CN104582282A - Manufacturing method of high coupling degree and high frequency circuit board - Google Patents
Manufacturing method of high coupling degree and high frequency circuit board Download PDFInfo
- Publication number
- CN104582282A CN104582282A CN201410794653.1A CN201410794653A CN104582282A CN 104582282 A CN104582282 A CN 104582282A CN 201410794653 A CN201410794653 A CN 201410794653A CN 104582282 A CN104582282 A CN 104582282A
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- CN
- China
- Prior art keywords
- compoboard
- circuit board
- carried out
- frequency circuit
- carry out
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to a manufacturing method of a high coupling degree and high frequency circuit board. The manufacturing method comprises the following steps: step one, manufacturing project files and Plotted films; step two, cutting, pretreating a copper-clad plate, and drilling; step three, manufacturing surface patterns; step four, electroplating and etching; step five, forming. The manufacturing method has the advantages that modes of pre-grinding of the plate before drilling and pre-alignment of film production are adopted in the manufacturing process, so that the problem that antenna type high frequency plates are difficult to debug caused by the deformation of the films or the copper-clad plate is solved, and the production efficiency and product quality are greatly improved.
Description
Technical field
The present invention relates to a kind of making of circuit board, especially relate to a kind of manufacture method of high degree of coupling high-frequency circuit board.
Background technology
High-frequency circuit board is the special circuit board that electromagnetic frequency is higher, and in general, high frequency may be defined as frequency at more than 1GHz.Its physical properties, precision, technical parameter require very high, are usually used in the fields such as car collision avoidance System, satellite system, radio system; Although common high-frequency circuit board has outside excellent high-fire resistance, high-cooling property, excellent dimensional stability, not there is high frequency, lightening and stable frequency characteristic.
Summary of the invention
For overcoming the problems referred to above, the present invention adopts following technical scheme:
A manufacture method for high degree of coupling high-frequency circuit board, is characterized in that, comprising:
(1) project file, light are painted the film and are made: first adopt and carry out graphic designs to template, then will design figure and carry out project file process according to processing parameter, then according to working condition, the file handled well carried out to layout, makes black egative film, the egative film painted light rinses, develop, fixing, cleaning, air-dry; Again the egative film of completing is checked, finally again with the egative film checked for female parent carries out diazo sheet copy, and the diazo sheet copied to be checked;
(2) sawing sheet, boring make: first output high-frequency copper-clad plate required for production with electric plate shearer by flow process list requirement size; Then will hold the plate of material successfully with after 500 order nylon bruss process, high-frequency copper-clad plate is carried out wrapper sheet and form compoboard, get pin hole in the minor face position of compoboard; The compoboard accomplishing fluently pin hole is fixed on numerical control drilling machine work top, then carries out digital control hole drilling, again the burr on compoboard surface and burr are processed after boring, finally check;
(3) making of surfacial pattern: first polish-brush process is carried out to the surface of compoboard, then wet film printing is carried out to its surface, baking; To copy and the diazo sheet checked fixes after carrying out pre-contraposition OK, then by location hole, diazo sheet and compoboard are carried out figure contraposition, exposure; Finally adopt volume ratio be 0.9-1.2% sodium carbonate liquor to exposure after compoboard develop, by development after compoboard overhaul;
(4) electroplate, etching making: pre-electroplating treatment is carried out on the compoboard surface after being completed by Graphic transitions, then to patterned surface carry out successively electro-coppering thicken process and gold-plated; Again by the compoboard surface resist ink stripping after process, the figure of then foundation design, by partially-etched removal unwanted in surfacial pattern, finally checks the compoboard after etching, repaiies plate;
(5) shaping making: first adopt the shape fabricating of numerical control mill software to compoboard to programme, and simulation test is carried out to the profile path after programming, simulate errorless rear employing CNC milling machine and carry out shaping making; Shaping complete after use cleaning machine carry out cleaning, dry, check, obtain high degree of coupling high-frequency circuit board.Resolution is adopted to be that the high precision laser drawing mechanism of 20240dpi makes black egative film in described step one; Use 200 times of magnifying glasses to check egative film, then use 5KW exposure machine copy diazo sheet.
Before boring in described step 2, nog plate uses 500 order nylon bruss nog plates, boring is 2-4 borings, the pin hole aperture got out in the minor face position of compoboard is 3.2mm, numerical control drilling machine adopts the drill of 45 degree, the drilling hole amount of drill is less than 1000 holes, uses the sand paper of more than 2000 orders to process compoboard surface spikes, burr after boring.
800 object running roller scrubbers are adopted to carry out polish-brush process to the surface of compoboard in described step 3; Before compoboard contraposition, fix after the production film is first carried out pre-contraposition, and then utilize location hole that the film and compoboard are carried out contraposition; 8KW exposure machine is used to carry out graph exposure.
First acid deoiling is carried out, alligatoring after two-stage washing headed by the process of the pre-electroplating treatment in described step 4, then through two-stage washing, last pickling.
When carrying out shaping making in described step 5, CNC milling cutter adopts two blade milling cutters.
Advantage of the present invention is pre-nog plate and the pre-alignment mode of the production film have employed boring in manufacturing process before, and the problem of the antenna class high frequency plate debug difficulties that the distortion solving the film or copper-clad plate causes, drastically increases production efficiency and product quality.
Accompanying drawing explanation
Fig. 1 is process chart of the present invention.
Embodiment
As shown in Figure 1, a kind of manufacture method of high degree of coupling high-frequency circuit board, comprises the following steps: step one adopts resolution to be that the high precision laser drawing mechanism of 20240dpi makes black egative film; Use 200 times of magnifying glasses to check egative film, use 5KW exposure machine copy diazo sheet.Before step 2 boring, the plate holding material successfully is carried out wrapper sheet again with after 500 order nylon bruss process, boring is 2-4 borings, the pin hole aperture got out in the minor face position of compoboard is 3.2mm, numerical control drilling machine adopts the drill of 45 degree, the drilling hole amount of drill is less than 1000 holes, uses the sand paper of more than 2000 orders to process compoboard surface spikes, burr after boring.Step 3 adopts 800 object running roller scrubbers to carry out polish-brush process to the surface of compoboard; Before compoboard contraposition, fixing after first the production film being carried out pre-contraposition, then utilize location hole that the film and compoboard are carried out contraposition; 8KW exposure machine is used to carry out graph exposure.First acid deoiling is carried out, alligatoring after two-stage washing headed by the process of the pre-electroplating treatment of step 4, then through two-stage washing, last pickling.When step 5 carries out shaping making, CNC milling cutter adopts two blade milling cutters.Shaping complete after use cleaning machine carry out cleaning, dry, check, obtain high degree of coupling high-frequency circuit board.
Claims (6)
1. a manufacture method for high degree of coupling high-frequency circuit board, is characterized in that, comprising:
(1) project file, light are painted the film and are made: first adopt and carry out graphic designs to template, then will design figure and carry out project file process according to processing parameter, then according to working condition, the file handled well carried out to layout, makes black egative film, the egative film painted light rinses, develop, fixing, cleaning, air-dry; Again the egative film of completing is checked, finally again with the egative film checked for female parent carries out diazo sheet copy, and the diazo sheet copied to be checked;
(2) sawing sheet, boring make: first output high-frequency copper-clad plate required for production with electric plate shearer by flow process list requirement size; Then will hold the plate of material successfully with after 500 order nylon bruss process, high-frequency copper-clad plate is carried out wrapper sheet and form compoboard, get pin hole in the minor face position of compoboard; The compoboard accomplishing fluently pin hole is fixed on numerical control drilling machine work top, then carries out digital control hole drilling, again the burr on compoboard surface and burr are processed after boring, finally check;
(3) making of surfacial pattern: first polish-brush process is carried out to the surface of compoboard, then wet film printing is carried out to its surface, baking; To copy and the diazo sheet checked fixes after carrying out pre-contraposition OK, then by location hole, diazo sheet and compoboard are carried out figure contraposition, exposure; Finally adopt volume ratio be 0.9-1.2% sodium carbonate liquor to exposure after compoboard develop, by development after compoboard overhaul;
(4) electroplate, etching making: pre-electroplating treatment is carried out on the compoboard surface after being completed by Graphic transitions, then to patterned surface carry out successively electro-coppering thicken process and gold-plated; Again by the compoboard surface resist ink stripping after process, the figure of then foundation design, by partially-etched removal unwanted in surfacial pattern, finally checks the compoboard after etching, repaiies plate;
(5) shaping making: first adopt the shape fabricating of numerical control mill software to compoboard to programme, and simulation test is carried out to the profile path after programming, simulate errorless rear employing CNC milling machine and carry out shaping making; Shaping complete after use cleaning machine carry out cleaning, dry, check, obtain high degree of coupling high-frequency circuit board.
2. the manufacture method of high degree of coupling high-frequency circuit board according to claim 1, is characterized in that adopting in described step one resolution to be that the high precision laser drawing mechanism of 20240dpi makes black egative film; Use 200 times of magnifying glasses to check egative film, then use 5KW exposure machine copy diazo sheet.
3. the manufacture method of a kind of high degree of coupling high-frequency circuit board according to claim 1, before it is characterized in that the boring in described step 2, nog plate uses 500 order nylon bruss nog plates, boring is 2-4 borings, the pin hole aperture got out in the minor face position of compoboard is 3.2mm, numerical control drilling machine adopts the drill of 45 degree, the drilling hole amount of drill is less than 1000 holes, uses the sand paper of more than 2000 orders to process compoboard surface spikes, burr after boring.
4. the manufacture method of a kind of high degree of coupling high-frequency circuit board according to claim 1, is characterized in that adopting 800 object running roller scrubbers to carry out polish-brush process to the surface of compoboard in described step 3; Before compoboard contraposition, fix after the production film is first carried out pre-contraposition, and then utilize location hole that the film and compoboard are carried out contraposition; 8KW exposure machine is used to carry out graph exposure.
5. the manufacture method of a kind of high degree of coupling high-frequency circuit board according to claim 1, first carries out acid deoiling headed by the process that it is characterized in that the pre-electroplating treatment in described step 4, alligatoring after two-stage washing, then through two-stage washing, last pickling.
6. the manufacture method of high degree of coupling high-frequency circuit board according to claim 1, when it is characterized in that carrying out shaping making in described step 5, CNC milling cutter adopts two blade milling cutters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410794653.1A CN104582282A (en) | 2014-12-19 | 2014-12-19 | Manufacturing method of high coupling degree and high frequency circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410794653.1A CN104582282A (en) | 2014-12-19 | 2014-12-19 | Manufacturing method of high coupling degree and high frequency circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104582282A true CN104582282A (en) | 2015-04-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410794653.1A Pending CN104582282A (en) | 2014-12-19 | 2014-12-19 | Manufacturing method of high coupling degree and high frequency circuit board |
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| Country | Link |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08316639A (en) * | 1995-05-16 | 1996-11-29 | Sharp Corp | Manufacture of buildup multilayer wiring board |
| CN102638938A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Manufacturing method of high-intermodulation and high-frequency circuit board |
-
2014
- 2014-12-19 CN CN201410794653.1A patent/CN104582282A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08316639A (en) * | 1995-05-16 | 1996-11-29 | Sharp Corp | Manufacture of buildup multilayer wiring board |
| CN102638938A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Manufacturing method of high-intermodulation and high-frequency circuit board |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150429 |