JP2006275603A - Method for inspecting solid-state imaging element, and its device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To illuminate a solid-state imaging element with light for inspection of desired intensity, without the calibration work, and thereby reducing the inspection cost. <P>SOLUTION: This inspection device is equipped with a light source device 10 for illuminating the solid-state imaging element 31, which is an inspecting object with a light 15 for inspection and a prober device 20 equipped with a probe card 22 for acquiring the output signal of the imaging element 31, by bringing a probe 22a into contact with a stage 21 for placing the imaging element 31 thereon and with the electrode pad of the imaging element 31. The imaging element 31 is inspected with a light sensor 25 provided in the prober device 20 for detecting the light 15 for illuminating the imaging element 31 and with a control means 14 provided for controlling the source device 10 according to a detection value of the sensor 25 to illuminate the imaging element 31 with the prescribed light 15. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an inspection method and apparatus for inspecting a solid-state image sensor such as a CCD type image or a CMOS image sensor, and more particularly to an inspection method and apparatus for a solid-state image sensor that can reduce the inspection cost.

  When inspecting a solid-state imaging device, for example, as described in Patent Documents 1 and 2 below, the solid-state imaging device is actually irradiated with light (test light) of a predetermined intensity, and the output of the solid-state imaging device obtained at that time Inspected by signal.

  FIG. 5 is a configuration diagram of a conventional inspection apparatus. This inspection device includes a light source device 100, a prober device 200, and a control device 300 for controlling them. The light source device 100 includes a light source 101 such as a halogen lamp, a light amount adjuster 102 that adjusts an emitted light amount of test light emitted from the light source 101 to the prober device 200, and an output light intensity of the light source 101 that is disposed in the vicinity of the light source 101. And an AGC control unit 104 that controls the power supply voltage of the light source 101 based on the detection signal of the optical sensor 103 and controls the detection value of the optical sensor 103 to be a predetermined value. The light amount adjuster 102 includes a first slit plate 102a and a second slit plate 102b, and adjusts the opening amount of the slit hole 102c formed between the two by moving both of them. Adjust the amount of emitted light.

  The prober apparatus 200 collects output signals of a solid-state image sensor by contacting a probe 201a with a table 201 on which a semiconductor wafer 301 on which a solid-state image sensor to be inspected is formed, and an electrode pad of the solid-state image sensor. And a disk-shaped probe card 202.

  The control device 300 controls the light source device 100 and the prober device 200, and the solid-state imaging device obtained from the probe card 202 when the solid-state imaging device is irradiated with the test light 105 from the light source device 100 through the center hole 202b of the probe card 202. The output signal is acquired and the quality of the solid-state image sensor is checked.

  Since the inspection device for a solid-state image sensor needs to inspect the solid-state image sensor by irradiating a test light with a predetermined intensity, the detection value of the optical sensor 103 even when the light source 101 deteriorates with time and the output light intensity decreases. The AGC control unit 104 controls the power supply voltage of the light source 101 such that the test light intensity is kept at a predetermined value.

Japanese Patent Laid-Open No. 2004-266250 JP 2002-261141 A

  However, in the conventional solid-state image sensor inspection device, since the installation position of the optical sensor is in the vicinity of the light source 101 and away from the solid-state image sensor to be inspected, the test light intensity at the position of the solid-state image sensor is obtained. In order to obtain the required strength, calibration takes a long time, and this calibration work must be performed every maintenance of the inspection apparatus, resulting in an increase in inspection cost.

  An object of the present invention is to provide a solid-state imaging device inspection method and apparatus capable of performing calibration work in a short time and reducing maintenance time.

  The inspection method of the present invention includes a light source device that irradiates a solid-state image sensor to be inspected with light for inspection, a stage on which the solid-state image sensor is mounted, and a probe needle in contact with an electrode pad of the solid-state image sensor. In the inspection method of an inspection apparatus provided with a blower device provided with a probe card which acquires an output signal of a solid-state image sensor, an optical sensor which detects the inspection light irradiated to the solid-state image sensor is provided in the blower device The light source device is controlled according to the detection value of the optical sensor, and the solid-state image sensor is inspected by irradiating the solid-state image sensor with a predetermined inspection light.

  The inspection method of the present invention is characterized in that the optical sensor is provided in or on the stage.

  The inspection method of the present invention is characterized in that the optical sensor is provided on the probe card.

  An inspection apparatus for a solid-state image sensor according to the present invention includes a light source device that irradiates a test solid-state image sensor with light for inspection, a stage on which the solid-state image sensor is mounted, and a probe needle on an electrode pad of the solid-state image sensor. In a solid-state image sensor inspection apparatus comprising a probe card including a probe card that obtains an output signal of the solid-state image sensor by contact with the light, the inspection light that is installed in the blower apparatus and irradiated on the solid-state image sensor And a control means for controlling the light source device in accordance with a detection value of the light sensor and irradiating the solid-state image sensor with predetermined inspection light.

  The solid-state imaging device inspection apparatus according to the present invention is characterized in that the optical sensor is installed in or on the stage.

  The inspection device for a solid-state imaging device according to the present invention is characterized in that the optical sensor is installed on the probe card.

  According to the present invention, since the light source of the test light is controlled by the detection value of the optical sensor installed in the vicinity of the solid-state imaging device to be inspected, test light having a desired intensity can be obtained without calibration, thereby reducing the inspection cost. Reduction can be achieved.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a configuration diagram of a solid-state imaging device inspection apparatus according to a first embodiment of the present invention.

  The inspection apparatus according to this embodiment includes a light source device 10, a prober device 20, and a control device 30 that controls them.

  The light source device 10 includes a light source 11 such as a halogen lamp, a light amount adjuster 12 that adjusts an emitted light amount of test light emitted from the light source 11 to the prober device 20, and an optical sensor 25 described later installed in the prober device 20. And a light source controller 14 that controls the power supply voltage of the light source 11 based on the detection signal of the light source 11 and controls the detection value of the optical sensor 25 to be a predetermined value.

  Similarly to FIG. 5, the light amount adjuster 12 is composed of a first slit plate 12a and a second slit plate 12b, and by moving both, the opening amount of the slit hole 12c formed between the two is adjusted. And adjust the amount of light emitted from the test light 15.

  The prober apparatus 20 collects output signals of the solid-state image sensor by bringing the probe needle 22a into contact with the table 21 on which the semiconductor wafer 31 on which the solid-state image sensor to be inspected is formed, and the electrode pad of the solid-state image sensor. A disk-shaped probe card 22 is provided, and an optical sensor 25 having a light receiving surface exposed on the upper surface of the table is provided immediately below the position where the solid-state imaging device is installed in the table 21.

  The control device 30 controls the light source device 10 and the prober device 20, and the solid-state imaging device obtained from the probe card 22 when the solid-state imaging device is irradiated with the test light 15 from the light source device 10 through the center hole 22 b of the probe card 22. The output signal is acquired and the quality of the solid-state image sensor is checked.

  When inspecting a solid-state imaging device using this inspection apparatus, the position of the stage 21 is adjusted so that the light receiving surface of the optical sensor 25 is positioned to receive the test light 15 without placing the semiconductor wafer 31 on the stage 21. I do. Then, the light source 11 is controlled, and the light source control unit 14 adjusts the power supply voltage of the light source 11 so that the light intensity necessary for the inspection is obtained, that is, the detection value of the optical sensor 25 becomes a predetermined value. The adjustment value is stored in a memory or the like. At this time, the light amount adjuster 12 is adjusted to obtain an adjustment value based on the necessary light amount.

  Next, the semiconductor wafer 31 on which the solid-state imaging device is formed is placed on the stage 21, and the stage 21 is moved so that the solid-state imaging device is positioned immediately below the test light 15. At this time, the light source control unit 14 controls the light source 11 using an adjustment value stored in a memory or the like. Thereby, the test light 15 having the light intensity necessary for the inspection is irradiated onto the solid-state image sensor, and the output signal of the solid-state image sensor is taken into the control device 30 to determine whether the solid-state image sensor is good or bad.

  In this embodiment, since the optical sensor is installed in the vicinity of the solid-state imaging device to be inspected, if the light source 11 is controlled by the control value (the adjustment value) of the light source 11 obtained from the detection value of the optical sensor, The test light 15 having the intensity required for inspection can be obtained without calibration.

  In the above example, the desired light intensity is obtained by adjusting the power supply voltage of the light source 11, but it goes without saying that the desired light intensity may be obtained by adjusting the current value. In addition to the analog signal, the control may be performed using a digital signal. Further, an example in which the light intensity of the test light is controlled to a desired value has been described. However, a color temperature sensor is used as the light sensor 25, and the color temperature filter provided in the light source is adjusted by the control unit 14 to thereby test light. The fifteen color temperature may be controlled to a desired color temperature.

  FIG. 2 is a configuration diagram of an inspection apparatus according to the second embodiment of the present invention. Since the inspection apparatus according to the present embodiment and the inspection apparatus according to the first embodiment of FIG. 1 only differ in the installation position of the optical sensor, the same components are denoted by the same reference numerals and description thereof is omitted. Only the different parts will be described.

  In the inspection apparatus of this embodiment, the optical sensor 26 is installed on the upper surface immediately adjacent to the center hole 22b of the probe card 22 in which the center hole 22b through which the test light 15 is transmitted. Since the probe card 22 has lines for transmitting and receiving various electrical signals to and from the control device 30, the optical sensor 26 can be connected to the light source control unit 14 using the signal lines of the probe card 22. .

  According to the present embodiment, the same effects as those of the first embodiment can be obtained, and the light sensor 26 always receives the test light 15 even during the inspection of the solid-state imaging device. The light source 11 can be feedback-controlled online using the detected value.

  FIG. 3 is a configuration diagram of an inspection apparatus according to the third embodiment of the present invention. Since the inspection apparatus according to the present embodiment and the inspection apparatus according to the first embodiment of FIG. 1 only differ in the installation position of the optical sensor, the same components are denoted by the same reference numerals and description thereof is omitted. Only the different parts will be described.

  In the inspection apparatus of this embodiment, the optical sensor 27 is fixedly installed at a predetermined position of the stage 21 on which the semiconductor wafer 31 is placed. The stage 21 is moved to the position shown in FIG. 3 when the semiconductor wafer 31 is replaced, and is moved to the position shown in FIG. 4 when inspecting the solid-state imaging device. Therefore, when the stage 21 is moved when the semiconductor wafer 31 is replaced, the optical sensor 27 is attached at a position that is directly below the test light 15.

  In the first embodiment, the optical sensor 25 is built in the stage 21, but in the present embodiment, the optical sensor 27 is installed on the stage 21, and the optical sensor 27 is easily installed.

  When inspecting a solid-state imaging device using this inspection apparatus, when the stage 21 is moved to replace the semiconductor wafer 31, the light receiving surface of the optical sensor 27 is positioned to receive the test light 15 (FIG. 3). . At this time, the light source 11 controls the light source 11 so that the light intensity necessary for the inspection is obtained, that is, the light source control unit 14 adjusts the power supply voltage of the light source 11 so that the detection value of the optical sensor 27 becomes a predetermined value. The adjustment value is stored in a memory or the like. At this time, the light amount adjuster 12 is adjusted to obtain an adjustment value based on the necessary light amount.

  Next, when the stage 21 is moved and the solid-state imaging device of the semiconductor wafer 31 comes to a position immediately below the test light 15 (FIG. 4), the light source control unit 14 uses the adjustment value stored in the memory or the like as the light source. 11 is controlled. Thereby, the test light 15 having the light intensity necessary for the inspection is irradiated onto the solid-state image sensor, and the output signal of the solid-state image sensor is taken into the control device 30 to determine whether the solid-state image sensor is good or bad.

  According to this embodiment, the same effects as those of the first and second embodiments can be obtained.

  According to the present invention, it is possible to easily obtain test light necessary for inspecting a solid-state imaging device, and therefore, the inspection cost can be reduced, which is useful as a solid-state imaging device inspection method and apparatus.

1 is a configuration diagram of an inspection apparatus for a solid-state imaging element according to a first embodiment of the present invention. It is a block diagram of the inspection apparatus of the solid-state image sensor which concerns on the 2nd Embodiment of this invention. It is a block diagram at the time of semiconductor wafer replacement | exchange of the inspection apparatus of the solid-state image sensor which concerns on the 3rd Embodiment of this invention. It is a block diagram at the time of the test | inspection of the test | inspection apparatus of the solid-state image sensor which concerns on the 3rd Embodiment of this invention. It is a block diagram of the inspection apparatus of the conventional solid-state image sensor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Light source device 11 Light source 12 Light quantity adjuster 14 Light source control part 15 Test light (light for test | inspection)
20 prober device 21 stage 22 probe card 22a probe needle 22b center hole 25, 26, 27 optical sensor 30 control device 31 semiconductor wafer on which solid-state imaging device is formed

Claims (6)

  A light source device for irradiating inspection light to a solid-state image sensor to be inspected, a stage on which the solid-state image sensor is mounted, and an electrode pad of the solid-state image sensor to contact an output signal of the solid-state image sensor In an inspection method of an inspection apparatus including a probe card including a probe card to be acquired, an optical sensor for detecting the inspection light irradiated on the solid-state imaging device is provided in the blower apparatus, and a detection value of the optical sensor In accordance with the method, the solid-state image sensor is inspected by controlling the light source device and irradiating the solid-state image sensor with predetermined inspection light.   The method for inspecting a solid-state imaging device according to claim 1, wherein the optical sensor is provided in or on the stage.   The method for inspecting a solid-state imaging device according to claim 1, wherein the optical sensor is provided on the probe card.   A light source device for irradiating inspection light to a solid-state image sensor to be inspected, a stage on which the solid-state image sensor is mounted, and an electrode pad of the solid-state image sensor to contact an output signal of the solid-state image sensor An inspection apparatus for a solid-state image pickup device including a blower device including a probe card to be acquired, an optical sensor that is installed in the blower device and detects the light for inspection irradiated on the solid-state image pickup device, and the optical sensor An inspection apparatus for a solid-state imaging device, comprising: a control unit that controls the light source device according to a detection value to irradiate the solid-state imaging device with predetermined inspection light.   The solid-state imaging device inspection apparatus according to claim 4, wherein the optical sensor is installed in or on the stage.   The solid-state imaging device inspection apparatus according to claim 4, wherein the optical sensor is installed on the probe card.

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