CN104181456A - Method for testing printed circuit board - Google Patents
Method for testing printed circuit board Download PDFInfo
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- CN104181456A CN104181456A CN201310202972.4A CN201310202972A CN104181456A CN 104181456 A CN104181456 A CN 104181456A CN 201310202972 A CN201310202972 A CN 201310202972A CN 104181456 A CN104181456 A CN 104181456A
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Abstract
The invention discloses a method for testing a printed circuit board. The method includes: placing a printed circuit board in a cold-hot impact bench; setting temperature and time for a low temperature test and a high temperature test, and performing cold and hot impact tests for multiple times in a repeated and circular manner; taking out the printed circuit board, after placing the printed circuit board in normal temperature for a predetermined time, detecting soldering points and the electrified working state of the printed circuit board, and feeding back test parameters; enabling the printed circuit board to be powered on and work and placing the printed circuit board in a constant temperature and humidity box for a high-temperature high-humidity test; taking out the printed circuit board, after placing the printed circuit board in normal temperature for a predetermined time, detecting the soldering points and the electrified working state of the printed circuit board, and feeding back test parameters; and analyzing the test parameters, and feeding back abnormal parameter information of the printed circuit board. The method for testing the printed circuit board in the invention utilizes a cold-hot impact test and a high-temperature high-humidity test, and can expose in a short time potential defects in welding and parts which may occur after long-term use, thereby improving accuracy of the tests of the printed circuit board.
Description
Technical field
The present invention relates to printed circuit board test method.
Background technology
Printed circuit board (PCB) (Printed Circuit Board, PCB) is quite extensive in all trades and professions application, and it is the supporter of electronic devices and components, plays key effect in various electric equipments.Along with the develop rapidly of P.e.c., on printed circuit board (PCB), the quality of connection of electronic devices and components has become the important component part of printed circuit board (PCB).Because factors such as being subject to working environment, use habit affects, printed circuit board (PCB) is occurring that after long-term use substrate distortion causes each electronic devices and components to occur that sealing-off or pad cracking and each electronic devices and components, due to defects such as the design defect average life cycle are short, finally cause printed circuit board (PCB) normally to work.How in the design phase, printed circuit board (PCB) may potential weld defects and electronic devices and components short defect in serviceable life be come out, and design is effectively corrected, become to improve the important component part of printed circuit board (PCB) reliability.Existing printed circuit board test method only detects outward appearance and the electrical performance of printed circuit board (PCB) conventionally, this method of testing can only be found out the problem having existed in printed circuit board (PCB), for printed circuit board (PCB) is contingent after long-term use, extremely cannot judge, cause testing inaccurate.
Summary of the invention
The object of the present invention is to provide a kind of printed circuit board test method.
In order to solve the problems of the technologies described above, the invention provides a kind of printed circuit board test method, comprising: described printed circuit board (PCB) is positioned over to thermal shock board the inside; Set the temperature of low-temperature test and temperature and the retention time of retention time and high temperature test, make described printed circuit board (PCB) with the frequency iterative cycles that at least per minute is changed once, repeatedly carry out thermal shock test between low-temperature test and high temperature test; Take out and under described printed circuit board (PCB) normal temperature, place pad and the energising duty that detects described printed circuit board (PCB) after the schedule time, and feedback test parameter; Make described printed circuit board (PCB) energising work and be placed in climatic chamber to carry out hot and humid test, design temperature and humidity parameter also keep one period of hot and humid test duration; Take out and under described printed circuit board (PCB) normal temperature, place pad and the energising duty that detects described printed circuit board (PCB) after the schedule time, and feedback test parameter; And analyze described test parameter, feed back the anomaly parameter information of described printed circuit board (PCB).
Wherein, the temperature of described low-temperature test and high temperature test is adjusted according to the temperature resistant grade of parts on printed circuit board (PCB).
Wherein, the temperature of described low-temperature test is higher than the minimum temperature in the temperature resistant grade of the parts on described printed circuit board (PCB), and the temperature of described high temperature test is lower than the maximum temperature in the temperature resistant grade of the parts on described printed circuit board (PCB).
Wherein, the retention time of described low-temperature test and high temperature test is consistent, is at least 10 minutes.
Wherein, the cycle index of thermal shock test is 60-120 time.
Wherein, the temperature of described low-temperature test is subzero 40 ° of C ± 5 ° C, and the temperature of described high temperature test is 90 ° of C ± 5 ° C.
Wherein, the circulation of described thermal shock test is from low-temperature test.
Wherein, the temperature parameter of described hot and humid test is 70 ° of C ± 5 ° C, and humidity parameter is 95%RH ± 5%, and the test duration is 240 ± 5 hours.
The schedule time of wherein, placing under described normal temperature is 1～2.5 hour.
Wherein, before described printed circuit board (PCB) being positioned over to thermal shock board the inside, also comprise:
Detect the pad of described printed circuit board (PCB); And detect the electrical performance of described printed circuit board (PCB).
Printed circuit board test method provided by the invention, utilize thermal shock test and hot and humid test, can expose at short notice printed circuit board (PCB) potential contingent welding after long-term use and parts defect, thereby improve the accuracy of printed circuit board test.
Accompanying drawing explanation
In order to be illustrated more clearly in technical scheme of the present invention, to the accompanying drawing of required use in embodiment be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the process flow diagram of the printed circuit board test method that provides of embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is clearly and completely described.
Please refer to Fig. 1, is a kind of printed circuit board test method that embodiment of the present invention provides, and for the performance of testing printed circuit board, it comprises:
S101, is positioned over thermal shock board the inside by described printed circuit board (PCB).
S102, sets the temperature of low-temperature test and temperature and the retention time of retention time and high temperature test, makes described printed circuit board (PCB) with the frequency iterative cycles that at least per minute is changed once, repeatedly carry out thermal shock test between low-temperature test and high temperature test.At this test phase, for printed circuit board (PCB) is carried out to temperature stress test, to accelerate, printed circuit board (PCB) welds and the exposure of parts defect.
In the present embodiment, between described low-temperature test and described high temperature test, iterative cycles is 60-120 time, as 60 times, 100 times, 110 times, 120 inferior.Circulation between described low-temperature test and described high temperature test is started by low-temperature test, and high temperature test finishes, and to avoid testing rear PCB surface, occurs dewfall phenomenon, and the electrical performance that affects PCB detects.
In the present embodiment, the temperature of low-temperature test is subzero 40 ° of C ± 5 ° C, and the temperature of high temperature test is 90 ° of C ± 5 ° C.The temperature of low-temperature test and high temperature test can be adjusted according to the temperature resistant grade of the upper parts of PCB, the temperature of low-temperature test and high temperature test should not surpass the temperature resistant grade of parts, be the temperature of low-temperature test higher than the minimum temperature in the temperature resistant grade of the parts on described printed circuit board (PCB), the temperature of high temperature test is lower than the maximum temperature in the temperature resistant grade of the parts on described printed circuit board (PCB).
In the present embodiment, the retention time of described low-temperature test and high temperature test is consistent, is at least 10 minutes.In other embodiments, the retention time of described low-temperature test and high temperature test can for 12 minutes, 15 minutes etc. At All Other Times.
Because the temperature of low-temperature test and high temperature test can be adjusted according to the temperature resistant grade of the upper parts of PCB, thereby can not damage the parts on PCB in test process.
S103, takes out and under described printed circuit board (PCB) normal temperature, places pad and the energising duty that detects described printed circuit board (PCB) after the schedule time, and feedback test parameter.In the present embodiment, from cold and hot temperature shock platform, printed circuit board (PCB) is taken out, place the schedule time at normal temperatures, then from tested circuit board, extracting 5 PCB out uses the microscope of 40 times to carry out pad inspection to each parts in PCB, for critical elements, need carry out ultrasonic scanning (Scanning Acoustic Microscope, C-SAM) scan with X ray (X-Ray) situation whether pad inside has microfracture, carry out electrical performance inspection simultaneously, confirm whether PCB can normally work, and record and feedback test parameter.For convenience of description, the test parameter in this step record and feedback is called as the first test parameter.
S104, makes described printed circuit board (PCB) energising work and is placed in climatic chamber to carry out hot and humid test, and design temperature and humidity parameter also keep one period of hot and humid test duration.This test phase for detection of PCB welding quality, parts adaptability and the permanance under hot and humid environment, to expose the too low PCB defect of reliability design surplus.
In the present embodiment, the temperature parameter of hot and humid test is 70 ° of C ± 5 ° C, and humidity parameter is 95%RH ± 5%, and the test duration is 240 ± 5 hours, wherein, the temperature and humidity of hot and humid test can be adjusted according to the temperature and humidity of PCB environment for use.In test process, need regularly to whether PCB is still in running order, electrically confirm every day.
Because of in test process, the temperature and humidity of hot and humid test can be adjusted according to the temperature and humidity of printed circuit board (PCB) environment for use, thereby temperature and humidity when temperature and humidity during printed circuit board test is worked with printed circuit board (PCB) is consistent, and then improved the accuracy of printed circuit board test.
S105, takes out and under described printed circuit board (PCB) normal temperature, places pad and the energising duty that detects described printed circuit board (PCB) after the schedule time, and feedback test parameter.In the present embodiment, printed circuit board (PCB) is taken out in climatic chamber, place the schedule time at normal temperatures, then from tested circuit board, extracting 5 PCB out uses the microscope of 40 times to carry out pad inspection to each parts in PCB, for critical elements, need carry out ultrasonic scanning (Scanning Acoustic Microscope, C-SAM) scan with X ray (X-Ray) situation whether pad inside has microfracture, carry out electrical performance inspection simultaneously, confirm whether PCB can normally work, and record and feedback test parameter.For convenience of description, the test parameter in this step record and feedback is called as the second test parameter.
S106, analyzes described test parameter, feeds back the anomaly parameter information of described printed circuit board (PCB).
As a further improvement on the present invention, described printed circuit board (PCB) being positioned over to thermal shock board the inside also comprises before: the pad that detects described printed circuit board (PCB); And detect the electrical performance of described printed circuit board (PCB).
In the present embodiment, from a production batch, extracting 5 PCB out uses the microscope of 40 times to carry out pad inspection to each parts in PCB, for critical elements, need carry out ultrasonic scanning (Scanning Acoustic Microscope, C-SAM) scan with X ray (X-Ray) situation whether pad inside has microfracture, and carry out electrical performance inspection, confirm whether PCB can normally work, and record and feedback test parameter.For convenience of description, the test parameter in this step record and feedback is called as the 3rd test parameter.The object that increases this two step is that preliminary screening goes out to test sample, for the sample that tentatively carries out pad and electrical performance test failure, there is no need to continue again to detect, but directly to production division's feedback test data.
In the present embodiment, by comparing the first test parameter and the 3rd test parameter, the second test parameter and the 3rd test parameter and the first test parameter and the second test parameter, can find that PCB is through vibration-testing, hot and humid test and vibration-testing and hot and humid test, the defect that the welding that may occur and parts are abnormal, such as pad disconnects, electrical property lost efficacy, pad cracking, damage of components quit work etc. abnormal.In testing process, if not abnormal, the performance of printed circuit board (PCB) meets the requirements, otherwise the performance of printed circuit board (PCB) is undesirable.
The schedule time of placing under described normal temperature in the present embodiment, is at least 1～2.5 when slight.
Printed circuit board test method provided by the invention, utilize thermal shock test and hot and humid test, can expose at short notice printed circuit board (PCB) potential contingent welding after long-term use and parts defect, thereby improve the accuracy of printed circuit board test.
Printed circuit board test method provided by the invention, utilize thermal shock test and hot and humid test, can expose at short notice printed circuit board (PCB) potential contingent welding after long-term use and parts defect, thereby improve the accuracy of printed circuit board test.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a printed circuit board test method, is characterized in that, described printed circuit board test method comprises:
Described printed circuit board (PCB) is positioned over to thermal shock board the inside;
Set the temperature of low-temperature test and temperature and the retention time of retention time and high temperature test, make described printed circuit board (PCB) with the frequency iterative cycles that at least per minute is changed once, repeatedly carry out thermal shock test between low-temperature test and high temperature test;
Take out and under described printed circuit board (PCB) normal temperature, place pad and the energising duty that detects described printed circuit board (PCB) after the schedule time, and feedback test parameter;
Make described printed circuit board (PCB) energising work and be placed in climatic chamber to carry out hot and humid test, design temperature and humidity parameter also keep one period of hot and humid test duration;
Take out and under described printed circuit board (PCB) normal temperature, place pad and the energising duty that detects described printed circuit board (PCB) after the schedule time, and feedback test parameter; And
Analyze described test parameter, feed back the anomaly parameter information of described printed circuit board (PCB).
2. printed circuit board test method according to claim 1, is characterized in that, the temperature of described low-temperature test and high temperature test is adjusted according to the temperature resistant grade of parts on printed circuit board (PCB).
3. printed circuit board test method according to claim 2, it is characterized in that, the temperature of described low-temperature test is higher than the minimum temperature in the temperature resistant grade of the parts on described printed circuit board (PCB), and the temperature of described high temperature test is lower than the maximum temperature in the temperature resistant grade of the parts on described printed circuit board (PCB).
4. printed circuit board test method according to claim 1, is characterized in that, the retention time of described low-temperature test and high temperature test is consistent, is at least 10 minutes.
5. printed circuit board test method according to claim 1, is characterized in that, the cycle index of thermal shock test is 60-120 time.
6. printed circuit board test method according to claim 3, is characterized in that, the temperature of described low-temperature test is subzero 40 ° of C ± 5 ° C, and the temperature of described high temperature test is 90 ° of C ± 5 ° C.
7. printed circuit board test method according to claim 3, is characterized in that, the circulation of described thermal shock test is from low-temperature test.
8. printed circuit board test method according to claim 1, is characterized in that, the temperature parameter of described hot and humid test is 70 ° of C ± 5 ° C, and humidity parameter is 95%RH ± 5%, and the test duration is 240 ± 5 hours.
9. printed circuit board test method according to claim 1, is characterized in that, the schedule time of placing under described normal temperature is 1～2.5 hour.
10. printed circuit board test method according to claim 1, is characterized in that, before described printed circuit board (PCB) being positioned over to thermal shock board the inside, also comprises:
Detect the pad of described printed circuit board (PCB); And
Detect the electrical performance of described printed circuit board (PCB).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310202972.4A CN104181456A (en) | 2013-05-27 | 2013-05-27 | Method for testing printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310202972.4A CN104181456A (en) | 2013-05-27 | 2013-05-27 | Method for testing printed circuit board |
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| CN104181456A true CN104181456A (en) | 2014-12-03 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106324488A (en) * | 2016-11-23 | 2017-01-11 | 沈阳航天新光集团有限公司 | Testing system on assembly of printed-circuit board of automation equipment |
| CN106370958A (en) * | 2016-10-25 | 2017-02-01 | 北京大学深圳研究生院 | Testing method and apparatus for LTCC substrate with inwardly embedded micro channel |
| CN109932590A (en) * | 2019-03-15 | 2019-06-25 | 深圳沸石智能技术有限公司 | A kind of high temperature durability test macro and method based on car networking intelligent terminal |
| CN110726923A (en) * | 2018-07-16 | 2020-01-24 | 郑州宇通客车股份有限公司 | Accelerated life test method for motor controller circuit board |
| CN111337079A (en) * | 2020-03-20 | 2020-06-26 | 深圳市同创鑫电子有限公司 | Test inspection method for printed circuit board production |
| CN114019353A (en) * | 2021-10-30 | 2022-02-08 | 江门市鸿基安普电子有限公司 | Production performance test system and test method for direct current motor driving circuit board |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06174785A (en) * | 1992-12-01 | 1994-06-24 | Hitachi Electron Eng Co Ltd | Thermostatic test equipment for ic device |
| CN101354429A (en) * | 2008-09-12 | 2009-01-28 | 北京圣涛平试验工程技术研究院有限责任公司 | Integrated circuit thermal vacuum test method |
| CN201247235Y (en) * | 2008-08-08 | 2009-05-27 | 东莞生益电子有限公司 | PCB synthesis reliability testing board |
| TW201007188A (en) * | 2008-08-14 | 2010-02-16 | King Yuan Electronics Co Ltd | Chip testing and sorting machine capable of simulating a system test |
| CN101813745A (en) * | 2009-02-20 | 2010-08-25 | 日月光半导体制造股份有限公司 | Electrical performance test method and equipment thereof |
| CN101900788A (en) * | 2009-05-25 | 2010-12-01 | 北京圣涛平试验工程技术研究院有限责任公司 | Test method for detecting reliability of product |
| CN101936954A (en) * | 2010-08-24 | 2011-01-05 | 深南电路有限公司 | Method for detecting reliability of printed circuit board (PCB) product with metal substrate |
| CN101957426A (en) * | 2009-07-14 | 2011-01-26 | 北京圣涛平试验工程技术研究院有限责任公司 | Combined environment test method for integrated circuit |
| CN102193054A (en) * | 2010-03-03 | 2011-09-21 | 上海微电子装备有限公司 | Method for determining highly accelerated stress screening test condition |
-
2013
- 2013-05-27 CN CN201310202972.4A patent/CN104181456A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06174785A (en) * | 1992-12-01 | 1994-06-24 | Hitachi Electron Eng Co Ltd | Thermostatic test equipment for ic device |
| CN201247235Y (en) * | 2008-08-08 | 2009-05-27 | 东莞生益电子有限公司 | PCB synthesis reliability testing board |
| TW201007188A (en) * | 2008-08-14 | 2010-02-16 | King Yuan Electronics Co Ltd | Chip testing and sorting machine capable of simulating a system test |
| CN101354429A (en) * | 2008-09-12 | 2009-01-28 | 北京圣涛平试验工程技术研究院有限责任公司 | Integrated circuit thermal vacuum test method |
| CN101813745A (en) * | 2009-02-20 | 2010-08-25 | 日月光半导体制造股份有限公司 | Electrical performance test method and equipment thereof |
| CN101900788A (en) * | 2009-05-25 | 2010-12-01 | 北京圣涛平试验工程技术研究院有限责任公司 | Test method for detecting reliability of product |
| CN101957426A (en) * | 2009-07-14 | 2011-01-26 | 北京圣涛平试验工程技术研究院有限责任公司 | Combined environment test method for integrated circuit |
| CN102193054A (en) * | 2010-03-03 | 2011-09-21 | 上海微电子装备有限公司 | Method for determining highly accelerated stress screening test condition |
| CN101936954A (en) * | 2010-08-24 | 2011-01-05 | 深南电路有限公司 | Method for detecting reliability of printed circuit board (PCB) product with metal substrate |
Non-Patent Citations (1)
| Title |
|---|
| 胡梦海等: "印制线路板CAF失效研究", 《印制电路信息》 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106370958A (en) * | 2016-10-25 | 2017-02-01 | 北京大学深圳研究生院 | Testing method and apparatus for LTCC substrate with inwardly embedded micro channel |
| CN106370958B (en) * | 2016-10-25 | 2019-08-13 | 北京大学深圳研究生院 | A kind of the ltcc substrate test method and device of embedded fluid channel |
| CN106324488A (en) * | 2016-11-23 | 2017-01-11 | 沈阳航天新光集团有限公司 | Testing system on assembly of printed-circuit board of automation equipment |
| CN110726923A (en) * | 2018-07-16 | 2020-01-24 | 郑州宇通客车股份有限公司 | Accelerated life test method for motor controller circuit board |
| CN109932590A (en) * | 2019-03-15 | 2019-06-25 | 深圳沸石智能技术有限公司 | A kind of high temperature durability test macro and method based on car networking intelligent terminal |
| CN111337079A (en) * | 2020-03-20 | 2020-06-26 | 深圳市同创鑫电子有限公司 | Test inspection method for printed circuit board production |
| CN114019353A (en) * | 2021-10-30 | 2022-02-08 | 江门市鸿基安普电子有限公司 | Production performance test system and test method for direct current motor driving circuit board |
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