CN103743974A - Reliability test board and CAF resistance performance test method of printed circuit board - Google Patents
Reliability test board and CAF resistance performance test method of printed circuit board Download PDFInfo
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- CN103743974A CN103743974A CN201310739721.XA CN201310739721A CN103743974A CN 103743974 A CN103743974 A CN 103743974A CN 201310739721 A CN201310739721 A CN 201310739721A CN 103743974 A CN103743974 A CN 103743974A
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Abstract
The present invention discloses a reliability test board, which includes a test substrate. The test substrate is provided with a positive test terminal, a negative test terminal and at least two rows of test plated-through-hole, each row of test plated-through-hole respectively comprises a first and a second plated-through-holes, the first plated-through-hole through the second plated-through-hole is performed at a interval one by one, the first plated-through-hole in each row of test plated-through-hole is opposited with the second plated-through-hole in adjacent other row of test plated-through-hole, the first plated-through-hole is connected to the positive test terminal through lines respectively, and the second plated-through-hole is connected to the negative test terminal through lines. The CAF resistance performance test method of printed circuit board based on the reliability test board can be more fully and accurately evaluate the performance of the CAF resistance performance test method of printed circuit board.
Description
Technical field
The printed circuit board performance test methods of resistance to CAF that the present invention relates to a kind of method for making of reliability test board and carry out based on this reliability test board.
Background technology
Along with electronic product is constantly to the future development of multifunction, miniaturization and, high performance, printed wiring board mesopore density is increasing, CAF inefficacy probability between corresponding hole is also increasing, and therefore most of printed wiring boards all can carry out CAF performance evaluation by design test plate when carrying out new sheet material, new technology, new construction Product Validation.But how to make CAF graphic designs more reasonable, to more can accurately comprehensively evaluate the CAF performance of printed circuit board and can conveniently determine that inefficacy hole site is very crucial.The CAF resolution chart of industry is all to design according to the example graph in IPC9691 at present, the test board (as shown in Figure 5) of making based on this CAF resolution chart has a significantly deficiency: it has all linked up a round one circuit, so just cannot test evaluation to CAF inefficacy situation occurs between the hole of same round, this be because between instrument connection due to the circuit short circuit that is connected; In addition, owing to connecting between hole, when occurring, after CAF inefficacy, also cannot to find concrete CAF inefficacy hole by the resistance between instrument connection, be unfavorable for the CAF analysis of causes and improvement.
Summary of the invention
Based on this, the invention reside in the defect that overcomes prior art, the performance test methods of resistance to CAF of a kind of reliability test board and printed circuit board is provided, the printed circuit board performance test methods of resistance to CAF carrying out based on described reliability test board, can evaluate the resistance to CAF performance of printed circuit board more all-sidedly and accurately.
Its technical scheme is as follows:
A kind of reliability test board, comprise test base, on test base, be provided with anodal test lead, negative pole test lead and at least two row's test plated-through-holes, every row tests plated-through-hole and includes the first plated-through-hole and the second plated-through-hole, the first plated-through-hole and the second plated-through-hole are all spaced one by one, it is relative with the second plated-through-hole in adjacent another row's test plated-through-hole that every row tests the first plated-through-hole in plated-through-hole, described the first plated-through-hole is connected with anodal test lead by circuit respectively, and described the second plated-through-hole is connected with negative pole test lead by circuit respectively.
Thereby, when utilizing this reliability test board to carry out the reliability testing of resistance to CAF, as long as the positive pole of resistance meter is connected to described anodal test lead, the negative pole of resistance meter connects described negative pole test lead, can judge between test plated-through-hole whether have the short-circuit failure situation being caused by CAF according to the resistance showing described in resistance meter.
In an embodiment, described anodal test lead is anodal plated-through-hole, and negative pole test lead is made into negative pole plated-through-hole therein.By this setting, can be conveniently connection between the connection between the anodal plated-through-hole in the front of reliability test board and the first plated-through-hole and reverse side negative pole plated-through-hole and the second plated-through-hole at reliability test board.
Therein in an embodiment, described reliability test board has pro and con, circuit between described anodal plated-through-hole and the first plated-through-hole is arranged on the front of reliability test board, and the circuit between described negative pole plated-through-hole and the second plated-through-hole is arranged on the reverse side of reliability test board.Thereby, can avoid circuit between anodal plated-through-hole and the first plated-through-hole with the circuit phase mutual interference between negative pole plated-through-hole and the second plated-through-hole.
Therein in an embodiment, described anodal test lead, negative pole test lead and test plated-through-hole are all arranged in a test module district, and anodal test lead and negative pole test lead are all away from described test plated-through-hole.Thereby, can avoid, between anodal test lead and negative pole test lead and test plated-through-hole, the short-circuit failure situation that CAF causes also occurs, thereby can avoid the mistake in test.
Therein in an embodiment, described reliability test board is provided with multiple described test module districts, and in each test module district, is provided with negative pole test lead and the described test plated-through-hole of two rows described in anodal test lead described in one, one.Thereby, by testing, can evaluate more all-sidedly and accurately the resistance to CAF performance of printed circuit board in different test module districts.
A method for making for reliability test board, comprises the following steps:
A kind of test base is provided, on this test base, make at least two row's test plated-through-holes, every row tests plated-through-hole and includes the first plated-through-hole and the second plated-through-hole, make the first plated-through-hole and the second plated-through-hole interval one by one mutually, and it is relative with the second plated-through-hole in adjacent another row's test plated-through-hole to make every row test the first plated-through-hole in plated-through-hole;
On test base, make anodal test lead and negative pole test lead, described the first plated-through-hole is connected with anodal test lead by circuit respectively, and the second plated-through-hole is connected with negative pole test lead by circuit respectively, obtain reliability test board.
A kind of performance test methods of resistance to CAF of printed circuit board, comprises the following steps:
A kind of test base is provided, on this test base, make at least two row's test plated-through-holes, every row tests plated-through-hole and includes the first plated-through-hole and the second plated-through-hole, make the first plated-through-hole and the second plated-through-hole interval one by one mutually, and it is relative with the second plated-through-hole in adjacent another row's test plated-through-hole to make every row test the first plated-through-hole in plated-through-hole;
On test base, make anodal test lead and negative pole test lead, described the first plated-through-hole is connected with anodal test lead by circuit respectively, and the second plated-through-hole is connected with negative pole test lead by circuit respectively, obtain reliability test board;
Resistance on measurement reliability test board between anodal test lead and negative pole test lead, and judge between test plated-through-hole whether have the short-circuit failure situation being caused by CAF according to this resistance.
Further, when measuring resistance between anodal test lead and negative pole test lead and be less than or equal to 10M Ω, can determine between test plated-through-hole and have the short-circuit failure situation being caused by CAF.
Further, further comprising the steps of: the circuit between anodal test lead and the first plated-through-hole is all cut off, detect one by one the resistance between described the first plated-through-hole and negative pole test lead, according to this resistance, determine again the position in CAF inefficacy hole: when measuring resistance between negative pole test lead and the first plated-through-hole and be less than or equal to 10M Ω, can determine that this first plated-through-hole is CAF inefficacy hole; Then measure respectively again the resistance between two second plated-through-holes on this first plated-through-hole and its side, and according to the position of the actual generation of definite CAF of these two resistances: when the resistance between the second plated-through-hole of measuring the first plated-through-hole and its side is less than or equal to 10M Ω, can determine that CAF occurs between this first plated-through-hole and this second plated-through-hole.
Further, further comprising the steps of: the circuit between negative pole test lead and the second plated-through-hole is all cut off, detect one by one the resistance between the second plated-through-hole and anodal test lead, and according to this resistance, determine the position in CAF inefficacy hole: when measuring resistance between anodal test lead and the second plated-through-hole and be less than or equal to 10M Ω, can determine that this second plated-through-hole is CAF inefficacy hole; Then measure respectively again the resistance between two first plated-through-holes on this second plated-through-hole and its side, and according to the position of the actual generation of definite CAF of these two resistances: when the resistance between the first plated-through-hole of measuring the second plated-through-hole and its side is less than or equal to 10M Ω, can determine that CAF occurs between this second plated-through-hole and this first plated-through-hole.
Described CAF is the abbreviation of ConductiveAnodic Filament, and Chinese is conductive anodic filament.
Described " anodal plated-through-hole ", " negative pole plated-through-hole ", " the first plated-through-hole " and " the second plated-through-hole " are exactly plated-through-hole in essence, only according to their position, use different titles to be distinguished them here.
Beneficial effect of the present invention is:
1, the reliability test board of making by described method for making and the performance test methods of resistance to CAF carrying out based on this reliability test board machine not only can be evaluated the CAF ability between different test plated-through-holes of arranging, can also evaluate with the CAF ability between row's test plated-through-hole, improve the comprehensive and accuracy that CAF evaluates.
2, by the described performance test methods of resistance to CAF, can find easily two test plated-through-holes that CAF lost efficacy occur, thereby can find the particular location that CAF occurs, be convenient to follow-up the carry out analysis of causes and improvement.
Accompanying drawing explanation
Fig. 1 is the Facad structure schematic diagram of the reliability test board described in the embodiment of the present invention.
Fig. 2 is the reverse side structural representation of the reliability test board described in the embodiment of the present invention.
Fig. 3 is the schematic diagram of measuring resistance between anodal plated-through-hole and negative pole plated-through-hole described in the embodiment of the present invention.
Fig. 4 is the schematic diagram of measuring resistance between negative pole plated-through-hole and the first plated-through-hole described in the embodiment of the present invention.
Fig. 5 is traditional reliable test board or the structural representation of its resolution chart.
Description of reference numerals:
10, reliability test board, 11, the first plated-through-hole, 12, the second plated-through-hole, 121, test plated-through-hole, 13, anodal plated-through-hole, 14, negative pole plated-through-hole, 15, test module district, 16, test base, 20, resistance meter, 30, multimeter.
Embodiment
Below embodiments of the invention are elaborated:
As shown in Figure 1 to Figure 2, a kind of reliability test board 10, comprise test base 16, on test base 16, be provided with anodal test lead, negative pole test lead and at least two row's test plated-through-holes 121, every row tests plated-through-hole 121 and includes the first plated-through-hole 11 and the second plated-through-hole 12, the first plated-through-hole 11 and the second plated-through-hole 12 are all spaced one by one, it is relative with the second plated-through-hole 12 in adjacent another row's test plated-through-hole 121 that every row tests the first plated-through-hole 11 in plated-through-hole 121, described the first plated-through-hole 11 is connected with anodal test lead by circuit respectively, described the second plated-through-hole 12 is connected with negative pole test lead by circuit respectively.
Wherein, described anodal test lead is anodal plated-through-hole 13, and negative pole test lead is made into negative pole plated-through-hole 14.By this setting, can be conveniently on the front of reliability test board 10 connection between anodal plated-through-hole 13 and the first plated-through-hole 11 and on the reverse side of reliability test board 10 connection between negative pole plated-through-hole 14 and the second plated-through-hole 12.Described reliability test board 10 has pro and con, circuit between described anodal plated-through-hole 13 and the first plated-through-hole 11 is arranged on the front of reliability test board 10, and the circuit between described negative pole plated-through-hole 14 and the second plated-through-hole 12 is arranged on the reverse side of reliability test board 10.Described anodal plated-through-hole 13, negative pole plated-through-hole 14 and test plated-through-hole 121 are all arranged in a test module district 15, and anodal plated-through-hole 13 and negative pole plated-through-hole 14 be all away from described test plated-through-hole 121, and described test plated-through-hole 121 is made as two rows.Multiple described test module districts 15 can be set on described reliability test board 10, and in each test module district 15 interior negative pole plated-through-hole 14 and the described test plated-through-hole 121 of two rows all arranging described in anodal plated-through-hole described in one 13.
The present embodiment also provides a kind of method for making of reliability test board 10, comprises the following steps:
A kind of test base 16 is provided, on this test base 16, make at least two row's test plated-through-holes 121, every row tests plated-through-hole 121 and includes the first plated-through-hole 11 and the second plated-through-hole 12, make the first plated-through-hole 11 and the second plated-through-hole 12 interval one by one mutually, and it is relative with the second plated-through-hole 12 in adjacent another row's test plated-through-hole 121 to make every row test the first plated-through-hole 11 in plated-through-hole 121;
On test base 16, make anodal test lead and negative pole test lead, described the first plated-through-hole 11 is connected with anodal test lead by circuit respectively, and the second plated-through-hole 12 is connected with negative pole test lead by circuit respectively, obtain reliability test board 10.
Certainly, in the actual technological process of production, the resolution chart that first design is corresponding with Fig. 1 and Fig. 2, then resolution chart is transferred on test base 16, then according to conventional printed circuit board production procedure, carry out technology controlling and process and can produce reliability test board 10.
As shown in Figure 3 and Figure 4, the present embodiment also provides a kind of performance test methods of resistance to CAF of printed circuit board, comprises the following steps:
A kind of test base 16 is provided, on this test base 16, make at least two row's test plated-through-holes 121, every row tests plated-through-hole 121 and includes the first plated-through-hole 11 and the second plated-through-hole 12, make the first plated-through-hole 11 and the second plated-through-hole 12 interval one by one mutually, and it is relative with the second plated-through-hole 12 in adjacent another row's test plated-through-hole 121 to make every row test the first plated-through-hole 11 in plated-through-hole 121;
On test base 16, make anodal plated-through-hole 13 and negative pole plated-through-hole 14, described the first plated-through-hole 11 is connected with anodal plated-through-hole 13 by circuit respectively, and the second plated-through-hole 12 is connected with negative pole plated-through-hole 14 by circuit respectively, obtain reliability test board 10;
Measure the resistance between anodal plated-through-hole 13 and negative pole plated-through-hole 14 on reliability test board 10 with resistance meter 20, and judge between test plated-through-hole 121 whether have the short-circuit failure situation being caused by CAF according to this resistance.
Further, when measuring resistance between anodal plated-through-hole 13 and negative pole plated-through-hole 14 and be less than or equal to 10M Ω, can determine between test plated-through-hole 121 and have the short-circuit failure situation being caused by CAF.
After the situation that exists CAF to lose efficacy between the test plated-through-hole 121 of having determined printed circuit board, can determine the position that CAF inefficacy occurs according to following two kinds of modes:
The first is that the circuit between anodal plated-through-hole 13 and the first plated-through-hole 11 is all cut off, but do not cut off the circuit between negative pole plated-through-hole 14 and the second plated-through-hole 12, detect one by one the resistance between described the first plated-through-hole 11 and negative pole plated-through-hole 14 with multimeter 30, according to this resistance, determine again the position in CAF inefficacy hole: when measuring resistance between negative pole plated-through-hole 14 and the first plated-through-hole 11 and be less than or equal to 10M Ω, can determine that this first plated-through-hole 11 is CAF inefficacy hole; When measuring resistance between negative pole plated-through-hole 14 and the first plated-through-hole 11 and be more than or equal to 500M Ω, can determine that this first plated-through-hole 11 is not CAF inefficacy hole.And then can determine that on these the first plated-through-hole 11 sides, must have second plated-through-hole 12 is also CAF inefficacy hole, then as long as measure respectively the resistance between the first plated-through-hole 11 and two second plated-through-holes 12 on its side that CAF inefficacy occurs with multimeter 30, according to two measured different resistances, just can judge that the physical location that CAF occurs is between two test plated-through-holes 121 with row or between two test plated-through-holes 121 of arranging in difference.As shown in Figure 4, when measuring A hole while being CAF inefficacy hole, can determine that B hole and C hole must have one for CAF inefficacy hole, now as long as measure the resistance of measuring respectively between A hole and B hole, A hole and C hole with multimeter 30, according to these two different resistances, can determine that CAF occurs between A hole and B hole, still occur between A hole and C hole: if when recording resistance between A hole and B hole and being less than or equal to 10M Ω, can determine that CAF occurs between A hole and B hole, CAF occurs between different rows' hole; If when recording resistance between A hole and C hole and being less than or equal to 10M Ω, can determine that CAF occurs between A hole and C hole, CAF occurs between same round.
The second is that the circuit between negative pole test lead and the second plated-through-hole 12 is all cut off, but do not cut off the circuit between anodal test lead and the first plated-through-hole 11, detect one by one the resistance between the second plated-through-hole 12 and anodal test lead, and according to this resistance, determine the position in CAF inefficacy hole: when measuring resistance between anodal test lead and the second plated-through-hole 12 and be less than or equal to 10M Ω, can determine that this second plated-through-hole 12 is CAF inefficacy hole; When measuring resistance between anodal test lead and the second plated-through-hole 12 and be greater than 500M Ω, can determine that this second plated-through-hole 12 is not CAF inefficacy hole.And then can determine that on these the second plated-through-hole 12 sides, must have first plated-through-hole 11 is also CAF inefficacy hole, then as long as measure respectively the resistance between the second plated-through-hole 12 and two first plated-through-holes 11 on its side that CAF inefficacy occurs with multimeter 30, according to two measured different resistances, just can judge that the physical location that CAF occurs is between two test plated-through-holes 121 with row or between two test plated-through-holes 121 of arranging in difference.
Described CAF is the abbreviation of ConductiveAnodic Filament, and Chinese is conductive anodic filament.
Described " anodal plated-through-hole ", " negative pole plated-through-hole ", " the first plated-through-hole " and " the second plated-through-hole " are exactly plated-through-hole in essence, only according to their position, use different titles to be distinguished them here.
The present embodiment has the following advantages or principle:
1, when utilizing reliability test board 10 to carry out the reliability testing of resistance to CAF, as long as the positive pole of resistance meter 20 is connected to described anodal plated-through-hole 13, the negative pole of resistance meter 20 connects described negative pole plated-through-hole 14, can judge between test plated-through-hole 121 whether have the short-circuit failure situation being caused by CAF according to the resistance showing described in resistance meter 20.
2, described anodal test lead is anodal plated-through-hole 13, and described negative pole test lead is negative pole plated-through-hole 14.By this setting, can the front of convenient and reliable property test board 10 on the connection between negative pole plated-through-hole 14 and the second plated-through-hole 12 on the reverse side of connection between anodal plated-through-hole 13 and the first plated-through-hole 11 and reliability test board 10.
3, the circuit between described anodal plated-through-hole 13 and the first plated-through-hole 11 is arranged on the front of reliability test board 10, and the circuit between described negative pole plated-through-hole 14 and the second plated-through-hole 12 is arranged on the reverse side of reliability test board 10.Thereby, can avoid circuit between anodal plated-through-hole 13 and the first plated-through-hole 11 with the circuit phase mutual interference between negative pole plated-through-hole 14 and the second plated-through-hole 12.
4, described anodal plated-through-hole 13, negative pole plated-through-hole 14 and test plated-through-hole 121 are all arranged in a test module district 15, and anodal plated-through-hole 13 and negative pole plated-through-hole 14 are all away from described test plated-through-hole 121.Thereby, can avoid, between anodal plated-through-hole 13 and negative pole plated-through-hole 14 and test plated-through-hole 121, the short-circuit failure situation that CAF causes also occurs, thereby can avoid the mistake in test.
5, described reliability test board 10 is provided with multiple described test module districts 15, thereby, by testing, can evaluate more all-sidedly and accurately the resistance to CAF performance of printed circuit board in different test module districts 15.
6, the reliability test board 10 of making by described method for making and the performance test methods of resistance to CAF carrying out based on these reliability test board 10 machines not only can be evaluated the CAF ability between different test plated-through-holes 121 of arranging, can also evaluate with the CAF ability between row's test plated-through-hole 121, improve the comprehensive and accuracy that CAF evaluates.
7, by the described performance test methods of resistance to CAF, can find easily two test plated-through-holes 121 that CAF lost efficacy occur, thereby can find the particular location that CAF occurs, be convenient to follow-up the carry out analysis of causes and improvement.
The above embodiment has only expressed the specific embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (10)
1. a reliability test board, it is characterized in that, comprise test base, on test base, be provided with anodal test lead, negative pole test lead and at least two row's test plated-through-holes, every row tests plated-through-hole and includes the first plated-through-hole and the second plated-through-hole, the first plated-through-hole and the second plated-through-hole are all spaced one by one, it is relative with the second plated-through-hole in adjacent another row's test plated-through-hole that every row tests the first plated-through-hole in plated-through-hole, described the first plated-through-hole is connected with anodal test lead by circuit respectively, and described the second plated-through-hole is connected with negative pole test lead by circuit respectively.
2. reliability test board according to claim 1, is characterized in that, described anodal test lead is anodal plated-through-hole, and described negative pole test lead is negative pole plated-through-hole.
3. reliability test board according to claim 2, it is characterized in that, described reliability test board has pro and con, circuit between described anodal plated-through-hole and the first plated-through-hole is arranged on the front of reliability test board, and the circuit between described negative pole plated-through-hole and the second plated-through-hole is arranged on the reverse side of reliability test board.
4. reliability test board according to claim 1, is characterized in that, described anodal test lead, negative pole test lead and test plated-through-hole are all arranged in a test module district, and anodal test lead and negative pole test lead are all away from described test plated-through-hole.
5. reliability test board according to claim 4, it is characterized in that, described reliability test board is provided with multiple described test module districts, and in each test module district, is provided with negative pole test lead and the described test plated-through-hole of two rows described in anodal test lead described in one, one.
6. a method for making for reliability test board, is characterized in that, comprises the following steps:
A kind of test base is provided, on this test base, make at least two row's test plated-through-holes, every row tests plated-through-hole and includes the first plated-through-hole and the second plated-through-hole, make the first plated-through-hole and the second plated-through-hole interval one by one mutually, and it is relative with the second plated-through-hole in adjacent another row's test plated-through-hole to make every row test the first plated-through-hole in plated-through-hole;
On test base, make anodal test lead and negative pole test lead, described the first plated-through-hole is connected with anodal test lead by circuit respectively, and the second plated-through-hole is connected with negative pole test lead by circuit respectively, obtain reliability test board.
7. the performance test methods of resistance to CAF of a printed circuit board, is characterized in that, comprises the following steps:
A kind of test base is provided, on this test base, make at least two row's test plated-through-holes, every row tests plated-through-hole and includes the first plated-through-hole and the second plated-through-hole, make the first plated-through-hole and the second plated-through-hole interval one by one mutually, and it is relative with the second plated-through-hole in adjacent another row's test plated-through-hole to make every row test the first plated-through-hole in plated-through-hole;
On test base, make anodal test lead and negative pole test lead, described the first plated-through-hole is connected with anodal test lead by circuit respectively, and the second plated-through-hole is connected with negative pole test lead by circuit respectively, obtain reliability test board;
Resistance on measurement reliability test board between anodal test lead and negative pole test lead, and judge between test plated-through-hole whether have the short-circuit failure situation being caused by CAF according to this resistance.
8. the performance test methods of resistance to CAF of printed circuit board according to claim 7, it is characterized in that, when measuring resistance between anodal test lead and negative pole test lead and be less than or equal to 10M Ω, can determine between test plated-through-hole and have the short-circuit failure situation being caused by CAF.
9. according to the performance test methods of resistance to CAF of the printed circuit board described in claim 7 or 8, it is characterized in that, further comprising the steps of: the circuit between anodal test lead and the first plated-through-hole is all cut off, detect one by one the resistance between described the first plated-through-hole and negative pole test lead, according to this resistance, determine again the position in CAF inefficacy hole: when measuring resistance between negative pole test lead and the first plated-through-hole and be less than or equal to 10M Ω, can determine that this first plated-through-hole is CAF inefficacy hole; Then measure respectively again the resistance between two second plated-through-holes on this first plated-through-hole and its side, and according to the position of the actual generation of definite CAF of these two resistances: when the resistance between the second plated-through-hole of measuring the first plated-through-hole and its side is less than or equal to 10M Ω, can determine that CAF occurs between this first plated-through-hole and this second plated-through-hole.
10. according to the performance test methods of resistance to CAF of the printed circuit board described in claims 7 or 8, it is characterized in that, further comprising the steps of: the circuit between negative pole test lead and the second plated-through-hole is all cut off, detect one by one the resistance between the second plated-through-hole and anodal test lead, and according to this resistance, determine the position in CAF inefficacy hole: when measuring resistance between anodal test lead and the second plated-through-hole and be less than or equal to 10M Ω, can determine that this second plated-through-hole is CAF inefficacy hole; Then measure respectively again the resistance between two first plated-through-holes on this second plated-through-hole and its side, and according to the position of the actual generation of definite CAF of these two resistances: when the resistance between the first plated-through-hole of measuring the second plated-through-hole and its side is less than or equal to 10M Ω, can determine that CAF occurs between this second plated-through-hole and this first plated-through-hole.
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| CN105467172A (en) * | 2016-01-01 | 2016-04-06 | 广州兴森快捷电路科技有限公司 | CAF testing plate with switching circuit |
| CN106324349A (en) * | 2016-08-25 | 2017-01-11 | 浪潮电子信息产业股份有限公司 | Electrical resistance test method and system |
| CN107064776A (en) * | 2017-04-20 | 2017-08-18 | 北京品驰医疗设备有限公司 | A kind of system and method that reliability test is carried out to medical device circuitry plate |
| CN108107342A (en) * | 2017-11-07 | 2018-06-01 | 广州兴森快捷电路科技有限公司 | Test module wiring method and test module |
| CN111257731A (en) * | 2020-02-17 | 2020-06-09 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | CAF test module, test fixture and test assembly |
| CN112305403A (en) * | 2020-09-14 | 2021-02-02 | 南方科技大学 | Test board for testing CAF resistance and test method |
| CN113660773A (en) * | 2021-07-14 | 2021-11-16 | 深圳市景旺电子股份有限公司 | Reliability test board and manufacturing method thereof |
| CN114167259A (en) * | 2021-12-07 | 2022-03-11 | 华东光电集成器件研究所 | Method for programming and testing on-off of through holes of multi-piece substrate |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201247235Y (en) * | 2008-08-08 | 2009-05-27 | 东莞生益电子有限公司 | PCB synthesis reliability testing board |
| US20090233461A1 (en) * | 2008-03-17 | 2009-09-17 | Tourne Joseph A A M | Method of Manufacturing a Printed Circuit Board |
| CN103118485A (en) * | 2013-01-25 | 2013-05-22 | 广东生益科技股份有限公司 | Printed circuit board for testing electric-resistant chemical migration performances |
| CN103323505A (en) * | 2013-06-13 | 2013-09-25 | 广东生益科技股份有限公司 | Evaluation method for goodness and badness of conductive anodic filament resistance performance |
| CN103336019A (en) * | 2013-05-28 | 2013-10-02 | 麦可罗泰克（常州）产品服务有限公司 | Method for analyzing circuit board conductive anodic filament failure |
| CN103369857A (en) * | 2012-03-30 | 2013-10-23 | 北大方正集团有限公司 | A method for processing a testing board before a conductive anodic filament experiment |
| CN103364674A (en) * | 2012-03-30 | 2013-10-23 | 北大方正集团有限公司 | Method for judging glass fiber bundle anode leakage and failure |
-
2013
- 2013-12-26 CN CN201310739721.XA patent/CN103743974A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090233461A1 (en) * | 2008-03-17 | 2009-09-17 | Tourne Joseph A A M | Method of Manufacturing a Printed Circuit Board |
| CN201247235Y (en) * | 2008-08-08 | 2009-05-27 | 东莞生益电子有限公司 | PCB synthesis reliability testing board |
| CN103369857A (en) * | 2012-03-30 | 2013-10-23 | 北大方正集团有限公司 | A method for processing a testing board before a conductive anodic filament experiment |
| CN103364674A (en) * | 2012-03-30 | 2013-10-23 | 北大方正集团有限公司 | Method for judging glass fiber bundle anode leakage and failure |
| CN103118485A (en) * | 2013-01-25 | 2013-05-22 | 广东生益科技股份有限公司 | Printed circuit board for testing electric-resistant chemical migration performances |
| CN103336019A (en) * | 2013-05-28 | 2013-10-02 | 麦可罗泰克（常州）产品服务有限公司 | Method for analyzing circuit board conductive anodic filament failure |
| CN103323505A (en) * | 2013-06-13 | 2013-09-25 | 广东生益科技股份有限公司 | Evaluation method for goodness and badness of conductive anodic filament resistance performance |
Non-Patent Citations (2)
| Title |
|---|
| R.S.KHANDPUR: "《印制电路板-设计、制造、装配与测试》", 29 February 2008, article "印制电路板的分类" * |
| 张盘新等: "CAF失效分析方法探讨", 《印制电路信息》, no. 1, 31 December 2009 (2009-12-31) * |
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| CN108107342B (en) * | 2017-11-07 | 2020-07-28 | 广州兴森快捷电路科技有限公司 | Test module |
| CN111257731A (en) * | 2020-02-17 | 2020-06-09 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | CAF test module, test fixture and test assembly |
| CN112305403A (en) * | 2020-09-14 | 2021-02-02 | 南方科技大学 | Test board for testing CAF resistance and test method |
| CN113660773A (en) * | 2021-07-14 | 2021-11-16 | 深圳市景旺电子股份有限公司 | Reliability test board and manufacturing method thereof |
| CN113660773B (en) * | 2021-07-14 | 2022-10-21 | 深圳市景旺电子股份有限公司 | Reliability test board and manufacturing method thereof |
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