CN103760482A - Photoelectric testing apparatus for LED packaging - Google Patents
Photoelectric testing apparatus for LED packaging Download PDFInfo
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- CN103760482A CN103760482A CN201310578913.7A CN201310578913A CN103760482A CN 103760482 A CN103760482 A CN 103760482A CN 201310578913 A CN201310578913 A CN 201310578913A CN 103760482 A CN103760482 A CN 103760482A
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Abstract
The invention, which relates to the LED processing field, discloses a photoelectric testing apparatus for LED packaging. The photoelectric testing apparatus comprises an assembling-disassembling pedestal; two parallel inner material box clamps are vertically arranged at the assembling-disassembling pedestal; the outer sides of the two inner material box clamps vertically extend out of two material box clamp connecting tracks; the two material box clamp connecting tracks are fixed with two outer material box clamps; and the two inner material box clamps and the two outer material box clamps form a material box channel for material box downward arrangement. A material box rack is arranged in the material box channel by a sliding way and is arranged at a lead screw between the two inner material box clamps; and the lead screw is driven by a drive unit to enable the material box rack to slide up and down in the material box channel. The material blanking space between the lower ends of the outer material box clamps and the assembling-disassembling pedestal is larger than the height of the material box. According to the invention, the provided testing apparatus has the advantage of intelligent photoelectric testing on the LED chip.
Description
Technical field
The present invention relates to LED manufacture field, especially relate to a kind of opto-electronic testing apparatus that can carry out intelligently the LED encapsulation of photoelectricity test to LED chip.
Background technology
In recent years, along with the development of LED industry, the application aspect of material, chip, encapsulation and LED illumination has formed an industrial chain with high content of technology, market outlook are wide, and especially high-power, high-brightness LED module has become international semiconductor illumination and shown the hot spot for competition in field.
A new generation's great power LED module packaging technical and equipment are manufactured the research emphasis of Ge great LED leading enterprise and research institution in the world especially, and its barrier in the core technology of high-power, high-brightness LED industry development is shaped gradually.LED packaging technology is the accurate assembly technology of the one of chip attach is fixing and seal protection.LED sealed in unit comprises a set of production technologies such as cleaning, die bond, die bond baking, bonding wire, dot fluorescent powder, mounted lens, embedding lens, testing package; Its core is die bond and bonding (bonding wire) technique.Aspect the chip manufacturing of LED, tube core (module) encapsulation and product apply three, packaging technology and equipment are closer to market, more direct to the impetus of industry.Wherein, eutectic solder technology is one of core technology of crux the most in upside-down mounting high-power LED chip package technique of future generation, and the quality of eutectic welding technology can directly have influence on luminescence efficiency, life-span, heat dispersion and the end product quality of great power LED module.Packaged LED because quantity is larger, must will have a kind of instrument of automatically full test when testing.
Summary of the invention
The object of the invention is to provide a kind of opto-electronic testing apparatus that can carry out intelligently the LED encapsulation of photoelectricity test to LED chip.
The present invention realizes by following technical measures, a kind of opto-electronic testing apparatus of LED encapsulation, comprise testing base, described testing base is provided with test tracks, in described test tracks, slide and be provided with testing jig, the top, middle part of described test tracks is across being provided with an integrating sphere device for optical measurement, described testing jig top is provided with a test board parallel with test tracks, on described test board, be laid with multiple test syringe needles, described testing jig top is provided with at least three semi-girders of vertical checkout plate, the free end of each semi-girder is equipped with and is positioned at conplane barb, between the plane that the plane that described barb forms and test syringe needle form, can block and establish ceramics bracket, when described ceramics bracket is fastened between barb and test syringe needle, the pad of described test syringe needle and ceramics bracket bottom is corresponding and electric connection one by one, described testing jig is slidably to the thieff hatch of the bottom of integrating sphere device.
As a kind of optimal way, described semi-girder is to be arranged on four of four jiaos of test boards.
As a kind of optimal way, described testing jig is driven and is slided in test tracks by a testing of electric motors.
As a kind of optimal way, in described testing jig, be provided with testing host, described testing host is electrically connected each test syringe needle.
As a kind of optimal way, on described testing jig, be provided with the communication port that is electrically connected testing host.
Integrating sphere is the hollow ball with highly reflective inside surface, is used for to being placed in ball or ball is outer and near the scattered light of the sample at thief hatch place or a kind of high-level efficiency device that utilizing emitted light is collected.Collected light, after integrating sphere internal integral, is transformed into simulating signal by detector by light signal, after sampling, amplifying, through A/D, converts digital signal to, obtains afterwards as calculated light flux values.
The ceramics bracket that has welded chip is fastened between barb and test syringe needle, now test the pad corresponding and electric connection one by one of syringe needle and ceramics bracket bottom, when testing jig slides in the thieff hatch of bottom of integrating sphere device, chip on ceramics bracket is lighted successively by testing syringe needle, by calculating its light flux values, thereby form the photoelectricity test report of each chip.The present invention tests syringe needle and in integrating sphere device, lights successively the LED of required test, need not manually intervene by other, thereby can to LED chip, carry out photoelectricity test intelligently.
Accompanying drawing explanation
Fig. 1 is the structural representation of the embodiment of the present invention;
Fig. 2 is the C partial enlarged drawing of Fig. 1.
Embodiment
Below in conjunction with embodiment and contrast accompanying drawing the present invention is described in further detail.
A kind of opto-electronic testing apparatus of LED encapsulation, with reference to figure 1 and Fig. 2, comprise testing base 502, in described testing base 502, be provided with test tracks 504, in described test tracks 504, slide and be provided with testing jig 507, the top, middle part of described test tracks 504 is across being provided with an integrating sphere device 501 for optical measurement, described testing jig 507 tops are provided with a test board 510 parallel with test tracks 504, on described test board 510, be laid with multiple test syringe needles 511, described testing jig 507 tops are provided with four semi-girders 509 of vertical checkout plate, the free end of four semi-girders 509 is equipped with and is positioned at conplane barb, between the plane that the plane that described barb forms and test syringe needle 511 form, can block and establish ceramics bracket 300, when described ceramics bracket 300 is fastened between barb and test syringe needle 511, the pad of described test syringe needle 511 and ceramics bracket 300 bottoms is corresponding and be electrically connected one by one, described testing jig 507 is slidably to the thieff hatch of the bottom of integrating sphere device 501.The ceramics bracket 300 that has welded chip 100 is fastened between barb and test syringe needle 511, the pad of now testing syringe needle 511 and ceramics bracket 300 bottoms is corresponding and be electrically connected one by one, when testing jig 507 slides in the thieff hatch of bottom of integrating sphere device 501, chip 100 on ceramics bracket 300 is lighted successively by test syringe needle 511, by calculating its light flux values, thereby form the photoelectricity test report of each chip.
The opto-electronic testing apparatus of LED encapsulation of the present invention, with reference to figure 1 and Fig. 2, on the basis of previous technique scheme, specifically testing jig 507 is driven and is slided in test tracks 504 by a testing of electric motors 503.
The opto-electronic testing apparatus of LED encapsulation of the present invention with reference to figure 1 and Fig. 2, is specifically provided with testing host (not shown) in testing jig 507 on the basis of previous technique scheme, and described testing host is electrically connected each test syringe needle 511.For controlling the energising order of each test syringe needle.
The opto-electronic testing apparatus of LED encapsulation of the present invention with reference to figure 1 and Fig. 2, is specifically provided with the communication port 508 that is electrically connected testing host on testing jig on the basis of previous technique scheme.For being connected with extraneous control device.
More than that the opto-electronic testing apparatus of LED encapsulation of the present invention is set forth; be used for helping to understand the present invention; but embodiments of the present invention are not restricted to the described embodiments; anyly do not deviate from the change done under the principle of the invention, modification, substitute, combination, simplify; all should be equivalent substitute mode, within being included in protection scope of the present invention.
Claims (5)
1. the opto-electronic testing apparatus of a LED encapsulation, it is characterized in that: comprise testing base, described testing base is provided with test tracks, in described test tracks, slide and be provided with testing jig, the top, middle part of described test tracks is across being provided with an integrating sphere device for optical measurement, described testing jig top is provided with a test board parallel with test tracks, on described test board, be laid with multiple test syringe needles, described testing jig top is provided with at least three semi-girders of vertical checkout plate, the free end of each semi-girder is equipped with and is positioned at conplane barb, between the plane that the plane that described barb forms and test syringe needle form, can block and establish ceramics bracket, when described ceramics bracket is fastened between barb and test syringe needle, the pad of described test syringe needle and ceramics bracket bottom is corresponding and electric connection one by one, described testing jig is slidably to the thieff hatch of the bottom of integrating sphere device.
2. the opto-electronic testing apparatus of LED encapsulation according to claim 1, is characterized in that: described semi-girder is to be arranged on four of four jiaos of test boards.
3. the opto-electronic testing apparatus that LED encapsulates according to claim 1, is characterized in that: described testing jig is driven and slided in test tracks by a testing of electric motors.
4. the opto-electronic testing apparatus that LED encapsulates according to claim 1, is characterized in that: in described testing jig, be provided with testing host, described testing host is electrically connected each test syringe needle.
5. the opto-electronic testing apparatus that LED encapsulates according to claim 4, is characterized in that: on described testing jig, be provided with the communication port that is electrically connected testing host.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310578913.7A CN103760482A (en) | 2013-11-18 | 2013-11-18 | Photoelectric testing apparatus for LED packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310578913.7A CN103760482A (en) | 2013-11-18 | 2013-11-18 | Photoelectric testing apparatus for LED packaging |
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| Publication Number | Publication Date |
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| CN103760482A true CN103760482A (en) | 2014-04-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310578913.7A Pending CN103760482A (en) | 2013-11-18 | 2013-11-18 | Photoelectric testing apparatus for LED packaging |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104502070A (en) * | 2014-12-31 | 2015-04-08 | 华中科技大学 | Flip LED (light emitting diode) chip on-line detection light receiving testing module |
| CN105548855A (en) * | 2015-12-23 | 2016-05-04 | 陕西华经微电子股份有限公司 | Testing device of thick film ceramic support used for LED light source packaging and testing method thereof |
| CN105953915A (en) * | 2016-06-30 | 2016-09-21 | 维沃移动通信有限公司 | Calibration device and calibration method of photosensitive sensor |
| CN113639859A (en) * | 2021-08-25 | 2021-11-12 | 扬州和铵半导体有限公司 | Photoelectric testing device for LED packaging |
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| CN201218832Y (en) * | 2008-06-03 | 2009-04-08 | 张九六 | LED test device |
| CN201335765Y (en) * | 2008-12-31 | 2009-10-28 | 郑晓明 | Light splitting measuring device |
| KR20100137594A (en) * | 2009-06-11 | 2010-12-31 | 주식회사 루멘스 | Inspection apparatus of light emitting diode |
| CN102338850A (en) * | 2011-08-04 | 2012-02-01 | 东莞市福地电子材料有限公司 | Ceramic package type LED (light emitting diode) spot measurement device and method |
| CN203658528U (en) * | 2013-11-18 | 2014-06-18 | 深圳盛世天予科技发展有限公司 | Photoelectric testing apparatus for LED packaging |
-
2013
- 2013-11-18 CN CN201310578913.7A patent/CN103760482A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201218832Y (en) * | 2008-06-03 | 2009-04-08 | 张九六 | LED test device |
| CN201335765Y (en) * | 2008-12-31 | 2009-10-28 | 郑晓明 | Light splitting measuring device |
| KR20100137594A (en) * | 2009-06-11 | 2010-12-31 | 주식회사 루멘스 | Inspection apparatus of light emitting diode |
| CN102338850A (en) * | 2011-08-04 | 2012-02-01 | 东莞市福地电子材料有限公司 | Ceramic package type LED (light emitting diode) spot measurement device and method |
| CN203658528U (en) * | 2013-11-18 | 2014-06-18 | 深圳盛世天予科技发展有限公司 | Photoelectric testing apparatus for LED packaging |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104502070A (en) * | 2014-12-31 | 2015-04-08 | 华中科技大学 | Flip LED (light emitting diode) chip on-line detection light receiving testing module |
| CN104502070B (en) * | 2014-12-31 | 2017-09-05 | 华中科技大学 | A kind of flip LED chips on-line checking receives optical tests component |
| CN105548855A (en) * | 2015-12-23 | 2016-05-04 | 陕西华经微电子股份有限公司 | Testing device of thick film ceramic support used for LED light source packaging and testing method thereof |
| CN105548855B (en) * | 2015-12-23 | 2018-05-04 | 陕西华经微电子股份有限公司 | A kind of test device and test method of LED thick film ceramics stent |
| CN105953915A (en) * | 2016-06-30 | 2016-09-21 | 维沃移动通信有限公司 | Calibration device and calibration method of photosensitive sensor |
| CN113639859A (en) * | 2021-08-25 | 2021-11-12 | 扬州和铵半导体有限公司 | Photoelectric testing device for LED packaging |
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Application publication date: 20140430 |