CN112305403A - Test board for testing CAF resistance and test method - Google Patents
Test board for testing CAF resistance and test method Download PDFInfo
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- CN112305403A CN112305403A CN202010961726.7A CN202010961726A CN112305403A CN 112305403 A CN112305403 A CN 112305403A CN 202010961726 A CN202010961726 A CN 202010961726A CN 112305403 A CN112305403 A CN 112305403A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/045—Circuits
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
Abstract
The invention relates to the field of electronic material manufacturing, in particular to a test board and a test method for CAF resistance performance test. A test board for testing CAF resistance performance comprises a test substrate, wherein a cathode test end, a test link group and an anode test end are arranged on the test substrate; the test link group is including the first through-hole and the second through-hole that correspond the setting, first through-hole through first circuit with the switch-on of positive pole test end, the second through-hole through the second circuit with the switch-on of negative pole test end, the pore wall interval between first through-hole and the second through-hole is 3 ~ 12 mils. The CAF resistance performance can be quickly tested by limiting the hole wall spacing, and the testing efficiency is improved.
Description
Technical Field
The invention relates to the field of electronic material manufacturing, in particular to a test board and a test method for CAF resistance performance test.
Background
The ion migration caf (conductive chemical additive) refers to the phenomenon that metal ions generate electro-migration chemical reaction in a non-metal medium under the action of an electric field, so that a conductive channel is formed between an anode and a cathode of a circuit to cause short circuit of the circuit. The PCB (printed circuit board) is used as a carrier of electronic components, is the basis of the development of the electronic industry, and along with the development of light, thin, short, small and high-speed electronic products, the interlayer spacing and the hole wall spacing of the PCB become smaller and smaller, the circuits become denser and denser, and the probability of CAF failure between corresponding holes is larger and larger, so that most enterprises of printed circuit boards carry out CAF performance tests to evaluate the CAF resistance of the board when verifying new boards, new processes and new structural products.
At present, the CAF test method is basically tested by referring to the method recorded in the 2.6.25 Conductive Anodic Filament (CAF) test (electrochemical migration test) in the IPC-9691A-CN IPC-TM-650 test method, wherein because the CAF failure is most likely to occur between the holes on the test link, the test patterns on the general test board are all hole-to-hole test links (as shown in FIG. 1), the hole-to-hole distance between the holes is at most 20mil, and the test condition is 65 ℃/RH 85%/50V.
The disadvantage of using this test method is that each test takes a long time, usually over 1000h, resulting in low development efficiency of new plates.
Disclosure of Invention
Therefore, the invention aims to overcome the defect that the development efficiency of a new plate is lower due to longer time consumption of a CAF-resistant test method in the prior art, and provides a test board and a test method for CAF-resistant performance test.
In order to solve the technical problems, the technical scheme adopted by the invention is as follows:
a test board for testing CAF resistance performance comprises a test substrate, wherein a cathode test end, a test link group and an anode test end are arranged on the test substrate;
the test link group is including the first through-hole and the second through-hole that correspond the setting, first through-hole through first circuit with the switch-on of positive pole test end, the second through-hole through the second circuit with the switch-on of negative pole test end, the pore wall interval between first through-hole and the second through-hole is 3 ~ 12 mils.
Furthermore, the test link group and the anode test end are provided with at least two groups, and the anode test end and the test link group are arranged in a one-to-one correspondence manner.
Further, the test link group comprises at least two hole wall intervals.
Furthermore, the test link group comprises at least two first through holes and two second through holes, and the hole wall intervals of the first through holes and the second through holes in the same test link group are the same.
Furthermore, at least two cathode test ends are arranged and correspond to the test link groups one by one.
The invention also provides a testing method for testing the CAF resistance, which comprises the following steps:
providing a test board for testing CAF resistance performance according to any one of the above schemes;
and testing the resistance value between the anode test end and the cathode test end in the test board, and judging whether the short circuit failure condition caused by CAF exists between the first through hole and the second through hole or not according to the resistance value.
Further, the determining whether a short circuit failure condition caused by CAF exists between the first through hole and the second through hole according to the resistance value includes:
when the test resistance value is less than or equal to a set resistance value, determining that a short circuit failure condition caused by CAF exists between the first through hole and the second through hole, wherein the set resistance value is 106-108Ohm.
Further, before testing the resistance value between the anode test end and the cathode test end in the test board, the method also comprises the step of cleaning and decontaminating the test board for the CAF resistance performance test.
Further, the cleaning and decontaminating comprises:
ultrasonically cleaning with deionized water for 10-30 min; then ultrasonically cleaning for 15-30min by using an organic solvent; and finally, washing with deionized water for at least 10 min.
Further, the step of testing the resistance between the anode testing end and the cathode testing end comprises the step of carrying out online resistance testing on the test board for the CAF resistance performance test under the conditions that the temperature is more than or equal to 75 ℃, the humidity is more than or equal to RH 75% and the voltage is more than or equal to 75V.
The technical scheme of the invention has the following advantages:
1. according to the test board for testing the CAF resistance, the smaller the hole wall spacing is, the higher the possibility of the channel formed between the glass fiber and the resin is, and the quicker the failure is, and the hole wall spacing is limited, so that the first through hole and the second through hole can be more quickly subjected to conduction failure in the test process, the test time is shortened, and the test efficiency is improved.
2. According to the test board for the CAF resistance performance test, the number of the test samples can be increased by arranging the test link groups into at least two groups, so that one part of the test link groups can be used for the CAF resistance test, and the other part of the test link groups can be used for a repeatability experiment or a verification experiment.
3. According to the test board for the CAF resistance performance test, the different use environments of the board have different requirements on the CAF resistance failure of the board, the hole wall spacing of each test link group is set to be not identical, the test link groups are classified, the failure conditions of test links with different hole wall spacing sizes can be tested simultaneously only through one-time CAF resistance performance test, a user can judge the application scene of the board according to the relation between different hole wall spacing and failure speed in the test result, and the test efficiency of the applicable scene of the board is improved.
4. According to the testing method for testing the CAF resistance, provided by the invention, the testing conditions are further optimized on the basis of selecting the specific testing board, so that the CAF failure sensitivity of the material can be rapidly identified, the experimental time is shortened, and the testing efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic structural diagram of a test board for CAF-resistant testing in the prior art;
FIG. 2 is a front view of a test board for CAF resistance test in example 1 of the present invention;
FIG. 3 is a rear view of the test plate of FIG. 2;
FIG. 4 is a graph showing the results of the CAF resistance test in example 2 of the present invention;
FIG. 5 is a graph showing the results of the CAF resistance test in example 3 of the present invention;
FIG. 6 is a graph showing the results of the CAF resistance test in comparative example 1 of the present invention.
Reference numerals:
1. testing the substrate; 2. an anode test end; 3. a cathode test end; 41. a first through hole; 42. a first line; 43. a second through hole; 44. a second line.
Detailed Description
The following examples are provided to further understand the present invention, not to limit the scope of the present invention, but to provide the best mode, not to limit the content and the protection scope of the present invention, and any product similar or similar to the present invention, which is obtained by combining the present invention with other prior art features, falls within the protection scope of the present invention.
The examples do not show the specific experimental steps or conditions, and can be performed according to the conventional experimental steps described in the literature in the field. The reagents or instruments used are not indicated by manufacturers, and are all conventional reagent products which can be obtained commercially.
Example 1
Referring to fig. 2-3, the present embodiment relates to a testing board for CAF-resistant testing, which includes a testing substrate 1, wherein the testing substrate 1 is provided with an anode testing terminal 2, a testing link group and a cathode testing terminal 3.
The testing link group comprises a first through hole 41 and a second through hole 43 which are correspondingly arranged, and a corresponding first line 42 and a corresponding second line 44, wherein the first through hole 41 is communicated with the anode testing terminal 2 through the first line 42, the second through hole 43 is communicated with the cathode testing terminal 3 through the second line 44, the cathode testing terminal 3 is one end which is grounded, the hole wall distance between the first through hole 41 and the second through hole 43 can be set to be 3-12mil, and the hole wall distance refers to the shortest distance between the first through hole 41 and the second through hole 43.
Optionally, in order to increase the sample size, in one test link group, the number of the first through holes 41 and the number of the second through holes 43 may be at least two, but it should be noted that, in the same test link group, the hole wall pitches between the first through holes 41 and the second through holes 43 are consistent.
Alternatively, the number of the test link groups may be set to one or more groups, and when the number of the test link groups is set to at least two or more groups, the hole wall pitches between different test link groups may be set to be the same or different. When at least two groups of test link groups with the same hole wall spacing are arranged, the test link groups can be batched, one part of the test link groups can be used for CAF resistance performance test, and the other part of the test link groups can be used for subsequent repeatability test or verification test. When two different hole wall intervals appear on one test board, the classification of the test link group can be realized, the CAF failure time length caused by different hole wall intervals is different, the requirements of different use scenes on the CAF resistance performance of the PCB are different, therefore, the test link group is set in a grading way, the failure condition of the test link group with different hole wall intervals can be tested only through one-time CAF resistance performance test, and the application scene of the PCB is judged according to the failure condition of the test link group with different hole wall intervals, so that the test efficiency is improved.
Alternatively, the test board may be a double-sided board or a multi-layer board, and the circuits of the test link groups may be disposed on the same layer or different layers.
In this embodiment, test substrate 1 is the PCB board, and positive pole test end 2, negative pole test end 3 and test link group all are provided with 6 groups, and wherein, there are the interval of two sets of test link groups to set up to 4 mils, and there are the interval of two sets of test link groups to set up to 8 mils, and the interval of remaining two sets of test link groups sets up to 12 mils, and the pore wall interval in each test link group increases along the direction that test link group arranged gradually. In the present embodiment, the test substrate 1 is a double-sided board, in which the anode lines are disposed on the front side and the cathode lines are disposed on the back side. In addition, in the present embodiment, the number of the first through holes 41 and the number of the second through holes 43 are eight, the second through holes 43 correspond to the first through holes 41 one to one, the eight first through holes 41 are arranged in a straight line, and the hole wall pitches in the same group of test link groups are the same. The test substrate 1 includes a glass fiber cloth, in this embodiment, the straight lines formed by the eight first through holes 41 are parallel to the warp of the glass fiber cloth, so that ions can migrate along the weft of the glass fiber cloth, in other embodiments, the straight lines formed by the eight first through holes 41 may also be parallel to the weft of the glass fiber cloth, or form a certain included angle with both the warp and the weft of the glass fiber cloth.
Through setting up the pore wall interval between first through-hole 41 and the second through-hole 43 in different test link groups to different while to injecing pore wall interval size, on the one hand, the pore wall interval is smaller, it is higher to form the possibility that the passageway switched on between glass fiber and the resin, it is quicker to become invalid, on the other hand, the pore wall interval in different test link groups is different, make different test links on the same piece survey test panel can realize hierarchical, thereby can be according to the relation model of different pore wall intervals and failure rate, and then realize the quick test of CAF resistance performance, promote efficiency of software testing.
Example 2
The embodiment relates to a testing method for CAF resistance performance test, which comprises the following steps:
s1, providing a test board: plating hole wiring on a test substrate to form the test board described in embodiment 1, in the same ion migration test module, the cathode can be uniformly grounded after being communicated, the anode needs to be separately connected with an anode lead, wherein the hole wall pitch is 4mil for link 1, the hole wall pitch is 8mil for link 2, and the hole wall pitch is 12mil for link 3.
And S2, completing welding the welding points of the test board and the leads of the ion transfer equipment one by one according to the anode/cathode corresponding mode.
S3, cleaning: and placing the test board in deionized water for ultrasonic cleaning for 15min, then placing the test board in an isopropanol aqueous solution for ultrasonic cleaning for 15min, and finally placing the test board in the deionized water again for cleaning for 15min, so as to remove oil stains or ion pollution on the surface of the test board.
S4, placing the test board in the environment test box, wherein the test board is placed in the air as much as possible when placed, the connecting line connector is downward, and the situation that the test result judgment is influenced due to the fact that condensed water flows into the test board in the experiment process to cause short circuit is avoided. The other end of the connecting wire is connected to a test module in the ion migration system, in addition, the ion migration system is connected with a computer, a test program is set through software, the program mainly comprises input information of voltage and real-time monitoring of resistance, and the environment test box is synchronous and is provided with a temperature/humidity program.
S5, judging whether the experimental plate is normal: without connecting voltage, fully drying the test board at the drying temperature of 100-; and after drying, connecting voltage 10V, synchronously testing resistance, then performing temperature/humidity circulating treatment, synchronously detecting the resistance in an environment with the temperature of 25 ℃, the humidity range of RH 40% and the voltage of 10V, and judging that the experimental board is normal as the detection result is shown in section I in figure 4.
S6, CAF resistance test: and testing the resistance value of the test board under the conditions that the temperature is 85 ℃, the humidity is RH 85% and the voltage is 100v, and judging whether the test board fails due to CAF according to the test result, wherein the test result is shown in section II in figure 4.
In this embodiment, the resistance value is set to 106Ohm, from fig. 4, it can be seen that link 1 and link 2 fail.
The time to failure of link 1 tested in this example was about 3.5 x 104s。
Example 3
The present embodiment relates to a testing method for CAF resistance performance test, and the difference between the present embodiment and embodiment 2 is that in the present embodiment, the voltage tested in step S6 is 150V, and the real-time resistance test result of the present embodiment is shown in fig. 5. The time to failure of link 1 tested in this example was about 3.3 × 104s。
Comparative example 1
The comparative example relates to a test method for testing CAF resistance, which is designed and tested according to a standard plate according to IPC-TM-650 test standard, the distance between pore walls is 20mil, the test condition is 65 ℃/RH 85%/50V, and the test result is shown in FIG. 6. The comparative example tested a link failure time of approximately 850 hours.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (10)
1. The test board for the CAF-resistant performance test is characterized by comprising a test substrate, wherein a cathode test end, a test link group and an anode test end are arranged on the test substrate;
the test link group is including the first through-hole and the second through-hole that correspond the setting, first through-hole through first circuit with the switch-on of positive pole test end, the second through-hole through the second circuit with the switch-on of negative pole test end, the pore wall interval between first through-hole and the second through-hole is 3 ~ 12 mils.
2. The testing board for testing CAF resistance according to claim 1, wherein at least two groups of the testing link groups and the anode testing ends are arranged, and the anode testing ends are arranged in one-to-one correspondence with the testing link groups.
3. The test board for testing CAF resistance according to claim 2, wherein the test link group comprises at least two hole wall pitches.
4. The test board for testing CAF resistance according to any one of claims 1 to 3, wherein the test link group comprises at least two first through holes and two second through holes, and the hole wall pitches of the first through holes and the second through holes in the same test link group are the same.
5. The test board for testing CAF resistance according to claim 2, wherein the cathode test ends are also provided with at least two, and are in one-to-one correspondence with the test link groups.
6. A testing method for testing CAF resistance is characterized by comprising the following steps:
providing a test plate according to any one of claims 1 to 5 for testing CAF resistance;
and testing the resistance value between the anode test end and the cathode test end in the test board, and judging whether the short circuit failure condition caused by CAF exists between the first through hole and the second through hole or not according to the resistance value.
7. The testing method of claim 6, wherein determining whether a short circuit failure condition caused by CAF exists between the first through hole and the second through hole according to the resistance value comprises:
when the test resistance value is less than or equal to a set resistance value, determining that a short circuit failure condition caused by CAF exists between the first through hole and the second through hole, wherein the set resistance value is 106-108Ohm.
8. The method as claimed in claim 6 or 7, further comprising the step of washing and decontaminating said test board for CAF resistance testing before testing the resistance value between the anode test terminal and the cathode test terminal in said test board.
9. The testing method of claim 8, wherein the cleaning and decontaminating comprises:
ultrasonically cleaning with deionized water for 10-30 min; then ultrasonically cleaning for 15-30min by using an organic solvent; and finally, washing with deionized water for at least 10 min.
10. The testing method according to any one of claims 6 to 9, wherein the testing of the resistance between the anode testing terminal and the cathode testing terminal comprises performing an on-line resistance test on the test board for CAF resistance performance testing at a temperature of 75 ℃ or higher, a humidity of RH 75% or higher, and a voltage of 75V or higher.
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CN113702446A (en) * | 2021-09-03 | 2021-11-26 | 松山湖材料实验室 | Method for testing micro-resistance of through hole of ceramic substrate |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201247235Y (en) * | 2008-08-08 | 2009-05-27 | 东莞生益电子有限公司 | PCB synthesis reliability testing board |
CN103118485A (en) * | 2013-01-25 | 2013-05-22 | 广东生益科技股份有限公司 | Printed circuit board for testing electric-resistant chemical migration performances |
CN103743974A (en) * | 2013-12-26 | 2014-04-23 | 广州兴森快捷电路科技有限公司 | Reliability test board and CAF resistance performance test method of printed circuit board |
CN105467172A (en) * | 2016-01-01 | 2016-04-06 | 广州兴森快捷电路科技有限公司 | CAF testing plate with switching circuit |
CN205263264U (en) * | 2015-12-22 | 2016-05-25 | 山东海量信息技术研究院 | Survey test panel of resistant CAF performance of test PCB panel |
CN205812489U (en) * | 2016-07-07 | 2016-12-14 | 深圳中富电路有限公司 | A kind of printed circuit board (PCB) and CAF test cell thereof |
CN208013369U (en) * | 2018-03-13 | 2018-10-26 | 广东世运电路科技股份有限公司 | A kind of CAF test boards |
CN111257731A (en) * | 2020-02-17 | 2020-06-09 | 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) | CAF test module, test fixture and test assembly |
-
2020
- 2020-09-14 CN CN202010961726.7A patent/CN112305403A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201247235Y (en) * | 2008-08-08 | 2009-05-27 | 东莞生益电子有限公司 | PCB synthesis reliability testing board |
CN103118485A (en) * | 2013-01-25 | 2013-05-22 | 广东生益科技股份有限公司 | Printed circuit board for testing electric-resistant chemical migration performances |
CN103743974A (en) * | 2013-12-26 | 2014-04-23 | 广州兴森快捷电路科技有限公司 | Reliability test board and CAF resistance performance test method of printed circuit board |
CN205263264U (en) * | 2015-12-22 | 2016-05-25 | 山东海量信息技术研究院 | Survey test panel of resistant CAF performance of test PCB panel |
CN105467172A (en) * | 2016-01-01 | 2016-04-06 | 广州兴森快捷电路科技有限公司 | CAF testing plate with switching circuit |
CN205812489U (en) * | 2016-07-07 | 2016-12-14 | 深圳中富电路有限公司 | A kind of printed circuit board (PCB) and CAF test cell thereof |
CN208013369U (en) * | 2018-03-13 | 2018-10-26 | 广东世运电路科技股份有限公司 | A kind of CAF test boards |
CN111257731A (en) * | 2020-02-17 | 2020-06-09 | 中国电子产品可靠性与环境试验研究所((工业和信息化部电子第五研究所)(中国赛宝实验室)) | CAF test module, test fixture and test assembly |
Non-Patent Citations (1)
Title |
---|
胡梦海等: "玻纤裂纹分析及其对PCB耐CAF性能的影响", 《印制电路信息》 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113702446A (en) * | 2021-09-03 | 2021-11-26 | 松山湖材料实验室 | Method for testing micro-resistance of through hole of ceramic substrate |
CN113702446B (en) * | 2021-09-03 | 2023-11-03 | 松山湖材料实验室 | Micro-resistance testing method for ceramic substrate through hole |
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