CN202434505U - Photoelectricity chip assembly - Google Patents
Photoelectricity chip assembly Download PDFInfo
- Publication number
- CN202434505U CN202434505U CN201220022414.0U CN201220022414U CN202434505U CN 202434505 U CN202434505 U CN 202434505U CN 201220022414 U CN201220022414 U CN 201220022414U CN 202434505 U CN202434505 U CN 202434505U
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- photoelectric chip
- circuit board
- fixed
- optical fiber
- chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
The utility model provides a photoelectricity chip assembly, which comprises a first photoelectricity chip, an optical fiber component, a circuit board and a cover, wherein the first photoelectricity chip and the optical fiber component are fixedly arranged on the circuit board; a light receiving surface of the first photoelectricity chip and a light emitting surface of the optical fiber component are opposite; the first photoelectricity chip is electrically connected with the circuit board; the cover is arranged above the first photoelectricity chip and the optical fiber component; and the cover and the circuit board form a closed space. The chip is packaged by a packaging structure in the photoelectricity chip assembly, so that the corrosion and the high-temperature damage to the photoelectricity chip caused by seal gum can be avoided, the packaging volume is reduced, and the packaging operation process is simplified.
Description
Technical field
The utility model relates to electronic technology field, particularly relates to a kind of photoelectric chip assembly.
Background technology
Chip Packaging mode commonly used at present generally has two kinds, and the one, through plastic package process, chip is solidified with fluid sealant perfusion covering and completion.But therefore this mode has serious stress damage hidden danger to chip because fluid sealant directly contacts with chip, simultaneously, chemical reaction takes place between fluid sealant itself and the chip easily, thereby chip is caused corrosion, causes package reliability low.And, because pouring into, fluid sealant needs very high temperature when covering, the high temperature when adopting fluid sealant that photoelectric chip is encapsulated damages photoelectric chip easily.The 2nd, adopt pottery or metal shell separately chip to be encapsulated, adopt melting welding or soldering processes during encapsulation, when specifically realizing; Sealed in unit through special use is seal independently with Chip Packaging; And sealed in unit has high input, and packaging cost is high and the encapsulation flow process is complicated, and; Owing to there is not the structure of rational design chips, the volume of chip is also bigger after causing encapsulating.
Summary of the invention
The utility model embodiment provides a kind of photoelectric chip assembly; Adopt the sealant sealing dressing to be prone to cause corrosion and high temperature to damage to solve in traditional Chip Packaging mode to photoelectric chip, and the high and big problem of encapsulation back chip volume of packaging cost when adopting special-purpose sealed in unit encapsulation.
The utility model embodiment provides a kind of photoelectric chip assembly; Comprise: first photoelectric chip, optical fiber component, circuit board and capping; Wherein, Said first photoelectric chip and said optical fiber component are fixed on the said circuit board, and the light-emitting area of the light receiving surface of said first photoelectric chip and said optical fiber component is relative, and said first photoelectric chip is electrically connected with said circuit board; Said capping is positioned at said first photoelectric chip and optical fiber component top, and constitutes enclosure space with said circuit board.
The photoelectric chip assembly that the utility model embodiment provides comes packaged chip through capping, easily chip is caused the defective of stress damage and corrosion when having avoided utilizing the fluid sealant encapsulation in the traditional approach; Thereby improved package reliability; And, need very high temperature during the encapsulation of Traditional use fluid sealant, and photoelectric chip damages very easily at high temperature; Therefore; Therefore temperature effect when the photoelectric chip assembly that adopts the utility model embodiment to provide does not receive the fluid sealant encapsulation, also expanded the temperature range of chip when work and storage.
Aforesaid photoelectric chip assembly, said circuit board is provided with groove, and said optical fiber component is fixed on the bottom surface of said groove, and said first photoelectric chip is fixed on the sidewall of said groove.
Aforesaid photoelectric chip assembly; Said circuit board is provided with groove; First carrier that said optical fiber component fits through the bottom surface with said groove is fixed on the bottom surface of said groove; Said first photoelectric chip is fixed on through second carrier on the bottom surface of said groove, and wherein, said second carrier is fixed on the bottom surface of said groove and first photoelectric chip is fixed on the side of said second carrier.
Aforesaid photoelectric chip assembly, said circuit board is provided with cavity, and is fixed with base plate below the said cavity, and said optical fiber component is fixed on the said base plate, and said first photoelectric chip is fixed on the sidewall of said cavity.
Aforesaid photoelectric chip assembly; Said circuit board is provided with cavity; And said cavity below is fixed with base plate, and said optical fiber component is fixed on the said base plate through first carrier that fits with said base plate, and said first photoelectric chip is fixed on the said base plate through second carrier; Wherein, said second carrier is fixed on the said base plate and said first photoelectric chip is fixed on the side of said second carrier.
Aforesaid photoelectric chip assembly also comprises: second photoelectric chip, when said first photoelectric chip through second carrier fixedly the time, then said second photoelectric chip is fixed on the end face of said second carrier.
Aforesaid photoelectric chip assembly; Also comprise: second photoelectric chip; When said first photoelectric chip is fixed on the sidewall of said groove; Then said second photoelectric chip is fixed on the said circuit board near the position of said groove, and then said first photoelectric chip comprises with the implementation that said circuit board is electrically connected: said first photoelectric chip is electrically connected with said second photoelectric chip, and said second photoelectric chip is electrically connected with said circuit board.
Aforesaid photoelectric chip assembly; Also comprise: second photoelectric chip; When said first photoelectric chip is fixed on the sidewall of said cavity; Then said second photoelectric chip is fixed on the said circuit board near the position of said cavity, and then said first photoelectric chip comprises with the implementation that said circuit board is electrically connected: said first photoelectric chip is electrically connected with said second photoelectric chip, and said second photoelectric chip is electrically connected with said circuit board.
Aforesaid photoelectric chip assembly, the material of said first carrier and second carrier is pottery or silica-base material.
Aforesaid photoelectric chip assembly, said enclosure space inside is for vacuum or be filled with protective gas.
Description of drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art; To do one to the accompanying drawing of required use in embodiment or the description of the Prior Art below introduces simply; Obviously, the accompanying drawing in describing below is some embodiment of the utility model, for those of ordinary skills; Under the prerequisite of not paying creative work property, can also obtain other accompanying drawing according to these accompanying drawings.
The overall package structure chart of the photoelectric chip assembly that Fig. 1 provides for the utility model embodiment;
The vertical view of the circuit board that Fig. 2 provides for the utility model embodiment;
The end view of the circuit board that Fig. 3 provides for the utility model embodiment;
First photoelectric chip that Fig. 4 provides for the utility model embodiment and the location diagram of second photoelectric chip;
The optical fiber component that Fig. 5 provides for the utility model embodiment and the location diagram of photoelectric chip.
Embodiment
For the purpose, technical scheme and the advantage that make the utility model embodiment clearer; To combine the accompanying drawing among the utility model embodiment below; Technical scheme among the utility model embodiment is carried out clear, intactly description; Obviously, described embodiment is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the utility model protection.
The utility model embodiment provides a kind of photoelectric chip assembly, comprising: first photoelectric chip, optical fiber component, circuit board and capping, wherein,
Said first photoelectric chip and said optical fiber component are fixed on the said circuit board, and the light-emitting area of the light receiving surface of said first photoelectric chip and said optical fiber component is relative, and said first photoelectric chip is electrically connected with said circuit board;
Said capping is positioned at said first photoelectric chip and optical fiber component top, and constitutes enclosure space with said circuit board.
Preferable; In order to dwindle the volume of photoelectric chip assembly, can be provided with groove by said circuit board, then said optical fiber component is fixed on the bottom surface of said groove; Said first photoelectric chip is fixed on the sidewall of said groove; Perhaps, first carrier that said optical fiber component fits through the bottom surface with said groove is fixed on the bottom surface of said groove, and said first photoelectric chip is fixed on the bottom surface of said groove through second carrier; Wherein, said second carrier is fixed on the bottom surface of said groove and first photoelectric chip is fixed on the side of said second carrier.Wherein, the material of said first carrier and second carrier is pottery or silica-base material etc., fixes through carrier, not only is convenient to fixing but also be beneficial to heat radiation.
Preferable, on the basis that dwindles the photoelectric chip assembly volume, better realize heat radiation; Can be provided with cavity by said circuit board, and be fixed with base plate below the said cavity, then said optical fiber component is fixed on the said base plate; Said first photoelectric chip is fixed on the sidewall of said cavity; Perhaps, said optical fiber component is fixed on the said base plate through first carrier that fits with said base plate, and said first photoelectric chip is fixed on the said base plate through second carrier; Wherein, said second carrier is fixed on the said base plate and said first photoelectric chip is fixed on the side of said second carrier.Wherein, base plate generally selects for use the material that thermal conductivity is good, intensity is high to make, and for example can select metal material for use, like copper etc.
Preferable; This photoelectric chip assembly also comprises: second photoelectric chip; When said first photoelectric chip through second carrier fixedly the time, then said second photoelectric chip is fixed on the end face of said second carrier, or; When said first photoelectric chip is fixed on the sidewall of said groove or cavity; Then said second photoelectric chip is fixed on the said circuit board near the position of groove or cavity, and then said first photoelectric chip comprises with the implementation that said circuit board is electrically connected: said first photoelectric chip is electrically connected with said second photoelectric chip, and said second photoelectric chip is electrically connected with said circuit board.Wherein, said second photoelectric chip is mainly used in the processing that realizes the signal of telecommunication.
Preferable, said enclosure space inside is for vacuum or be filled with protective gas.
Below in conjunction with Figure of description, describe the scheme in the utility model in detail with a preferred embodiment.
Embodiment one,
Present embodiment provides a kind of photoelectric chip assembly, referring to shown in Figure 1, has provided the overall package effect of this photoelectric chip assembly among this figure.
Photoelectric chip assembly in the present embodiment comprises: have cavity circuit board 1, be positioned at said cavity below and be fixed on circuit board 1 bottom base plate 6, be fixed on optical fiber component 7 on the said base plate 6, be fixed on first photoelectric chip 3 on the said base plate 6 through first carrier 5 through second carrier 4, and be positioned at said first photoelectric chip 3 and optical fiber component 7 tops and constitute the capping 8 of enclosure spaces with circuit board that has cavity 1 and base plate 6.
Wherein, the shape of circuit board 1 is referring to Fig. 2 and shown in Figure 3, and Fig. 2 has provided the vertical view of circuit board 1 in this photoelectric chip assembly, and Fig. 3 has provided the end view of circuit board 1 in this photoelectric chip assembly.Circuit board 1 can be a printed circuit board (PCB); It also can be the circuit board of epoxy, ceramic circuit board or other materials; Comprise a plurality of layer and insulating barriers of being electrically connected; Accomplish the inner wiring of circuit board according to the principle of optical transmission circuit and optical receiving circuit, and design electrical interface to realize the input and output of the signal of telecommunication in a side of circuit board.Circuit board 1 in the present embodiment can be realized interconnecting of multiple electric signal, realizes the impedance matching of connecting line, is mainly used in through being positioned at the transmission channel that inner or surperficial electrical cable of circuit board and optical fiber component are realized signal.This circuit board can adopt epoxy, pottery or other basis material to make; And; In order to dwindle the encapsulation volume of photoelectric chip; Middle part at circuit board is designed with cavity, and the shape of this cavity designs with the shape of size according to photoelectric chip and optical fiber component, can be square or circle etc.This cavity below is fixed with base plate 6, and base plate 6 is generally selected the material that thermal conductivity is good, intensity is high for use.
In the present embodiment, optical fiber component 7 and internal optical fiber thereof are horizontally fixed on the base plate 6, i.e. optical fiber and base plate 6 place plane parallel; First photoelectric chip 3 is owing to the side that is fixed on second carrier 4, so vertical with plane, base plate place.And; First photoelectric chip 3 is direct-coupled with optical fiber component 7; Promptly adopt accurate coupling cramp to realize that the three-dimensional adjustment of optical fiber component 7 is coupled with the light signal of realizing the optical fiber component 7 and first photoelectric chip 3; Said coupling is that the position alignment through the optical fiber component 7 and first photoelectric chip 3 realizes; That is: the light-emitting area of first photoelectric chip 3 also makes light receiving surface vertical each other with the axial direction of optical fiber component 7 internal optical fibers; And the light-emitting area of first photoelectric chip 3 also makes light receiving surface aim at optical fiber component 7, the light of photoelectric chip 3 emissions of winning can be directly incident in the optical fiber of optical fiber component 7 inside, and the light of optical fiber component 7 internal optical fibers emission also can be directly incident on the light receiving surface of first photoelectric chip 3.Preferably, in order to improve the laser propagation effect of light signal, the vertical cross-section of said optical fiber component 7 and first photoelectric chip, 3 corresponding end faces and internal optical fiber is certain angle, and this angle can be between 0 to 15 degree.That is to say that optical fiber component 7 internal optical fibers might not be perpendicular cuts, but when cutting, certain inclination can be arranged that the end surface shape that cuts out accordingly is also for oval but not positive circular.Among the utility model embodiment the optical fiber component 7 and first photoelectric chip 3 directly are coupled, promptly directly aim at, saved in traditional implementation and realized the complex operations of optical signal transmission, and dwindled chip volume by lens change optical transmission direction.
And; When first photoelectric chip 3 in the present embodiment itself does not possess the processing capacity of the signal of telecommunication; Can further include second photoelectric chip 2 in the present embodiment; The signal of telecommunication that is used for maybe will importing the signal of telecommunication of first photoelectric chip 3 output first photoelectric chip 3 is handled, like amplification, filtering etc.Provided the location diagram of first photoelectric chip 3 and second photoelectric chip 2 among Fig. 4, second photoelectric chip 2 can be fixed on the end face of second carrier 4.And; Second photoelectric chip 2 and first photoelectric chip 3 are electrically connected, and soon pass through gold thread, aluminum steel or other metal connecting lines between the light-emitting area of the end face of second photoelectric chip 2 and first photoelectric chip 3, and promptly the bonding line among Fig. 49 is realized being electrically connected; Also be bonding; Because the light-emitting area of the end face of second photoelectric chip 2 and first photoelectric chip 3 is on a horizontal plane, but vertical each other, so this bonding techniques also can be referred to as three-dimensional bonding.And; Second photoelectric chip 2 is electrically connected with circuit board 1; The signal of telecommunication that is used for transmitting through the electrical interface on the circuit board 1 is transferred to optical fiber component 7 through first photoelectric chip 3; Also be used for sending the signal of telecommunication that transmits from optical fiber component 7 warps first photoelectric chip 3 to circuit board 1, and send other equipment to through the electrical interface on the circuit board 1.Wherein, first photoelectric chip in the present embodiment and second photoelectric chip can be one chips, also can be chipsets.
Pass through the cavity of a hollow of design on circuit board in the present embodiment; Thereby the optical fiber component 7 and first photoelectric chip 3 are placed in this cavity; Thereby reduced chip volume, and, optical fiber component 7 and first photoelectric chip 3 are fixed on the base plate 6 that the bottom surface with circuit board 1 fixes; Because base plate 6 adopts the material that is easy to dispel the heat to make, thereby is beneficial to chip cooling.And the optical fiber component 7 among the utility model embodiment and first photoelectric chip 3 directly are coupled, the simple and conserve space of implementation.And, among the utility model embodiment circuit board and photoelectric chip are carried out integrated encapsulation, saved complicated technology flow process and equipment when photoelectric chip encapsulated separately.And, utilize carrier to fix chip among the utility model embodiment, come packaged chip through capping; Easily chip is caused the defective of stress damage and corrosion when having avoided utilizing in the traditional approach fluid sealant encapsulation, thereby improved package reliability, and; Need very high temperature during the encapsulation of Traditional use fluid sealant; And photoelectric chip at high temperature very easily damages, therefore, and the temperature effect when the photoelectric chip assembly that adopts the utility model embodiment to provide does not receive the fluid sealant encapsulation; Therefore, also expanded the temperature range of chip when work and storage.
Except that the implementation of above-mentioned introduction, the utility model embodiment can also adopt other multiple modes to realize, for example; Can on circuit board 1, cavity be set, but a groove is set, thereby photoelectric chip and optical fiber component are placed in the groove; Can realize further dwindling the purpose of chip volume equally; At this moment, then can save base plate 6 accordingly, replace base plate 6 fixed light electrical chip and optical fiber components by the bottom of groove.In addition, can also optical fiber component and photoelectric chip directly be fixed on the bottom portion of groove or base plate 6 of circuit board, thereby save carrier; At this moment, in order to realize better radiating effect, can circuit board be adopted thermal diffusivity ceramic material preferably; At this moment, owing to saved second carrier, so first photoelectric chip 3 can't be fixed on second carrier side; In order to realize the direct coupling of first photoelectric chip and optical fiber component; When circuit board is provided with groove, can first photoelectric chip be fixed on the sidewall of groove, second photoelectric chip is fixed on the circuit board on the position near groove; When circuit board is provided with cavity, can first photoelectric chip be fixed on the sidewall of cavity, second photoelectric chip is fixed on the circuit board on the position near cavity.Certainly, concrete implementation also can be adjusted according to actual conditions, does not do concrete qualification here.
In addition; Cavity or groove are set on circuit board, are the preferred version among the utility model embodiment, if cavity or groove are not set on circuit board; And directly photoelectric chip and optical fiber component are fixed on the circuit board bottom, do not influence the normal enforcement of the utility model yet.
What should explain at last is: above embodiment is only in order to the technical scheme of explanation the utility model, but not to its restriction; Although the utility model has been carried out detailed explanation with reference to previous embodiment; Those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment put down in writing, and perhaps part technical characterictic wherein is equal to replacement; And these are revised or replacement, do not make the spirit and the scope of each embodiment technical scheme of essence disengaging the utility model of relevant art scheme.
Claims (10)
1. photoelectric chip assembly; It is characterized in that; Comprise: first photoelectric chip, optical fiber component, circuit board and capping, wherein, said first photoelectric chip and said optical fiber component are fixed on the said circuit board; And the light receiving surface of said first photoelectric chip is relative with the light-emitting area of said optical fiber component, and said first photoelectric chip is electrically connected with said circuit board; Said capping is positioned at said first photoelectric chip and optical fiber component top, and constitutes enclosure space with said circuit board.
2. photoelectric chip assembly as claimed in claim 1 is characterized in that said circuit board is provided with groove, and said optical fiber component is fixed on the bottom surface of said groove, and said first photoelectric chip is fixed on the sidewall of said groove.
3. photoelectric chip assembly as claimed in claim 1; It is characterized in that; Said circuit board is provided with groove, and first carrier that said optical fiber component fits through the bottom surface with said groove is fixed on the bottom surface of said groove, and said first photoelectric chip is fixed on the bottom surface of said groove through second carrier; Wherein, said second carrier is fixed on the bottom surface of said groove and first photoelectric chip is fixed on the side of said second carrier.
4. photoelectric chip assembly as claimed in claim 1; It is characterized in that said circuit board is provided with cavity, and said cavity below is fixed with base plate; Said optical fiber component is fixed on the said base plate, and said first photoelectric chip is fixed on the sidewall of said cavity.
5. photoelectric chip assembly as claimed in claim 1; It is characterized in that said circuit board is provided with cavity, and said cavity below is fixed with base plate; Said optical fiber component is fixed on the said base plate through first carrier that fits with said base plate; Said first photoelectric chip is fixed on the said base plate through second carrier, and wherein, said second carrier is fixed on the said base plate and said first photoelectric chip is fixed on the side of said second carrier.
6. like claim 3 or 5 described photoelectric chip assemblies, it is characterized in that, also comprise: second photoelectric chip, when said first photoelectric chip through second carrier fixedly the time, then said second photoelectric chip is fixed on the end face of said second carrier.
7. photoelectric chip assembly as claimed in claim 2; It is characterized in that; Also comprise: second photoelectric chip, when said first photoelectric chip was fixed on the sidewall of said groove, then said second photoelectric chip was fixed on the said circuit board position near said groove; Then said first photoelectric chip comprises with the implementation that said circuit board is electrically connected: said first photoelectric chip is electrically connected with said second photoelectric chip, and said second photoelectric chip is electrically connected with said circuit board.
8. photoelectric chip assembly as claimed in claim 4; It is characterized in that; Also comprise: second photoelectric chip, when said first photoelectric chip was fixed on the sidewall of said cavity, then said second photoelectric chip was fixed on the said circuit board position near said cavity; Then said first photoelectric chip comprises with the implementation that said circuit board is electrically connected: said first photoelectric chip is electrically connected with said second photoelectric chip, and said second photoelectric chip is electrically connected with said circuit board.
9. like claim 3 or 5 described photoelectric chip assemblies, it is characterized in that the material of said first carrier and second carrier is pottery or silica-base material.
10. photoelectric chip assembly as claimed in claim 1 is characterized in that, said enclosure space inside is for vacuum or be filled with protective gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220022414.0U CN202434505U (en) | 2012-01-18 | 2012-01-18 | Photoelectricity chip assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201220022414.0U CN202434505U (en) | 2012-01-18 | 2012-01-18 | Photoelectricity chip assembly |
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| Publication Number | Publication Date |
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| CN202434505U true CN202434505U (en) | 2012-09-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201220022414.0U Withdrawn - After Issue CN202434505U (en) | 2012-01-18 | 2012-01-18 | Photoelectricity chip assembly |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569431A (en) * | 2011-12-29 | 2012-07-11 | 青岛海信宽带多媒体技术有限公司 | Photoelectric chip assembly and packaging method |
| CN104730656A (en) * | 2015-04-01 | 2015-06-24 | 苏州旭创科技有限公司 | Optical module and manufacturing method thereof |
| TWI561873B (en) * | 2012-12-27 | 2016-12-11 | Hon Hai Prec Ind Co Ltd | Optical to electrical coverter |
| CN108882523A (en) * | 2018-06-27 | 2018-11-23 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN108885317A (en) * | 2016-11-25 | 2018-11-23 | 华为技术有限公司 | A kind of method of package of optical device device, optical module and package of optical device |
| US10495832B2 (en) | 2017-07-19 | 2019-12-03 | Innolight Technology (Suzhou) Ltd. | Optical module including heat sink arranged in housing |
| CN112051646A (en) * | 2019-06-06 | 2020-12-08 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2021036900A1 (en) * | 2019-08-26 | 2021-03-04 | 阿里巴巴集团控股有限公司 | Silicon optical module and optical transmission component |
| CN115508957A (en) * | 2017-07-19 | 2022-12-23 | 苏州旭创科技有限公司 | Optical module |
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2012
- 2012-01-18 CN CN201220022414.0U patent/CN202434505U/en not_active Withdrawn - After Issue
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102569431B (en) * | 2011-12-29 | 2014-03-19 | 青岛海信宽带多媒体技术有限公司 | Photoelectric chip assembly and packaging method |
| CN102569431A (en) * | 2011-12-29 | 2012-07-11 | 青岛海信宽带多媒体技术有限公司 | Photoelectric chip assembly and packaging method |
| TWI561873B (en) * | 2012-12-27 | 2016-12-11 | Hon Hai Prec Ind Co Ltd | Optical to electrical coverter |
| CN104730656A (en) * | 2015-04-01 | 2015-06-24 | 苏州旭创科技有限公司 | Optical module and manufacturing method thereof |
| CN108885317A (en) * | 2016-11-25 | 2018-11-23 | 华为技术有限公司 | A kind of method of package of optical device device, optical module and package of optical device |
| US10495832B2 (en) | 2017-07-19 | 2019-12-03 | Innolight Technology (Suzhou) Ltd. | Optical module including heat sink arranged in housing |
| CN115508957A (en) * | 2017-07-19 | 2022-12-23 | 苏州旭创科技有限公司 | Optical module |
| US11561351B2 (en) | 2017-07-19 | 2023-01-24 | Innolight Technology Pte. Ltd. | Optical module |
| CN115508957B (en) * | 2017-07-19 | 2024-02-23 | 苏州旭创科技有限公司 | Optical module |
| CN108882523A (en) * | 2018-06-27 | 2018-11-23 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112051646A (en) * | 2019-06-06 | 2020-12-08 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112051646B (en) * | 2019-06-06 | 2022-06-14 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2021036900A1 (en) * | 2019-08-26 | 2021-03-04 | 阿里巴巴集团控股有限公司 | Silicon optical module and optical transmission component |
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