CN107229013A - Pin prints bad method in a kind of golden face tests of improvement PCB - Google Patents
Pin prints bad method in a kind of golden face tests of improvement PCB Download PDFInfo
- Publication number
- CN107229013A CN107229013A CN201710499183.XA CN201710499183A CN107229013A CN 107229013 A CN107229013 A CN 107229013A CN 201710499183 A CN201710499183 A CN 201710499183A CN 107229013 A CN107229013 A CN 107229013A
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- CN
- China
- Prior art keywords
- pcb
- golden
- tool
- test
- golden face
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Tests Of Electronic Circuits (AREA)
- Measuring Leads Or Probes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Pin prints bad method in a kind of golden face tests of improvement PCB, comprises the following steps：（1）Tool boring point is selected, drilling file is made；（2）Tool sawing sheet；（3）According to step（1）Drilling file tool is drilled；（4）To tool assembling ox horn seat and measurement needle guard；（5）Making chases after the line film；（6）According to step（5）What is made chases after the line film to tool distribution, and assembles test probe；（7）PCB is filled on tool to carry out opening short-circuit board test；（8）PCB binding golden plates are carried out using tool to test.This method significantly reduces pin print caused by test bad by improving the drilling point selection of tool drilling file in test process.
Description
Technical field
The present invention relates to PCB manufacture fields, and in particular to pin prints bad method in a kind of golden face tests of improvement PCB.
Background technology
PCB binds golden plate, will golden bin part be fixed on pcb board, because golden face quality requirements are tighter, and golden face is softer,
It is generally also relatively tight to golden face quality requirements in PCB processing procedures, and the method for common PCB finished product tests would generally PCB pads,
The PAD such as BGA, IC leave many testing needle prints, have a strong impact on the quality requirements that PCB binds golden plate, cause to influence Products product
Matter.
With the quality requirements that the growing production capacity of company and efficiency and client are increasingly lifted, gold now is bound to PCB
The tool preparation method of board test is improved, and is printed with the testing needle for improving golden face, that is, is met the quality requirements of client, improved again
Products quality, reduces cost, thus improve I take charge of PCB industries competitiveness.
The content of the invention
The technical problems to be solved by the invention are to provide pin in a kind of golden face tests of improvement PCB and print bad method, carry
Rise the quality management and control of PCB binding golden plate tests, the production of reduction PCB product and qualitative control cost.
The technical problems to be solved by the invention are achieved by the following technical programs：
（1）The golden face measurement jig boring points of PCB are selected, drilling file is made；
（2）PCB gold face measurement jig sawing sheet；
（3）According to step（1）Drilling file the golden face measurement jigs of PCB are drilled；
（4）To the golden face measurement jig assembling ox horn seats of PCB and measurement needle guard；
（5）Making chases after the line film；It is to make the data for testing each PCB nexus to chase after the line film, forms measurement jig distribution network
Network figure, guides measurement jig distribution；
（6）According to step（5）What is made chases after the line film to the golden face measurement jig distributions of PCB, and assembles test probe；
（7）Dress PCB carries out opening short-circuit board test on the golden face measurement jigs of PCB；
（8）PCB binding golden plates are carried out using the golden face measurement jigs of PCB to test.
Wherein, step（1）The golden face measurement jig boring points of middle selection selection PCB, make drilling file specific as follows：
Each boring point of PCB gold face measurement jig designs the region by the 1/6 of the long side of each PCB welding disking areas, should
Region is not in welding disking area, and all boring points are located on a horizontal line.
Further, described test probe is the tylostyle of 115 ° -120 ° of syringe needle angle.
Further, described use tool carries out PCB binding golden plate open-short circuits, and pressure sets and arrived during test
45X0.1mm。
Employ after above-mentioned technical proposal, the present invention has the advantages that：
PCB gold face measurement jig is a kind of instrument for fixing pcb board and being tested, and drilling clicks deviation when making tool
At the long side 1/6 of pad, and all boring points are offset at same direction, can so be fallen using tool test pcb board hour hands print
Away from PAD（Pad on respective production drilling file）At edge 1/3, golden face PAD welding is not influenceed.And select syringe needle angle
115 ° -120 ° of tylostyle is difficult to protrude into plate face as test probe, syringe needle, further reduction pin print.Comprehensive lifting PCB bindings
Bad defect caused by golden plate test quality, the golden face pin print of reduction PCB binding golden plates.
Embodiment
With reference to embodiment, the present invention will be described in detail, and embodiment is only the preferred embodiment of the present invention,
It is not limitation of the invention.
Pin prints bad method in a kind of golden face tests of improvement PCB, comprises the following steps：
（1）Tool boring point is selected, drilling file is made；
（2）Tool sawing sheet；
（3）According to step（1）Drilling file tool is drilled；
（4）To tool assembling ox horn seat and measurement needle guard；
（5）Making chases after the line film；
（6）According to step（5）What is made chases after the line film to tool distribution, and assembles test probe；
（7）PCB is filled on tool to carry out opening short-circuit board test；
（8）PCB binding golden plate open-short circuits are carried out using tool, pressure, which is set, during test arrives 45X0.1mm.
Wherein, step（1）Middle selection selection tool boring point, makes drilling file specific as follows：
Each boring point design of tool at the 1/6 of the long side of each pad by region, the region not in pad, and
All boring points are located on a horizontal line.Pin print can fall at away from PAD edges 1/3, and golden face PAD welding is not influenceed.
Wherein, described test probe is the tylostyle of 115 ° -120 ° of syringe needle angle.So that being checked under ten times of mirrors without bright
Aobvious pin print.
After preferably being selected using the reconnaissance of this method improvement tool borehole data, the selection of improvement testing needle and test parameter, gold
Face pin prints fraction defective to be reduced to about 3-5% from original 50%.
Above-described embodiment is the preferred embodiment of the present invention, in addition, and the present invention can also have other implementations.
That is, on the premise of without departing from present inventive concept, any obvious replacement should also fall into the protection of the present invention
Within the scope of.
Claims (4)
1. pin prints bad method in a kind of golden face tests of improvement PCB, it is characterised in that comprise the following steps：
（1）The golden face measurement jig boring points of PCB are selected, drilling file is made；
（2）PCB gold face measurement jig sawing sheet；
（3）According to step（1）Drilling file the golden face measurement jigs of PCB are drilled；
（4）To the golden face measurement jig assembling ox horn seats of PCB and measurement needle guard；
（5）Making chases after the line film；
（6）According to step（5）What is made chases after the line film to the golden face measurement jig distributions of PCB, and assembles test probe；
（7）Dress PCB carries out opening short-circuit board test on the golden face measurement jigs of PCB；
（8）PCB binding golden plates are carried out using the golden face measurement jigs of PCB to test.
2. wherein, step（1）The golden face measurement jig boring points of middle selection selection PCB, make drilling file specific as follows：
Each boring point of PCB gold face measurement jig designs the region by the 1/6 of the long side of each PCB welding disking areas, should
Region is not in welding disking area, and all boring points are located on a horizontal line.
3. pin prints bad method in the golden face tests of improvement PCB according to claim 1, it is characterised in that described survey
Sound out the tylostyle that pin is 115 ° -120 ° of syringe needle angle.
4. pin prints bad method in the golden face tests of improvement PCB according to claim 1, it is characterised in that described makes
PCB binding golden plate open-short circuits are carried out with tool, pressure, which is set, during test arrives 45X0.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710499183.XA CN107229013A (en) | 2017-06-27 | 2017-06-27 | Pin prints bad method in a kind of golden face tests of improvement PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710499183.XA CN107229013A (en) | 2017-06-27 | 2017-06-27 | Pin prints bad method in a kind of golden face tests of improvement PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107229013A true CN107229013A (en) | 2017-10-03 |
Family
ID=59935304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710499183.XA Pending CN107229013A (en) | 2017-06-27 | 2017-06-27 | Pin prints bad method in a kind of golden face tests of improvement PCB |
Country Status (1)
| Country | Link |
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| CN (1) | CN107229013A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114423169A (en) * | 2022-02-28 | 2022-04-29 | 广东汇芯半导体有限公司 | Etching method of aluminum-based copper-clad plate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102638938A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Manufacturing method of high-intermodulation and high-frequency circuit board |
| CN103419518A (en) * | 2012-05-22 | 2013-12-04 | 上海百嘉电子有限公司 | Method for preparing field type display back electrode plate of electronic ink |
| CN103895061A (en) * | 2012-12-27 | 2014-07-02 | 中国航空工业集团公司第六三一研究所 | Method for machining holes in printed boards |
| CN104317998A (en) * | 2014-10-17 | 2015-01-28 | 深圳市百能信息技术有限公司 | Method and device for making and compensating parameters of Gerber file |
| CN106332476A (en) * | 2016-11-09 | 2017-01-11 | 珠海杰赛科技有限公司 | Multi-layer PCB manufacturing process |
-
2017
- 2017-06-27 CN CN201710499183.XA patent/CN107229013A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102638938A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Manufacturing method of high-intermodulation and high-frequency circuit board |
| CN103419518A (en) * | 2012-05-22 | 2013-12-04 | 上海百嘉电子有限公司 | Method for preparing field type display back electrode plate of electronic ink |
| CN103895061A (en) * | 2012-12-27 | 2014-07-02 | 中国航空工业集团公司第六三一研究所 | Method for machining holes in printed boards |
| CN104317998A (en) * | 2014-10-17 | 2015-01-28 | 深圳市百能信息技术有限公司 | Method and device for making and compensating parameters of Gerber file |
| CN106332476A (en) * | 2016-11-09 | 2017-01-11 | 珠海杰赛科技有限公司 | Multi-layer PCB manufacturing process |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114423169A (en) * | 2022-02-28 | 2022-04-29 | 广东汇芯半导体有限公司 | Etching method of aluminum-based copper-clad plate |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20171003 |