CN114102384B - Full-automatic suspension type pcb conductive pattern polishing and cleaning equipment - Google Patents

Full-automatic suspension type pcb conductive pattern polishing and cleaning equipment Download PDF

Info

Publication number
CN114102384B
CN114102384B CN202111462133.7A CN202111462133A CN114102384B CN 114102384 B CN114102384 B CN 114102384B CN 202111462133 A CN202111462133 A CN 202111462133A CN 114102384 B CN114102384 B CN 114102384B
Authority
CN
China
Prior art keywords
polishing
cleaning
shell
pcb
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202111462133.7A
Other languages
Chinese (zh)
Other versions
CN114102384A (en
Inventor
罗飞龙
沈翔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Zhengyang Circuit Technology Co ltd
Original Assignee
Shenzhen Zhengyang Circuit Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Zhengyang Circuit Technology Co ltd filed Critical Shenzhen Zhengyang Circuit Technology Co ltd
Priority to CN202111462133.7A priority Critical patent/CN114102384B/en
Publication of CN114102384A publication Critical patent/CN114102384A/en
Application granted granted Critical
Publication of CN114102384B publication Critical patent/CN114102384B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/005—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents using brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
    • B24B47/04—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by mechanical gearing only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The invention relates to full-automatic suspension type polishing and cleaning equipment for a pcb conductive pattern, which belongs to the field of polishing and cleaning of the pcb conductive pattern and solves the problems that the pcb is damaged due to scraps generated by polishing in the conventional polishing and polishing technology of a pcb and the contact between particles in a polishing medium and the pcb is not sufficient and uniform in the polishing process; this scheme includes the chassis and installs the storage device on the chassis, supporting device, draw gear, burnishing device, supporting device bearing pcb board, burnishing device once polishes the electrically conductive figure of pcb board, the secondary polishing, once clean, the secondary is clean, draw gear pulls burnishing device and removes in three-dimensional coordinate system, the liquid of polishing has independently been stored respectively in the storage device, polishing medium, cleaning medium, aqueous medium, the head of polishing among the burnishing device and the coincidence of clearance head synchronous revolution and orbit, it is abundant with pcb to polish the piece that produces and make polishing medium at the very first time clearance, even contact.

Description

Full-automatic suspension type pcb conductive pattern polishing and cleaning equipment
Technical Field
The invention relates to the field of polishing and cleaning of pcb conductive patterns, in particular to full-automatic suspension type polishing and cleaning equipment for pcb conductive patterns.
Background
In the prior art of polishing and polishing, a polishing head is generally selected to directly polish the pcb, and chips generated in the polishing process are positioned between the polishing head and the pcb, and because the polishing of the same part generally needs to be continued for a preset time and stays for several seconds quickly, the chips are dragged and moved by the polishing head to cause abrasion scratches on the pcb and seriously damage a conductive pattern of the pcb.
Disclosure of Invention
In order to solve the problems that chips generated by grinding can cause damage to the pcb and the contact between particles in a polishing medium and the pcb is not sufficient and uniform in the polishing process in the prior art of grinding and polishing the pcb, the invention provides full-automatic suspension type polishing and cleaning equipment for the conductive patterns of the pcb.
In order to achieve the technical purpose, the technical scheme adopted by the invention is as follows.
The utility model provides a full-automatic suspension formula pcb conductive pattern polishing cleaning device, which comprises a base frame, be provided with storage device on the chassis, supporting device, draw gear, burnishing device, supporting device is used for the bearing pcb board, burnishing device is used for polishing once in proper order to the conductive pattern of pcb board, the secondary polishing, once clean, the clean processing of secondary, draw gear is arranged in drawing burnishing device to remove in three-dimensional coordinate system, the liquid of polishing, polishing medium, cleaning medium, aqueous medium have independently been stored respectively in the storage device.
Furthermore, the polishing device comprises a mounting seat connected with the traction device, a mounting shell group is mounted on the mounting seat, a polishing component, a cleaning component and an input pipe network are arranged in the mounting shell group, the polishing component is used for polishing or polishing the conductive pattern of the pcb, the cleaning component is used for cleaning debris in the polishing process or enabling a polishing medium to be in uniform contact with the conductive pattern of the pcb or cleaning the pcb independently in the polishing process, the input pipe network is communicated with the storage device, and the input pipe network is used for providing polishing liquid required for polishing or polishing media required for polishing or cleaning media required for cleaning to the polishing component.
Furthermore, the mounting shell group comprises a rotating shaft vertically mounted on the mounting seat, the rotating shaft is of a tubular structure with openings at two ends, and the input end of the rotating shaft is in power connection with a rotating motor;
the bottom of the rotating shaft is provided with a mounting shell, the mounting shell is hollow and communicated with the rotating shaft, the bottom of the mounting shell is provided with through holes, the through holes are provided with two groups of polishing holes and cleaning holes respectively, and a mounting bracket is arranged in the mounting shell;
the polishing component and the cleaning component both comprise driving assemblies arranged on the mounting bracket, and the driving assemblies in the polishing component and the cleaning component are symmetrically arranged around the rotating shaft.
Furthermore, the driving assembly comprises a lifting screw rod and a guide rod which are vertically arranged on the mounting bracket, the input end of the lifting screw rod is in power connection with a lifting motor, the outer part of the lifting screw rod is provided with a containing shell in a threaded manner, and the containing shell is in sliding connection with the guide rod;
the accommodating shell is of a vertically arranged cylindrical shell structure with an opening at the upper end and a closed lower end, a convex ring in an annular structure coaxially extends upwards from the bottom of the accommodating shell, a driving motor is arranged in the convex ring, and the output end of the driving motor penetrates through the closed end of the accommodating shell and is positioned below the accommodating shell;
a sealing ring for sealing the opening end of the accommodating shell and the top end of the convex ring is arranged between the opening end of the accommodating shell and the top end of the convex ring, the bottom of the sealing ring, the inner wall of the accommodating shell, the cavity bottom of the accommodating shell and the outer wall of the convex ring jointly form a transfer area, a spray hole for communicating the transfer area with the outside is arranged at the cavity bottom of the accommodating shell, and a connecting pipeline for communicating the transfer area with an input pipeline network is arranged on the upper end surface of the sealing ring;
the driving assembly in the grinding and polishing component is right opposite to the grinding hole, and the driving assembly in the cleaning component is right opposite to the cleaning hole.
Furthermore, the polishing component also comprises a polishing head, the polishing head is detachably mounted with the output end of the driving motor in the polishing component, the cleaning component also comprises a cleaning head, and the cleaning head is detachably mounted with the output end of the driving motor in the cleaning component;
the input pipe network comprises an input pipe c, one end of the input pipe c is communicated with a connecting pipeline in the polishing component, a communicating part of the input pipe c is provided with a control valve a, the other end of the input pipe c is communicated with a connecting pipeline in the cleaning component, a communicating part of the input pipe c is provided with a control valve b, the outside of the input pipe c is communicated with an input pipe b, the tail end of the input pipe b is rotatably connected with the input pipe a, and the tail end of the input pipe a is communicated with the storage device.
Compared with the prior art, the invention has the beneficial effects that:
1. in the grinding and polishing process, the grinding head and the cleaning head rotate synchronously, and the track of the grinding head rotating axially around the rotating shaft is superposed with the track of the cleaning head rotating axially around the rotating shaft, so that in the grinding process, fragments generated by grinding are cleaned out synchronously by the cleaning head at the first time, the influence of the fragments on the grinding process can be avoided, and the pcb damage caused by the fragments can be avoided; in the polishing process, the cleaning head rotates to enable the polishing medium to be in full contact with the conductive pattern of the pcb and to be in uniform contact with the conductive pattern of the pcb, so that the polishing effect is further improved;
2. according to the scheme, the cleaning medium is used for cleaning the pcb for the first time, and then the ultrasonic cleaning mode is used for cleaning the pcb for the second time, so that stains are effectively separated from the pcb, and the cleaning effect on the pcb is better;
3. media required in the processes of primary grinding, secondary polishing, primary cleaning and secondary cleaning are separately stored in the storage box without mutual interference;
in addition, the medium can be recycled into the storage box after being used, and can be reused after being filtered and purified, so that the utilization rate of the medium is improved, and the cost is saved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the present invention;
FIG. 3 is a schematic view of the traction device of the present invention;
FIG. 4 is a schematic structural view of the traction device of the present invention;
FIG. 5 is a schematic structural view of the traction device of the present invention;
FIG. 6 is a view of the storage device and the supporting device of the present invention;
FIG. 7 is a schematic structural diagram of a storage device according to the present invention;
FIG. 8 is a schematic view of the storage case of the present invention;
FIG. 9 is a cross-sectional view of the bin of the present invention;
FIG. 10 is a schematic diagram of a control switch according to the present invention;
FIG. 11 is a schematic structural view of a conveying mechanism of the present invention;
FIG. 12 is a schematic view of the construction of the supporting device of the present invention;
FIG. 13 is a cross-sectional view of the support apparatus of the present invention;
FIG. 14 is a schematic view of the structure of a polishing apparatus of the present invention;
FIG. 15 is a schematic structural view of a mounting housing assembly of the present invention;
FIG. 16 is a schematic view showing the internal structure of the polishing apparatus of the present invention;
FIG. 17 is a cross-sectional view of the mounting housing assembly of the present invention;
FIG. 18 is a schematic view of the structure of the polishing member, the cleaning member and the input pipe network according to the present invention;
FIG. 19 is a schematic structural view of a drive assembly of the present invention;
FIG. 20 is a cross-sectional view of a containment shell of the present invention;
fig. 21 is a schematic structural view of the polishing head and the cleaning head of the present invention.
The reference numbers in the drawings are:
100. a chassis;
200. a storage device; 210. a storage tank; 211. installing a chamber; 212. mounting a plate; 213. a storage chamber; 214. a filter plate; 220. a conveying mechanism; 221. a water pump; 222. a suction main tube; 223. a suction branch pipe a; 224. a suction branch pipe b; 225. a suction branch pipe c; 226. d, sucking the branch pipes; 227. a liquid discharge pipe a; 228. a liquid discharge pipe b;
300. a supporting device; 310. a mounting frame; 320. cleaning the tank shell; 321. a support plate; 330. a vacuum suction table; 340. an ultrasonic generator;
400. a traction device; 410. an X-axis mechanism; 411. a guide bracket a; 412. an X lead screw; 413. an X motor; 414. a column; 420. a Z-axis mechanism; 421. a Z lead screw; 422. a Z motor; 423. a connecting seat; 430. a Y-axis mechanism; 431. a guide bracket b; 432. a Y screw rod; 433. a Y motor;
500. a polishing device; 510. a mounting base; 520. mounting a shell group; 521. a rotating shaft; 522. mounting a shell; 523. a rotating electric machine; 524. a through hole; 525. mounting a bracket; 530. grinding and polishing the component; 531. polishing head; 540. cleaning the component; 541. cleaning the head; 550. inputting into a pipe network; 551. an input pipe a; 552. an input pipe b; 553. an input pipe c; 560. a drive assembly; 561. a lifting screw rod; 562. a guide rod; 563. a lifting motor; 564. connecting a pipeline; 565. a housing case; 566. a convex ring; 567. spraying a hole; 568. a drive motor; 569. a seal ring;
600. a control switch; 601. a vertical tube; 602. a horizontal tube; 603. a control lever; 604. a spring; 605. an electromagnet; 606. and (7) blocking.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description of the embodiments, structures, characteristics and effects according to the present invention will be made with reference to the accompanying drawings and preferred embodiments.
As shown in fig. 1-2, a full-automatic suspension type pcb conductive pattern polishing and cleaning device comprises a chassis 100, wherein a storage device 200, a supporting device 300, a traction device 400 and a polishing device 500 are arranged on the chassis 100, the supporting device 300 is used for supporting a pcb, the polishing device 500 is used for sequentially performing primary polishing, secondary polishing, primary cleaning and secondary cleaning on a conductive pattern of the pcb, the traction device 400 is used for drawing the polishing device 500 to move in a three-dimensional coordinate system, and polishing liquid, polishing media, cleaning media and aqueous media are respectively and independently stored in the storage device 200.
During working, a pcb is placed on the supporting device 300, the traction device 400 pulls the polishing device 500 to contact with the conductive pattern of the pcb, then, the polishing component 530 in the polishing device 500 operates to polish the conductive pattern of the pcb for the first time, debris generated in the polishing process is simultaneously cleaned out by the cleaning component 540 in the polishing device 500, the polishing generally needs a continuous preset time to clean the debris synchronously, the influence of the debris on the polishing process can be avoided, if the debris is not cleaned synchronously, the debris is positioned between the polishing head 531 and the pcb, the conductive pattern of the pcb can be scratched, the copper circuit of the pcb can be seriously damaged, and the storage device 200 continuously provides polishing liquid (namely cutting liquid) required by polishing to the polishing component 530 in the polishing process;
after the first grinding is finished, the grinding and polishing component 530 changes the rotating speed to perform second polishing on the conductive pattern of the pcb, in the polishing process, the storage device 200 continuously provides the polishing medium required by polishing to the grinding and polishing component 530, and the cleaning component 540 synchronously rotates while polishing, so that the polishing medium is fully contacted with the conductive pattern of the pcb uniformly, and the polishing effect is further improved;
after the second polishing is finished, the polishing member 530 retracts to be separated from the contact with the pcb, the cleaning member 540 continues to operate to clean the pcb for the first time, after the first cleaning is finished, the cleaning member 540 retracts to be separated from the contact with the pcb, and then the pcb is cleaned for the second time in an ultrasonic cleaning mode to enable stains to leave the pcb;
at this point, the pcb conductive pattern polish clean is complete.
As shown in fig. 3-5, the traction device 400 includes an X-axis mechanism 410, a Z-axis mechanism 420, and a Y-axis mechanism 430.
Specifically, the X-axis mechanism 410 includes a guide bracket a411 installed on the base frame 100, an X-ray rod 412 is horizontally installed on the guide bracket a411, an X-motor 413 is connected to an input end of the X-ray rod 412 in a power manner, a vertical column 414 is installed on an external thread of the X-ray rod 412 in a vertical arrangement manner, and the vertical column 414 and the guide bracket a411 form a sliding connection with a guide direction parallel to the axial direction of the X-ray rod 412; when the X motor 413 operates to drive the X-axis rod 412 to rotate, the column 414 is displaced along the axial direction of the X-axis rod 412, and the axial direction of the X-axis rod 412 is the X-axis.
The Z-axis mechanism 420 comprises a Z lead screw 421 vertically installed on the upright post 414, the input end of the Z lead screw 421 is connected with a Z motor 422 through belt transmission power, the outer part of the Z lead screw 421 is provided with a connecting seat 423 through a screw thread, and the connecting seat 423 is also vertically connected with the upright post 414 in a sliding manner in a guiding direction; when the Z motor 422 operates to drive the Z lead screw 421 to rotate, the connecting seat 423 is displaced along the vertical direction, and the vertical direction is the Z axis.
The Y-axis mechanism 430 comprises a guide support b431, the extension direction of the guide support b431 is parallel to the ground and perpendicular to the X axis, the guide support b431 is connected with the connecting seat 423 in a sliding mode, a Y lead screw 432 is installed on the guide support b431, the axial direction of the Y lead screw 432 is parallel to the extension direction of the guide support b431, the input end of the Y lead screw 432 is connected with a Y motor 433 through belt transmission power, the belt transmission comprises a driving belt wheel arranged at the output end of the Y motor 433, a driven belt wheel arranged at the input end of the Y lead screw 432 and a transmission belt arranged between the driving belt wheel and the driven belt wheel, wherein the driven belt wheel is limited by the connecting seat 423 to rotate only around the self axial direction and cannot displace along the self axial direction; the operation of the Y motor 433 drives the driven belt wheel to rotate, so that the Y lead screw 432 is displaced along the axial direction of the Y lead screw 432, the Y lead screw 432 moves to pull the guide support b431 to move synchronously, and the axial direction of the Y lead screw 432 is the Y axis.
The polishing device 500 is mounted on the guide bracket b431, and the polishing device 500 is pulled to move in a three-dimensional coordinate system formed by an X axis, a Y axis and a Z axis through the cooperation of the X motor 413, the Y motor 433 and the Z motor 422.
As shown in fig. 1 and 14 to 21, the polishing apparatus 500 includes a mounting base 510 connected to a guide bracket b431, a mounting case group 520 is mounted on the mounting base 510, a polishing member 530, a cleaning member 540 and an input pipe network 550 are disposed in the mounting case group 520, wherein the polishing member 530 is used for polishing or polishing the conductive pattern of the pcb, the cleaning member 540 is used for cleaning debris during polishing or enabling a polishing medium to be in uniform contact with the conductive pattern of the pcb or cleaning the pcb separately during polishing, the input pipe network 550 is communicated with the storage apparatus 200, and the input pipe network 550 is used for supplying polishing liquid required for polishing or a polishing medium required for polishing or a cleaning medium required for cleaning to the polishing member 530.
As shown in fig. 15 to 17, the mounting shell group 520 includes a rotating shaft 521 vertically mounted on the mounting base 510, the rotating shaft 521 is a tubular structure with two open ends, a mounting shell 522 is mounted at the bottom of the rotating shaft 521, the interior of the mounting shell 522 is hollow and is communicated with the rotating shaft 521, a through hole 524 is provided at the bottom of the mounting shell 522, and the through hole 524 is provided with two groups: and grinding and cleaning holes.
The rotating shaft 521 is connected with a rotating motor 523 through belt transmission power, and the rotating motor 523 operates to drive the rotating shaft 521 and the mounting shell 522 to rotate simultaneously.
A mounting bracket 525 is disposed within the mounting housing 522.
As shown in fig. 18, each of the burnishing and polishing member 530 and the cleaning member 540 includes a driving assembly 560 mounted on a mounting bracket 525, and the driving assembly 560 in the burnishing and polishing member 530 and the driving assembly 560 in the cleaning member 540 are arranged symmetrically with respect to the rotating shaft 521.
Specifically, as shown in fig. 19 to 20, the driving assembly 560 includes a lifting screw 561 vertically installed on the mounting bracket 525 and a guide rod 562, and an input end of the lifting screw 561 is connected to a lifting motor 563 through a belt driving power.
An accommodating shell 565 is arranged on the external thread of the lifting screw mandrel 561, and the accommodating shell 565 is also connected with the guide rod 562 in a sliding way; the lifting motor 563 is operated to rotate the lifting screw 561, so that the accommodating case 565 is vertically displaced.
The accommodating shell 565 is a cylindrical shell structure which is vertically arranged, the upper end of the accommodating shell 565 is open, the lower end of the accommodating shell is closed, a protruding ring 566 which is in an annular structure coaxially extends upwards from the bottom of the cavity of the accommodating shell 565, a driving motor 568 is arranged in the protruding ring 566, and the output end of the driving motor 568 penetrates through the closed end of the accommodating shell 565 and is positioned below the accommodating shell 565.
A sealing ring 569 for sealing between the open end of the accommodating shell 565 and the top end of the convex ring 566 is arranged between the open end of the accommodating shell 565 and the top end of the convex ring 566, and the bottom of the sealing ring 569, the inner wall of the accommodating shell 565, the bottom of the cavity of the accommodating shell 565 and the outer wall of the convex ring 566 jointly form a transmission area.
The bottom of the accommodating shell 565 is provided with a spray hole 567 for communicating the transfer area with the outside, and the upper end surface of the sealing ring 569 is provided with a connecting pipeline 564 for communicating the transfer area and the input pipe network 550.
As shown in fig. 17, the drive assembly 560 in the burnishing and polishing member 530 is facing the burnishing aperture and the drive assembly 560 in the cleaning member 540 is facing the cleaning aperture.
As shown in fig. 18 and 21, the polishing member 530 further includes a polishing head 531, and the polishing head 531 is detachably mounted on the output end of the driving motor 568 of the polishing member 530.
The cleaning assembly 540 further includes a cleaning head 541, wherein the cleaning head 541 is removably mounted to an output of a drive motor 568 in the cleaning assembly 540.
The polishing head 531 and the cleaning head 541 are realized by the prior art, and are not described in detail.
As shown in fig. 17 to 18, the input pipe network 550 includes an input pipe c553, one end of the input pipe c553 is communicated with a connection pipe 564 of the polishing member 530 and a control valve a is disposed at the communication position, and the other end of the input pipe c553 is communicated with the connection pipe 564 of the cleaning member 540 and a control valve b is disposed at the communication position, which is realized by the prior art and is not described again.
An inlet pipe b552 is connected to the outside of the inlet pipe c553, an inlet pipe a551 is rotatably connected to the end of the inlet pipe b552, and the end of the inlet pipe a551 is connected to the storage apparatus 200.
The operation of the polishing apparatus 500 is embodied as follows:
firstly, the lifting motor 563 operates to drive the lifting screw 561 to rotate, so that the accommodating shell 565 displaces in the vertical direction, and the polishing head 531 and the cleaning head 541 move downwards to extend out of the mounting shell 522;
then, the traction device 400 draws the polishing device 500 to move, so that the polishing head 531 and the cleaning head 541 are in contact with the conductive pattern of the pcb;
then, the rotating motor 523 and the driving motor 568 operate simultaneously, the rotating motor 523 operates to drive the mounting shell 522, the polishing member 530 and the cleaning member 540 to rotate around the axial direction of the rotating shaft 521 simultaneously, and the driving motor 568 operates to drive the polishing head 531 and the cleaning head 541 to rotate around the respective axial directions, wherein, as the driving assembly 560 in the polishing member 530 and the driving assembly 560 in the cleaning member 540 are symmetrically arranged about the rotating shaft 521, the axial rotation trajectory of the polishing head 531 around the rotating shaft 521 coincides with the axial rotation trajectory of the cleaning head 541 around the rotating shaft, the polishing head 531 performs first polishing on the conductive pattern of the pcb, the debris generated in the polishing process is cleaned out by the cleaning head 541 at the first time, the polishing generally needs to last preset time, the debris is cleaned synchronously, the polishing process can be prevented from being influenced, if the debris is not cleaned synchronously, the debris is located between the polishing head 531 and the pcb, the conductive pattern of the pcb can be caused, and the copper line of the pcb can be damaged seriously;
in the grinding process, the control valve a is opened, and the storage device 200 continuously supplies grinding fluid (i.e., cutting fluid) required for grinding to the grinding and polishing member 530 through the input pipe network 550;
after the first grinding, the rotation speed of the driving motor 568 in the grinding and polishing component 530 is changed, so that the grinding head 531 carries out the second polishing on the conductive pattern of the pcb, in the polishing process, the storage device 200 continuously provides the polishing medium required by the polishing to the grinding and polishing component 530, and during the polishing, the cleaning head 541 rotates to enable the polishing medium to be in full contact with and even contact with the conductive pattern of the pcb, so that the polishing effect is further improved.
As shown in fig. 6 to 11, the storage device 200 includes a storage tank 210 and a delivery mechanism 220, the storage tank 210 stores therein the polishing liquid, the polishing medium, the cleaning medium, and the aqueous medium, respectively, and the delivery mechanism 220 is used for drawing the polishing liquid, the polishing medium, or the cleaning medium to be delivered into the input pipe network 550 and drawing the aqueous medium to be delivered into the supporting device 300.
As shown in fig. 7 to 9, a mounting chamber 211 and a storage chamber 213 are provided in the storage tank 210, wherein the mounting chamber 211 is disposed concentrically with the storage tank 210, and the storage chamber 213 is provided with four sets: the polishing device comprises a storage chamber a for storing polishing liquid, a storage chamber b for storing polishing media, a storage chamber c for storing cleaning media, a storage chamber d for storing aqueous media, and an installation chamber 211 and four groups of storage chambers 213 which are not communicated with each other.
An end cover is mounted on the upper end face of the storage box 210 in a matching manner, and an avoiding opening for avoiding the mounting cavity 211 is formed in the end face of the end cover.
The mounting plate 212 is horizontally arranged in the mounting cavity 211, the mounting plate 212 divides the mounting cavity 211 into an upper mounting area and a lower mounting area which are not communicated with each other, and the upper mounting area is positioned above the lower mounting area.
Each set of storage chambers 213 is provided with a filter plate 214, and the filter plate 214 divides the storage chambers 213 into a purification area and a storage area which are not communicated with each other.
As shown in fig. 12 to 13, the supporting device 300 includes a mounting frame 310 mounted on the end cover, a cleaning tank 320 having a truncated-cone-shaped cylindrical shell structure with openings at upper and lower ends is mounted in the mounting frame 310, and the horizontal cross-sectional area of the cleaning tank 320 increases from bottom to top in the vertical direction.
The upper end level of rinsing tank shell 320 inwards extends there is the layer board 321, has seted up the water hole on the layer board 321, installs the vacuum on the layer board 321 and inhales platform 330, and the vacuum is inhaled platform 330 and is used for supporting the pcb board and adsorb, and the pcb board is placed and is inhaled the bench 330 back in the vacuum, and the vacuum is inhaled platform 330 and is carried out negative pressure absorption restriction to it promptly, can realize for prior art, and not repeated.
The lower opening end of the cleaning tank shell 320 is communicated with the upper mounting area of the mounting chamber 211, a control switch 600 is arranged between the lower opening end of the cleaning tank shell and the upper mounting area, and the control switch 600 is used for controlling the communication between the cleaning tank shell 320 and the four groups of storage chambers 213, so that the used medium returns to the corresponding storage chambers 213 through the control switch 600, and the purposes of recycling and resource saving are achieved.
The wall of the cleaning tank 320 is provided with an ultrasonic generator 340, which is realized by the prior art and is not described in detail.
As shown in fig. 9 to 10 and 13, the control switch 600 includes four sets of control parts provided corresponding to the four sets of storage chambers 213.
Specifically, a shell cover is mounted at the lower opening end of the cleaning tank shell 320 in a matching manner, and a water flowing hole is vertically formed in the shell cover.
The control component comprises a vertical pipe 601 vertically arranged on the lower end face of the shell cover, the upper end of the vertical pipe 601 is open and communicated with the water flowing hole, the lower end of the vertical pipe 601 is closed, the outer part of the vertical pipe 601 is communicated with a horizontal pipe 602, and the horizontal pipe 602 is communicated with the purification area of the storage chamber 213.
A control rod 603 is coaxially installed in the vertical pipe 601, the top end of the control rod 603 is located in the cleaning tank 320 and is provided with a blocking plug 606 for blocking a water flow hole, the bottom end of the control rod 603 sequentially penetrates through the lower closed end of the vertical pipe 601, the mounting plate 212 and is located in the lower mounting area of the mounting chamber 211, and the bottom end of the control rod 603 is provided with a magnetic ring made of a magnetic material.
A limiting ring is arranged in the lower mounting area of the mounting chamber 211, and the limiting ring is sleeved outside the control rod 603 and located above the magnetic ring.
The bottom of the mounting plate 212 is provided with an electromagnet 605, and a magnetic adsorption force for pulling the magnetic ring and the control rod 603 to move up vertically is generated between the electromagnet 605 and the magnetic ring.
The outside cover of control lever 603 is equipped with the spring 604 that is located between magnetic ring and the spacing ring, and the compression elasticity of spring 604 is used for drawing control lever 603 and moves down vertically.
When the medium in the storage chamber 213 is drawn by the conveying mechanism 220 to flow into the input pipe network 550, the electromagnet 605 in the control part corresponding to the storage chamber 213 is electrified, so that the magnetic ring, the control rod 603 and the blocking plug 606 move upwards vertically, the corresponding water flow hole is opened, then the used medium flows along the inclined shell wall of the cleaning tank shell 320 and returns to the purification area in the storage chamber 213 through the corresponding water flow hole and the control part in sequence, and the medium is filtered by the filter plate 214 and flows into the storage area of the storage chamber 213 to wait for the next use.
As shown in fig. 7 and 11, the conveying mechanism 220 includes a water pump 221, a main suction pipe 222 is connected to a liquid inlet end of the water pump 221, a sub suction pipe for communicating the main suction pipe 222 with the storage area of the storage chamber 213 is disposed between the main suction pipe 222 and the storage area, a control valve c is disposed on the sub suction pipe, and four sets of sub suction pipes are disposed corresponding to the storage chamber 213: suction manifold a223, suction manifold b224, suction manifold c225, suction manifold d226.
A liquid discharge pipe a227 used for communicating the liquid outlet end of the water pump 221 and the inner cavity of the cleaning tank shell 320 is arranged between the liquid outlet end of the water pump 221 and the inner cavity of the cleaning tank shell 320, a liquid discharge pipe b228 used for communicating the liquid outlet end of the water pump with the inner cavity of the cleaning tank shell 320 is arranged between the liquid discharge pipe a227 and the input pipe a551, a control valve d is arranged on the liquid discharge pipe a227, the control valve d is positioned between the communication point of the liquid discharge pipe b228 and the liquid discharge pipe a227 and the communication point of the liquid discharge pipe a227 and the cleaning tank shell 320, and a control valve e is arranged on the liquid discharge pipe b 228.
After finishing primary grinding and secondary polishing of the conductive pattern of the pcb:
firstly, the lifting motor 563 in the polishing member 530 operates to drive the lifting screw 561 to rotate, so that the accommodating shell 565 displaces in the vertical direction, the polishing head 531 moves upwards to retract into the mounting shell 522, and the cleaning head 541 in the cleaning member 540 still contacts with the conductive pattern of the pcb;
next, the rotating motor 523 operates simultaneously with the driving motor 568 of the cleaning member 540 to perform the first cleaning of the conductive pattern of the pcb board by the cleaning head 541, and at the same time, the conveying mechanism 220 sucks the cleaning medium in the storage chamber c and conveys it to the cleaning member 540;
after the first cleaning is finished, the lifting motor 563 in the cleaning member 540 operates to drive the lifting screw 561 to rotate, so that the accommodating shell 565 displaces in the vertical direction, the cleaning head 541 moves upwards to retract into the mounting shell 522, and the traction device 400 pulls the polishing device 500 to be away from the pcb;
then, the conveying mechanism 220 pumps the aqueous medium in the storage chamber d to the washing tank 320, so that the liquid level of the aqueous medium in the washing tank 320 is over the pcb;
then, the ultrasonic generator 340 is operated to perform a second cleaning of the entire pcb by ultrasonic cleaning.
The working principle of the invention is specifically shown as follows:
the method comprises the following steps: placing the pcb board on a vacuum table 330;
step two: the lifting motor 563 in the polishing member 530 and the cleaning member 540 operates to drive the lifting screw 561 to rotate, so that the accommodating shell 565 displaces in the vertical direction, the polishing head 531 and the cleaning head 541 move downwards to extend out of the mounting shell 522, and meanwhile, the traction device 400 pulls the polishing device 500 to move, so that the polishing head 531 and the cleaning head 541 contact with the conductive pattern of the pcb;
and simultaneously with the step two, the step three: an electromagnet 605 in a control part corresponding to the storage cavity a is electrified, so that the magnetic ring, the control rod 603 and the blocking plug 606 move upwards vertically, and the corresponding water flow hole is opened; the control valve c on the suction branch pipe a223 corresponding to the reserve chamber a is opened; the control valve a provided on the input pipe c553 is opened; the control valve e provided on the drain pipe b228 is opened;
step four: the rotating motor 523 and the driving motor 568 run simultaneously, the rotating motor 523 runs to drive the mounting shell 522, the polishing member 530 and the cleaning member 540 to simultaneously rotate around the axial direction of the rotating shaft 521, and the driving motor 568 runs to drive the polishing head 531 and the cleaning head 541 to respectively rotate around the axial directions, wherein as the driving assembly 560 in the polishing member 530 and the driving assembly 560 in the cleaning member 540 are symmetrically arranged around the rotating shaft 521, the axial rotation track of the polishing head 531 around the rotating shaft 521 coincides with the axial rotation track of the cleaning head 541 around the rotating shaft 521, the polishing head 531 polishes the conductive pattern of the pcb for the first time, and debris generated in the polishing process is cleaned out by the cleaning head 541 for the first time;
meanwhile, the water pump 221 operates, the grinding fluid in the storage chamber a is continuously conveyed to the grinding and polishing member 530 through the suction branch pipe a223, the suction main pipe 222, the liquid discharge pipe a227, the liquid discharge pipe b228 and the input pipe network 550 in sequence, the grinding fluid continuously flows to the grinding head 531 through the connecting pipe 564, the transmission area in the accommodating shell 565 and the spray holes 567 in sequence in the grinding and polishing member 530 to assist grinding, then the grinding fluid flows back to the purification area of the storage chamber a through the water through holes arranged on the supporting plate 321, the shell wall of the cleaning tank shell 320 and the control component corresponding to the storage chamber a in sequence, is filtered by the filter plate 214, enters the storage area of the storage chamber a and is continuously used;
after the first grinding is finished, step five: the electromagnet 605 in the control part corresponding to the storage chamber a is powered off, the elastic force of the spring 604 drives the control part to reset and block the corresponding water flow hole, and the electromagnet 605 in the control part corresponding to the storage chamber b is powered on to open the corresponding water flow hole;
the control valve c on the suction branch pipe a223 corresponding to the reserve chamber a is closed, and the control valve c on the suction branch pipe b224 corresponding to the reserve chamber b is opened;
the control valve a provided on the input pipe c553 is kept open; the control valve e provided on the drain pipe b228 remains open;
step six: the driving motor 568 in the grinding and polishing component 530 changes the rotating speed, so that the grinding head 531 carries out secondary polishing on the conductive pattern of the pcb, and in the polishing process, the cleaning head 541 rotates to ensure that the polishing medium is fully contacted with and uniformly contacted with the conductive pattern of the pcb;
the water pump 221 operates, the polishing medium in the storage chamber b is continuously conveyed to the grinding and polishing member 530 through the suction branch pipe b224, the suction main pipe 222, the liquid discharge pipe a227, the liquid discharge pipe b228 and the input pipe network 550 in sequence, the polishing medium continuously flows to the grinding head 531 through the connecting pipe 564, the transmission area in the accommodating shell 565 and the spray holes 567 in sequence in the grinding and polishing member 530, the polished polishing medium flows back to the purification area of the storage chamber b through the water through holes arranged on the supporting plate 321, the shell wall of the cleaning tank shell 320 and the control component corresponding to the storage chamber b in sequence, and the polishing medium enters the storage area of the storage chamber b after being filtered by the filter plate 214 and is continuously used;
and after finishing the second polishing, a seventh step: the lifting motor 563 in the polishing member 530 operates to drive the lifting screw 561 to rotate, so that the accommodating shell 565 displaces in the vertical direction, the polishing head 531 moves upwards to retract into the mounting shell 522, and the cleaning head 541 in the cleaning member 540 still contacts with the conductive pattern of the pcb;
the electromagnet 605 in the control part corresponding to the storage chamber b is powered off, the elastic force of the spring 604 drives the control part to reset and block the corresponding water flow hole, and the electromagnet 605 in the control part corresponding to the storage chamber c is powered on to open the corresponding water flow hole;
the control valve c on the suction branch pipe b224 corresponding to the reservoir chamber b is closed, and the control valve c on the suction branch pipe c225 corresponding to the reservoir chamber c is opened;
the control valve a provided in the input pipe c553 is closed and the control valve b is opened; the control valve e provided on the drain pipe b228 remains open;
step eight: the rotating motor 523 and the driving motor 568 in the cleaning member 540 run simultaneously, the cleaning head 541 cleans the conductive pattern of the pcb board for the first time, in the cleaning process, the water pump 221 runs, the cleaning medium in the storage chamber c is continuously conveyed to the cleaning member 540 through the suction branch pipe c225, the suction main pipe 222, the liquid discharge pipe a227, the liquid discharge pipe b228 and the input pipe network 550 in sequence, the cleaning medium continuously flows to the cleaning head 541 through the connecting pipe 564, the transmission area in the accommodating shell 565 and the spray holes 567 in sequence in the cleaning member 540, the cleaning medium required for the first cleaning is provided for the cleaning head 541, the cleaned cleaning medium flows back to the purification area of the storage chamber c through the water through holes arranged on the supporting plate 321, the shell wall of the cleaning tank shell 320 and the control part corresponding to the storage chamber c in sequence, and is filtered by the filter plate 214, enters the storage area of the storage chamber c and is continuously used;
after the first cleaning is finished, the ninth step: the lifting motor 563 in the cleaning member 540 operates to drive the lifting screw 561 to rotate, so that the accommodating shell 565 displaces in the vertical direction, and the cleaning head 541 moves upwards and retracts into the mounting shell 522, and the traction device 400 pulls the polishing device 500 to be away from the pcb integrally;
the electromagnet 605 in the control part corresponding to the storage chamber c is powered off, and the elastic force of the spring 604 drives the control part to reset and block the corresponding water flowing hole;
the control valve c on the suction branch pipe c225 corresponding to the reservoir chamber c is closed, and the control valve c on the suction branch pipe d226 corresponding to the reservoir chamber d is opened;
the control valve b provided in the inlet pipe c553 is closed, the control valve e provided in the discharge pipe b228 is closed, and the control valve d provided in the discharge pipe a227 is opened;
step ten: the water pump 221 operates to continuously convey the aqueous medium in the storage chamber d to the cleaning tank shell 320 through the suction branch pipe d226, the suction main pipe 222 and the liquid discharge pipe a227 in sequence, so that the liquid level of the aqueous medium in the cleaning tank shell 320 is over the pcb;
the ultrasonic generator 340 operates, and the pcb is integrally cleaned for the second time in an ultrasonic cleaning mode;
after the second cleaning is finished, step eleven: the water pump 221 is turned off and all control valves are closed;
the electromagnet 605 in the control part corresponding to the storage chamber d is energized to open the corresponding water flow hole, and the aqueous medium in the cleaning tank 320 flows back to the purification area of the storage chamber d through the control part corresponding to the storage chamber d, and enters the storage area of the storage chamber d after being filtered by the filter plate 214.
Although the present invention has been described with reference to the preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (7)

1. The full-automatic suspension type polishing and cleaning equipment for the conductive patterns of the pcb comprises a chassis (100) and is characterized in that the chassis (100) is provided with a storage device (200), a supporting device (300), a traction device (400) and a polishing device (500), wherein the supporting device (300) is used for supporting the pcb, the polishing device (500) is used for sequentially carrying out primary polishing, secondary polishing, primary cleaning and secondary cleaning treatment on the conductive patterns of the pcb, the traction device (400) is used for drawing the polishing device (500) to move in a three-dimensional coordinate system, and polishing liquid, polishing media, cleaning media and water media are respectively and independently stored in the storage device (200);
the polishing device (500) comprises a mounting seat (510) connected with the traction device (400), a mounting shell group (520) is mounted on the mounting seat (510), a polishing component (530), a cleaning component (540) and an input pipe network (550) are arranged in the mounting shell group (520), the polishing component (530) is used for polishing or polishing the conductive pattern of the pcb, the cleaning component (540) is used for cleaning debris in the polishing process or enabling a polishing medium to be in uniform contact with the conductive pattern of the pcb or cleaning the pcb independently in the polishing process, the input pipe network (550) is communicated with the storage device (200), and the input pipe network (550) is used for providing polishing liquid required by polishing or a polishing medium required by polishing or a cleaning medium required by cleaning for the polishing component (530);
the mounting shell group (520) comprises a rotating shaft (521) vertically mounted on the mounting base (510), the rotating shaft (521) is of a tubular structure with openings at two ends, and the input end of the rotating shaft (521) is in power connection with a rotating motor (523);
the bottom of the rotating shaft (521) is provided with a mounting shell (522), the mounting shell (522) is hollow and communicated with the rotating shaft (521), the bottom of the mounting shell (522) is provided with through holes (524), the through holes (524) are provided with two groups which are respectively a polishing hole and a cleaning hole, and a mounting bracket (525) is arranged in the mounting shell (522);
the polishing members (530) and the cleaning members (540) respectively comprise driving assemblies (560) arranged on the mounting brackets (525), and the driving assemblies (560) in the polishing members (530) and the driving assemblies (560) in the cleaning members (540) are symmetrically arranged around the rotating shaft (521);
the driving assembly (560) comprises a lifting screw rod (561) and a guide rod (562) which are vertically installed on the installation support (525), the input end of the lifting screw rod (561) is in power connection with a lifting motor (563), an accommodating shell (565) is installed on the external thread of the lifting screw rod (561), and the accommodating shell (565) is in sliding connection with the guide rod (562);
the accommodating shell (565) is of a vertically arranged cylindrical shell structure with an open upper end and a closed lower end, a protruding ring (566) in an annular structure coaxially extends upwards from the bottom of the accommodating shell (565), a driving motor (568) is arranged in the protruding ring (566), and the output end of the driving motor (568) penetrates through the closed end of the accommodating shell (565) and is positioned below the accommodating shell (565);
a sealing ring (569) used for sealing between the opening end of the accommodating shell (565) and the top end of the convex ring (566) is arranged between the opening end of the accommodating shell (565), the bottom of the sealing ring (569), the inner wall of the accommodating shell (565), the bottom of the cavity of the accommodating shell (565) and the outer wall of the convex ring (566) jointly form a transfer area, a spray hole (567) used for communicating the transfer area with the outside is arranged at the bottom of the cavity of the accommodating shell (565), and a connecting pipeline (564) used for communicating the transfer area and the input pipe network (550) is arranged on the upper end face of the sealing ring (569);
the driving assembly (560) in the sanding and polishing member (530) is opposite to the sanding hole, and the driving assembly (560) in the cleaning member (540) is opposite to the cleaning hole.
2. A fully automatic suspended pcb conductive pattern polishing and cleaning device as recited in claim 1, wherein said polishing means (530) further comprises a polishing head (531), said polishing head (531) being detachably mounted to an output of a driving motor (568) of said polishing means (530), said cleaning means (540) further comprising a cleaning head (541), said cleaning head (541) being detachably mounted to an output of a driving motor (568) of said cleaning means (540);
the input pipe network (550) comprises an input pipe c (553), one end of the input pipe c (553) is communicated with a connecting pipeline (564) in the grinding and polishing component (530), a control valve a is arranged at the communication position, the other end of the input pipe c (553) is communicated with the connecting pipeline (564) in the cleaning component (540), a control valve b is arranged at the communication position, an input pipe b (552) is communicated with the outside of the input pipe c (553), the tail end of the input pipe b (552) is rotatably connected with an input pipe a (551), and the tail end of the input pipe a (551) is communicated with the storage device (200).
3. The fully automatic suspension type pcb conductive pattern polishing and cleaning device as claimed in claim 2, wherein the storage device (200) comprises a storage tank (210) and a conveying mechanism (220), the storage tank (210) is respectively and independently stored with polishing fluid, polishing medium, cleaning medium and water medium, and the conveying mechanism (220) is used for drawing the polishing fluid, the polishing medium or the cleaning medium to be conveyed into an input pipe network (550) and drawing the water medium to be conveyed into the supporting device (300).
4. The full-automatic suspension type pcb conductive pattern polishing and cleaning device of claim 3, wherein the storage box (210) is internally provided with a mounting chamber (211) and a storage chamber (213), the mounting chamber (211) and the storage box (210) are arranged in a common center line, the storage chamber (213) is provided with four groups of storage chambers a for storing grinding fluid, a storage chamber b for storing polishing medium, a storage chamber c for storing cleaning medium and a storage chamber d for storing aqueous medium, and the mounting chamber (211) and the four groups of storage chambers (213) are not communicated with each other;
the terminal surface of the up end of bin (210) matches the terminal surface of installing end cover and offers the mouth of dodging that is used for dodging installation cavity (211), the level is provided with mounting panel (212) in installation cavity (211), mounting panel (212) will install that cavity (211) are separated into the last installing zone and the installing zone down that do not switch on each other, it is located the top of installing zone down to go up the installing zone, all be provided with filter (214) in every group storage cavity (213), filter (214) will store cavity (213) and separate into the clean area and the storage area that do not switch on each other.
5. The full-automatic polishing and cleaning device for the suspended pcb conductive pattern as claimed in claim 4, wherein the supporting device (300) comprises a mounting frame (310) mounted on the end cover, a cleaning tank shell (320) having a platform-shaped cylindrical shell structure with openings at upper and lower ends is mounted in the mounting frame (310), and the horizontal cross-sectional area of the cleaning tank shell (320) is increased from bottom to top along the vertical direction;
the upper open end level of washing cell shell (320) inwards extends has layer board (321), the water hole has been seted up on layer board (321), install vacuum on layer board (321) and inhale platform (330), vacuum is inhaled platform (330) and is used for supporting the absorption to the pcb, the lower open end of washing cell shell (320) and the last installing zone intercommunication of installation cavity (211) and be provided with control switch (600) between the two, control switch (600) are used for controlling the intercommunication between washing cell shell (320) and four groups of storage cavity (213), the cell wall of washing cell shell (320) is provided with supersonic generator (340).
6. The full-automatic suspension type pcb conductive pattern polishing and cleaning device as claimed in claim 5, wherein the control switch (600) comprises four control components, the four control components are arranged corresponding to the four groups of storage chambers (213), a shell cover is mounted at the lower opening end of the cleaning tank shell (320) in a matching way, and a water flowing hole is vertically formed in the shell cover;
the control component comprises a vertical pipe (601) vertically arranged on the lower end face of the shell cover, the upper end of the vertical pipe (601) is opened and communicated with the water flowing hole, the lower end of the vertical pipe is closed, the outer part of the vertical pipe (601) is communicated with a horizontal pipe (602), and the horizontal pipe (602) is communicated with the purification area of the storage chamber (213);
a control rod (603) is coaxially installed in the vertical pipe (601), the top end of the control rod (603) is located in the cleaning tank shell (320) and is provided with a blocking plug (606) for blocking a water flow hole, the bottom end of the control rod (603) sequentially penetrates through the lower closed end of the vertical pipe (601), the mounting plate (212) and is located in a lower mounting area of the mounting chamber (211), a magnetic ring made of a magnetic material is arranged at the bottom end of the control rod (603), a limit ring is arranged in the lower mounting area of the mounting chamber (211), and the limit ring is sleeved outside the control rod (603) and is located above the magnetic ring;
the bottom of mounting panel (212) is provided with electro-magnet (605), produces the magnetic adsorption power that is used for drawing magnetic ring and control lever (603) to move up vertically between electro-magnet (605) circular telegram and the magnetic ring, and the outside cover of control lever (603) is equipped with spring (604) that are located between magnetic ring and the spacing ring, and the compression elasticity of spring (604) is used for drawing control lever (603) and moves down vertically.
7. The full-automatic suspension type pcb conductive pattern polishing and cleaning device of claim 5 or 6, wherein the conveying mechanism (220) comprises a water pump (221), a main suction pipe (222) is connected to a liquid inlet end of the water pump (221), a branch suction pipe for communicating the main suction pipe (222) and a storage area of the storage chamber (213) is arranged between the main suction pipe (222) and the storage area of the storage chamber (213), a control valve c is arranged on the branch suction pipe, and four groups of branch suction pipes are arranged corresponding to the storage chamber (213);
a liquid discharge pipe a (227) for communicating the liquid outlet end of the water pump (221) and the inner cavity of the cleaning tank shell (320) is arranged between the liquid outlet end of the water pump (221), a liquid discharge pipe b (228) for communicating the liquid outlet end of the water pump and the inner cavity of the cleaning tank shell (320) is arranged between the liquid discharge pipe a (227) and the input pipe a (551), a control valve d is arranged on the liquid discharge pipe a (227), the control valve d is positioned between the communication point of the liquid discharge pipe b (228) and the liquid discharge pipe a (227) and the communication point of the liquid discharge pipe a (227) and the cleaning tank shell (320), and a control valve e is arranged on the liquid discharge pipe b (228).
CN202111462133.7A 2021-12-02 2021-12-02 Full-automatic suspension type pcb conductive pattern polishing and cleaning equipment Active CN114102384B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111462133.7A CN114102384B (en) 2021-12-02 2021-12-02 Full-automatic suspension type pcb conductive pattern polishing and cleaning equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111462133.7A CN114102384B (en) 2021-12-02 2021-12-02 Full-automatic suspension type pcb conductive pattern polishing and cleaning equipment

Publications (2)

Publication Number Publication Date
CN114102384A CN114102384A (en) 2022-03-01
CN114102384B true CN114102384B (en) 2022-11-18

Family

ID=80365620

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111462133.7A Active CN114102384B (en) 2021-12-02 2021-12-02 Full-automatic suspension type pcb conductive pattern polishing and cleaning equipment

Country Status (1)

Country Link
CN (1) CN114102384B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114760765B (en) * 2022-06-16 2022-09-02 深圳市惠利电子科技有限公司 Dry-type circuit board chemical etching equipment

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63278752A (en) * 1987-05-08 1988-11-16 Tokyo Kakoki Kk Polishing device for printed circuit board
US4854081A (en) * 1987-03-13 1989-08-08 Pola E Massa S.N.C. Di Pola C. E M. & Massa G. Device for treating printed circuit boards, in particular for pumicing and trimming
CN104842238A (en) * 2015-04-09 2015-08-19 徐州德坤电气科技有限公司 Intelligent automatic grinding and polishing unit based on digital bus and usage method thereof
CN108788945A (en) * 2018-07-03 2018-11-13 嘉兴学院 Sapphire crystal precise grinding device
CN109202621A (en) * 2018-09-14 2019-01-15 湖北优尔特轴承科技有限公司 One kind using grinding apparatus based on bearing inner race processing
CN209078496U (en) * 2018-10-12 2019-07-09 高邑县福隆陶瓷有限责任公司 A kind of floor tile automatic polishing machine
CN209773407U (en) * 2019-04-22 2019-12-13 中信戴卡股份有限公司 rotatory cleaning device of wheel mould
CN111633490A (en) * 2020-06-09 2020-09-08 陈二凤 Grinding device is used in processing of high quality panel
CN112643533A (en) * 2019-10-10 2021-04-13 清华大学 Cleaning device and cleaning method for substrate thinning processing

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4854081A (en) * 1987-03-13 1989-08-08 Pola E Massa S.N.C. Di Pola C. E M. & Massa G. Device for treating printed circuit boards, in particular for pumicing and trimming
JPS63278752A (en) * 1987-05-08 1988-11-16 Tokyo Kakoki Kk Polishing device for printed circuit board
CN104842238A (en) * 2015-04-09 2015-08-19 徐州德坤电气科技有限公司 Intelligent automatic grinding and polishing unit based on digital bus and usage method thereof
CN108788945A (en) * 2018-07-03 2018-11-13 嘉兴学院 Sapphire crystal precise grinding device
CN109202621A (en) * 2018-09-14 2019-01-15 湖北优尔特轴承科技有限公司 One kind using grinding apparatus based on bearing inner race processing
CN209078496U (en) * 2018-10-12 2019-07-09 高邑县福隆陶瓷有限责任公司 A kind of floor tile automatic polishing machine
CN209773407U (en) * 2019-04-22 2019-12-13 中信戴卡股份有限公司 rotatory cleaning device of wheel mould
CN112643533A (en) * 2019-10-10 2021-04-13 清华大学 Cleaning device and cleaning method for substrate thinning processing
CN111633490A (en) * 2020-06-09 2020-09-08 陈二凤 Grinding device is used in processing of high quality panel

Also Published As

Publication number Publication date
CN114102384A (en) 2022-03-01

Similar Documents

Publication Publication Date Title
CN114102384B (en) Full-automatic suspension type pcb conductive pattern polishing and cleaning equipment
CN211125603U (en) Rotary silicon wafer cleaning and drying equipment
CN112936534B (en) Ceramic blank inner and outer wall acid pickling polishing device and using method thereof
CN114083371B (en) Polishing and cleaning method for pcb conductive pattern
CN110732936B (en) Integrative device of hard seal ball valve production of autologous clearance
CN112372396B (en) Cleaning and polishing device for cylinder sleeve processing and using method thereof
CN215599444U (en) Etching device for processing optical components
CN212762839U (en) Silicon wafer single-side polishing device in vacuum coating process
CN109732454A (en) A kind of mobile phone glass polishing machine
CN212494171U (en) Electrophoresis application is with wasing filter equipment
CN211938329U (en) Cleaning device for chemical equipment
CN204898088U (en) Spiral galvanic anode cleaning machine
CN216463867U (en) Spraying and polishing device for workpiece machining
CN208811820U (en) A kind of glass production polishing machine
CN218081759U (en) Cutter cooling and spray-washing device of numerical control machining center
CN111974740A (en) High-speed water jet cleaning device for textile equipment
CN218697465U (en) Improved polishing mechanism of plane grinding machine tool
CN213494465U (en) Spraying equipment with good spraying effect
CN219025159U (en) Small shell cover turntable type cleaning device
CN221270766U (en) Polishing device
CN220218034U (en) Can reduce burnishing machine of dust harm
CN220575550U (en) Polishing device for silicon wafer processing
CN210059160U (en) Aluminum alloy piston surface treatment device
CN221715076U (en) Be used for pentahedron processing platform high pressure belt cleaning device
CN221387784U (en) Positioning device for cleaning mechanical parts

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right
TA01 Transfer of patent application right

Effective date of registration: 20221028

Address after: 518000 floor 1, floor 2, floor 3 and floor 4, building 37, Zhongwu Industrial Zone, Zhongwu community, Hangcheng street, Bao'an District, Shenzhen, Guangdong Province

Applicant after: Shenzhen Zhengyang Circuit Technology Co.,Ltd.

Address before: 518000 East and third floors of building 6, Gonghe jidali Industrial Zone, Shajing street, Bao'an District, Shenzhen City, Guangdong Province

Applicant before: SHENZHEN FEIXIANG CIRCUIT CO.,LTD.

GR01 Patent grant
GR01 Patent grant