CN105323973B - The bad reworking method of backlight caused by printed wiring board hole wall is coarse - Google Patents
The bad reworking method of backlight caused by printed wiring board hole wall is coarse Download PDFInfo
- Publication number
- CN105323973B CN105323973B CN201510732039.7A CN201510732039A CN105323973B CN 105323973 B CN105323973 B CN 105323973B CN 201510732039 A CN201510732039 A CN 201510732039A CN 105323973 B CN105323973 B CN 105323973B
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- plating
- backlight
- time
- wiring board
- hole wall
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention belongs to a kind of printed wiring board hole wall it is coarse caused by the bad reworking method of backlight, work as insert hole（4）Occurs hole wall recess on wall（6）>=30 microns, and have sheet light transmission with 40 power microscopes sight recess, it is that backlight is bad caused by hole wall is coarse, to the undesirable reworking method of such backlight, it is characterised in that take following steps：A. to the wiring board of first time electroless copper plating semi-finished product（1）First time electric plating of whole board is carried out, current density presses the half of 1.6ASD when plating, i.e., is electroplated with 0.8ASD, time 30min；B. to the wiring board of above-mentioned electric plating of whole board（1）Carry out second of electroless copper plating；C. to the wiring board after second of electroless copper plating（1）Carry out second of electric plating of whole board；D. slice confirms quality of doing over again.The invention effective solution due to hole wall it is coarse it is big caused by electroless copper plating backlight is bad and the technical problem in plating cavity, improve the quality of do-over, reduce and scrap.
Description
Technical field
The invention belongs to wiring board reworking method, more particularly to backlight caused by a kind of printed wiring board Hole Wall Roughness is not
Good reworking method.
Background technology
In printed circuit board manufacturing process, hole metallization usually first uses electroless copper plating bottoming, then the copper-plated side of electricity consumption
Method thickeies.Drilling → electroless copper plating technique → as take bulk → two level washing → de-smear → recycling to wash → preneutralization → two level
Washing → neutralization → two level washing → whole hole → two level washing → microetch → two level washing → preimpregnation → activation → two level washing →
The flow production of fastization → two level washing → electroless copper plating → two level washing, plug-in holes of circuit board Hole Wall Roughness after drilling
It is excessive（More than 30 microns）When, will form recess at hole wall, electroless copper plating to the recess of the excessive formation of Hole Wall Roughness simultaneously
It cannot be completely covered, can find that hole wall recess has local sheet light transmission with the observation of 40 power microscopes after electroless copper plating, here it is
Backlight caused by Hole Wall Roughness is excessive is bad.The general reworking method of industry is at present：Microetch → nog plate → whole hole → two level
Washing → microetch → two level washing → preimpregnation → activation → two level washing → speedization → two level washing → electroless copper plating → two level water
It washes, then electric plating of whole board thickeies again.This reworking method has the following defects：When Hole Wall Roughness is more than 30 microns, backlight
Undesirable probability will be multiplied, and the production plate of backlight qualification cannot be produced with above-mentioned reworking method, and number of doing over again is super
2 times are crossed to be possible to that production plate is caused to be scrapped.
Invention content
The technical proposal for solving the technical problem of the invention is：A kind of printed wiring board Hole Wall Roughness is excessive to be caused
The bad reworking method of backlight, including first by after electroless copper plating circuit boards half-finished product insert hole slice confirm backlight state；When
Occur on insert hole hole wall hole wall be recessed >=30 microns when, and recess is viewed as local sheet light transmission by 40 power microscopes,
This bad backlight is that backlight is bad caused by Hole Wall Roughness is excessive, compares the undesirable reworking method of backlight, it is characterised in that adopt
Take following steps：
A. first time electric plating of whole board is carried out to the half-finished circuit board after first time electroless copper plating, current density is pressed when plating
The half of current density when normal plating, the time is constant, and current density is 1.6ASD, time 30min when being such as normally electroplated,
Here it is that 30min is electroplated to use the current density of 0.8ASD, time；
B. second of electroless copper plating is carried out again to the wiring board after above-mentioned electric plating of whole board；
C. second of electric plating of whole board carried out to the wiring board of second electroless copper plating, current density is by 1.6ASD's when plating
Half carries out second of electric plating of whole board, time 30min with 0.8ASD；
D. last slice confirms that quality of doing over again, backlight level are more than 8 grades for qualification.
The beneficial effects of the invention are as follows：The invention effective solution due to hole wall it is coarse it is big caused by electroless copper plating backlight
Bad and plating cavity technical problem, improves product quality and yield rate, reduces cost.
Description of the drawings
Below in conjunction with attached drawing, illustrated with embodiment.
Fig. 1 is the front view of the bad reworking method of printed wiring board hole wall manufacture degree backlight；
Fig. 2 is insert hole A-A sectional views in Fig. 1.
In figure：1- wiring boards；2-PAD；3- circuits；4- insert holes；5- elements are by surfacing；6- hole walls are recessed.
Specific embodiment
Embodiment, reference attached drawing, a kind of bad reworking method of printed wiring board hole wall manufacture degree backlight, including first will be chemical
The slice of insert hole 4 on the wiring board 1 of heavy copper semi-finished product confirms backlight state；When occur on 4 wall of insert hole hole wall recess 6 >=30
When micron, and recess is viewed as local sheet light transmission by 40 power microscopes, this backlight is bad to be made for Hole Wall Roughness is excessive
At backlight it is bad, to such reworking method, it is characterised in that take following steps：
A. an electric plating of whole board is carried out to the wiring board 1 of first time electroless copper plating semi-finished product, current density is by just when plating
The half of current density when being often electroplated, the time is constant, i.e., normal current is 1.6ASD, time 30min；Here use 0.8ASD's
Current density, time are electroplated for 30min；
B. second electroless copper plating is carried out to the wiring board 1 after above-mentioned first time electric plating of whole board；
C. second of electric plating of whole board is carried out to the wiring board 1 of second of electroless copper plating, current density presses 1.6ASD when plating
Half, i.e., carry out second with 0.8ASD and be electroplated, time 30min；
D. last slice confirms that quality of doing over again, backlight level are more than 8 grades for qualification.
Wiring board 1 is equipped with PAD2, circuit 3 and element by surfacing 5.It is easy to operate, success rate of doing over again height.
Claims (1)
- The bad reworking method of backlight caused by 1. a kind of printed wiring board hole wall is coarse, including first by the line of electroless copper plating semi-finished product Road plate（1）On insert hole（4）Slice confirms backlight state；Work as insert hole（4）Occurs hole wall recess on wall（6）>=30 microns When, and it is local sheet light transmission that recess observes recess by 40 power microscopes, this bad backlight is that Hole Wall Roughness is excessive Caused by backlight it is bad, to the undesirable reworking method of such backlight, it is characterised in that take following steps：A. to the half-finished circuit board after first time electroless copper plating（1）First time electric plating of whole board is carried out, current density is pressed when plating The half of normal current density, the time is constant, such as normal electric plating of whole board when current density be 1.6ASD, time 30min, this The current density of Shi Zeyong 0.8ASD is electroplated, time or 30min;B. to the wiring board of above-mentioned first time electric plating of whole board（1）Carry out second of electroless copper plating；C. to the wiring board of second of electroless copper plating（1）Carry out second of electric plating of whole board, current density presses 1.6ASD when plating Half, i.e., carry out second time electroplating, time or 30min with 0.8ASD；D. last slice confirms that quality of doing over again, backlight level are more than 8 grades for qualification.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510732039.7A CN105323973B (en) | 2015-11-03 | 2015-11-03 | The bad reworking method of backlight caused by printed wiring board hole wall is coarse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510732039.7A CN105323973B (en) | 2015-11-03 | 2015-11-03 | The bad reworking method of backlight caused by printed wiring board hole wall is coarse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105323973A CN105323973A (en) | 2016-02-10 |
| CN105323973B true CN105323973B (en) | 2018-11-06 |
Family
ID=55250320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510732039.7A Active CN105323973B (en) | 2015-11-03 | 2015-11-03 | The bad reworking method of backlight caused by printed wiring board hole wall is coarse |
Country Status (1)
| Country | Link |
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| CN (1) | CN105323973B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106413273B (en) * | 2016-11-01 | 2019-11-22 | 江门崇达电路技术有限公司 | The technique for improving plate face copper particle |
| CN107529285A (en) * | 2017-09-05 | 2017-12-29 | 奥士康精密电路（惠州）有限公司 | A kind of bad PCB of backlight does over again technique |
| CN110461105B (en) * | 2019-07-23 | 2022-03-18 | 福州瑞华印制线路板有限公司 | Automatic control copper deposition process for printed circuit board |
| CN115066099A (en) * | 2022-07-15 | 2022-09-16 | 科惠白井(佛冈)电路有限公司 | Forming method of PTH hole with high thickness-diameter ratio of PCB |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101841972A (en) * | 2010-04-23 | 2010-09-22 | 汕头超声印制板公司 | Method for manufacturing high-AR and fine-line PCB |
| CN101977486A (en) * | 2010-10-29 | 2011-02-16 | 东莞红板多层线路板有限公司 | Method for manufacturing via stubs of circuit board |
| CN103731992A (en) * | 2013-12-27 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | Method for reducing pits generated in gold-plated area of circuit board |
-
2015
- 2015-11-03 CN CN201510732039.7A patent/CN105323973B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101841972A (en) * | 2010-04-23 | 2010-09-22 | 汕头超声印制板公司 | Method for manufacturing high-AR and fine-line PCB |
| CN101977486A (en) * | 2010-10-29 | 2011-02-16 | 东莞红板多层线路板有限公司 | Method for manufacturing via stubs of circuit board |
| CN103731992A (en) * | 2013-12-27 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | Method for reducing pits generated in gold-plated area of circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105323973A (en) | 2016-02-10 |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Ji Longjiang Inventor after: Zheng Wei Inventor after: Chen Lingling Inventor after: Zhao Jinliang Inventor after: Sun Miao Inventor before: Shang Tinghua |
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| CB03 | Change of inventor or designer information |