CN105548855A - Testing device of thick film ceramic support used for LED light source packaging and testing method thereof - Google Patents
Testing device of thick film ceramic support used for LED light source packaging and testing method thereof Download PDFInfo
- Publication number
- CN105548855A CN105548855A CN201510979563.4A CN201510979563A CN105548855A CN 105548855 A CN105548855 A CN 105548855A CN 201510979563 A CN201510979563 A CN 201510979563A CN 105548855 A CN105548855 A CN 105548855A
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- controller
- array probe
- monitor
- probe card
- ipc
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2632—Circuits therefor for testing diodes
- G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Led Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a testing device of an LED thick film ceramic support and a testing method thereof. The device comprises an IPC master control portion, a power supply system, a mechanical control panel, a monitor, an AD acquisition plate, an array probe card and a controller. A probe of the array probe card is stably contacted with positive and negative metal electrodes of a corresponding support to be tested respectively and tests a resistance value between the positive and negative metal electrodes. And the resistance value is transmitted into the controller and an AD acquisition card via a port of the array probe card and then is transmitted into the IPC master control portion via the controller and the AD acquisition card. The IPC master control portion compares a testing value with a set index range, processes and then transmits the value to the controller. The monitor controlled by the controller is used to display whether the tested resistance value is in the set index range, and a concrete position of an unqualified unit is identified so that the unqualified unit can be rejected effectively during LED light source packaging. In the invention, operation is simple; data collection, monitoring and ascending are convenient; because of array testing, detection efficiency can be effectively increased and production efficiency during an LED light source packaging process is increased too.
Description
Technical field
The invention belongs to thick film ceramic support technical field of measurement and test, more specifically, relate to a kind of method of testing and device of LED thick film ceramic support.
Background technology
Research finds, makes the LED light source of substrate, have energy-saving and environmental protection, life-span long three advantages, can realize an energy consumption for consumption incandescent lamp 10% in theory, than fluorescent lamp energy saving 50% of LED ceramics bracket; It adopts solid encapsulation, and the life-span is 10 times of fluorescent light, 100 times of incandescent lamp; Meanwhile, LED light source without the radiation such as ultraviolet light, infrared light, and can be avoided fluorescent tube to break overflowing the secondary pollution of mercury.
There is due to ceramic substrate the advantages such as high heat radiation, low thermal resistance, life-span length, proof voltage, along with the improvement of production technology, equipment, product price is accelerated to rationalize, and then expands the application of LED industry, as the pilot lamp of household appliances, automobile lamp, street lamp and outdoor large billboard etc.Pottery the succeeding in developing of series stent, can make the market application in LED industry future broader.
After the manufacture of LED thick film ceramic support completes, in order to ensure the reliability that it is communicated with, avoid encapsulating service life reduction in rear light source use procedure, need to carry out strict detection to judge that whether it is qualified to the conducting of its metal electrode and the conducting of metalized blind vias.Because LED thick film ceramic support generally adopts array way to make, thus, its method of testing is different from conventional thick film products test, how to ensure the electrode conduction reliability in LED thick film ceramic rack making process, directly affect quality and the serviceable life of final LED light source product, therefore, the device and method for the test of LED thick film ceramic support has urgent actual demand.
Summary of the invention
The object of this invention is to provide a kind of proving installation and method of testing of LED thick film ceramic support, simple to operate, be convenient to Data Collection, monitor and review, array test effectively can improve detection efficiency, and improves the production efficiency of LED light source encapsulation process.
The technical scheme realizing the object of the invention is: a kind of proving installation of LED thick film ceramic support, comprises IPC overhead control part, power-supply system, Mechanical course panel, monitor, AD collection plate, array probe card and controller;
IPC overhead control part provides each several part synchronizing signal, the setting of primary data and monitor the duty of each several part in test process;
What microscope carrier was responsible for by Mechanical course panel mobile controls, the input through keyboard of alerting signal and Mechanical course panel;
Power-supply system provides primary power source for test macro each several part;
Monitor monitors the support of microscope carrier and shows test results;
AD collection plate Real-time Collection metrical information, controls test process according to test value;
Array probe cartoon is crossed probe and is connected with support to be measured, transmits detection resistance value, then by the line of array probe card, test value is transferred to array probe card port, then transfer on the Mechanical course panel of proving installation by array probe card port;
Controller controls monitor and shows test results.
A kind of method of testing of LED thick film ceramic support, probe is it is characterized in that to contact with the positive and negative metal electrode of corresponding support to be measured is stable respectively, switch on power, the resistance value tested out between positive and negative metal electrode is imported controller and AD capture card into via array probe card port, and then is imported IPC overhead control part into by controller and AD capture card; Test value and setting indication range contrast by the overhead control part of IPC, controller is imported into again after process, the monitor controlled by controller again shows the indication range whether mensuration resistance value is positioned at setting, and identifies the particular location of defective unit effectively to reject defective unit when LED light source encapsulates.
This LED thick film ceramic support proving installation provided by the invention and method of testing have feature that is simple to operate, that be convenient to Data Collection, monitor and review, and array test effectively can improve detection efficiency, and improves the production efficiency of LED light source encapsulation process.
Accompanying drawing explanation
Fig. 1 is LED array construction profile schematic diagram.
Fig. 2 is array probe card schematic diagram
Fig. 3 is proving installation of the present invention and carrier unit Electrode connection schematic diagram to be measured.
Embodiment
Below in conjunction with accompanying drawing, specific embodiment of the invention method is described further.
As shown in Figure 3, a kind of proving installation of LED thick film ceramic support, is characterized in that this proving installation comprises IPC overhead control part, power-supply system, Mechanical course panel, monitor part, AD collection plate, array probe card and controller;
IPC overhead control part, provides each several part synchronizing signal, the setting of primary data and monitor the duty of each several part in test process;
What support microscope carrier was responsible for by Mechanical course panel mobile controls, the input through keyboard of alerting signal and panel;
Power-supply system provides primary power source for test macro each several part, and each several part carries out secondary pressure, filtering as required, to reduce ripple interference, improves the stability of power supply precision, accuracy of detection and system;
Monitor is mainly used as to monitor the support of microscope carrier, is used for the support outward appearance of observation test unit, and shows test results;
AD collection plate is responsible for Real-time Collection metrical information, controls test process according to test value;
Array probe cartoon is crossed probe and is connected with the positive and negative metal electrode of corresponding support to be measured is stable, (detection resistance value comprises standard electric resistance to transmit detection resistance value, because measured value is bold and unconstrained Europe level, serial standard resistance is needed to increase the measuring stability of resistance), then by the line of array probe card, test value is transferred to probe port, then by probe port transmission on the Mechanical course panel of proving installation;
Controller controls monitor and shows mensuration resistance information data.
Method of testing is: probe contacts with the positive and negative metal electrode of corresponding support to be measured is stable respectively, test out the resistance information data between positive and negative metal electrode and import controller and AD capture card into via the port of array probe card, and then import IPC overhead control part into by controller and AD capture card; Test result and setting indication range carry out contrasting by IPC overhead control part, process after import controller into again, the monitor controlled by controller again shows the indication range whether mensuration resistance information data are positioned at setting, and identifies the particular location of defective unit effectively to reject defective unit when LED light source encapsulates.
Fig. 1 is HL-3535H type LED array construction profile schematic diagram, the unit arranged by 11 row 26 forms, the proving installation technical scheme provided according to Fig. 3,23 probes of the special array probe card of structure shown in Fig. 2 are carried out reliable contacts with the positive and negative metal electrode of each carrier unit arranged respectively by sequence number, switch on power, test out the resistance information data between positive and negative metal electrode and import controller and AD capture card into via the port of array probe card, and then import IPC overhead control part by controller and AD capture card into through RS485 bus and PLC bus.Test result and setting indication range (<1 Ω) are carried out contrasting by the overhead control part of IPC, process after import controller into again, the monitor controlled by controller again shows the indication range whether mensuration resistance information data are positioned at setting, and what identify Zu Zhi≤1 Ω unit is unacceptable product, effectively to reject defective unit during LED light source encapsulation.
Claims (2)
1. a proving installation for LED thick film ceramic support, is characterized in that this proving installation comprises IPC overhead control part, power-supply system, Mechanical course panel, monitor, AD collection plate, array probe card and controller;
IPC overhead control part provides each several part synchronizing signal, the setting of primary data and monitor the duty of each several part in test process;
What microscope carrier was responsible for by Mechanical course panel mobile controls, the input through keyboard of alerting signal and Mechanical course panel;
Power-supply system provides primary power source for test macro each several part;
Monitor monitors the support of microscope carrier and shows test results;
AD collection plate Real-time Collection metrical information, controls test process according to test value;
Array probe cartoon is crossed probe and is connected with support to be measured, transmits detection resistance value, then by the line of array probe card, test value is transferred to array probe card port, then transfer on the Mechanical course panel of proving installation by array probe card port;
Controller controls monitor and shows test results.
2. the proving installation of LED thick film ceramic support as claimed in claim 1, it is characterized in that method of testing is as follows: contacted with the positive and negative metal electrode of corresponding support to be measured is stable respectively by probe, switch on power, the resistance value tested out between positive and negative metal electrode is imported controller and AD capture card into via array probe card port, and then is imported IPC overhead control part into by controller and AD capture card; Test value and setting indication range contrast by the overhead control part of IPC, controller is imported into again after process, the monitor controlled by controller again shows the indication range whether mensuration resistance value is positioned at setting, and identifies the particular location of defective unit effectively to reject defective unit when LED light source encapsulates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510979563.4A CN105548855B (en) | 2015-12-23 | 2015-12-23 | A kind of test device and test method of LED thick film ceramics stent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510979563.4A CN105548855B (en) | 2015-12-23 | 2015-12-23 | A kind of test device and test method of LED thick film ceramics stent |
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| Publication Number | Publication Date |
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| CN105548855A true CN105548855A (en) | 2016-05-04 |
| CN105548855B CN105548855B (en) | 2018-05-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510979563.4A Active CN105548855B (en) | 2015-12-23 | 2015-12-23 | A kind of test device and test method of LED thick film ceramics stent |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114167259A (en) * | 2021-12-07 | 2022-03-11 | 华东光电集成器件研究所 | Method for programming and testing on-off of through holes of multi-piece substrate |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006275603A (en) * | 2005-03-28 | 2006-10-12 | Fuji Photo Film Co Ltd | Method for inspecting solid-state imaging element, and its device |
| CN101285869A (en) * | 2008-06-03 | 2008-10-15 | 张九六 | LED parameter test method |
| US20110133769A1 (en) * | 2009-12-09 | 2011-06-09 | Industrial Technology Research Institute | Inspection apparatus and method for led package interface |
| CN102326090A (en) * | 2009-02-20 | 2012-01-18 | Qmc株式会社 | LED chip testing device |
| CN102338850A (en) * | 2011-08-04 | 2012-02-01 | 东莞市福地电子材料有限公司 | Ceramic package type LED (light emitting diode) spot measurement device and method |
| CN103760482A (en) * | 2013-11-18 | 2014-04-30 | 深圳盛世天予科技发展有限公司 | Photoelectric testing apparatus for LED packaging |
-
2015
- 2015-12-23 CN CN201510979563.4A patent/CN105548855B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006275603A (en) * | 2005-03-28 | 2006-10-12 | Fuji Photo Film Co Ltd | Method for inspecting solid-state imaging element, and its device |
| CN101285869A (en) * | 2008-06-03 | 2008-10-15 | 张九六 | LED parameter test method |
| CN102326090A (en) * | 2009-02-20 | 2012-01-18 | Qmc株式会社 | LED chip testing device |
| US20110133769A1 (en) * | 2009-12-09 | 2011-06-09 | Industrial Technology Research Institute | Inspection apparatus and method for led package interface |
| CN102338850A (en) * | 2011-08-04 | 2012-02-01 | 东莞市福地电子材料有限公司 | Ceramic package type LED (light emitting diode) spot measurement device and method |
| CN103760482A (en) * | 2013-11-18 | 2014-04-30 | 深圳盛世天予科技发展有限公司 | Photoelectric testing apparatus for LED packaging |
Non-Patent Citations (2)
| Title |
|---|
| 蔡有海 等: "LED芯片封装缺陷检测方法研究", 《传感技术学报》 * |
| 马小宁 等: "LED芯片封装缺陷检测方法研究", 《企业技术开发》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114167259A (en) * | 2021-12-07 | 2022-03-11 | 华东光电集成器件研究所 | Method for programming and testing on-off of through holes of multi-piece substrate |
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| CN105548855B (en) | 2018-05-04 |
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