CN114167259A - Method for programming and testing on-off of through holes of multi-piece substrate - Google Patents
Method for programming and testing on-off of through holes of multi-piece substrate Download PDFInfo
- Publication number
- CN114167259A CN114167259A CN202111479869.5A CN202111479869A CN114167259A CN 114167259 A CN114167259 A CN 114167259A CN 202111479869 A CN202111479869 A CN 202111479869A CN 114167259 A CN114167259 A CN 114167259A
- Authority
- CN
- China
- Prior art keywords
- piece
- substrate
- hole
- testing
- programming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 59
- 238000012360 testing method Methods 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000000523 sample Substances 0.000 claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 230000009191 jumping Effects 0.000 claims abstract description 4
- 238000012544 monitoring process Methods 0.000 claims abstract description 4
- 238000009966 trimming Methods 0.000 claims description 9
- 238000005259 measurement Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract description 10
- 238000004458 analytical method Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- HCWZEPKLWVAEOV-UHFFFAOYSA-N 2,2',5,5'-tetrachlorobiphenyl Chemical compound ClC1=CC=C(Cl)C(C=2C(=CC=C(Cl)C=2)Cl)=C1 HCWZEPKLWVAEOV-UHFFFAOYSA-N 0.000 description 1
- 102100031629 COP9 signalosome complex subunit 1 Human genes 0.000 description 1
- 101000940485 Homo sapiens COP9 signalosome complex subunit 1 Proteins 0.000 description 1
- 229910021124 PdAg Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention relates to a method for programming and testing the on-off of a through hole of a multi-piece substrate, which comprises the following steps: s1, manufacturing a probe card special for the matched measuring holes according to the corresponding conduction relation among the metallized holes in the layout of the substrate to be measured; s2, according to the corresponding conduction relation among the metallized holes in the layout of the substrate to be tested, programming is carried out according to the resistance value test principle among the metallized holes; and S3, after the substrate to be tested and the probe card are installed, running a program in the laser resistance adjusting system for testing, monitoring the output resistance value in real time by using the program, automatically judging the test result and reminding, and jumping the worktable piece by piece to finish the automatic test piece by piece. The invention can realize the on-off detection of the through hole of the substrate at one time with low cost and short time, and is convenient for the analysis of the failure reason of the product and the subsequent process improvement by displaying the related data content of the on-off parameter.
Description
Technical Field
The invention relates to the technical field of thick film integrated circuit manufacturing, in particular to a method for programming and testing the on-off of a through hole of a multi-piece substrate.
Background
With the trend of miniaturization development of thick film integrated circuits, the technology of realizing high-density wiring on the front side and the back side by adopting metallized holes is gradually increased. Generally, the filling of the conductive paste into the through hole of the substrate is achieved, however, insufficient filling occurs in the filling process of the through hole, or shrinkage and fracture occur in the multiple sintering process of the conductive paste, which can cause the condition that the metalized hole is not conducted or is not conducted well, and if the on-off test is not performed on the metalized hole of the thick film integrated circuit, the defective substrate can cause serious quality loss in the subsequent assembly.
The original thick film integrated circuit metallized hole on-off test method comprises the following steps:
1. the universal meter is used for manual testing, the meter pen is manually connected in a point finding way, the detection method is low in speed and efficiency, and the method is only suitable for detection operation of small-batch products;
2. the simple fixture (or the LED lamp prompting combined) is used for clamping the test board for testing, so that the detection efficiency of the through hole of the substrate is relatively improved, but the through hole of the substrate cannot be accurately positioned, the accuracy of the inclined pressing of the probe card is low, the consistency of the conduction detection contact resistance of the back surface of the substrate is poor, and the insulating substrate with the back surface printed with the glass glaze cannot be tested;
3. the special flying probe tester is used for testing, the two probe roots are used for quickly detecting, the alignment precision is high, the detection efficiency is high, the positioning is accurate, the related data content of the on-off parameters cannot be displayed, the product failure reason analysis and the subsequent process improvement are not facilitated, and the use cost of the special flying probe tester is high.
When the number of the metallized holes is large, simple tool tests cannot meet the requirement of batch processing, so that a low-cost, quick and efficient detection method is urgently needed, relevant data content of on-off parameters can be displayed, and product failure reason analysis and subsequent process improvement are facilitated.
Disclosure of Invention
In order to solve the problems, the invention provides a method for programming and testing the on-off of a through hole of a multi-piece substrate. The method can realize on-off detection of the through hole of the substrate at one time with low cost and short time, and facilitates analysis of product failure reasons and subsequent process improvement by displaying related data content of on-off parameters.
The invention adopts the following technical scheme:
a method for programming and testing the on-off of a through hole of a multi-piece substrate is characterized by comprising the following steps:
s1, manufacturing a probe card special for the matched measuring holes according to the corresponding conduction relation among the metallized holes in the layout of the substrate to be measured;
s2, according to the corresponding conduction relation among the metallized holes in the layout of the substrate to be tested, programming is carried out according to the resistance value test principle among the metallized holes;
and S3, after the substrate to be tested and the probe card are installed, running a program in the laser resistance adjusting system for testing, monitoring the output resistance value in real time by using the program, automatically judging the test result and reminding, and jumping the worktable piece by piece to finish the automatic test piece by piece.
Further, the program includes the following constitutions:
defining the names of resistors, setting resistance values and corresponding probe numbers among the associated metallized holes, and noting the names of the metallized holes, wherein the resistance values are determined by the requirements of the layout, and the probe numbers correspond to the metallized hole numbers in the layout one by one;
1) and (3) resistance value prediction: using PT sentences to predict the upper limit and the lower limit of the resistance value precision according to the layout requirement;
2) turning off the laser with the resistance cutting/trimming function;
3) and (3) resistance final measurement: using FT statement to compare and judge the actual resistance value and the set resistance value, and outputting the result; setting a jump step pitch of the connected sheets and completing automatic test piece by piece;
4) stopping: at the end of the test, the program is terminated using a STOP statement.
Further, in step S3, the result of the failed test is prompted by a light alarm.
Furthermore, the probe card is manufactured by adopting a special probe card for laser fine tuning.
The invention has the following beneficial effects:
the method has the advantages of simple operation, reliable measurement, low use cost and high detection efficiency, can finish the on-off detection of all the metallized holes at one time in a short time, visually displays the positions of the unqualified holes and the on-off parameter data content, and is convenient for failure analysis and process processing improvement.
Drawings
FIG. 1 is a first schematic diagram of a thick film substrate metallization hole filling paste;
FIG. 2 is a schematic diagram of a thick film substrate metalized via filling paste II;
FIG. 3 is a schematic view of a thick film substrate;
FIG. 4 is a schematic view of a probe card and thick film substrate mounted in cooperation;
fig. 5 is a partial sectional view a-a of fig. 4.
Detailed Description
In order to make the present invention more clear, the method for programming and testing the via-on/off of a multi-chip substrate according to the present invention is further described with reference to the accompanying drawings, and the embodiments described herein are only for explaining the present invention and are not intended to limit the present invention.
In the embodiment, a program is written in the existing laser resistance trimming system, and the program is run by matching with a probe card matched with a substrate to be tested, so that the aim of automatically testing the output result of the substrate is fulfilled.
The substrate to be tested is a thick film integrated circuit film-forming metallized hole substrate, and the manufacturing method comprises the following steps:
the cleaned substrate is put into a high-temperature furnace to be sintered once at 850 ℃, DUPONT-6388 hole filling slurry is filled, and the surface of the substrate is basically flush without pits, burrs and protrusions. And the DUPONT-6177 PdAg paste is used for manufacturing a PAD (PAD insulated wire) and a back conductive band on the surface of the hole, and the DUPONT-5715 or 5771 Au conductive paste is used for manufacturing a front conductive band to realize front-back interconnection.
As shown in fig. 1: when the size a2 around the through hole a1 is larger than one time of the diameter d of the through hole (phi d =8 mils), the through hole a is unqualified;
as shown in fig. 2: when the thickness of the paste a2 in the through hole a1 is smaller than that of the substrate a3, and the difference between the thicknesses is larger than 20% of the thickness of the substrate, the chip is not qualified.
Manufacturing a thick film resistor: and carrying out screen printing according to the selected resistance paste, and then sintering to obtain the thick film substrate.
A method for programming and testing the on-off of a through hole of a multi-piece substrate comprises the following steps:
and S1, manufacturing a matched probe card special for the hole measurement according to the corresponding conduction relation between the metallized holes in the layout of the substrate to be measured, wherein the probe card is manufactured by adopting a probe card special for laser fine tuning.
S2, according to the corresponding conduction relation among the metallized holes in the layout of the substrate to be tested, programming is carried out according to the resistance value test principle among the metallized holes, and the programming comprises the following components:
defining the name of a resistor, setting a resistance value and the number of a corresponding probe among the related metallized holes, and noting the name of the metallized hole, wherein the resistance value is determined by a layout, and the numbers of the probes correspond to the numbers of the metallized holes in the layout one by one;
1) and (3) resistance value prediction: using PT sentences to predict the upper limit and the lower limit of the resistance value precision according to the layout requirement;
2) turning off the laser with the resistance cutting/trimming function in the laser resistance trimming system, and stopping the resistance trimming function of the laser resistance trimming system;
3) and (3) resistance final measurement: using FT statement to compare and judge the actual resistance value and the set resistance value, and outputting the result; setting a jump step pitch of the connected sheets and completing automatic test piece by piece;
4) stopping: at the end of the test, the program is terminated using a STOP statement.
The thick film substrate hole measuring program definition format is as follows (23 # -33# in the substrate to be measured is connected with a fixed resistor with the resistance value of 1K +/-1%):
setting the name of the resistor and setting the name of the remark hole corresponding to the resistance value of the probe number
DEF R1 2 HP42 LP35 ；（1，21）
DEF R2 1K HP29 LP3 ；（23，33）
……
IF SW2=1，GPS1
PS1
nop;---------------------------------
PT R1 -80% ＋5%
PT R2 -1% ＋1%
……
nop;---------------------------------
STOP
i) When only conduction band connection is formed between the metallized holes, the programmed conduction conditions are as follows: 2 omega-4 omega, -80% + 5%, such as: r12-80% + 5%.
ii) when a fixed resistor is connected in series between the metallized holes, programming to set the conduction condition as follows: fixed resistance value and tolerance. Such as: R21K-1% + 1%.
S3, (a) when there is a bare interconnecting conductive tape on the back of the thick film substrate, for example, as shown in fig. 3, on the back of the thick film substrate, the 1# and 21# metallized holes are conducted through the conductive tape, and a 1K resistor is connected in series between the 23# and 33# metallized holes through the conductive tape, in order to prevent the contact short circuit phenomenon during testing, a blue film insulation treatment is adopted on the working platform contacted with the back of the thick film substrate.
(b) And adjusting and installing a probe card in a laser resistance-adjusting system, adjusting and installing the thick film substrate on a workbench, and accurately aligning a probe area of the thick film substrate to be adjusted with a needle point of the probe card by operating the laser resistance-adjusting system so as to ensure that each probe is reliably contacted with the corresponding probe area. After the operation of this step is completed, the probe card and the thick film substrate are schematically matched as shown in fig. 4 and 5: the probe card 5 comprises a PCB 52 with square holes and probes 51 connected with the PCB, the tips of the probes 51 are located corresponding to the positions of the metallized holes in the thick film substrate 6 (for example, the tip of the probe with HP42 corresponds to the probe area with metallized hole number 1), the number of the probes 51 is the same as the number of the metallized holes, and only some of the probes are shown in the figure. On the front surface of the thick film substrate 6, the tip of the probe 51 is accurately and reliably contacted with the probe area of the corresponding metallized hole. On the back of the thick film substrate 6, the blue film 7 is in insulating contact with the worktable through the pad. In addition, this step is a conventional operation method of the laser trimming system, and the probe card is well known to those skilled in the art.
(c) And (3) automatically testing the resistance of the thick film substrate: and running a program in the laser resistance trimming system for testing, and predicting the resistance between the metallized holes corresponding to the thick film substrate according to the program requirement. And (3) judging: and (4) judging the light alarm of the working table lamp, monitoring the output resistance value in real time by using a program, and continuing to execute the following steps when the test is qualified. The defects of the conventional on-off test of the thick film integrated circuit metallized hole are overcome.
Such as: the hole measuring program determines that the hole is conducted within the range of 2 omega-80% + 5% by defining the line resistance of R1 (the hole No. 1 and the hole No. 21 form an interconnection through a conduction band), and otherwise, the hole is regarded as a failure.
And the automatic test is finished piece by piece through the continuous jumping of the workbench.
The invention sets the jump step pitch of the connected pieces and automatically completes the multi-connected piece automatic test of the on-off of the thick film integrated circuit metallized hole substrate with various wiring forms, meets the requirement of accurate positioning of the hole testing of the miniaturized substrate, and has high hole testing efficiency and low cost. And the position and the on-off test data of the unqualified hole are visually displayed, so that failure analysis and process improvement are facilitated.
Claims (4)
1. A method for programming and testing the on-off of a through hole of a multi-piece substrate is characterized by comprising the following steps:
s1, manufacturing a probe card special for the matched measuring holes according to the corresponding conduction relation among the metallized holes in the layout of the substrate to be measured;
s2, according to the corresponding conduction relation among the metallized holes in the layout of the substrate to be tested, programming is carried out according to the resistance value test principle among the metallized holes;
and S3, after the substrate to be tested and the probe card are installed, running a program in the laser resistance adjusting system for testing, monitoring the output resistance value in real time by using the program, automatically judging the test result and reminding, and jumping the worktable piece by piece to finish the automatic test piece by piece.
2. The method for programming and testing the through hole on/off of the multi-piece substrate according to claim 1, wherein the program comprises the following components:
defining the names of resistors, setting resistance values and corresponding probe numbers among the associated metallized holes, and noting the names of the metallized holes, wherein the resistance values are determined by the requirements of the layout, and the probe numbers correspond to the metallized hole numbers in the layout one by one;
1) and (3) resistance value prediction: using PT sentences to predict the upper limit and the lower limit of the resistance value precision according to the layout requirement;
2) turning off the laser with the resistance cutting/trimming function;
3) and (3) resistance final measurement: using FT statement to compare and judge the actual resistance value and the set resistance value, and outputting the result; setting a jump step pitch of the connected sheets and completing automatic test piece by piece;
4) stopping: at the end of the test, the program is terminated using a STOP statement.
3. The method for programming and testing the through hole on-off of the multi-piece substrate according to claim 1, wherein: in step S3, the result of the unqualified test is prompted by a light alarm.
4. The method for programming and testing the through hole on-off of the multi-piece substrate according to claim 1, wherein: the probe card is manufactured by adopting a special probe card for laser fine tuning.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111479869.5A CN114167259A (en) | 2021-12-07 | 2021-12-07 | Method for programming and testing on-off of through holes of multi-piece substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111479869.5A CN114167259A (en) | 2021-12-07 | 2021-12-07 | Method for programming and testing on-off of through holes of multi-piece substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114167259A true CN114167259A (en) | 2022-03-11 |
Family
ID=80483612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111479869.5A Pending CN114167259A (en) | 2021-12-07 | 2021-12-07 | Method for programming and testing on-off of through holes of multi-piece substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114167259A (en) |
Citations (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4565966A (en) * | 1983-03-07 | 1986-01-21 | Kollmorgen Technologies Corporation | Method and apparatus for testing of electrical interconnection networks |
| JPH08178992A (en) * | 1994-12-21 | 1996-07-12 | Sony Corp | Method and apparatus for inspection circuit board |
| WO2000042442A1 (en) * | 1999-01-13 | 2000-07-20 | Imax Trading Corporation | Apparatus for testing the pattern of pcb and method thereof |
| JP2002026100A (en) * | 2000-07-04 | 2002-01-25 | Hitachi Ltd | Semiconductor substrate and inspection method of electric circuit fabricating process and method for fabricating electric circuit |
| TW555988B (en) * | 2001-07-31 | 2003-10-01 | Xilinx Inc | Testing vias and contacts in integrated circuit fabrication |
| CN2685891Y (en) * | 2004-04-02 | 2005-03-16 | 达方电子股份有限公司 | Connecting sheet tester |
| JP2005191215A (en) * | 2003-12-25 | 2005-07-14 | Hitachi Chem Co Ltd | Manufacturing method and apparatus of wiring board mounted with resistance element |
| TW200528722A (en) * | 2004-02-24 | 2005-09-01 | Mjc Probe Inc | Mutifunction probe card |
| TW200624830A (en) * | 2005-01-03 | 2006-07-16 | Insight Electronic Group Inc | A PCB testing device |
| WO2006077823A1 (en) * | 2005-01-18 | 2006-07-27 | Nidec-Read Corporation | Substrate inspecting apparatus and substrate inspecting method |
| CN1996028A (en) * | 2005-12-28 | 2007-07-11 | 日本电产丽德株式会社 | Substrate checking device and method |
| US20070229097A1 (en) * | 2006-02-20 | 2007-10-04 | Fujitsu Limited | Probe, probe card, and testing device |
| JP2008292332A (en) * | 2007-05-25 | 2008-12-04 | Yokogawa Electric Corp | Test system |
| CN101363884A (en) * | 2007-08-10 | 2009-02-11 | 富葵精密组件(深圳)有限公司 | Method for testing circuit board |
| JP2011096836A (en) * | 2009-10-29 | 2011-05-12 | Ishioka:Kk | Method and device for inspecting printed board |
| CN102269781A (en) * | 2011-05-10 | 2011-12-07 | 贵州航天电器股份有限公司 | Auxiliary device for testing on-resistance of throwing line connector |
| CN102914723A (en) * | 2012-10-29 | 2013-02-06 | 江苏物联网研究发展中心 | Test structure and test method for electrically interconnected arrays |
| CN103097901A (en) * | 2011-09-08 | 2013-05-08 | 日本梅克特隆株式会社 | Continuity inspection apparatus and continuity inspection method |
| CN103344791A (en) * | 2013-06-26 | 2013-10-09 | 中国科学院深圳先进技术研究院 | Test substrate and probe card manufactured by means of test substrate |
| CN103367323A (en) * | 2012-03-31 | 2013-10-23 | 中芯国际集成电路制造(上海)有限公司 | Detection layout structure and detection method |
| CN103743974A (en) * | 2013-12-26 | 2014-04-23 | 广州兴森快捷电路科技有限公司 | Reliability test board and CAF resistance performance test method of printed circuit board |
| CN104124235A (en) * | 2014-07-30 | 2014-10-29 | 上海华力微电子有限公司 | Testing structure and testing method implemented by same |
| US20140347089A1 (en) * | 2013-05-21 | 2014-11-27 | Esilicon Corporation | Testing of Thru-Silicon Vias |
| CN104701206A (en) * | 2015-03-02 | 2015-06-10 | 上海华岭集成电路技术股份有限公司 | Three-dimensional packaging chip silicon through hole testing device |
| CN104793098A (en) * | 2015-04-28 | 2015-07-22 | 华东光电集成器件研究所 | Substrate via-hole on-off test device |
| CN105067991A (en) * | 2015-08-10 | 2015-11-18 | 宁波华远电子科技有限公司 | Circuit board detection device and detection method |
| CN105548855A (en) * | 2015-12-23 | 2016-05-04 | 陕西华经微电子股份有限公司 | Testing device of thick film ceramic support used for LED light source packaging and testing method thereof |
| CN105845597A (en) * | 2016-05-13 | 2016-08-10 | 中国航天科技集团公司第九研究院第七七研究所 | Through-silicon-via stacked chip test method |
| CN106249049A (en) * | 2016-08-25 | 2016-12-21 | 华东光电集成器件研究所 | A kind of device improving extreme value thick-film resistor laser trimming precision |
| CN205898964U (en) * | 2016-07-01 | 2017-01-18 | 深圳中富电路有限公司 | Conducting hole pick -up plate and semi -manufactured goods printed circuit board |
| CN108225963A (en) * | 2017-12-30 | 2018-06-29 | 广州兴森快捷电路科技有限公司 | PCB design method based on the test of BGA welding spot reliabilities |
| CN109255167A (en) * | 2018-08-27 | 2019-01-22 | 珠海市微半导体有限公司 | The method of adjustment of ESD resistance between a kind of IC domain weld pad |
| CN110554301A (en) * | 2019-09-06 | 2019-12-10 | 依利安达(广州)电子有限公司 | Method for detecting machine resistance of electric measuring machine and printed circuit board electric measuring machine |
| CN110850268A (en) * | 2018-08-21 | 2020-02-28 | 华邦电子股份有限公司 | Test system and method thereof |
| CN110869780A (en) * | 2017-05-15 | 2020-03-06 | 东京毅力科创株式会社 | Device inspection method |
| CN111751700A (en) * | 2019-03-26 | 2020-10-09 | 新唐科技股份有限公司 | Apparatus for automatically testing electronic components and method thereof |
| CN112731101A (en) * | 2020-12-18 | 2021-04-30 | 江苏物联网研究发展中心 | Integrated circuit connectivity testing system and manufacturing method thereof |
| CN113506755A (en) * | 2021-06-28 | 2021-10-15 | 上海华虹宏力半导体制造有限公司 | Checking graph structure for automatically detecting test channel and test method |
| CN113567828A (en) * | 2021-06-15 | 2021-10-29 | 中国电子科技集团公司第十三研究所 | Nondestructive failure detection method for multilayer low-temperature co-fired ceramic substrate |
| CN113640639A (en) * | 2021-08-26 | 2021-11-12 | 苏州晶睿半导体科技有限公司 | Testing device and testing method for semiconductor device |
-
2021
- 2021-12-07 CN CN202111479869.5A patent/CN114167259A/en active Pending
Patent Citations (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4565966A (en) * | 1983-03-07 | 1986-01-21 | Kollmorgen Technologies Corporation | Method and apparatus for testing of electrical interconnection networks |
| JPH08178992A (en) * | 1994-12-21 | 1996-07-12 | Sony Corp | Method and apparatus for inspection circuit board |
| WO2000042442A1 (en) * | 1999-01-13 | 2000-07-20 | Imax Trading Corporation | Apparatus for testing the pattern of pcb and method thereof |
| JP2002026100A (en) * | 2000-07-04 | 2002-01-25 | Hitachi Ltd | Semiconductor substrate and inspection method of electric circuit fabricating process and method for fabricating electric circuit |
| TW555988B (en) * | 2001-07-31 | 2003-10-01 | Xilinx Inc | Testing vias and contacts in integrated circuit fabrication |
| JP2005191215A (en) * | 2003-12-25 | 2005-07-14 | Hitachi Chem Co Ltd | Manufacturing method and apparatus of wiring board mounted with resistance element |
| TW200528722A (en) * | 2004-02-24 | 2005-09-01 | Mjc Probe Inc | Mutifunction probe card |
| CN2685891Y (en) * | 2004-04-02 | 2005-03-16 | 达方电子股份有限公司 | Connecting sheet tester |
| TW200624830A (en) * | 2005-01-03 | 2006-07-16 | Insight Electronic Group Inc | A PCB testing device |
| WO2006077823A1 (en) * | 2005-01-18 | 2006-07-27 | Nidec-Read Corporation | Substrate inspecting apparatus and substrate inspecting method |
| CN1996028A (en) * | 2005-12-28 | 2007-07-11 | 日本电产丽德株式会社 | Substrate checking device and method |
| US20070229097A1 (en) * | 2006-02-20 | 2007-10-04 | Fujitsu Limited | Probe, probe card, and testing device |
| JP2008292332A (en) * | 2007-05-25 | 2008-12-04 | Yokogawa Electric Corp | Test system |
| CN101363884A (en) * | 2007-08-10 | 2009-02-11 | 富葵精密组件(深圳)有限公司 | Method for testing circuit board |
| JP2011096836A (en) * | 2009-10-29 | 2011-05-12 | Ishioka:Kk | Method and device for inspecting printed board |
| CN102269781A (en) * | 2011-05-10 | 2011-12-07 | 贵州航天电器股份有限公司 | Auxiliary device for testing on-resistance of throwing line connector |
| CN103097901A (en) * | 2011-09-08 | 2013-05-08 | 日本梅克特隆株式会社 | Continuity inspection apparatus and continuity inspection method |
| CN103367323A (en) * | 2012-03-31 | 2013-10-23 | 中芯国际集成电路制造(上海)有限公司 | Detection layout structure and detection method |
| CN102914723A (en) * | 2012-10-29 | 2013-02-06 | 江苏物联网研究发展中心 | Test structure and test method for electrically interconnected arrays |
| US20140347089A1 (en) * | 2013-05-21 | 2014-11-27 | Esilicon Corporation | Testing of Thru-Silicon Vias |
| CN103344791A (en) * | 2013-06-26 | 2013-10-09 | 中国科学院深圳先进技术研究院 | Test substrate and probe card manufactured by means of test substrate |
| CN103743974A (en) * | 2013-12-26 | 2014-04-23 | 广州兴森快捷电路科技有限公司 | Reliability test board and CAF resistance performance test method of printed circuit board |
| CN104124235A (en) * | 2014-07-30 | 2014-10-29 | 上海华力微电子有限公司 | Testing structure and testing method implemented by same |
| CN104701206A (en) * | 2015-03-02 | 2015-06-10 | 上海华岭集成电路技术股份有限公司 | Three-dimensional packaging chip silicon through hole testing device |
| CN104793098A (en) * | 2015-04-28 | 2015-07-22 | 华东光电集成器件研究所 | Substrate via-hole on-off test device |
| CN105067991A (en) * | 2015-08-10 | 2015-11-18 | 宁波华远电子科技有限公司 | Circuit board detection device and detection method |
| CN105548855A (en) * | 2015-12-23 | 2016-05-04 | 陕西华经微电子股份有限公司 | Testing device of thick film ceramic support used for LED light source packaging and testing method thereof |
| CN105845597A (en) * | 2016-05-13 | 2016-08-10 | 中国航天科技集团公司第九研究院第七七研究所 | Through-silicon-via stacked chip test method |
| CN205898964U (en) * | 2016-07-01 | 2017-01-18 | 深圳中富电路有限公司 | Conducting hole pick -up plate and semi -manufactured goods printed circuit board |
| CN106249049A (en) * | 2016-08-25 | 2016-12-21 | 华东光电集成器件研究所 | A kind of device improving extreme value thick-film resistor laser trimming precision |
| CN110869780A (en) * | 2017-05-15 | 2020-03-06 | 东京毅力科创株式会社 | Device inspection method |
| CN108225963A (en) * | 2017-12-30 | 2018-06-29 | 广州兴森快捷电路科技有限公司 | PCB design method based on the test of BGA welding spot reliabilities |
| CN110850268A (en) * | 2018-08-21 | 2020-02-28 | 华邦电子股份有限公司 | Test system and method thereof |
| CN109255167A (en) * | 2018-08-27 | 2019-01-22 | 珠海市微半导体有限公司 | The method of adjustment of ESD resistance between a kind of IC domain weld pad |
| CN111751700A (en) * | 2019-03-26 | 2020-10-09 | 新唐科技股份有限公司 | Apparatus for automatically testing electronic components and method thereof |
| CN110554301A (en) * | 2019-09-06 | 2019-12-10 | 依利安达(广州)电子有限公司 | Method for detecting machine resistance of electric measuring machine and printed circuit board electric measuring machine |
| CN112731101A (en) * | 2020-12-18 | 2021-04-30 | 江苏物联网研究发展中心 | Integrated circuit connectivity testing system and manufacturing method thereof |
| CN113567828A (en) * | 2021-06-15 | 2021-10-29 | 中国电子科技集团公司第十三研究所 | Nondestructive failure detection method for multilayer low-temperature co-fired ceramic substrate |
| CN113506755A (en) * | 2021-06-28 | 2021-10-15 | 上海华虹宏力半导体制造有限公司 | Checking graph structure for automatically detecting test channel and test method |
| CN113640639A (en) * | 2021-08-26 | 2021-11-12 | 苏州晶睿半导体科技有限公司 | Testing device and testing method for semiconductor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20060044321A (en) | Electrical inspection method and apparatus for printed wiring board for the electronic component mounting, and computer-readable recording medium | |
| CN106526452A (en) | System and method for achieving PCBA automatic detection by use of probe | |
| CN110554273A (en) | Detection method of PCBA short circuit point | |
| CN114167259A (en) | Method for programming and testing on-off of through holes of multi-piece substrate | |
| CN206832921U (en) | Module samples wire harness on off test frock | |
| CN105430869B (en) | The high hole position precision processing method of IC test boards and production method | |
| CN110375696B (en) | Method for rapidly calculating thickness of copper in PCB (printed circuit board) via hole | |
| CN112730987A (en) | Method for quickly measuring impedance of PCB (printed circuit board) | |
| CN111948519A (en) | Method for controlling high-temperature test needle mark of wafer | |
| CN112505102A (en) | Method for measuring resistance of package substrate and package substrate thereof | |
| KR100795691B1 (en) | Probe sheet for testing flexible printed circuit board and method using which | |
| JPH11233574A (en) | Z-axis height setting device and method by wafer test system | |
| JPH07244117A (en) | Inspecting apparatus for semiconductor element | |
| KR101215366B1 (en) | Method for manufacturing contactor, method for manufacturing semiconductor inspection apparatus, contactor and semiconductor inspection apparatus including the same | |
| CN111366811B (en) | Integrated automatic inspection device and method for electronic components | |
| JP2005049314A (en) | Probing test method and probe condition detector | |
| TWI604204B (en) | Testing device for testing electrical property of probe head and testing method thereof | |
| JP3804429B2 (en) | Method for manufacturing power supply device | |
| JPH06174774A (en) | Electric inspection method for tab film carrier tape | |
| JPH03218042A (en) | High-frequency fixing card | |
| JP5495303B2 (en) | Semiconductor module and semiconductor module inspection method | |
| KR20050068118A (en) | Method for testing the needle of probe card | |
| KR200221077Y1 (en) | Conductive polymer probe card | |
| JP2004233171A (en) | Assembly failure analytical device of semiconductor device and its failure analytical method | |
| CN113804095A (en) | Circuit board convenient for testing copper thickness and copper thickness testing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |