CN102638938A - Manufacturing method of high-intermodulation and high-frequency circuit board - Google Patents
Manufacturing method of high-intermodulation and high-frequency circuit board Download PDFInfo
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- CN102638938A CN102638938A CN2012101152958A CN201210115295A CN102638938A CN 102638938 A CN102638938 A CN 102638938A CN 2012101152958 A CN2012101152958 A CN 2012101152958A CN 201210115295 A CN201210115295 A CN 201210115295A CN 102638938 A CN102638938 A CN 102638938A
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- compoboard
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- circuit board
- frequency circuit
- intermodulation
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Abstract
The invention discloses a manufacturing method of a high-intermodulation and high-frequency circuit board, comprising the following steps of: step 1. carrying out engineering and light painting data preparation; step 2. cutting, pre-treating a copper covered plate and drilling; step 3. manufacturing a surface pattern; step 4. electroplating and etching; and step 5. molding and manufacturing. The manufacturing method of the high-intermodulation and high-frequency circuit board, disclosed by the invention, not only can manufacture the high-intermodulation and high-frequency circuit board with high precision, but also effectively improves the product quality and the working efficiency; and meanwhile, the high-intermodulation and high-frequency circuit board manufactured by using the method has stable and reliable performance.
Description
Technical field
The present invention relates to a kind of manufacture method of high intermodulation high-frequency circuit board.
Background technology
Along with the direction of electronic product to miniaturization, digitlization, lightening, high frequencyization, high reliabilityization develops; High intermodulation high-frequency circuit board has more high frequencyization, lightening and stable frequency characteristics except having the good high-fire resistance of common high-frequency circuit board, high-cooling property, excellent size stability.
Summary of the invention
The invention provides a kind of manufacture method of high intermodulation high-frequency circuit board, it not only makes the precision height, has effectively improved product quality and operating efficiency, and the stable performance of the high intermodulation high-frequency circuit board that makes.
The present invention has adopted following technical scheme: a kind of manufacture method of high intermodulation high-frequency circuit board; It may further comprise the steps: step 1; Carry out engineering, light is painted data make: at first adopt template carried out graphic designs; To design figure then and carry out project file according to processing parameter and handle, and according to working condition the file of handling well carried out layout, makes the black egative film then, the egative film that light is painted washes, development, photographic fixing, cleaning, air-dry; Again the egative film of completing is checked that last is that female parent carries out the diazo sheet copy with the egative film of checking again, and the diazo sheet that copies is checked; Step 2 is opened the making of material, copper-clad plate preliminary treatment, boring: at first leave by singly requirement size of flow process with electronic plate shearing machine and produce needed high-frequency copper-clad plate; The plate that to hold material then successfully carries out wrapper sheet with high-frequency copper-clad plate and forms compoboard after handling with nylon bruss, gets pin hole in the minor face position of compoboard; The compoboard of accomplishing fluently pin hole is fixed on the numerical control drilling machine work top, carries out digital control hole drilling then, again the burr and the burr on compoboard surface are handled after the boring, check at last; Step 3, the making of surfacial pattern: at first polish-brush is carried out on the surface of compoboard and handle, then the wet film printing is carried out on its surface, baking; Copy and the good diazo sheet of inspection are carried out preparatory contraposition fix after good, through location hole diazo sheet and compoboard are carried out figure contraposition, exposure then; Compoboard after adopting 0.9-1.0% sodium carbonate liquor to exposure at last develops, and the compoboard after developing is overhauled; Step 4, to electroplate, etched making: pre-electroplating treatment is carried out on the compoboard surface after figure transfer accomplished, and again patterned surface is carried out successively that the electro-coppering thickening is handled and gold-plated; Compoboard surface anti-plate printing ink stripping after will handling again, plate is checked, repaiied to the figure of foundation design to the compoboard after the etching at last with unwanted partially-etched removal in the surfacial pattern then; Step 5, moulding is made: at first adopt numerical control to mill software the shape fabricating of compoboard is programmed, and simulation test is carried out in the profile path after the programming, simulate errorless back and adopt CNC milling machine to carry out the moulding making; Use cleaning machine to clean, dry, check after moulding is accomplished, obtain high intermodulation high-frequency circuit board.
Adopting resolution in the said step 1 is that the high precision laser drawing mechanism of 20240dpi is made the black egative film; Use 200 times of magnifying glasses that egative film is checked, use 5KW exposure machine copy diazo sheet then; Nylon bruss in the said step 2 is 500 order nylon brusses; Boring is 2-4 borings; The pin hole aperture that gets out in the minor face position of compoboard is 3.2mm; Numerical control drilling machine adopts the brill cutter of 45 degree, and the drilling hole amount that bores cutter is less than 1000 holes, and the boring back uses the above sand paper of 2000 orders that compoboard surface burr, burr are handled; In the said step 3 800 purpose running roller polish-brush machines are carried out adopting when polish-brush is handled in the surface of compoboard; Before the compoboard contraposition, will produce the film and carry out earlier fixing after the preparatory contraposition, and then utilize location hole that the film and compoboard are carried out contraposition; Use the 5KW exposure machine to carry out graph exposure; Carry out acid deoiling headed by the process of the pre-electroplating treatment in the said step 4 earlier, through two-stage washing back alligatoring, again through the two-stage washing, last pickling; When carrying out the moulding making in the said step 5, CNC milling cutter adopts two blade milling cutters.
The present invention has following beneficial effect: the present invention has adopted the preceding pre-grinding plate of boring and has produced the preparatory contraposition mode of the film in manufacturing process; Solve the problem of the antenna class high frequency plate debug difficulties that the distortion of the film or copper-clad plate causes, greatly improved production efficiency and product quality.
Description of drawings
Fig. 1 is a process chart of the present invention.
Embodiment
In Fig. 1; The present invention is a kind of manufacture method of high intermodulation high-frequency circuit board; It may further comprise the steps: step 1; Carry out engineering, light is painted data make: at first adopt template carried out graphic designs; To design figure then and carry out project file according to processing parameter and handle, according to working condition the file of handling well being carried out layout, adopts resolution then is that the high precision laser drawing mechanism of 20240dpi is made the black egative film, and the egative film that light is painted washes, development, photographic fixing, cleaning, air-dry; Re-use 200 times of magnifying glasses the egative film of completing is checked, last serves as that the maternal 5KW of use exposure machine carries out the diazo sheet copy with the egative film of checking again, and the diazo sheet that copies is checked; Step 2 is opened the making of material, copper-clad plate preliminary treatment, boring: at first leave by singly requirement size of flow process with electronic plate shearing machine and produce needed high-frequency copper-clad plate; The plate that to hold material then successfully carries out wrapper sheet with high-frequency copper-clad plate and forms compoboard after handling with 500 order nylon brusses, gets pin hole in the minor face position of compoboard; The compoboard of accomplishing fluently pin hole is fixed on the numerical control drilling machine work top; Carry out digital control hole drilling then, boring is 2-4 borings, and the pin hole aperture that gets out in the minor face position of compoboard is 3.2mm; Numerical control drilling machine adopts the brill cutter of 45 degree; The drilling hole amount that bores cutter is less than 1000 holes, with the above sand paper of 2000 orders the burr and the burr on compoboard surface is handled after the boring again, checks at last; Step 3, the making of surfacial pattern: at first adopt 800 purpose running roller polish-brush machines that polish-brush is carried out on the surface of compoboard and handle, then the wet film printing is carried out on its surface, baking; Copy and the good diazo sheet of inspection are carried out preparatory contraposition fix after good, before the compoboard contraposition, will produce the film carries out earlier fixing after the preparatory contraposition, and then utilizes location hole that the film and compoboard are carried out contraposition; Through location hole diazo sheet and compoboard are carried out the figure contraposition, use the 5KW exposure machine to carry out graph exposure then; Compoboard after adopting 0.9-1.0% sodium carbonate liquor to exposure at last develops, and the compoboard after developing is overhauled; Step 4; To electroplate, etched making: pre-electroplating treatment is carried out on the compoboard surface after figure transfer accomplished; Carry out acid deoiling headed by the process of pre-electroplating treatment earlier, through two-stage washing back alligatoring, again through the two-stage washing; Last pickling is carried out electro-coppering thickening processing and gold-plated to patterned surface more successively; Compoboard surface anti-plate printing ink stripping after will handling again, plate is checked, repaiied to the figure of foundation design to the compoboard after the etching at last with unwanted partially-etched removal in the surfacial pattern then; Step 5; Moulding is made: at first adopt numerical control to mill software the shape fabricating of compoboard is programmed, and simulation test is carried out in the profile path after the programming, simulate errorless back and adopt CNC milling machine to carry out the moulding making; When moulding was made, CNC milling cutter adopted two blade milling cutters; Use cleaning machine to clean, dry, check after moulding is accomplished, obtain high intermodulation high-frequency circuit board.
Claims (6)
1. the manufacture method of a high intermodulation high-frequency circuit board is characterized in that it may further comprise the steps:
Step 1; Carry out engineering, light is painted data make: at first adopt template carried out graphic designs; To design figure then and carry out the project file processing according to processing parameter; According to working condition the file of handling well is carried out layout, makes the black egative film then, the egative film that light is painted washes, development, photographic fixing, cleaning, air-dry; Again the egative film of completing is checked that last is that female parent carries out the diazo sheet copy with the egative film of checking again, and the diazo sheet that copies is checked;
Step 2 is opened the making of material, copper-clad plate preliminary treatment, boring: at first leave by singly requirement size of flow process with electronic plate shearing machine and produce needed high-frequency copper-clad plate; The plate that to hold material then successfully carries out wrapper sheet with high-frequency copper-clad plate and forms compoboard after handling with nylon bruss, gets pin hole in the minor face position of compoboard; The compoboard of accomplishing fluently pin hole is fixed on the numerical control drilling machine work top, carries out digital control hole drilling then, again the burr and the burr on compoboard surface are handled after the boring, check at last;
Step 3, the making of surfacial pattern: at first polish-brush is carried out on the surface of compoboard and handle, then the wet film printing is carried out on its surface, baking; Copy and the good diazo sheet of inspection are carried out preparatory contraposition fix after good, through location hole diazo sheet and compoboard are carried out figure contraposition, exposure then; Compoboard after adopting 0.9-1.0% sodium carbonate liquor to exposure at last develops, and the compoboard after developing is overhauled;
Step 4, to electroplate, etched making: pre-electroplating treatment is carried out on the compoboard surface after figure transfer accomplished, and again patterned surface is carried out successively that the electro-coppering thickening is handled and gold-plated; Compoboard surface anti-plate printing ink stripping after will handling again, plate is checked, repaiied to the figure of foundation design to the compoboard after the etching at last with unwanted partially-etched removal in the surfacial pattern then;
Step 5, moulding is made: at first adopt numerical control to mill software the shape fabricating of compoboard is programmed, and simulation test is carried out in the profile path after the programming, simulate errorless back and adopt CNC milling machine to carry out the moulding making; Use cleaning machine to clean, dry, check after moulding is accomplished, obtain high intermodulation high-frequency circuit board.
2. the manufacture method of a kind of high intermodulation high-frequency circuit board according to claim 1, it is characterized in that in the said step 1 adopting resolution is that the high precision laser drawing mechanism of 20240dpi is made the black egative film; Use 200 times of magnifying glasses that egative film is checked, use 5KW exposure machine copy diazo sheet then.
3. the manufacture method of a kind of high intermodulation high-frequency circuit board according to claim 1; It is characterized in that the nylon bruss in the said step 2 is 500 order nylon brusses; Boring is 2-4 borings, and the pin hole aperture that gets out in the minor face position of compoboard is 3.2mm, and numerical control drilling machine adopts the brill cutter of 45 degree; The drilling hole amount that bores cutter is less than 1000 holes, and the boring back uses the above sand paper of 2000 orders that compoboard surface burr, burr are handled.
4. the manufacture method of a kind of high intermodulation high-frequency circuit board according to claim 1 is characterized in that in the said step 3 800 purpose running roller polish-brush machines being carried out adopting when polish-brush is handled in the surface of compoboard; Before the compoboard contraposition, will produce the film and carry out earlier fixing after the preparatory contraposition, and then utilize location hole that the film and compoboard are carried out contraposition; Use the 5KW exposure machine to carry out graph exposure.
5. the manufacture method of a kind of high intermodulation high-frequency circuit board according to claim 1 is characterized in that carrying out acid deoiling earlier headed by the process of the pre-electroplating treatment in the said step 4, through two-stage washing back alligatoring, and again through the two-stage washing, last pickling.
6. the manufacture method of a kind of high intermodulation high-frequency circuit board according to claim 1, when it is characterized in that carrying out in the said step 5 moulding making, CNC milling cutter adopts two blade milling cutters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101152958A CN102638938A (en) | 2012-04-19 | 2012-04-19 | Manufacturing method of high-intermodulation and high-frequency circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012101152958A CN102638938A (en) | 2012-04-19 | 2012-04-19 | Manufacturing method of high-intermodulation and high-frequency circuit board |
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| CN102638938A true CN102638938A (en) | 2012-08-15 |
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| CN2012101152958A Pending CN102638938A (en) | 2012-04-19 | 2012-04-19 | Manufacturing method of high-intermodulation and high-frequency circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104582282A (en) * | 2014-12-19 | 2015-04-29 | 泰州市金鼎电子有限公司 | Manufacturing method of high coupling degree and high frequency circuit board |
| CN104640378A (en) * | 2013-11-06 | 2015-05-20 | 周海梅 | Manufacturing method for improving holing yield of high-frequency circuit board |
| CN104640351A (en) * | 2013-11-06 | 2015-05-20 | 周海梅 | Method for manufacturing high-insulation-resistance and high-frequency circuit board |
| CN107229013A (en) * | 2017-06-27 | 2017-10-03 | 奥士康精密电路（惠州）有限公司 | Pin prints bad method in a kind of golden face tests of improvement PCB |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101784162A (en) * | 2010-03-09 | 2010-07-21 | 施吉连 | Manufacturing method for microwave high frequency metal base circuit board |
| CN102159028A (en) * | 2011-03-15 | 2011-08-17 | 珠海元盛电子科技股份有限公司 | Manufacturing method of flexible printed circuit board for manufacturing bank card patterns |
| CN102159030A (en) * | 2011-03-16 | 2011-08-17 | 蔡新民 | Making method of high-frequency ultrathin circuit board |
-
2012
- 2012-04-19 CN CN2012101152958A patent/CN102638938A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101784162A (en) * | 2010-03-09 | 2010-07-21 | 施吉连 | Manufacturing method for microwave high frequency metal base circuit board |
| CN102159028A (en) * | 2011-03-15 | 2011-08-17 | 珠海元盛电子科技股份有限公司 | Manufacturing method of flexible printed circuit board for manufacturing bank card patterns |
| CN102159030A (en) * | 2011-03-16 | 2011-08-17 | 蔡新民 | Making method of high-frequency ultrathin circuit board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104640378A (en) * | 2013-11-06 | 2015-05-20 | 周海梅 | Manufacturing method for improving holing yield of high-frequency circuit board |
| CN104640351A (en) * | 2013-11-06 | 2015-05-20 | 周海梅 | Method for manufacturing high-insulation-resistance and high-frequency circuit board |
| CN104582282A (en) * | 2014-12-19 | 2015-04-29 | 泰州市金鼎电子有限公司 | Manufacturing method of high coupling degree and high frequency circuit board |
| CN107229013A (en) * | 2017-06-27 | 2017-10-03 | 奥士康精密电路（惠州）有限公司 | Pin prints bad method in a kind of golden face tests of improvement PCB |
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Application publication date: 20120815 Assignee: TAIZHOU JINDING ELECTRONIC CO., LTD. Assignor: Cai Xinmin Contract record no.: 2013320000370 Denomination of invention: Manufacturing method of high-intermodulation and high-frequency circuit board License type: Exclusive License Record date: 20130425 |
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Assignee: TAIZHOU JINDING ELECTRONIC CO., LTD. Assignor: Cai Xinmin Contract record no.: 2013320000370 Date of cancellation: 20160520 |
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