processor 300. The light source board 100 is used to place a multilayer circuit board to emit light to conductive connection holes on the multilayer circuit board. Wherein the conductive connection hole penetrates through the multilayer circuit board. At least a portion of the electronic lens 200 is accommodated in the conductive connecting hole. The electronic lens 200 is used for collecting copper foil images in the conductive connection holes. The display processor 300 is connected to the electronic lens 200. The display processor 300 is used for displaying the copper foil image of the conductive connecting hole.
In this embodiment, shine on the multilayer circuit board through the produced light of light source board 100, be convenient for light to pass the electrically conductive connecting hole on the multilayer circuit board, for providing illumination in the electrically conductive connecting hole, make the inside of electrically conductive connecting hole illuminate, and stretch into the electrically conductive connecting hole with electronic lens 200, under the illumination that light source board 100 provided, be convenient for electronic lens 200 to obtain the reflection light of the copper foil in the electrically conductive connecting hole, thereby be convenient for electronic lens 200 to show the copper foil image of gathering on display processor 300, and then be convenient for detect the damaged condition of copper foil in the electrically conductive connecting hole through display processor 300, need not artifical with the eye direct observation electrically conductive connecting hole, the detection degree of difficulty to the damaged condition of copper foil in the electrically conductive connecting hole has been reduced, thereby the detection efficiency of the damaged condition of copper foil in the electrically conductive connecting hole has been improved. Moreover, for the conductive connection holes with different apertures, the electronic lenses 200 with different specifications are used, so that the electronic lenses 200 can extend into the conductive connection holes to obtain the copper foil images, and the display processor 300 is arranged in a split screen mode, that is, the display interface of the display processor 300 corresponds to the copper foil images collected by the electronic lenses 200 with different specifications.
In one embodiment, referring to fig. 2, the light source board 100 has a light emitting surface 110, and a light emitting direction of the light emitting surface 110 is parallel to an opening direction of the conductive connection hole. In this embodiment, the light emitting surface 110 is used for providing illumination light, the light emitted from the light emitting surface 110 is perpendicular to the multilayer circuit board, and the conductive connecting holes penetrate through the multilayer circuit board, so that the light emitted from the light emitting surface 110 just penetrates through the conductive connecting holes, and thus the brightness in the conductive connecting holes is improved, that is, the light in the conductive connecting holes is increased, and the brightness in the conductive connecting holes is improved. Like this, under the light irradiation of light source board 100, electrically conductive connecting hole is the bright unthreaded hole, makes electronic lens 200 stretches into behind the electrically conductive connecting hole, its image of acquireing is more clear, is convenient for accurate demonstration copper foil distribution on the electrically conductive connecting hole inner wall to be convenient for accurate detection the damaged condition of copper foil on the electrically conductive connecting hole inner wall.
In one embodiment, the light source board includes a transparent carrier sub-board and a plurality of luminous bodies, the luminous bodies are all connected with the transparent carrier sub-board, and one surface of the transparent carrier sub-board, which is away from the luminous bodies, is used for carrying the multilayer circuit board. In this embodiment, the transparent daughter board that bears is used for placing multilayer circuit board, promptly the side of multilayer circuit board with the transparent surface laminating who bears the daughter board, and the luminous body is located the transparent daughter board that bears deviates from multilayer circuit board's one side makes the light that the luminous body sent shine in the conductive connection is downthehole, thereby makes luminance in the conductive connection is strengthened, moreover, the transparent daughter board that bears will the luminous body with the multilayer circuit board is separated, makes the light that the luminous body sent shine in the quantity in the conductive connection is adjustable, is convenient for adjust luminance in the conductive connection is downthehole, has avoided the condition that the luminance in the conductive connection is too dark or too bright to be convenient for clear and accurate demonstration the damaged condition of copper foil in the conductive connection. In other embodiments, the plurality of light-emitting bodies are uniformly distributed on the transparent sub-carrier plate, so that light emitted by the light source plate is uniform, that is, the light of the light source plate is uniformly dispersed, and thus, the brightness in each conductive connecting hole on the multilayer circuit board is consistent, and the damage condition of the copper foil in the conductive connecting hole is conveniently and accurately determined.
In one embodiment, referring to fig. 2, the circuit board lighting hole device 10 further includes an image projection amplifier 400, the image projection amplifier 400 is connected to the electronic lens 200, and the image projection amplifier 400 is configured to amplify the copper foil image collected by the electronic lens 200. In this embodiment, image projection amplifier 400 with electronic lens 200 together stretches into in the electrically conductive connecting hole, image projection amplifier 400 will be located the reflection light of electrically conductive connecting hole refracts, will follow light of reflection is enlargied on the copper foil in the electrically conductive connecting hole, makes the copper foil image that electronic lens 200 gathered does the enlarged image of the copper foil in the electrically conductive connecting hole is convenient for enlarge damaged position on the copper foil in the electrically conductive connecting hole to be convenient for show blackening phenomenon on the copper foil in the electrically conductive connecting hole is favorable to the short-term determination the damaged degree of copper foil in the electrically conductive connecting hole, thereby make monitoring personnel in time discover through the copper foil image of enlargeing blackening problem in the electrically conductive connecting hole. In another embodiment, the image projection amplifier 400 includes a hexagonal prism for amplifying the copper foil image in the conductive connection hole, so as to facilitate the electronic lens 200 to capture the copper foil image.
In one embodiment, the circuit board hole illuminating device further comprises a gravity sensor, and the gravity sensor is connected with the light source board. In this embodiment, the gravity sensor is used for sensing the weight of the multilayer circuit board on the light source board, that is, when the multilayer circuit board is placed on the light source board, the gravity sensed by the gravity sensor is increased, and the gravity sensor opens the light source board at the moment, so that the light source board emits light. Therefore, when the conductive connecting holes of the multilayer circuit board need to be detected, the gravity sensor detects that the multilayer circuit board is placed on the gravity sensor, and then the power supply of the light source board is started, so that the light source board starts to work, light rays are conveniently irradiated on the multilayer circuit board, and light ray time needing to be detected is provided for the conductive connecting holes.
In one embodiment, the circuit board hole lighting device further comprises a reset switch, and the reset switch is connected with the light source board. In this embodiment, the reset switch is used for when the light source board goes out light failure, it is right the light source board carries out light-emitting reset, makes the light-emitting mode and the light-emitting procedure of light source board reset, has avoided the condition of light source board light failure.
In one embodiment, the circuit board hole lighting device further comprises a storage cabinet, the storage cabinet is respectively connected with the light source board and the display processor, and the storage cabinet is used for accommodating the electronic lens. In this embodiment, the storage cabinet is movably connected to the display processor, so that the electronic lens can be conveniently stored when the circuit board hole lighting device is idle, and the probability that the electronic lens is damaged due to exposure to the external environment is reduced.
It can be understood that the light source board 100 is used for bearing the multilayer circuit board and providing light to the conductive connection holes on the multilayer circuit board, so that the brightness inside the conductive connection holes is improved, and the electronic lens 200 is convenient to obtain the copper foil images of the inner walls of the conductive connection holes. After the multilayer circuit board is placed on the light source board 100, in order to not affect the surface cleanliness of the multilayer circuit board, it is generally necessary to ensure that the surface of the light source board 100 is clean, however, on the premise of ensuring that the surface of the light source board 100 is clean, the multilayer circuit board is easily made to slide off the light source board 100, so that the multilayer circuit board cannot be detected by the circuit board hole illuminating device.
In order to improve the connection stability between the multilayer circuit board and the light source board 100, please refer to fig. 3 and fig. 4, the light source board 100 is provided with an installation groove 120 and a reverse clamping groove 130 which are communicated with each other, the light source board 100 is provided with a chamfer abutting surface 140, the chamfer abutting surface 140 is located in the reverse clamping groove 130, the chamfer abutting surface 140 is located outside the opening extending direction of the installation groove 120, and the chamfer abutting surface 140 abuts against the multilayer circuit board. In this embodiment, the outermost layer of the multilayer circuit board is a solder paste layer, and the solder paste layer is used to improve solderability of the multilayer circuit board. The tin cream layer of multilayer circuit board is located reverse joint inslot 130, promptly the tin cream layer of multilayer circuit board stretches into reverse joint inslot 130, the tin cream layer of multilayer circuit board support hold in chamfer butt face 140, chamfer butt face 140 does the multilayer circuit board provides an extrusion force for stably support and hold on the tin cream layer of multilayer circuit board, the multilayer circuit board is in the bottom in reverse joint inslot 130 and under the common centre gripping of chamfer butt face 140, make the stable card in tin cream layer of multilayer circuit board is located in reverse joint inslot 130, thereby make the stable card of multilayer circuit board is located mounting groove 120 and in the reverse joint inslot 130, improved the multilayer circuit board with connection stability between the light source board 100. In one embodiment, the number of the reverse clamping grooves 130 is two, two reverse clamping grooves 130 are oppositely arranged, and the openings of two reverse clamping grooves 130 are oppositely arranged. Like this, the multilayer circuit board stretches into reverse joint groove 130's part increases, makes the multilayer circuit board with the joint area increase between the light source board 100 improves the multilayer circuit board with stability of connection between the light source board 100. Moreover, the supporting force provided by the chamfer butting faces 140 in the two oppositely arranged reverse clamping grooves 130 is symmetrical, so that the stress of the multilayer circuit board is stable, and the connection stability between the multilayer circuit board and the light source board 100 is further improved. In the present embodiment, the inclination angle of the chamfer abutting surface 140 is smaller, and the angle shown in fig. 4 is adjusted for easy understanding, that is, only the chamfer abutting surface 140 and the side surface of the multilayer circuit board need to be inclined, and the inclination angle is not 90 degrees or 180 degrees.
Further, since the multilayer circuit board is partially in contact with the light source board 100, the adhesive force between the multilayer circuit board and the light source board 100 is adjusted by the contact area between the multilayer circuit board and the light source board 100, that is, the adhesive force between the multilayer circuit board and the light source board 100 is in direct proportion to the contact area between the multilayer circuit board and the light source board 100, that is, the larger the contact area between the multilayer circuit board and the light source board 100 is, the larger the adhesive force between the multilayer circuit board and the light source board 100 is, so that the connection between the multilayer circuit board and the light source board 100 is more stable. In order to improve the connection stability between the multilayer circuit board and the light source board 100, please refer to fig. 3, the aperture of the mounting groove 120 away from the light source board 100 is larger than the aperture of the mounting groove 120 close to the light source board 100. In this embodiment, the portion of the multilayer circuit board is embedded in the mounting groove 120, so that the multilayer circuit board is stably clamped in the mounting groove 120 and the reverse clamping groove 130, wherein the light source board 100 covers the mounting groove 120, so that the light source board 100 abuts against the multilayer circuit board. Under the condition that the aperture of the mounting groove 120 is adjusted, that is, the aperture of the mounting groove 120 far away from the light source plate 100 is larger than the aperture of the mounting groove 120 near the light source plate 100, so that the contact area between the light source plate 100 and the multilayer circuit board is increased, the adhesive force between the multilayer circuit board and the light source plate 100 is increased, the connection stability between the light source plate 100 and the multilayer circuit board is improved, and the separation probability between the multilayer circuit board and the light source plate 100 is reduced. In other embodiments, the aperture of the mounting groove 120 gradually increases along the opening direction thereof, so that the contact area between the light source board 100 and the multilayer circuit board increases. In this embodiment, the difference between the two calibers of the mounting groove 120 is small, and the difference between the calibers shown in fig. 4 is adjusted for easy understanding, that is, only the calibers of the mounting groove 120 far away from the light source board 100 are required to be larger than the calibers of the mounting groove 120 near the light source board 100, for example, the relative difference between the calibers of the two openings of the mounting groove 120 is 1.2% -2.4%.
Furthermore, in order to further improve the stability of the multilayer circuit board in the mounting groove 120, please refer to fig. 4, the hole illuminating device 10 further includes a clamping protrusion 500, the clamping protrusion 500 is disposed in the mounting groove 120, the clamping protrusion 500 is connected to the light source plate 100, and the clamping protrusion 500 is used for clamping with a positioning groove on the multilayer circuit board. In this embodiment, the clamping protrusion 500 is located in the mounting groove 120, for example, the clamping protrusion 500 is connected to a side wall of the mounting groove 120; for another example, the clamping protrusion 500 is convexly arranged at the bottom of the mounting groove 120; for another example, the clamping protrusion 500 is respectively protruded from the side wall of the mounting groove 120 and the bottom of the mounting groove 120. Protruding 500 of joint with constant head tank on the multilayer circuit board corresponds, is convenient for with the multilayer circuit board joint in protruding 500 of joint in the mounting groove 120 makes the multilayer circuit board with the protruding 500 stable connection of joint, thereby makes the multilayer circuit board set up in stability in the mounting groove 120, and then make the multilayer circuit board with the stability of being connected between the light source board 100 improves.
In one embodiment, referring to fig. 4, the circuit board lighting device 10 further includes a heat exchange layer 600, the heat exchange layer 600 is disposed in the mounting groove 120, the heat exchange layer 600 is connected to the light source board 100 and the multilayer circuit board, respectively, and a portion of the heat exchange layer 600 is configured to protrude to an external environment. In this embodiment, since the multilayer circuit board needs to be irradiated by light, after the light source board 100 emits light, the multilayer circuit board is heated by heat radiation, the heat is gradually gathered in the mounting groove 120, and the part of the heat exchange layer 600 extends out to the external environment, the heat exchange layer 600 guides the heat on the multilayer circuit board to the external environment, so that the heat on the multilayer circuit board is dissipated to the external environment through the heat exchange layer 600, the temperature in the mounting groove 120 is reduced, and the heat dissipation effect of the multilayer circuit board is improved.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A copper-clad detection method of a conductive connecting hole is characterized by comprising the following steps:
acquiring a copper-clad distribution image of the inner wall of the conductive connecting hole;
comparing the copper-clad distribution image with a preset copper-clad image to obtain copper-clad deficiency feedback quantity;
and adjusting the type of the black spot detection signal sent to a monitoring system according to the copper-cladding deficiency feedback quantity.
2. The method for detecting the copper-clad layer of the conductive connecting hole according to claim 1, wherein the adjusting the type of the black spot detection signal sent to the monitoring system according to the copper-clad layer missing feedback quantity comprises:
obtaining the copper-cladding ratio according to the copper-cladding deficiency feedback quantity;
and adjusting the type of the black spot detection signal sent to a monitoring system according to the copper-clad ratio.
3. The method for detecting the copper-clad layer of the conductive connection hole according to claim 2, wherein the adjusting the type of the black spot detection signal transmitted to the monitoring system according to the copper-clad ratio comprises:
detecting whether the copper-clad ratio is smaller than a preset ratio or not;
and when the copper-clad area is smaller than the preset occupation ratio, sending a black spot abnormal signal to a monitoring system.
4. The method for detecting copper-clad of a via according to claim 3, wherein the detecting whether the copper-clad ratio is less than a preset ratio further comprises:
and when the copper-clad area is larger than or equal to the preset occupation ratio, sending a normal black spot signal to a monitoring system.
5. The method for detecting the copper-clad layer of the conductive connecting hole according to claim 1, wherein the adjusting the type of the black spot detection signal sent to the monitoring system according to the copper-clad layer missing feedback quantity comprises:
acquiring a copper-clad brightness mean value according to the copper-clad deficiency feedback quantity;
and adjusting the type of a black spot detection signal sent to a monitoring system according to the copper-clad brightness mean value.
6. The method for detecting the copper-clad layer of the conductive connecting hole according to claim 5, wherein the adjusting the type of the black spot detection signal sent to the monitoring system according to the average value of the copper-clad layer brightness comprises the following steps:
detecting whether the average value of the copper-clad brightness is smaller than the preset copper-clad brightness;
and when the copper-clad brightness mean value is smaller than the preset copper-clad brightness, sending a black spot abnormal signal to a monitoring system.
7. The method for detecting copper-clad of the via hole according to claim 6, wherein the step of detecting whether the average value of the copper-clad brightness is less than a preset copper-clad brightness further comprises the following steps:
and when the average copper-clad brightness value is greater than or equal to the preset copper-clad brightness, sending a normal black spot signal to a monitoring system.
8. The method for detecting the copper-clad layer of the conductive connecting hole according to claim 1, wherein the adjusting the type of the black spot detection signal sent to the monitoring system according to the copper-clad layer missing feedback quantity comprises:
acquiring a copper-free reflection area according to the copper-cladding deficiency feedback quantity;
and adjusting the type of the black spot detection signal sent to a monitoring system according to the copper-free reflection area.
9. The method for detecting copper-clad of conductive connection hole according to claim 8, wherein said adjusting the type of black spot detection signal transmitted to the monitoring system according to the copper-free reflection area comprises:
detecting whether the copper-free reflection area is larger than a preset area or not;
and when the copper-free reflection area is larger than the preset area, sending a black spot abnormal signal to a monitoring system.
10. The utility model provides a copper detection device that covers of electrically conductive connecting hole which characterized in that includes:
the light source plate is used for emitting light rays into the conductive connecting hole of the circuit board;
the electronic lens is used for extending into the conductive connecting hole so as to obtain a copper-clad distribution image of the inner wall of the conductive connecting hole;
the image processing main board is connected with the electronic lens and used for comparing the copper-clad distribution image with a preset copper-clad image to obtain copper-clad deficiency feedback quantity; the image processing main board is also used for adjusting the type of a black spot detection signal sent to a monitoring system according to the copper-clad missing feedback quantity.
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| CN202011166194.4A CN112326667A (en) | 2020-10-27 | 2020-10-27 | Copper-clad detection method and device for conductive connecting hole |
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| CN202011166194.4A CN112326667A (en) | 2020-10-27 | 2020-10-27 | Copper-clad detection method and device for conductive connecting hole |
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Cited By (1)
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| CN115119407A (en) * | 2022-07-14 | 2022-09-27 | 东莞市国盈电子有限公司 | Three-color LED aluminum-based circuit board and manufacturing process thereof |
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Address after: 516300 Jinpaishan Mountain, Taiyang Depression, Baihua Town, Huidong County, Huizhou City, Guangdong Province Applicant after: Huizhou techuang Electronic Technology Co.,Ltd. Address before: 516369 jinpaishan Industrial Zone, taiyangao, Baihua Town, Huidong County, Huizhou City, Guangdong Province Applicant before: HUIZHOU GLORYSKY ELECTRONICS TECHNOLOGY Co.,Ltd. |
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Application publication date: 20210205 |