CN201247235Y - PCB synthesis reliability testing board - Google Patents
PCB synthesis reliability testing board Download PDFInfo
- Publication number
- CN201247235Y CN201247235Y CNU2008201464446U CN200820146444U CN201247235Y CN 201247235 Y CN201247235 Y CN 201247235Y CN U2008201464446 U CNU2008201464446 U CN U2008201464446U CN 200820146444 U CN200820146444 U CN 200820146444U CN 201247235 Y CN201247235 Y CN 201247235Y
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Abstract
The utility model relates to a PCB integrated reliability test board, which comprises a body and an integrated test pattern which is arranged on the body, wherein the integrated test pattern comprises a plurality of unit test patterns. A plurality of the unit test patterns respectively are a peel strength test pattern, a test pattern of heat stress, weld ability and pull-off strength, a test pattern of a heat moist insulation resistance and a CAF resistance, a voltage-withstand test pattern, a laminated insulation resistance test pattern, and a test pattern of thermal shock, heating-cooling cycle and oil heating bath and a T260 test pattern. Through integrating various PCB unit test patterns on the producing type of the test board body, which together forms an integrated test pattern, wherein the unit test patterns comprise the main reliability category of the evaluation of the PCB test board, the test board can better evaluate the integrated reliability of the PCB test board, solves the problems that troubles which exist in manufacturing patterns and test items are easily undetected in tests in the evaluation of the PCB integrated reliability, and the time and the cost are effectively saved.
Description
Technical field
The utility model relates to a kind of test board, relates in particular to a kind of PCB combined reliability test board, in order to PCB is carried out the combined reliability test.
Background technology
Printed circuit board (pcb) has become electronic devices and components and has carried out the indispensable significant components of circuit connection now, thereby need test its combined reliability, application according to PCB, test event to the evaluation of PCB combined reliability mainly comprises: heat resistance, solderability, stripping performance, insulating property etc., yet, existing combined reliability evaluation, need each test event is designed independent resolution chart on the test board of certain model, each resolution chart all need be made the independent testing tool of a cover, and to feed intake separately, produce separately and independent technology controlling and process, under such technological process, finish the making of all reliability testing figures, make trouble, cycle is long, and expends lot of manpower and material resources again; Simultaneously, when testing, the test board that needs to have various resolution charts is made uniform one by one, and test is one by one wasted time and energy and omitted test event easily.
The utility model content
The purpose of this utility model is to provide a kind of PCB combined reliability test board, integrated multiple PCB resolution chart, can estimate easy omission test event problem in graphic making trouble in estimating with solution PCB combined reliability and the test to the PCB combined reliability.
For achieving the above object, the utility model provides a kind of PCB combined reliability test board, comprising: body and be located at composite test pattern on the body, composite test pattern comprises several unit testing figures.
Described several unit testing figures are: the peel strength test figure; Thermal stress, solderability, pull-off strength resolution chart; Damp and hot insulation resistance, the resolution chart of anti-CAF; The proof voltage resolution chart; Layer insulation resistance test figure; Thermal shock, cold cycling, hot oil bath resolution chart; The T260 resolution chart.
The beneficial effects of the utility model: by integrated multiple PCB unit testing figure on the test board body of same production model, these unit testing figures have been contained the main reliability category that pcb board is estimated, the common composite test pattern of forming, can estimate the PCB combined reliability preferably, solved the PCB combined reliability in estimating the graphic making trouble and test in omit the problem of test event easily, effectively save time and cost.
In order further to understand feature of the present utility model and technology contents, see also following about detailed description of the present utility model and accompanying drawing, yet appended graphic only provide with reference to and the explanation usefulness, be not to be used for the utility model is limited.
Description of drawings
Below in conjunction with accompanying drawing,, will make the technical solution of the utility model and other beneficial effects apparent by embodiment of the present utility model is described in detail.
In the accompanying drawing,
Fig. 1 is the synoptic diagram of PCB combined reliability test board of the present utility model.
Embodiment
Below in conjunction with accompanying drawing the utility model is described in detail.
As shown in Figure 1, PCB combined reliability test board of the present utility model comprises: body 10 and be located at composite test pattern 1 on the body 10, composite test pattern 1 comprises several unit testing figures.In the present embodiment, described body 10 is the PCB multilayer board, and described several unit testing figures are peel strength test figure 41, and it is made up of regular length, width, circuit that copper is thick; Thermal stress, solderability, pull-off strength resolution chart 11,12,13, its hole battle array by different apertures, pitch of holes is formed; Damp and hot insulation resistance, the resolution chart of anti-CAF 21,22,23,24,25, its Kong Zhen by the comb shape circuit of different spacing, different pitchs of holes, hole and base material circle are formed; Proof voltage resolution chart 31,22, the interlayer conductor of its comb shape circuit by a determining deviation, different medium thickness is formed; Layer insulation resistance test figure 31 is made up of the interlayer conductor of different medium thickness; Thermal shock, cold cycling, hot oil bath resolution chart 51 are made up of one group of pore chain road; T260 resolution chart 26,27, the copper sheet district that is all contained copper sheet by each floor in the PCB multilayer board forms.
Make the step of composite test pattern, comprising:
Step 1: identify the main reliability category of PCB needs assessment, comprising: heat resistance (thermal stress, T260), solderability, switching performance (thermal shock, cold cycling, hot oil bath), mechanical property (peel strength, pull-off strength), insulating property (damp and hot, layer insulation performance, anti-CAF, proof voltage);
Step 2: at each test event in the above-mentioned five class performances, design several suitable unit testing figures based on the test philosophy among the IPC TM-650 (test methods manual of printed circuit association), then they are classified layout on the test board body of same production model according to functional block, form a composite test pattern.
In sum, PCB combined reliability test board of the present invention is specifically designed to and carries out the test of PCB combined reliability, by on the test board body, each main reliability testing items graphics of PCB is made into the composite test pattern of integral body according to its functional classification, thereby, in the making of the utility model PCB combined reliability test board, only need to make cover tools, throw a defective material, producing a model gets final product, carry out (approving when the PCB combined reliability is estimated at needs as sheet material, technology assessment), make the test board body according to composite test pattern, carrying out technology controlling and process according to the production procedure of existing test board then produces, when test, by the composite test pattern on the PCB combined reliability test board being tested the combination property that gets final product the thoroughly evaluating pcb board.
The above; for the person of ordinary skill of the art; can make other various corresponding changes and distortion according to the technical solution of the utility model and technical conceive, and all these changes and distortion all should belong to the protection domain of the utility model accompanying Claim.
Claims (10)
1, a kind of PCB combined reliability test board is characterized in that, comprising: body and be located at composite test pattern on the body, composite test pattern comprises several unit testing figures.
2, PCB combined reliability test board as claimed in claim 1 is characterized in that, described several unit testing figures are: the peel strength test figure; Thermal stress, solderability, pull-off strength resolution chart; Damp and hot insulation resistance, the resolution chart of anti-CAF; The proof voltage resolution chart; Layer insulation resistance test figure; Thermal shock, cold cycling, hot oil bath resolution chart; The T260 resolution chart.
3, PCB combined reliability test board as claimed in claim 2 is characterized in that, described peel strength test figure is made up of regular length, width, circuit that copper is thick.
4, PCB combined reliability test board as claimed in claim 2 is characterized in that, described thermal stress, solderability, pull-off strength resolution chart are made up of the hole battle array of different apertures, pitch of holes.
5, PCB combined reliability test board as claimed in claim 2 is characterized in that, described damp and hot insulation resistance, the resolution chart of anti-CAF are made up of Kong Zhen, hole and the base material circle of the comb shape circuit of different spacing, different pitchs of holes.
6, PCB combined reliability test board as claimed in claim 2 is characterized in that, described proof voltage resolution chart is made up of the comb shape circuit of a determining deviation, the interlayer conductor of different medium thickness.
7, PCB combined reliability test board as claimed in claim 2 is characterized in that, described layer insulation resistance test figure is made up of the interlayer conductor of different medium thickness.
8, PCB combined reliability test board as claimed in claim 2 is characterized in that, described thermal shock, cold cycling, hot oil bath resolution chart are made up of one group of pore chain road.
9, PCB combined reliability test board as claimed in claim 2 is characterized in that, described body is the PCB multilayer board.
10, PCB combined reliability test board as claimed in claim 9 is characterized in that, described T260 resolution chart is made up of the copper sheet district that each floor of PCB multilayer board contains copper sheet.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008201464446U CN201247235Y (en) | 2008-08-08 | 2008-08-08 | PCB synthesis reliability testing board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008201464446U CN201247235Y (en) | 2008-08-08 | 2008-08-08 | PCB synthesis reliability testing board |
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CN201247235Y true CN201247235Y (en) | 2009-05-27 |
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CNU2008201464446U Expired - Fee Related CN201247235Y (en) | 2008-08-08 | 2008-08-08 | PCB synthesis reliability testing board |
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Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101887101A (en) * | 2010-06-09 | 2010-11-17 | 深圳市深联电路有限公司 | High withstand voltage testing device of single-sided aluminum-base printed circuit board and testing method |
CN101893545A (en) * | 2010-07-14 | 2010-11-24 | 深南电路有限公司 | Test method and test apparatus for bonding force of PCB (Printed Circuit Board) embedded metal base |
CN102421241A (en) * | 2011-08-01 | 2012-04-18 | 东莞生益电子有限公司 | Withstand voltage test pattern of layer insulation medium of PCB (Printed Circuit Board) multilayer board |
CN102445466A (en) * | 2010-09-30 | 2012-05-09 | 北大方正集团有限公司 | Method for determining heat resistance of circuit board and device thereof |
CN102628922A (en) * | 2012-04-17 | 2012-08-08 | 无锡市大元广盛电气有限公司 | Manual testing board |
CN103118485A (en) * | 2013-01-25 | 2013-05-22 | 广东生益科技股份有限公司 | Printed circuit board for testing electric-resistant chemical migration performances |
CN103369857A (en) * | 2012-03-30 | 2013-10-23 | 北大方正集团有限公司 | A method for processing a testing board before a conductive anodic filament experiment |
CN103389319A (en) * | 2012-05-10 | 2013-11-13 | 海洋王(东莞)照明科技有限公司 | Test method for rapidly exposing welding defects of printed circuit board, and test system thereof |
CN103728512A (en) * | 2013-12-26 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | Reliability test board and PCB inter-hole CAF failure analysis method |
CN103743974A (en) * | 2013-12-26 | 2014-04-23 | 广州兴森快捷电路科技有限公司 | Reliability test board and CAF resistance performance test method of printed circuit board |
CN104181456A (en) * | 2013-05-27 | 2014-12-03 | 海洋王(东莞)照明科技有限公司 | Method for testing printed circuit board |
CN104237752A (en) * | 2014-09-25 | 2014-12-24 | 广州兴森快捷电路科技有限公司 | Test method, test fixture and test device for thin core board layer short risks |
CN107064776A (en) * | 2017-04-20 | 2017-08-18 | 北京品驰医疗设备有限公司 | A kind of system and method that reliability test is carried out to medical device circuitry plate |
CN107703425A (en) * | 2017-09-26 | 2018-02-16 | 郑州云海信息技术有限公司 | A kind of method of testing and device of detection CCL materials proof voltage energy |
CN108107342A (en) * | 2017-11-07 | 2018-06-01 | 广州兴森快捷电路科技有限公司 | Test module wiring method and test module |
CN108169633A (en) * | 2017-12-07 | 2018-06-15 | 中国船舶重工集团公司第七0五研究所 | A kind of method using dereferenced searching algorithm test insulating properties |
CN109696206A (en) * | 2018-06-26 | 2019-04-30 | 上海嘉捷通电路科技股份有限公司 | A kind of self-control buried resistor plate and its test method |
CN110375961A (en) * | 2019-07-29 | 2019-10-25 | 武汉电信器件有限公司 | A kind of automatic test approach of optical module and the Auto-Test System of optical module |
CN112305403A (en) * | 2020-09-14 | 2021-02-02 | 南方科技大学 | Test board for testing CAF resistance and test method |
CN114994449A (en) * | 2022-07-18 | 2022-09-02 | 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) | Electronic material compatibility testing device and method and computer equipment |
-
2008
- 2008-08-08 CN CNU2008201464446U patent/CN201247235Y/en not_active Expired - Fee Related
Cited By (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101887101A (en) * | 2010-06-09 | 2010-11-17 | 深圳市深联电路有限公司 | High withstand voltage testing device of single-sided aluminum-base printed circuit board and testing method |
CN101893545A (en) * | 2010-07-14 | 2010-11-24 | 深南电路有限公司 | Test method and test apparatus for bonding force of PCB (Printed Circuit Board) embedded metal base |
CN102445466B (en) * | 2010-09-30 | 2014-02-26 | 北大方正集团有限公司 | Method for determining heat resistance of circuit board and device thereof |
CN102445466A (en) * | 2010-09-30 | 2012-05-09 | 北大方正集团有限公司 | Method for determining heat resistance of circuit board and device thereof |
CN102421241A (en) * | 2011-08-01 | 2012-04-18 | 东莞生益电子有限公司 | Withstand voltage test pattern of layer insulation medium of PCB (Printed Circuit Board) multilayer board |
CN103369857A (en) * | 2012-03-30 | 2013-10-23 | 北大方正集团有限公司 | A method for processing a testing board before a conductive anodic filament experiment |
CN102628922A (en) * | 2012-04-17 | 2012-08-08 | 无锡市大元广盛电气有限公司 | Manual testing board |
CN103389319A (en) * | 2012-05-10 | 2013-11-13 | 海洋王(东莞)照明科技有限公司 | Test method for rapidly exposing welding defects of printed circuit board, and test system thereof |
CN103118485B (en) * | 2013-01-25 | 2016-08-03 | 广东生益科技股份有限公司 | A kind of printed circuit board testing resistance to electrochemical migration performance and preparation method thereof |
CN103118485A (en) * | 2013-01-25 | 2013-05-22 | 广东生益科技股份有限公司 | Printed circuit board for testing electric-resistant chemical migration performances |
CN104181456A (en) * | 2013-05-27 | 2014-12-03 | 海洋王(东莞)照明科技有限公司 | Method for testing printed circuit board |
CN103728512A (en) * | 2013-12-26 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | Reliability test board and PCB inter-hole CAF failure analysis method |
CN103743974A (en) * | 2013-12-26 | 2014-04-23 | 广州兴森快捷电路科技有限公司 | Reliability test board and CAF resistance performance test method of printed circuit board |
CN104237752A (en) * | 2014-09-25 | 2014-12-24 | 广州兴森快捷电路科技有限公司 | Test method, test fixture and test device for thin core board layer short risks |
CN107064776A (en) * | 2017-04-20 | 2017-08-18 | 北京品驰医疗设备有限公司 | A kind of system and method that reliability test is carried out to medical device circuitry plate |
CN107064776B (en) * | 2017-04-20 | 2019-10-25 | 北京品驰医疗设备有限公司 | A kind of pair of medical device circuitry plate carries out the system and method for reliability test |
CN107703425A (en) * | 2017-09-26 | 2018-02-16 | 郑州云海信息技术有限公司 | A kind of method of testing and device of detection CCL materials proof voltage energy |
CN108107342A (en) * | 2017-11-07 | 2018-06-01 | 广州兴森快捷电路科技有限公司 | Test module wiring method and test module |
CN108107342B (en) * | 2017-11-07 | 2020-07-28 | 广州兴森快捷电路科技有限公司 | Test module |
CN108169633A (en) * | 2017-12-07 | 2018-06-15 | 中国船舶重工集团公司第七0五研究所 | A kind of method using dereferenced searching algorithm test insulating properties |
CN108169633B (en) * | 2017-12-07 | 2020-02-07 | 中国船舶重工集团公司第七0五研究所 | Method for testing insulativity by using non-associative search algorithm |
CN109696206A (en) * | 2018-06-26 | 2019-04-30 | 上海嘉捷通电路科技股份有限公司 | A kind of self-control buried resistor plate and its test method |
CN109696206B (en) * | 2018-06-26 | 2021-04-13 | 上海嘉捷通电路科技股份有限公司 | Self-made buried resistance plate and testing method thereof |
CN110375961A (en) * | 2019-07-29 | 2019-10-25 | 武汉电信器件有限公司 | A kind of automatic test approach of optical module and the Auto-Test System of optical module |
CN112305403A (en) * | 2020-09-14 | 2021-02-02 | 南方科技大学 | Test board for testing CAF resistance and test method |
CN114994449A (en) * | 2022-07-18 | 2022-09-02 | 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) | Electronic material compatibility testing device and method and computer equipment |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090527 Termination date: 20130808 |