CN205263264U - Survey test panel of resistant CAF performance of test PCB panel - Google Patents
Survey test panel of resistant CAF performance of test PCB panel Download PDFInfo
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- CN205263264U CN205263264U CN201521079608.4U CN201521079608U CN205263264U CN 205263264 U CN205263264 U CN 205263264U CN 201521079608 U CN201521079608 U CN 201521079608U CN 205263264 U CN205263264 U CN 205263264U
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Abstract
The utility model discloses a survey test panel of resistant CAF performance of test PCB panel relates to the electronics field, and its overall structure is a PCB circuit board, be provided with A test region, B test region and C test region on the survey test panel to, testing region, B test region and C test region, a all be provided with corresponding test point on, the test point of drawing is tested on region, B test region and the C test region through A and the resistant CAF performance of PCB panel can be tested. Can be able to bear or endure CAF capability test to PCB panel commonly used through this utility model, reach each panel and be able to bear or endure the CAF performance condition, have certain reference value to follow -up PCB panel lectotype, the resistant CAF performance of corresponding control PCB panel that can be fine, improve greatly with the reliability of improving PCB panel.
Description
Technical field
The utility model relates to electronic applications, specifically a kind of test board of testing the resistance to CAF performance of pcb board material.
Background technology
Along with the development in high speed epoch, the transmission speed of signal is more and more faster, and design density is also increasing, and for reducing heating, the operating voltage that electronic product sets constantly reduces, and two-forty, high density, low-voltage also further increase for the requirement of signal quality like this. Conventionally all can there is unavoidably a little flaw in pcb board material, as the impact such as moisture-proof, heat resistance. Up to today of high-speed transfer, the design of electronic products cycle is shorter and shorter, particularly motherboard and the backboard in electronic product, board is thick, the number of plies is many, the probability that CAF occurs must be avoided or reduce to the sheet material of these boards, the electronic product design cycle is ensured, in the time of long-term use, reliability is also ensured.
Because the insulating barrier of PCB base material is made up of resin and glass cloth, when under high-voltage state, between through hole and through hole, circuit and circuit, circuit and through hole, form an electric field, and PCB wet process is a lot, in moisture or the clean bad residual electrolyte of the plate face microcrack that may produce via boring produce short circuit along the direction migration of glass fibers, cause failure of insulation, this phenomenon is called the leaky of CAF positive polarity glass fiber yarn. If can well control the resistance to CAF performance of pcb board material, also can greatly improve and improve accordingly the reliability of pcb board material, be therefore badly in need of the measuring technology of the resistance to CAF performance of some test pcb board materials.
Summary of the invention
The utility model, for the weak point of current needs and prior art development, provides a kind of test board of testing the resistance to CAF performance of pcb board material.
A kind of test board of testing the resistance to CAF performance of pcb board material described in the utility model, the technical scheme that solves the problems of the technologies described above employing is as follows: the test board of the resistance to CAF performance of described test pcb board material, its overall structure is a PCB circuit board, on described test board, be provided with A test zone, B test zone and C test zone, and, on A test zone, B test zone and C test zone, be provided with corresponding test point; Can test the resistance to CAF performance of pcb board material by the test point of drawing on A test zone, B test zone and C test zone.
Preferably, described A test zone comprises the through hole of some horizontally-arrangeds, some vertical setting of types, and described through hole and through hole center distance are 40mil; Meanwhile, described A test zone is drawn four test points.
Preferably, described B test zone comprises the through hole of 20 horizontally-arrangeds, 10 vertical setting of types, and described through hole and through hole center distance are 31.5mil.
Preferably, described B test zone is drawn test point 1 and test point 2, and 1,3,5,7,9 vertical setting of types through holes connect together by wire, receives test point B1; 2,4,6,8,10 vertical setting of types through holes connect together by wire, receive test point B2.
Preferably, described C test zone comprises circuit region and line bore region, and described circuit region comprises some test leads, and described test lead adopts live width 12.5mil line-spacing 12.5mil, or live width 4mil line-spacing 4mil, or live width 3mil line-spacing 3mil; And odd number wire and even number wire connect together by Copper Foil respectively, receive separately test point C1 and test point C4.
Preferably, described line bore region comprises some wires and through hole, and the spacing of described wire and through hole is 3.8mil, and described through-hole spacing is 40mil; Wherein two live width 4mil line-spacing 4.4mil wires are together around through hole cabling, and link test point C3, and another test clicks test point C1 or test point C4.
Preferably, described line bore region comprises some wires and through hole, and the spacing of described wire and through hole is 5mil, and described through-hole spacing is 40mil; Copper Foil is laid in described through hole, and described Copper Foil is 5mil apart from the spacing of through hole, and described Copper Foil to be connected to test point C2 upper, another test clicks test point C1 or test point C4.
Preferably, four of described test board angle places offer fixing hole.
The beneficial effect that a kind of test board of testing the resistance to CAF performance of pcb board material described in the utility model compared with prior art has is: can do to conventional pcb board material the test of resistance to CAF performance by this utility model, draw the resistance to CAF performance of each sheet material situation, follow-up pcb board material type selecting is had to certain reference value; Can be good at controlling the resistance to CAF performance of pcb board material by this test board, also can greatly improve and improve accordingly the reliability of pcb board material.
Brief description of the drawings
Accompanying drawing 1 is the structural representation of the test board of the resistance to CAF performance of described test pcb board material;
Description of reference numerals: 1, test board; 2, A test zone; 3, B test zone; 4, C test zone; 5, test point; 6, through hole; 7, test point B1; 8, test point B2; 9, wire; 10, Copper Foil; 11, test point C1; 12, test point C2; 13, test point C3; 14, test point C4; 15, fixing hole.
Detailed description of the invention
For making the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with specific embodiment, and with reference to accompanying drawing, a kind of test board of testing the resistance to CAF performance of pcb board material described in the utility model is further described.
In order better to test the situation of the resistance to CAF performance of pcb board material, the utility model provides a kind of test board of testing the resistance to CAF performance of pcb board material, by corresponding test zone and test point are set on test board, facilitates the resistance to CAF performance of follow-up test pcb board material. Four jiaos are added with fixing hole, when convenient test, fix. Can do to conventional pcb board material the test of resistance to CAF performance by this utility model, draw the resistance to CAF performance of each sheet material situation, follow-up pcb board material type selecting is had to certain reference value.
Embodiment:
A kind of test board of testing the resistance to CAF performance of pcb board material described in the present embodiment, its overall structure as shown in Figure 1, this test board (1) is a PCB circuit board, on described test board, be provided with A test zone (2), B test zone (3) and C test zone (4), and, on A test zone, B test zone and C test zone, be provided with corresponding test point (5); Can test the resistance to CAF performance of pcb board material by the test point of drawing on A test zone, B test zone and C test zone. A test zone both can be for through hole and through hole on test pcb board material, again can measurement circuit and the situation of through hole, and B test zone can be for testing the situation of through hole and through hole, and C test zone can be for the situation of measurement circuit and circuit.
Described in the present embodiment, test the test board of the resistance to CAF performance of pcb board material, as shown in Figure 1, described A test zone (2) comprises the through hole (6) of some horizontally-arrangeds, some vertical setting of types, and described through hole and through hole center distance are 40mil; Meanwhile, described A test zone (2) is drawn four test points (5); Described B test zone (3) comprises the through hole (6) of 20 horizontally-arrangeds, 10 vertical setting of types, and described through hole and through hole center distance are 31.5mil; Meanwhile, described B test zone is drawn two test points, and 1,3,5,7,9 vertical setting of types through holes connect together by wire, receives test point B1 (7); 2,4,6,8,10 vertical setting of types through holes connect together by wire, receive test point B2 (8). While using this test board to test, the resistance value that can test between these two test points judges the resistance to CAF situation of pcb board material.
Described in the present embodiment, test the test board of the resistance to CAF performance of pcb board material, as shown in Figure 1, described C test zone (4) comprises circuit region and line bore region, described circuit region comprises some wires (9), described test lead can be designed as live width 12.5mil line-spacing 12.5mil, or live width 4mil line-spacing 4mil, or live width 3mil line-spacing 3mil. And, odd number wire (the 1st, the 3rd, the 5th etc. odd number wire) and even number wire (the 2nd, the 4th, the 6th etc. even number wire) connect together by Copper Foil respectively, receive separately in test point, shown in accompanying drawing 1, receive respectively test point C1 (11) and test point C4 (14). While using this test board to test, the resistance value that can test between these two test points judges the resistance to CAF situation of pcb board material.
The line bore region of described C test zone (4), comprises some wires and through hole, and the spacing of described wire and through hole is 5mil or 3.8mil, and described through-hole spacing is 40mil; In the time that the spacing of described wire and through hole is 3.8mil, in order to ensure that conductor spacing through hole is 3.8mil, allow two live width 4mil line-spacing 4.4mil wires (9) together around through hole cabling, finally link test point C3 (13), another test point can be selected any in test point C1, test point C4. In the time that the spacing of described wire and through hole is 5mil, Copper Foil (10) is laid in described through hole, and described Copper Foil is 5mil apart from the spacing of through hole, and it is upper that described Copper Foil is connected to test point C2 (12), another test point also can be selected any in test point C1, test point C4; When test, the resistance value that can survey between these two test points judges sheet material CAF situation.
In addition, test the test board of the resistance to CAF performance of pcb board material described in the present embodiment, offer fixing hole (15) at four angles place of test board, as shown in Figure 1, this test board can be fixed on to relevant position by these fixing holes, convenient test pcb board material. While using this test board to test the resistance to CAF performance of pcb board material, add 50V voltage tester, Temperature and Humidity Control: 85+/-2 DEG C, 85%RH, the testing time is 500H. After 500H, add 50V voltage tester, whether survey its resistance value >=10^7ohms.
Above-mentioned detailed description of the invention is only concrete case of the present utility model; scope of patent protection of the present utility model includes but not limited to above-mentioned detailed description of the invention; anyly meet suitable variation or replacement claims of the present utility model and that any person of an ordinary skill in the technical field does it, all should fall into scope of patent protection of the present utility model.
Claims (8)
1. test the test board of the resistance to CAF performance of pcb board material for one kind, it is characterized in that, its overall structure is a PCB circuit board, on described test board, be provided with A test zone, B test zone and C test zone, and, on A test zone, B test zone and C test zone, be provided with corresponding test point; Can test the resistance to CAF performance of pcb board material by the test point of drawing on A test zone, B test zone and C test zone.
2. a kind of test board of testing the resistance to CAF performance of pcb board material according to claim 1, is characterized in that, described A test zone comprises the through hole of some horizontally-arrangeds, some vertical setting of types, and described through hole and through hole center distance are 40mil; Meanwhile, described A test zone is drawn four test points.
3. a kind of test board of testing the resistance to CAF performance of pcb board material according to claim 2, is characterized in that, described B test zone comprises the through hole of 20 horizontally-arrangeds, 10 vertical setting of types, and described through hole and through hole center distance are 31.5mil.
4. a kind of test board of testing the resistance to CAF performance of pcb board material according to claim 3, is characterized in that, described B test zone is drawn test point 1 and test point 2, and 1,3,5,7,9 vertical setting of types through holes connect together by wire, receives test point B1; 2,4,6,8,10 vertical setting of types through holes connect together by wire, receive test point B2.
5. according to the arbitrary described a kind of test board of testing the resistance to CAF performance of pcb board material of claim 1 to 4, it is characterized in that, described C test zone comprises circuit region and line bore region, described circuit region comprises some test leads, described test lead adopts live width 12.5mil line-spacing 12.5mil, or live width 4mil line-spacing 4mil, or live width 3mil line-spacing 3mil; And odd number wire and even number wire connect together by Copper Foil respectively, receive separately test point C1 and test point C4.
6. a kind of test board of testing the resistance to CAF performance of pcb board material according to claim 5, is characterized in that, described line bore region comprises some wires and through hole, and the spacing of described wire and through hole is 3.8mil, and described through-hole spacing is 40mil; Wherein two live width 4mil line-spacing 4.4mil wires are together around through hole cabling, and link test point C3, and another test clicks test point C1 or test point C4.
7. a kind of test board of testing the resistance to CAF performance of pcb board material according to claim 5, is characterized in that, described line bore region comprises some wires and through hole, and the spacing of described wire and through hole is 5mil, and described through-hole spacing is 40mil; Copper Foil is laid in described through hole, and described Copper Foil is 5mil apart from the spacing of through hole, and described Copper Foil to be connected to test point C2 upper, another test clicks test point C1 or test point C4.
8. according to a kind of test board of testing the resistance to CAF performance of pcb board material described in claim 6 or 7, it is characterized in that, four angles place of described test board offers fixing hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521079608.4U CN205263264U (en) | 2015-12-22 | 2015-12-22 | Survey test panel of resistant CAF performance of test PCB panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521079608.4U CN205263264U (en) | 2015-12-22 | 2015-12-22 | Survey test panel of resistant CAF performance of test PCB panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205263264U true CN205263264U (en) | 2016-05-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521079608.4U Expired - Fee Related CN205263264U (en) | 2015-12-22 | 2015-12-22 | Survey test panel of resistant CAF performance of test PCB panel |
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| CN (1) | CN205263264U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111707847A (en) * | 2020-07-03 | 2020-09-25 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Clamp and method for fixing sample in conductive anode wire test box |
| CN112305403A (en) * | 2020-09-14 | 2021-02-02 | 南方科技大学 | Test board for testing CAF resistance and test method |
| CN112858875A (en) * | 2021-01-04 | 2021-05-28 | 广州广合科技股份有限公司 | PCB CAF test module design method |
-
2015
- 2015-12-22 CN CN201521079608.4U patent/CN205263264U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111707847A (en) * | 2020-07-03 | 2020-09-25 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Clamp and method for fixing sample in conductive anode wire test box |
| CN112305403A (en) * | 2020-09-14 | 2021-02-02 | 南方科技大学 | Test board for testing CAF resistance and test method |
| CN112858875A (en) * | 2021-01-04 | 2021-05-28 | 广州广合科技股份有限公司 | PCB CAF test module design method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160525 Termination date: 20161222 |