CN113639859A - Photoelectric testing device for LED packaging - Google Patents
Photoelectric testing device for LED packaging Download PDFInfo
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- CN113639859A CN113639859A CN202110982395.XA CN202110982395A CN113639859A CN 113639859 A CN113639859 A CN 113639859A CN 202110982395 A CN202110982395 A CN 202110982395A CN 113639859 A CN113639859 A CN 113639859A
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- 238000012360 testing method Methods 0.000 title claims abstract description 121
- 238000004806 packaging method and process Methods 0.000 title abstract description 11
- 230000007246 mechanism Effects 0.000 claims abstract description 64
- 239000000463 material Substances 0.000 claims description 13
- 238000007599 discharging Methods 0.000 claims description 7
- 230000005693 optoelectronics Effects 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 10
- 238000007664 blowing Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000011056 performance test Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000012858 packaging process Methods 0.000 description 4
- 230000005622 photoelectricity Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 3
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/04—Optical or mechanical part supplementary adjustable parts
- G01J1/0403—Mechanical elements; Supports for optical elements; Scanning arrangements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
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Abstract
The invention provides a photoelectric testing device for LED packaging. The photoelectric testing device for LED packaging comprises a testing box, an equipment box, a pick-and-place mechanism and a testing mechanism, wherein the front surface of the testing box is rotatably connected with a shading door through a hinge, and one side of the shading door is fixedly connected with a handle; the picking and placing mechanism is positioned in the inner cavity of the test box and comprises a first cylinder, a first motor and a picking plate; the testing mechanism is located in the inner cavity of the testing box and comprises a third air cylinder, a fixing frame and an integrating sphere, the outer side of the third air cylinder is fixedly connected with the top of the inner cavity of the testing box, a piston rod of the third air cylinder is fixedly connected with the top of the fixing frame, and the integrating sphere is arranged inside the fixing frame. The photoelectric testing device for the LED package has the advantages of automatic testing and high testing accuracy.
Description
Technical Field
The invention relates to the technical field of LED testing, in particular to a photoelectric testing device for LED packaging.
Background
In recent years, with the development of the LED industry, an industrial chain with high technical content and wide market prospect is formed in the application aspect of materials, chips, packaging and LED lighting, especially, high-power and high-brightness LED modules have become a competitive hot spot in the international semiconductor lighting and display field, the new generation of high-power LED module packaging process and equipment manufacturing is more a research focus of various large LED faucet enterprises and research institutions in the world, the barrier of the new generation of high-power and high-brightness LED module packaging process and equipment manufacturing is gradually formed on the core technology of the development of the high-power and high-brightness LED industry, the LED packaging process is a precise assembly manufacturing technology for bonding, fixing and sealing and protecting chips, and the LED packaging equipment comprises a set of production processes of cleaning, die bonding and baking, bonding wires, fluorescent powder spot-mounting, lenses, potting lenses, testing and packaging and the like; the core of the method is a die bonding and bonding (wire bonding) process, and in the aspects of chip manufacturing of the LED, tube core (module) packaging and product application, the packaging process and equipment are closer to the market and have a more direct pushing effect on the industry.
At present, the photoelectricity test of LED encapsulation is as an important ring, need carry out the photoelectricity test to every LED chip, the qualified rear of test can dispatch from the factory, but some LED photoelectricity testing arrangement of current are when using, because comparatively extravagant manpower, can not carry out full automatic test, the efficiency is reduced, and when testing, do not carry out effectual shading and handle, there is certain error in the report that leads to the photoelectricity test because of external light source, influence the accuracy of test, can not satisfy user's user demand.
Therefore, it is necessary to provide a photoelectric testing apparatus for LED package to solve the above technical problems.
Disclosure of Invention
In order to solve the above technical problems, the present invention provides a photoelectric testing apparatus for LED package, which can perform automatic testing and has high testing accuracy.
The photoelectric testing device for LED packaging comprises a testing box, an equipment box, a pick-and-place mechanism and a testing mechanism, wherein the front surface of the testing box is rotatably connected with a shading door through a hinge, and one side of the shading door is fixedly connected with a handle; the picking and placing mechanism is positioned in the inner cavity of the test box and comprises a first cylinder, a first motor and a picking plate; the testing mechanism is located in the inner cavity of the testing box and comprises a third air cylinder, a fixing frame and an integrating sphere, the outer side of the third air cylinder is fixedly connected with the top of the inner cavity of the testing box, a piston rod of the third air cylinder is fixedly connected with the top of the fixing frame, and the integrating sphere is arranged inside the fixing frame.
In order to achieve the effect of conveniently placing the LED wafer to be tested, the inner cavity of the test box is provided with a placing frame, a feeding box is arranged inside the placing frame, and a trough is formed in the feeding box.
In order to achieve the effect of conveniently taking, placing and adsorbing the LED wafer, the taking and placing mechanism further comprises a CCD light source and a first air vent, a piston rod of the first air cylinder is fixedly connected with the bottom of the first motor, the output end of the first motor is fixedly connected with one side of the bottom of the taking plate, the CCD light source is arranged at the bottom of the taking plate, and the first air vent is formed in one side of the top of the taking plate.
In order to achieve the effect of conveniently driving the first moving plate to move, a moving mechanism is further arranged inside the test box and comprises the first moving plate and a second motor, a first lead screw is fixedly connected to the output end of the second motor, a first moving block is in threaded connection with the outer side of the first lead screw, and the top of the first moving block is fixedly connected with the bottom of the first moving plate.
In order to achieve the effect of conveniently driving the second moving plate to move and further driving the discharging table to move, the moving mechanism further comprises a third motor, the bottom of the third motor is fixedly connected with the top of the first moving plate, a second lead screw is fixedly connected to the output end of the third motor, a second moving block is connected to the outer side of the second lead screw in a threaded mode, and a second moving plate is fixedly connected to the top of the second moving block.
In order to achieve the effect of improving the stability of the first moving plate and the second moving plate, a first sliding block is fixedly connected to one side of the bottom of the first moving plate, a first sliding rod is slidably connected to the inside of the first sliding block, a second sliding block is fixedly connected to one side of the bottom of the second moving plate, and a second sliding rod is slidably connected to the inside of the second sliding block.
In order to reach the effect that conveniently drives the blowing platform and reciprocate, the top of second movable plate is provided with elevating system, elevating system includes fixed bucket, the inner chamber of fixed bucket is provided with the second cylinder, the piston rod fixedly connected with blowing platform of second cylinder, the second venthole has been seted up at the top of blowing platform.
In order to achieve the effect of improving the stability of the discharging table, the bottom of the discharging table is fixedly connected with a fixing rod, and a through hole matched with the fixing rod for use is formed in the fixing barrel.
In order to reach the effect of conveniently carrying out the point survey, the inner chamber of test box still is provided with the point survey mechanism, the point survey mechanism includes the fixed station, the equal fixedly connected with needle file in both sides at fixed station top, one side of needle file is provided with the point survey needle.
In order to reach the effect that the person of facilitating the use operates and conveniently carries out the heat dissipation to the equipment box, one side of equipment box is provided with emergency stop button, one side fixedly connected with operation panel of equipment box, the top of operation panel is provided with the operation panel, the top of operation panel is provided with operating button, the electrical output end electric connection of operation panel has the display screen, the display screen sets up in the top of test box, one side of equipment box is provided with the case lid, the thermovent has been seted up to the inside of case lid.
Compared with the related art, the photoelectric testing device for the LED package has the following beneficial effects:
1. the invention can conveniently place the LED wafer by arranging the placing frame and the feeding box, can conveniently take and place the wafer by arranging the taking and placing mechanism, can conveniently receive the wafer by arranging the moving mechanism 5 by the placing platform, can conveniently carry out automatic test, can conveniently carry out point test on the chips by arranging the lifting mechanism, can carry out photoelectric performance test on each chip by arranging the point test mechanism and the test mechanism through the integrating sphere and the point test needle, realizes automatic test, improves the working efficiency, can avoid the influence of other external light sources on the test by arranging the shading door and the handle at one side of the test box, solves the problems that the prior LED photoelectric test devices can not carry out full-automatic test due to more manpower waste when in use, reduces the efficiency, and does not carry out effective shading treatment during the test, the problem that the accuracy of the test is influenced because a certain error exists in the report of the photoelectric test due to an external light source;
2. the invention can conveniently take and place LED wafer by arranging the taking and placing mechanism, can scan the wafer in the feeding box by the CCD light source and then take the wafer by the taking plate, the first vent hole arranged on the taking plate needs to be connected with the outer vacuum tube for vacuumizing so as to adsorb the wafer, the position of the taking plate can be adjusted by the first motor, the height of the taking plate can be adjusted by the first cylinder, the fixing frame can be driven to move by the third cylinder when the test is needed by arranging the testing mechanism, the integrating sphere can be driven to move when the fixing frame moves, the integrating sphere can calculate the light flux value thereof, thereby forming a photoelectric test report of each chip, carrying out the photoelectric test, and by arranging the moving mechanism, the first lead screw can be driven to rotate by the second motor, the first lead screw can drive the first moving block and the first moving block to move by rotating the moving plate, the third motor can drive the second screw rod to rotate, the second screw rod can drive the second moving block and the second moving plate to move when rotating, so that the wafer sent by the material taking plate can be conveniently received, the material placing table can be driven to move up and down through the second air cylinder by arranging the lifting mechanism, each chip of the wafer can be contacted with the point measuring needle when the material placing table moves up and down, and further the photoelectric performance test of the wafer can be conveniently carried out, the needle seat can be conveniently fixed by arranging the fixing table, the point measuring needle is arranged in the needle seat and can be used for carrying out the photoelectric performance test, the point measuring needle is a beryllium copper needle, the test is convenient to carry out, the emergency stop button is arranged, the test can be timely suspended when the equipment fails, the loss is reduced, and the operation of an operator can be conveniently carried out various operations by arranging the operation table, the use is convenient, and a box cover and a heat radiating port are arranged on one side of the equipment box, the box cover can be conveniently opened to overhaul the inside of the equipment box, heat in the equipment box is conveniently dissipated, and the service life of the equipment is prolonged.
Drawings
FIG. 1 is a schematic structural diagram of a preferred embodiment of an optoelectronic testing device for LED packages according to the present invention;
FIG. 2 is a schematic view of the internal structure of the test chamber shown in FIG. 1;
FIG. 3 is a schematic structural diagram of the testing mechanism shown in FIG. 2;
FIG. 4 is a schematic structural view of the moving mechanism shown in FIG. 2;
FIG. 5 is an enlarged view of the structure shown at A in FIG. 2;
FIG. 6 is a schematic structural view of the lifting mechanism shown in FIG. 4;
fig. 7 is an enlarged view of the structure shown at B in fig. 2.
Reference numbers in the figures: 1. a test box; 2. placing the frame; 3. feeding a material box; 4. a pick and place mechanism; 41. a first cylinder; 42. a first motor; 43. taking a material plate; 44. a CCD light source; 45. a first vent hole; 5. a moving mechanism; 51. a first moving plate; 52. a second motor; 53. a first lead screw; 54. a first moving block; 55. a third motor; 56. a second lead screw; 57. a second moving block; 58. a second moving plate; 6. a lifting mechanism; 61. fixing the barrel; 62. a second cylinder; 63. a discharge table; 64. a second vent hole; 7. a point measurement mechanism; 71. a fixed table; 72. a needle seat; 73. pointing a measuring needle; 8. a testing mechanism; 81. a third cylinder; 82. a fixed mount; 83. an integrating sphere; 9. an equipment box; 10. an operation table; 11. an operation panel; 12. an operation button; 13. an emergency stop button; 14. a box cover; 15. a heat dissipation port; 16. a light-shielding door; 17. a handle; 18. a display screen; 19. a first slider; 20. a first slide bar; 21. a second slider; 22. a second slide bar; 23. fixing the rod; 24. and a through hole.
Detailed Description
The invention is further described with reference to the following figures and embodiments.
Please refer to fig. 1, fig. 2, fig. 3, fig. 4, fig. 5, fig. 6 and fig. 7 in combination, wherein fig. 1 is a schematic structural diagram of a preferred embodiment of an optoelectronic testing apparatus for an LED package according to the present invention; FIG. 2 is a schematic view of the internal structure of the test chamber shown in FIG. 1; FIG. 3 is a schematic structural diagram of the testing mechanism shown in FIG. 2; FIG. 4 is a schematic structural view of the moving mechanism shown in FIG. 2; FIG. 5 is an enlarged view of the structure shown at A in FIG. 2; FIG. 6 is a schematic structural view of the lifting mechanism shown in FIG. 4; fig. 7 is an enlarged view of the structure shown at B in fig. 2. The photoelectric testing device for LED packaging comprises a testing box 1 and an equipment box 9, wherein the front surface of the testing box 1 is rotatably connected with a light-shielding door 16 through a hinge, and one side of the light-shielding door 16 is fixedly connected with a handle 17.
In the specific implementation process, as shown in fig. 2 and 5, the pick-and-place mechanism 4 is located in the inner cavity of the test box 1, and the pick-and-place mechanism 4 includes a first cylinder 41, a first motor 42 and a pick-and-place plate 43.
The inner cavity of the test box 1 is provided with a placing frame 2, a feeding box 3 is arranged inside the placing frame 2, and a trough is arranged inside the feeding box 3.
The pick-and-place mechanism 4 further comprises a CCD light source 44 and a first vent hole 45, a piston rod of the first cylinder 41 is fixedly connected with the bottom of the first motor 42, an output end of the first motor 42 is fixedly connected with one side of the bottom of the pick-and-place plate 43, the CCD light source 44 is arranged at the bottom of the pick-and-place plate 43, and the first vent hole 45 is formed in one side of the top of the pick-and-place plate 43.
It should be noted that: get through setting up and put mechanism 4, can conveniently get LED wafer and put, accessible CCD light source 44 scans the wafer in the material loading box 3, and the rethread is got flitch 43 and is taken, and the first air vent 45 that gets flitch 43 and set up need connect the outside vacuum tube and carry out the evacuation, and then can adsorb the wafer, through the adjustable position of getting flitch 43 of first motor 42, the height of getting flitch 43 is adjusted to the first cylinder 41 of accessible.
Referring to fig. 2 and 3, the testing mechanism 8 is located in the inner cavity of the testing box 1, the testing mechanism 8 includes a third cylinder 81, a fixing frame 82 and an integrating sphere 83, the outer side of the third cylinder 81 is fixedly connected with the top of the inner cavity of the testing box 1, the piston rod of the third cylinder 81 is fixedly connected with the top of the fixing frame 82, and the integrating sphere 83 is disposed inside the fixing frame 82.
It should be noted that: through setting up testing mechanism 8, when needs test, accessible third cylinder 81 drives mount 82 and removes, can drive integrating sphere 83 and remove when mount 82 removes, and integrating sphere 83 can calculate its luminous flux value to form the photoelectric test report of each chip, can carry out the photoelectric test.
Referring to fig. 2 and 4, a moving mechanism 5 is further disposed inside the testing box 1, the moving mechanism 5 includes a first moving plate 51 and a second motor 52, an output end of the second motor 52 is fixedly connected with a first lead screw 53, an outer side of the first lead screw 53 is in threaded connection with a first moving block 54, and a top of the first moving block 54 is fixedly connected with a bottom of the first moving plate 51.
The moving mechanism 5 further comprises a third motor 55, the bottom of the third motor 55 is fixedly connected with the top of the first moving plate 51, the output end of the third motor 55 is fixedly connected with a second lead screw 56, the outer side of the second lead screw 56 is in threaded connection with a second moving block 57, and the top of the second moving block 57 is fixedly connected with a second moving plate 58.
A first slide block 19 is fixedly connected to one side of the bottom of the first moving plate 51, a first slide bar 20 is slidably connected to the inside of the first slide block 19, a second slide block 21 is fixedly connected to one side of the bottom of the second moving plate 58, and a second slide bar 22 is slidably connected to the inside of the second slide block 21.
It should be noted that: by arranging the moving mechanism 5, the first lead screw 53 can be driven to rotate by the second motor 52, the first lead screw 53 can drive the first moving block 54 and the first moving plate 51 to move by rotating, the second lead screw 56 can be driven to rotate by the third motor 55, and the second lead screw 56 can drive the second moving block 57 and the second moving plate 58 to move by rotating, so that the wafer sent by the material taking plate 43 can be conveniently taken.
Referring to fig. 2 and 6, the lifting mechanism 6 is disposed at the top of the second moving plate 58, the lifting mechanism 6 includes a fixed barrel 61, a second cylinder 62 is disposed in an inner cavity of the fixed barrel 61, a discharging table 63 is fixedly connected to a piston rod of the second cylinder 62, and a second vent hole 64 is formed at the top of the discharging table 63.
The bottom of the material placing table 63 is fixedly connected with a fixing rod 23, and a through hole 24 matched with the fixing rod 23 for use is formed in the fixing barrel 61.
It should be noted that: through setting up elevating system 6, accessible second cylinder 62 drives blowing platform 63 and reciprocates, can make each chip of wafer and some measuring pins 73 contact when blowing platform 63 reciprocates, and then can conveniently carry out the photoelectric property test to the wafer.
Referring to fig. 2 and 7, the inner cavity of the test box 1 is further provided with a point measurement mechanism 7, the point measurement mechanism 7 includes a fixed table 71, needle bases 72 are fixedly connected to both sides of the top of the fixed table 71, and point measurement needles 73 are arranged on one side of the needle bases 72.
It should be noted that: the needle seat 72 can be conveniently fixed by arranging the fixing table 71, the photoelectric performance test can be carried out by arranging the point measuring needle 73 in the needle seat 72, and the point measuring needle 73 is a beryllium copper needle, so that the test is convenient.
Referring to fig. 1 and 2, an emergency stop button 13 is arranged on one side of an equipment box 9, an operation console 10 is fixedly connected to one side of the equipment box 9, an operation panel 11 is arranged on the top of the operation console 10, an operation button 12 is arranged on the top of the operation panel 11, an electrical output end of the operation panel 11 is electrically connected with a display screen 18, the display screen 18 is arranged on the top of the test box 1, a box cover 14 is arranged on one side of the equipment box 9, and a heat dissipation port 15 is formed in the box cover 14.
It should be noted that: through setting up scram button 13, can in time pause when equipment breaks down, reduce the loss, and through setting up operation panel 10, can make things convenient for the operator to carry out each item operation, facilitate the use, and through setting up case lid 14 and thermovent 15 in one side of equipment box 9, can conveniently open case lid 14 and overhaul work to the inside of equipment box 9, and conveniently dispel the heat in the equipment box 9, improved the life of equipment.
The working principle of the photoelectric testing device for the LED package provided by the invention is as follows:
before the photoelectric test of the LED is carried out, the device needs to be placed in a dust-free constant-temperature environment to work so as to ensure the accuracy of the test and avoid errors, when the test is carried out, firstly, a wafer is placed in the feeding box 3, then, the LED wafer can be conveniently taken and placed through the arranged taking and placing mechanism 4, the wafer in the feeding box 3 can be scanned through the CCD light source 44, then, the taking plate 43 is taken, the first vent hole 45 formed in the taking plate 43 needs to be connected with an outer vacuum tube for vacuumizing, further, the wafer can be adsorbed, the position of the taking plate 43 can be adjusted through the first motor 42, the height of the taking plate 43 can be adjusted through the first air cylinder 41, then, the second motor 52 in the moving mechanism 5 drives the first screw rod 53 to rotate, the first screw rod 53 can drive the first moving block 54 and the first moving plate 51 to move, the third motor 55 can drive the second screw rod 56 to rotate, the second lead screw 56 can drive the second moving block 57 and the second moving plate 58 to move when rotating, so that a wafer sent by the material taking plate 43 can be conveniently received, when the wafer is placed at the top of the material placing table 63, the material placing table 63 is reset, after resetting, the point measuring needle 73 is aligned to a chip, finally, the third air cylinder 81 drives the fixing frame 82 to move, the fixing frame 82 moves to drive the integrating sphere 83 to move, the integrating sphere 83 can be moved to the top of the point measuring needle 73, when the point measuring needle 73 works, the point measuring needle 73 can enable the single chip to emit light, the integrating sphere 83 can collect and process the emitted light source, a photoelectric test report can be formed after system processing is carried out, the photoelectric performance test of the LED is facilitated, and the shading door 16 needs to be closed during testing, so that the influence of the external light source on the test is avoided.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
- Optoelectronic testing device of LED encapsulation, characterized by, includes:the test box comprises a test box (1) and an equipment box (9), wherein the front surface of the test box (1) is rotatably connected with a shading door (16) through a hinge, and one side of the shading door (16) is fixedly connected with a handle (17);the test box comprises a pick-and-place mechanism (4), wherein the pick-and-place mechanism (4) is positioned in an inner cavity of the test box (1), and the pick-and-place mechanism (4) comprises a first air cylinder (41), a first motor (42) and a pick-and-place plate (43);testing mechanism (8), testing mechanism (8) are located the inner chamber of test box (1), testing mechanism (8) include third cylinder (81), mount (82) and integrating sphere (83), the outside of third cylinder (81) and the top fixed connection of test box (1) inner chamber, the piston rod of third cylinder (81) and the top fixed connection of mount (82), integrating sphere (83) set up in the inside of mount (82).
- 2. The photoelectric test device for the LED package according to claim 1, wherein a placement frame (2) is arranged in the inner cavity of the test box (1), a feeding box (3) is arranged inside the placement frame (2), and a trough is arranged inside the feeding box (3).
- 3. The photoelectric testing device for the LED package according to claim 1, wherein the pick-and-place mechanism (4) further comprises a CCD light source (44) and a first vent hole (45), a piston rod of the first cylinder (41) is fixedly connected with the bottom of the first motor (42), an output end of the first motor (42) is fixedly connected with one side of the bottom of the pick-and-place plate (43), the CCD light source (44) is arranged at the bottom of the pick-and-place plate (43), and the first vent hole (45) is formed in one side of the top of the pick-and-place plate (43).
- 4. The optoelectronic testing device for the LED package according to claim 1, wherein a moving mechanism (5) is further disposed inside the testing box (1), the moving mechanism (5) comprises a first moving plate (51) and a second motor (52), an output end of the second motor (52) is fixedly connected with a first lead screw (53), an outer side of the first lead screw (53) is connected with a first moving block (54) in a threaded manner, and a top of the first moving block (54) is fixedly connected with a bottom of the first moving plate (51).
- 5. The LED package photoelectric testing device according to claim 4, wherein the moving mechanism (5) further comprises a third motor (55), a bottom of the third motor (55) is fixedly connected with a top of the first moving plate (51), an output end of the third motor (55) is fixedly connected with a second lead screw (56), an outer side of the second lead screw (56) is connected with a second moving block (57) in a threaded manner, and a top of the second moving block (57) is fixedly connected with a second moving plate (58).
- 6. The LED package photoelectric testing device according to claim 4 or 5, wherein a first slider (19) is fixedly connected to one side of the bottom of the first moving plate (51), a first slide bar (20) is slidably connected to the inside of the first slider (19), a second slider (21) is fixedly connected to one side of the bottom of the second moving plate (58), and a second slide bar (22) is slidably connected to the inside of the second slider (21).
- 7. The LED package photoelectric testing device according to claim 5, wherein a lifting mechanism (6) is arranged at the top of the second moving plate (58), the lifting mechanism (6) comprises a fixed barrel (61), a second air cylinder (62) is arranged in an inner cavity of the fixed barrel (61), a discharging table (63) is fixedly connected to a piston rod of the second air cylinder (62), and a second vent hole (64) is formed in the top of the discharging table (63).
- 8. The photoelectric testing device of the LED package according to claim 7, wherein a fixing rod (23) is fixedly connected to the bottom of the material placing table (63), and a through hole (24) matched with the fixing rod (23) is formed in the fixing barrel (61).
- 9. The optoelectronic testing device for the LED package according to claim 1, wherein the inner cavity of the testing box (1) is further provided with a point testing mechanism (7), the point testing mechanism (7) comprises a fixed table (71), both sides of the top of the fixed table (71) are fixedly connected with a needle base (72), and one side of the needle base (72) is provided with a point testing needle (73).
- 10. The LED-packaged photoelectric test device according to claim 1, wherein an emergency stop button (13) is arranged on one side of the equipment box (9), an operation table (10) is fixedly connected to one side of the equipment box (9), an operation board (11) is arranged on the top of the operation table (10), an operation button (12) is arranged on the top of the operation board (11), a display screen (18) is electrically connected to an electrical output end of the operation board (11), the display screen (18) is arranged on the top of the test box (1), a box cover (14) is arranged on one side of the equipment box (9), and a heat dissipation port (15) is formed in the box cover (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110982395.XA CN113639859A (en) | 2021-08-25 | 2021-08-25 | Photoelectric testing device for LED packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110982395.XA CN113639859A (en) | 2021-08-25 | 2021-08-25 | Photoelectric testing device for LED packaging |
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| Publication Number | Publication Date |
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| CN113639859A true CN113639859A (en) | 2021-11-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110982395.XA Pending CN113639859A (en) | 2021-08-25 | 2021-08-25 | Photoelectric testing device for LED packaging |
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| CN (1) | CN113639859A (en) |
Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201429464Y (en) * | 2009-04-09 | 2010-03-24 | 张九六 | Automatic test spectrometer for united LED |
| WO2010095810A2 (en) * | 2009-02-20 | 2010-08-26 | (주)큐엠씨 | Led chip classifying apparatus |
| CN102290406A (en) * | 2010-06-18 | 2011-12-21 | 亿广科技(上海)有限公司 | Package of light-emitting diode with testing pads and testing method thereof |
| CN102419424A (en) * | 2011-12-16 | 2012-04-18 | 广东朗视光电技术有限公司 | Aging test equipment of illuminating lamp and aging test system using equipment |
| CN103134802A (en) * | 2011-11-25 | 2013-06-05 | 西安中科麦特电子技术设备有限公司 | Two-dimensional movement apparatus for PCB optical detection |
| JP2013135074A (en) * | 2011-12-26 | 2013-07-08 | Sharp Corp | Optical testing device |
| KR20130079041A (en) * | 2012-01-02 | 2013-07-10 | 주식회사 로보스타 | Apparatus for preventing leakage of light in chip tester |
| CN103760482A (en) * | 2013-11-18 | 2014-04-30 | 深圳盛世天予科技发展有限公司 | Photoelectric testing apparatus for LED packaging |
| CN203745602U (en) * | 2014-03-12 | 2014-07-30 | 何选民 | Array evaluating and testing system for LED photoelectric property relative standard |
| CN104438132A (en) * | 2014-12-01 | 2015-03-25 | 东莞市台工电子机械科技有限公司 | Full-automatic high-rate chip LED spectrophotometer |
| CN106291304A (en) * | 2016-07-29 | 2017-01-04 | 深圳清华大学研究院 | A kind of LED test device and method of testing |
| CN209182443U (en) * | 2018-09-10 | 2019-07-30 | 深圳市矽电半导体设备有限公司 | A kind of inverted light-emitting diode (LED) test equipment |
| CN209470852U (en) * | 2019-04-11 | 2019-10-08 | 杭州赛美蓝光电科技有限公司 | A kind of light source static array spectrophotometric test machine |
| CN110581096A (en) * | 2019-09-27 | 2019-12-17 | 江西兆驰半导体有限公司 | Photoelectric property and appearance integrated detection equipment for LED chip |
| CN211478536U (en) * | 2019-12-03 | 2020-09-11 | 安徽三安光电有限公司 | Core grain testing device |
| CN112074714A (en) * | 2018-04-17 | 2020-12-11 | 艾尔软体系统私人有限公司 | Apparatus for testing LED array tiles |
| CN212872830U (en) * | 2020-08-07 | 2021-04-02 | 东莞市中谱光电设备有限公司 | Direct-insertion LED lamp bead wet powder pre-testing machine |
| CN113108847A (en) * | 2021-05-26 | 2021-07-13 | 重庆睿博光电股份有限公司 | Multifunctional universal automobile LED lamp group detection system |
-
2021
- 2021-08-25 CN CN202110982395.XA patent/CN113639859A/en active Pending
Patent Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010095810A2 (en) * | 2009-02-20 | 2010-08-26 | (주)큐엠씨 | Led chip classifying apparatus |
| TW201102671A (en) * | 2009-02-20 | 2011-01-16 | Qmc Co Ltd | LED chip sorting apparatus |
| CN201429464Y (en) * | 2009-04-09 | 2010-03-24 | 张九六 | Automatic test spectrometer for united LED |
| CN102290406A (en) * | 2010-06-18 | 2011-12-21 | 亿广科技(上海)有限公司 | Package of light-emitting diode with testing pads and testing method thereof |
| CN103134802A (en) * | 2011-11-25 | 2013-06-05 | 西安中科麦特电子技术设备有限公司 | Two-dimensional movement apparatus for PCB optical detection |
| CN102419424A (en) * | 2011-12-16 | 2012-04-18 | 广东朗视光电技术有限公司 | Aging test equipment of illuminating lamp and aging test system using equipment |
| JP2013135074A (en) * | 2011-12-26 | 2013-07-08 | Sharp Corp | Optical testing device |
| KR20130079041A (en) * | 2012-01-02 | 2013-07-10 | 주식회사 로보스타 | Apparatus for preventing leakage of light in chip tester |
| CN103760482A (en) * | 2013-11-18 | 2014-04-30 | 深圳盛世天予科技发展有限公司 | Photoelectric testing apparatus for LED packaging |
| CN203745602U (en) * | 2014-03-12 | 2014-07-30 | 何选民 | Array evaluating and testing system for LED photoelectric property relative standard |
| CN104438132A (en) * | 2014-12-01 | 2015-03-25 | 东莞市台工电子机械科技有限公司 | Full-automatic high-rate chip LED spectrophotometer |
| CN106291304A (en) * | 2016-07-29 | 2017-01-04 | 深圳清华大学研究院 | A kind of LED test device and method of testing |
| CN112074714A (en) * | 2018-04-17 | 2020-12-11 | 艾尔软体系统私人有限公司 | Apparatus for testing LED array tiles |
| CN209182443U (en) * | 2018-09-10 | 2019-07-30 | 深圳市矽电半导体设备有限公司 | A kind of inverted light-emitting diode (LED) test equipment |
| CN209470852U (en) * | 2019-04-11 | 2019-10-08 | 杭州赛美蓝光电科技有限公司 | A kind of light source static array spectrophotometric test machine |
| CN110581096A (en) * | 2019-09-27 | 2019-12-17 | 江西兆驰半导体有限公司 | Photoelectric property and appearance integrated detection equipment for LED chip |
| CN211478536U (en) * | 2019-12-03 | 2020-09-11 | 安徽三安光电有限公司 | Core grain testing device |
| CN212872830U (en) * | 2020-08-07 | 2021-04-02 | 东莞市中谱光电设备有限公司 | Direct-insertion LED lamp bead wet powder pre-testing machine |
| CN113108847A (en) * | 2021-05-26 | 2021-07-13 | 重庆睿博光电股份有限公司 | Multifunctional universal automobile LED lamp group detection system |
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